EP3602582B1 - Elektrisches bauteil, bauteilanordnung und verfahren zur herstellung einer bauteilanordnung - Google Patents

Elektrisches bauteil, bauteilanordnung und verfahren zur herstellung einer bauteilanordnung Download PDF

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Publication number
EP3602582B1
EP3602582B1 EP18715546.0A EP18715546A EP3602582B1 EP 3602582 B1 EP3602582 B1 EP 3602582B1 EP 18715546 A EP18715546 A EP 18715546A EP 3602582 B1 EP3602582 B1 EP 3602582B1
Authority
EP
European Patent Office
Prior art keywords
connection
component
wire
connection area
latching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP18715546.0A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3602582A1 (de
Inventor
Günter FEIST
Karsten Frey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
TDK Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Electronics AG filed Critical TDK Electronics AG
Priority to PL18715546T priority Critical patent/PL3602582T3/pl
Publication of EP3602582A1 publication Critical patent/EP3602582A1/de
Application granted granted Critical
Publication of EP3602582B1 publication Critical patent/EP3602582B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2823—Wires
    • H01F27/2828—Construction of conductive connections, of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
    • H01F2027/065—Mounting on printed circuit boards

Definitions

  • the present invention relates to an electrical component having a winding of a wire.
  • it is an inductive component such as a choke or a transformer.
  • Such components are mounted on a circuit board, for example, by PTH (pin-through-hole) assembly.
  • PTH pin-through-hole
  • SMD mounting i.e. surface mounting
  • SMD mounting would be advantageous, which, however, is difficult to produce in a reliable form, especially with thick wires.
  • the problem with thick wires is often the insufficient coplanarity of the connection areas of the wires.
  • the pamphlets US 2006/001517 A1 and US 2016/086725 A1 each show a coil in which wire ends are bent around a core component.
  • an electrical component which has a winding body and a winding of a wire around the winding body.
  • the component is in particular an inductive component, for example a choke or a transformer.
  • the component has a connection area, wherein the connection area comprises a wire end of the wire.
  • the connection area is designed in particular for the electrical connection of the component to a connection device, such as a printed circuit board.
  • the connection area is designed for locking with a mounting device.
  • the assembly device is designed as a plate.
  • the component can have several such connection areas.
  • connection area By latching the connection area to the assembly device, surface mounting of the component on the connection device can be made possible.
  • the position of the connection area can be fixed by latching the connection area to the mounting device. If there are several connection areas that are locked to the assembly device, it can be ensured that the connection areas are on one level. Thus, a planarity required for surface mounting can be established.
  • the wire has a thickness of at least 1.5 mm. With such thick wires, surface mounting by conventional methods has hitherto only been possible with difficulty. However, the wire can also have a smaller thickness, depending on the component size and weight.
  • connection area is spaced down from the winding body, so that an assembly device can be arranged between the winding body and the connection area.
  • the assembly device can be clamped between the winding or the winding body and the connection area.
  • the Mounting device are pressed from the connection area to the winding or the winding body. In this way it can be achieved that the connection area rests closely on the assembly device and is thus particularly well fixed in its position.
  • connection area has a locking edge for locking with a mounting device.
  • the connection area can additionally or alternatively have an indentation.
  • the indentation can be designed to receive part of the assembly device.
  • the locking edge and / or indentation allow the connection area to be locked in position with the assembly device.
  • the end of the wire is designed to be latched directly to the assembly device.
  • the locking edge and / or the indentation can be formed directly from the wire end.
  • the wire end has a different cross-sectional shape than an adjoining wire region.
  • the wire end has a flat side, with an adjoining wire area being round.
  • the changed shape of the wire end is produced by deforming the wire end, such as for example squeezing.
  • the connection area can be designed for latching in a particularly simple and inexpensive manner.
  • the component has a connector attached to the wire end, which is used for locking with the Mounting device is formed.
  • the connection piece can provide a locking edge.
  • the connector surrounds the end of the wire, for example.
  • it can be a metallic piece of tape act (so-called "splice"). It can also be a sleeve.
