EP3841434A4 - Matériaux et films à motifs et systèmes et procédés pour les réaliser - Google Patents
Matériaux et films à motifs et systèmes et procédés pour les réaliser Download PDFInfo
- Publication number
- EP3841434A4 EP3841434A4 EP19852650.1A EP19852650A EP3841434A4 EP 3841434 A4 EP3841434 A4 EP 3841434A4 EP 19852650 A EP19852650 A EP 19852650A EP 3841434 A4 EP3841434 A4 EP 3841434A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- films
- systems
- making
- methods
- same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2012—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image using liquid photohardening compositions, e.g. for the production of reliefs such as flexographic plates or stamps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
- G03F7/203—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0031—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields combining different shielding materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/151—Copolymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP24158538.9A EP4350442A3 (fr) | 2018-08-21 | 2019-08-20 | Matériaux et films à motifs et systèmes et procédés de fabrication associés |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862720840P | 2018-08-21 | 2018-08-21 | |
PCT/US2019/047273 WO2020041320A1 (fr) | 2018-08-21 | 2019-08-20 | Matériaux et films à motifs et systèmes et procédés pour les réaliser |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP24158538.9A Division EP4350442A3 (fr) | 2018-08-21 | 2019-08-20 | Matériaux et films à motifs et systèmes et procédés de fabrication associés |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3841434A1 EP3841434A1 (fr) | 2021-06-30 |
EP3841434A4 true EP3841434A4 (fr) | 2021-10-20 |
Family
ID=69591127
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP24158538.9A Pending EP4350442A3 (fr) | 2018-08-21 | 2019-08-20 | Matériaux et films à motifs et systèmes et procédés de fabrication associés |
EP19852650.1A Ceased EP3841434A4 (fr) | 2018-08-21 | 2019-08-20 | Matériaux et films à motifs et systèmes et procédés pour les réaliser |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP24158538.9A Pending EP4350442A3 (fr) | 2018-08-21 | 2019-08-20 | Matériaux et films à motifs et systèmes et procédés de fabrication associés |
Country Status (6)
Country | Link |
---|---|
EP (2) | EP4350442A3 (fr) |
JP (2) | JP2021536126A (fr) |
KR (1) | KR102661722B1 (fr) |
CN (1) | CN112585541A (fr) |
DE (1) | DE202019005902U1 (fr) |
WO (1) | WO2020041320A1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113511146A (zh) * | 2020-04-09 | 2021-10-19 | 莱尔德技术股份有限公司 | 电磁干扰emi吸收体、雷达支架、汽车和汽车部件 |
US11599166B2 (en) * | 2020-07-16 | 2023-03-07 | Lenovo (Singapore) Pte. Ltd. | Shape-memory heat absorbers |
JPWO2022176974A1 (fr) * | 2021-02-22 | 2022-08-25 | ||
US11925009B2 (en) | 2021-03-09 | 2024-03-05 | Hamilton Sundstrand Corporation | Adaptive design and fabrication of radiation shielding inserts for electronic components |
CN113355902B (zh) * | 2021-05-21 | 2022-10-28 | 广州市风卓诚衣服饰有限公司 | 一种防褶皱的快速铺布装置 |
JP2023098230A (ja) * | 2021-12-28 | 2023-07-10 | 株式会社ニフコ | 高周波通信装置の電波吸収体 |
CN115911879B (zh) * | 2023-01-09 | 2023-06-02 | 中国科学院长春光学精密机械与物理研究所 | 一种立体环型频率选择天线罩/天线窗及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040084196A1 (en) * | 2000-05-22 | 2004-05-06 | Mats Hogberg | Cover for an electronic device |
US20050001780A1 (en) * | 2001-02-15 | 2005-01-06 | Integral Technologies, Inc. | Low cost electromagnetic energy absorbers manufactured from conductive loaded resin-based materials |
JP2017171773A (ja) * | 2016-03-23 | 2017-09-28 | 株式会社ジェイエスピー | 発泡粒子成形体 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0369197A (ja) * | 1989-08-08 | 1991-03-25 | Internatl Techno Res:Kk | 中空多角錐型電波吸収体 |
JP3252974B2 (ja) * | 1991-12-13 | 2002-02-04 | 日本電信電話株式会社 | 電磁波吸収材料を有する有機樹脂の製造方法 |