  • the connection piece is attached to the end of the wire, for example, by a clamp or crimp connection. In this way, a connection area suitable for latching can be produced by means of an inexpensive and easy-to-assemble connection piece.
  • a component arrangement having the component described above and a mounting device latched to the component is specified.
  • the latching is produced by the connection area.
  • the assembly device is designed in such a way that if there are several connection areas latched to the assembly device, the connection areas are arranged in one plane. In this way, a reliable surface mounting of the connection areas is made possible.
  • the assembly device is designed as a plate.
  • connection area rests against an underside of the assembly device, for example, and the winding body rests against an upper side of the assembly device.
  • the assembly device is clamped in particular between the connection area and the winding body and / or the winding.
  • the assembly device can have one or more latching areas, which are designed, for example, as openings or depressions in the underside of the assembly device.
  • the latching areas are designed in particular for latching with the one or more connection areas.
  • connection device is designed, for example, as a printed circuit board.
  • the component arrangement is attached to the connection device in particular by surface mounting.
  • a method for producing a component arrangement is specified.
  • a component as described above and an assembly device are provided.
  • the assembly device is arranged between the connection area of the component and the winding body or the winding. In this case, the connection area is latched to the assembly device.
  • connection area is bent away from the winding body, for example, and then snaps back into the assembly device with a springy return. In this way, the assembly device is pressed against the winding body and / or the winding.
  • a method for surface mounting the component described above is specified.
  • a component arrangement comprising the component and a mounting device is formed.
  • a connection device for example a printed circuit board, is provided.
  • the connection area of the component arrangement is placed on the circuit board and connected to the circuit board.
  • the connection area is soldered to the circuit board.
  • Figure 1A shows an electrical component 1 having a winding body 2 around which a winding 3 of a wire 4 is arranged.
  • the winding 3 is shown schematically in planar form.
  • the component 1 is designed as an inductive component, in particular as a throttle. It can also be a transformer.
  • the winding body 2 is designed as a magnetic core, in particular as a ferrite core. In the present case, it is a closed core, in particular a toroidal core. Other shapes and types of bobbins can also be used. For example, it can be a mushroom core, cylinder core or a D core.
  • the component 1 can have several windings 3, 5 of wires 4, 6. In the present case, there are two windings 3, 5, each formed by a wire 4, 6. There can also be fewer or more windings and wires. For example, it can be a single-wire, two-wire, three-wire, four-wire or five-wire component.
  • the wires 4, 6 are designed, for example, as relatively thick wires, in particular with a diameter greater than 1.5 mm.
  • the wires have a diameter of 2 mm.
  • the wires 4, 6 point for example a round cross-sectional shape.
  • it is in each case a copper wire, in particular an enamelled copper wire.
  • the wires 4, 6 can also have a smaller thickness.
  • connection areas 7, 8, 19, 20 (see also Figure 2B ) on. Only two connection areas 7, 8 are described in detail below, but the explanations also apply accordingly to the further connection areas 19, 20.
  • the connection areas 7, 8 are each formed by a wire end 9, 10.
  • the connection areas 7, 8 are for surface (SMD) mounting on a connection device 22 (see Figure 2A ), for example a printed circuit board.
  • connection areas 7, 8 protrude downward from the winding 3, 5 and the winding body 2.
  • connection areas 7, 8 are spaced apart from the winding body 2 and the windings 3, 5.
  • the wire ends 9, 10 are reshaped and bent over to form the connection areas 7, 8.
  • FIG. 8 shows an enlarged view of the connection areas 7, 8 from FIG Figure 1A .
  • the connection areas 7, 8 have flat undersides 11, 12, which can be mounted on a connection device in SMD assembly.
  • the connection areas 7, 8 are designed in the form of connection feet.
  • connection areas 7, 8, for example by squeezing The wire ends 9, 10 are deformed to form the connection areas 7, 8, for example by squeezing.
  • the wire ends 9, 10 have a different cross-sectional shape than the wire regions 28, 29 adjoining them, in particular wire regions within the winding.
  • the wire ends 9, 10 do not have a round cross-sectional shape.
  • the connection areas 7, 8, 19, 20 can consist of the wire ends 9, 10, so that no further elements are required for assembly.
  • the wire ends 9, 10 and thus also the connection areas 7, 8 each have a locking edge 13, 14 for locking with a mounting device 17 (see FIG Figure 1C ) on.
  • the locking edge 13, 14 is formed by the deformation of the wire ends 9, 10.
  • the wire ends 9, 10 are in particular in the form of latching hooks.
  • an indentation 15, 16 for receiving a region of the assembly device 17 is provided in each case.
  • the indentations 15, 16 have flat surfaces, for example.
  • Figure 1C shows a latching of one of the connection areas 7 with a mounting device 17 in a sectional view.
  • the mounting device 17 is designed, for example, as a plate. In particular, it can be a grid plate.
  • the further connection areas 8, 19, 20 are correspondingly latched to the assembly device 17.
  • connection area 7 protrudes downward from the winding 3 in such a way that the assembly device 17 can be received between the connection area 7 and the winding 3 or the winding body 2.
  • the assembly device 17 has an opening 18 through which the wire 4 is guided.
  • a latching area 21 for latching with the connection area 7, in particular with the latching edge 13, is formed on the underside of the assembly device 17.
  • the latching area 21 has wedge-shaped contours which enable the connection area 7 to latch into place.
  • the connection area 7 is designed to be resilient. For locking With the assembly device 17, the connection area 7 is bent open slightly and then snaps resiliently into the assembly device 17. The assembly device 17 is pressed by the connection area 7 onto the winding 3 and / or the winding body 2 and is thus clamped between the connection area 7 and the winding 3 and / or the winding body 2.
  • the assembly device 17 thereby produces a coplanar arrangement of the connection areas 7, 8, 19, 20, which enables reliable SMD assembly.
  • the connection areas 7, 8, 19, 20 rest on the assembly device 17 due to their resilient bias.
  • the latching areas 21 of the assembly device 17 are designed in such a way that a planar arrangement of the connection areas 7, 8, 19, 20 is established.
  • the arrangement of the connection areas 7, 8, 19, 20 ensures a sufficient standing and contact area for the SMD assembly.
  • the Figures 2A and 2B show a first embodiment of a component arrangement 23 comprising a component 1 and a mounting device 17 from a view obliquely from above and obliquely from below.
  • the component 1 can according to the Figures 1A to 1C and the mounting device 17 can according to Figure 1C be trained.
  • the assembly device 17 has, for example, ribs 30 on which the winding body 2 rests.
  • connection device 22 to which the component arrangement 23 can be attached is indicated by dashed lines.
  • Figure 2A thus also shows an arrangement comprising a component arrangement 23 and a connection device 22, the component arrangement 23 being surface-mounted on the connection device 22.
  • connection device 17 is connected to the component 1 through the connection areas 7, 8, 19, 20 ( Figure 2B ) clamped and the connection areas 7, 8, 19, 20 are arranged coplanar.
  • all connection areas 7, 8, 19, 20 are at the same height position.
  • the component 1 can be arranged on a planar connection device 22 in such a way that all connection areas 7, 8, 19, 20 rest on the connection device 22 and the component 1 does not tilt in the process.
  • the component assembly 23 can be attached to the connection device 22 by surface mounting.
  • the component arrangement 23 is soldered to the connection device 22.
  • the connection device 22 can be designed as a printed circuit board.
  • connection areas 7, 8, 19, 20 are thus designed at the same time for latching with the assembly device 17 and for electrical and mechanical connection to the connection device 22.
  • the upper sides of the connection areas 7, 8, 19, 20 are designed for latching and the undersides of the connection areas 7, 8, 19, 20 for electrical connection.
  • the assembly device 17 has a plurality of openings 18 through which the connection areas 7, 8 are passed for assembly.
  • the other connection areas 19, 20 are on a rear side of the Assembly device 17 passed.
  • the component 1 is shifted laterally with respect to the assembly device 17, so that the connection areas 7, 8, 19, 20 engage with latching areas 21 of the assembly device 17.
  • the assembly device 17 can be moved and the component 1 can be fixed.
  • connection areas 7, 8, 19, 20 are, for example, as in FIG Figure 2B shown arranged.
  • the first connection area 7 is arranged next to the second connection area 8.
  • the third and fourth connection areas 19, 20 are arranged next to one another and offset to the rear with respect to the first and second connection areas 7, 8. Due to the position of the respective wire ends 9, 10, 31, 32, the first and second connection areas 7, 8 are arranged closer to one another than the third and fourth connection areas 19, 20.
  • the first and third connection areas 7, 19 are formed by wire ends 9, 31 of the winding 3 and the second and fourth connection areas 8, 20 by wire ends 10, 32 of the further winding 5.
  • Figure 3A shows a second embodiment of an electrical component 1. This embodiment differs from the embodiment of FIG Figure 1A through the formation of the connection areas 7, 8, 19, 20.
  • connection areas 7, 8 each have a wire end 9, 10.
  • Connection pieces 24, 25 are attached to the wire ends 9, 10.