JP2000353893A (ja) * | 1999-06-11 | 2000-12-19 | Kagoshima Prefecture | 電波吸収体とその製造方法 |
JP2002261489A (ja) * | 2001-02-28 | 2002-09-13 | Kanto Kosen Kk | 電波吸収遮音パネル |
JP3708885B2 (ja) * | 2002-02-21 | 2005-10-19 | 三菱電線工業株式会社 | 電波音波吸収体 |
JP3836748B2 (ja) * | 2002-04-22 | 2006-10-25 | 三菱電線工業株式会社 | 電波音波吸収構造物およびそれを用いた電波音波吸収壁 |
JP2004172200A (ja) * | 2002-11-18 | 2004-06-17 | Riken Corp | 電波吸収材料及び電波吸収体 |
JP2004359752A (ja) * | 2003-06-03 | 2004-12-24 | Shin Etsu Polymer Co Ltd | シリコーン接着剤 |
US7589284B2 (en) * | 2005-09-12 | 2009-09-15 | Parker Hannifin Corporation | Composite polymeric material for EMI shielding |
JP2007088335A (ja) * | 2005-09-26 | 2007-04-05 | Konica Minolta Medical & Graphic Inc | 電磁波シールド膜及びその製造方法 |
JP2007251639A (ja) * | 2006-03-16 | 2007-09-27 | Fujitsu Ltd | 通信モジュール |
JP2008135485A (ja) * | 2006-11-27 | 2008-06-12 | Taika:Kk | 電波吸収体およびその製造方法 |
WO2008126690A1 (fr) * | 2007-03-29 | 2008-10-23 | Kabushiki Kaisha Asahi Rubber | Feuille de blindage électromagnétique et plaque d'identification par radiofréquence (rfid) |
JP5396096B2 (ja) * | 2009-02-16 | 2014-01-22 | 本田技研工業株式会社 | 軸調整用ターゲット装置 |
US7848108B1 (en) * | 2009-08-06 | 2010-12-07 | International Business Machines Corporation | Heatsink with periodically patterned baseplate structure |
JP2012199272A (ja) * | 2011-03-18 | 2012-10-18 | Bridgestone Corp | 電磁波シールド体及び電磁波シールド体アッセンブリ |
KR101866501B1 (ko) * | 2011-09-28 | 2018-06-12 | 삼성전자주식회사 | 초소수성 전자기장 차폐재 및 그 제조방법 |
CN105009225B (zh) * | 2013-02-21 | 2019-08-16 | 3M创新有限公司 | 具有电磁干扰减轻特性的聚合物复合物 |
CN105814979B (zh) * | 2013-12-18 | 2020-01-10 | 3M创新有限公司 | 使用一氧化钛(tio)基材料的电磁干扰(emi)屏蔽产品 |
US9635789B2 (en) * | 2015-01-30 | 2017-04-25 | Laird Technologies, Inc. | Board level electromagnetic interference (EMI) shields with increased under-shield space |
WO2017019948A1 (fr) * | 2015-07-30 | 2017-02-02 | Laird Technologies, Inc. | Structures à sélectivité de fréquence pour l'atténuation des interférences électromagnétiques |
EP3347399B1 (fr) * | 2015-09-09 | 2020-12-09 | Carbon, Inc. | Résines époxydes à polymérisation duale pour une fabrication additive |
JP2017183677A (ja) * | 2016-03-31 | 2017-10-05 | 株式会社村田製作所 | 回路モジュールおよびその製造方法 |
CN206416588U (zh) * | 2017-01-19 | 2017-08-18 | 亚天顿(廊坊)复合材料科技有限公司 | 一种新型吸波复合材料方舱用大板 |
-
2019
- 2019-08-20 WO PCT/US2019/047273 patent/WO2020041320A1/fr unknown
- 2019-08-20 EP EP24158538.9A patent/EP4350442A3/fr active Pending
- 2019-08-20 DE DE202019005902.4U patent/DE202019005902U1/de active Active
- 2019-08-20 JP JP2021509837A patent/JP2021536126A/ja active Pending
- 2019-08-20 EP EP19852650.1A patent/EP3841434A4/fr not_active Ceased
- 2019-08-20 KR KR1020217007508A patent/KR102661722B1/ko active IP Right Grant
- 2019-08-20 CN CN201980054705.2A patent/CN112585541A/zh active Pending
-
2023
- 2023-05-29 JP JP2023001825U patent/JP3243042U/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040084196A1 (en) * | 2000-05-22 | 2004-05-06 | Mats Hogberg | Cover for an electronic device |
US20050001780A1 (en) * | 2001-02-15 | 2005-01-06 | Integral Technologies, Inc. | Low cost electromagnetic energy absorbers manufactured from conductive loaded resin-based materials |
JP2017171773A (ja) * | 2016-03-23 | 2017-09-28 | 株式会社ジェイエスピー | 発泡粒子成形体 |
Non-Patent Citations (1)
Title |
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See also references of WO2020041320A1 * |
Also Published As
Publication number | Publication date |
---|---|
EP4350442A2 (fr) | 2024-04-10 |
CN112585541A (zh) | 2021-03-30 |
WO2020041320A1 (fr) | 2020-02-27 |
JP2021536126A (ja) | 2021-12-23 |
JP3243042U (ja) | 2023-07-31 |
EP4350442A3 (fr) | 2024-07-03 |
KR20210033059A (ko) | 2021-03-25 |
KR102661722B1 (ko) | 2024-04-26 |
DE202019005902U1 (de) | 2023-04-11 |
EP3841434A1 (fr) | 2021-06-30 |
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