  • the connecting pieces 24, 25 are for example as Prefabricated sleeves formed, which are pushed onto the wire ends 9, 10 and then press-formed for attachment to the wire ends 9, 10.
  • connection pieces 24, 25 are also possible, for example metallic pieces of tape.
  • the pieces of tape can be bent around the wire ends 9, 10 and fastened to the wire ends 9, 10 by a clamping or crimping connection.
  • so-called “splice crimps” can be involved.
  • FIG. 8 shows an enlarged view of the connection areas 7, 8 from FIG Figure 1A .
  • the connection areas 7, 8 have undersides 11, 12 which are suitable for SMD assembly.
  • the undersides 11, 12 are not completely flat, but rather slightly curved.
  • the undersides 11, 12, in particular due to the connection pieces 24, 25, have a sufficient contact surface for SMD assembly.
  • the connection pieces 24, 25 bring about a significant widening of the connection areas 7, 8.
  • the connection pieces 24, 25 are laterally spaced from the outer sides of the wire ends 9, 10.
  • connection pieces 24, 25 are designed to be latched to a mounting device 17.
  • the connection pieces 24, 25 form locking edges 13, 14 for locking with a mounting device 17.
  • the connection areas 7, 8 have indentations 15, 16 which are formed by parts of the wires 4, 6 adjoining the locking edges 13, 14.
  • Figure 3C shows a latching of one of the connection areas 7 with a mounting device 17 in a sectional view. the Latching applies accordingly to the other connection areas 8, 19, 20.
  • the wire ends 9, 10 have the same cross-sectional shape as the wire regions 28, 29 adjoining them, in particular a round cross-sectional shape.
  • the locking with the mounting device 17 is similar to that in FIG Figure 1C , however, the locking is produced by the connection piece 24 and not directly by the wire end 9.
  • the connection piece 24 latches with a latching area 21 of the assembly device 17 via its latching edge 13.
  • the connection area 7 is partially sunk into the assembly device 17.
  • the assembly device 17 is here also pressed by the connection area 7 onto the winding 3 and / or the winding body 2 and clamped therebetween.
  • connection areas 7, 8, 19, 20 are achieved here too, so that SMD assembly is possible.
  • the Figures 4A and 4B show a second embodiment of a component arrangement 23 comprising a component 1 and a mounting device 17 from a view obliquely above and obliquely below.
  • the component 1 can according to the Figures 3A to 3C and the mounting device 17 can according to Figure 3C be trained.
  • a connection device 22 is indicated by dashed lines, to which the component arrangement 23 can be attached by SMD assembly.
  • connection areas 7, 8 have connection pieces 24, 25, 26, 27, which are attached to the wire ends 9, 10, 31, 32.
  • Figure 5A shows a second embodiment of an electrical component 1. This embodiment differs from the embodiment of FIG Figure 1A by the shape of the bobbin 2 and the winding 3.
  • the winding body 2 is designed as a mushroom core.
  • the component 1 can in particular be a mushroom core choke.
  • a winding 3 is wound around the winding body 2.
  • the wire ends 9, 10 of the winding 3 are formed by reshaping and bending over as connection areas 7, 8, which correspond to the connection areas 7, 8 Figure 1A are trained.
  • FIG Figure 5B shows an enlarged connection area 7 of the embodiment according to FIG Figure 5A .
  • the connection areas 7 have a latching edge 13 for latching with a mounting device and a flat underside 11 for electrical connection to a connection device.
  • Figure 5C shows a latching of a connection area 7 from FIG Figures 5A and 5B on a mounting device 17.
  • the assembly device 17 has one or more latching areas 21 for latching with the latching edge 13 of the connection area 7.
  • the latching areas 21 can each have inclined outer sides.
  • connection areas 7, 8 latch with the latching area 21 of the assembly device 17.
  • the latching area 21 is formed here by a lateral outer edge of the assembly device 17.
  • the connection areas 7, 8 thus protrude laterally beyond the assembly device 17. This leads to a more compact form of the mounting device 17 compared to Figure 1C .
  • There the assembly device 17 protrudes laterally over the connection areas 7, 8.
  • the Figures 6A and 6B show a further embodiment of a component arrangement 23 comprising a component 1 and a mounting device 17 from lateral, perspective views.
  • the component 1 can according to the Figures 5A to 5C and the mounting device 17 can according to Figure 5C be trained.
  • connection areas 7, 8 are arranged next to one another and protrude beyond the assembly device 17.
  • connection device 22 is indicated by dashed lines, to which the component arrangement 23 can be attached by SMD assembly.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
EP18715546.0A 2017-03-31 2018-03-22 Elektrisches bauteil, bauteilanordnung und verfahren zur herstellung einer bauteilanordnung Active EP3602582B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL18715546T PL3602582T3 (pl) 2017-03-31 2018-03-22 Elektryczny element konstrukcyjny, układ elementu konstrukcyjnego i sposób wytwarzania układu elementu konstrukcyjnego

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102017106970.4A DE102017106970A1 (de) 2017-03-31 2017-03-31 Elektrisches Bauteil, Bauteilanordnung und Verfahren zur Herstellung einer Bauteilanordnung
PCT/EP2018/057308 WO2018177883A1 (de) 2017-03-31 2018-03-22 Elektrisches bauteil, bauteilanordnung und verfahren zur herstellung einer bauteilanordnung

Publications (2)

Publication Number Publication Date
EP3602582A1 EP3602582A1 (de) 2020-02-05
EP3602582B1 true EP3602582B1 (de) 2021-08-18

Family

ID=61899206

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18715546.0A Active EP3602582B1 (de) 2017-03-31 2018-03-22 Elektrisches bauteil, bauteilanordnung und verfahren zur herstellung einer bauteilanordnung

Country Status (8)

Country Link
US (1) US11488765B2 (pl)
EP (1) EP3602582B1 (pl)
JP (1) JP6833061B2 (pl)
CN (1) CN110692113B (pl)
DE (1) DE102017106970A1 (pl)
ES (1) ES2896501T3 (pl)
PL (1) PL3602582T3 (pl)
WO (1) WO2018177883A1 (pl)

Families Citing this family (1)

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Publication number Priority date Publication date Assignee Title
FR3094553B1 (fr) * 2019-03-25 2021-02-26 Continental Automotive Procédé de fixation d’une self sur une carte électronique

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Publication number Priority date Publication date Assignee Title
US4602235A (en) 1984-08-20 1986-07-22 Micron Industries Corp. Transformer assembly with terminal plates in support
JP4406187B2 (ja) 2002-03-01 2010-01-27 株式会社エス・エッチ・ティ 表面実装型コイル装置
CN2726077Y (zh) * 2004-07-02 2005-09-14 郑长茂 电感器
DE102006026364A1 (de) * 2006-02-16 2007-08-30 Klaus Lorenzen Bauelement für SMD-Leiterplattenbestückung
JP4783183B2 (ja) * 2006-03-16 2011-09-28 スミダコーポレーション株式会社 インダクタ
JP4837485B2 (ja) * 2006-08-07 2011-12-14 スミダコーポレーション株式会社 インダクタおよびインダクタの製造方法
US8400245B2 (en) * 2008-07-11 2013-03-19 Cooper Technologies Company High current magnetic component and methods of manufacture
JP4924598B2 (ja) * 2007-12-27 2012-04-25 Ｔｄｋ株式会社 コイル部品の継線方法
US20090256666A1 (en) * 2008-04-14 2009-10-15 Shieh Ming-Ming Inductor and a coil thereof
JP4714779B2 (ja) * 2009-04-10 2011-06-29 東光株式会社 表面実装インダクタの製造方法とその表面実装インダクタ
US9576721B2 (en) * 2013-03-14 2017-02-21 Sumida Corporation Electronic component and method for manufacturing electronic component
JP6245263B2 (ja) * 2013-07-08 2017-12-13 株式会社村田製作所 コイル部品
DE102015107605B4 (de) 2015-05-13 2018-01-25 Sma Solar Technology Ag Induktives Bauelement für Leiterplattenmontage und Wechselrichter mit einem leiterplattenmontierten induktiven Bauelement
KR101590132B1 (ko) * 2015-07-31 2016-02-01 삼성전기주식회사 트랜스포머, 및 판상 코일 성형체

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Title
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Also Published As

Publication number Publication date
DE102017106970A1 (de) 2018-10-04
CN110692113A (zh) 2020-01-14
US20200176172A1 (en) 2020-06-04
EP3602582A1 (de) 2020-02-05
JP6833061B2 (ja) 2021-02-24
CN110692113B (zh) 2023-06-16
US11488765B2 (en) 2022-11-01
ES2896501T3 (es) 2022-02-24
JP2020512702A (ja) 2020-04-23
WO2018177883A1 (de) 2018-10-04
PL3602582T3 (pl) 2022-01-17

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