EP3593937A4 - LEAD-FREE SOLDER ALLOY, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARD - Google Patents

LEAD-FREE SOLDER ALLOY, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARD Download PDF

Info

Publication number
EP3593937A4
EP3593937A4 EP18764657.5A EP18764657A EP3593937A4 EP 3593937 A4 EP3593937 A4 EP 3593937A4 EP 18764657 A EP18764657 A EP 18764657A EP 3593937 A4 EP3593937 A4 EP 3593937A4
Authority
EP
European Patent Office
Prior art keywords
lead
circuit board
electronic circuit
solder paste
free solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18764657.5A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP3593937A1 (en
Inventor
Masaya Arai
Tsukasa Katsuyama
Yurika MUNEKAWA
Takanori Shimazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tamura Corp
Original Assignee
Tamura Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Corp filed Critical Tamura Corp
Publication of EP3593937A1 publication Critical patent/EP3593937A1/en
Publication of EP3593937A4 publication Critical patent/EP3593937A4/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
EP18764657.5A 2017-03-10 2018-03-07 LEAD-FREE SOLDER ALLOY, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARD Pending EP3593937A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017046627A JP6230737B1 (ja) 2017-03-10 2017-03-10 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
PCT/JP2018/008723 WO2018164171A1 (ja) 2017-03-10 2018-03-07 鉛フリーはんだ合金、ソルダペースト及び電子回路基板

Publications (2)

Publication Number Publication Date
EP3593937A1 EP3593937A1 (en) 2020-01-15
EP3593937A4 true EP3593937A4 (en) 2020-08-05

Family

ID=60321103

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18764657.5A Pending EP3593937A4 (en) 2017-03-10 2018-03-07 LEAD-FREE SOLDER ALLOY, SOLDER PASTE AND ELECTRONIC CIRCUIT BOARD

Country Status (6)

Country Link
US (1) US20190210161A1 (ja)
EP (1) EP3593937A4 (ja)
JP (1) JP6230737B1 (ja)
KR (1) KR102494488B1 (ja)
CN (1) CN110392621A (ja)
WO (1) WO2018164171A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6349615B1 (ja) * 2017-10-03 2018-07-04 株式会社弘輝 はんだ合金、はんだ接合材料及び電子回路基板
JP6427752B1 (ja) * 2018-03-06 2018-11-28 株式会社弘輝 はんだ合金、はんだ接合材料及び電子回路基板
JP2020049543A (ja) * 2018-09-28 2020-04-02 株式会社ケーヒン はんだ材料
JP6731034B2 (ja) * 2018-12-25 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
CN114367762B (zh) * 2020-06-11 2023-08-18 中山翰华锡业有限公司 焊料合金粉、低介质损耗高可靠性焊锡膏及其制备方法
EP4086031A1 (de) * 2021-05-05 2022-11-09 Heraeus Deutschland GmbH & Co. KG Legierung
JP7032687B1 (ja) * 2021-10-22 2022-03-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、およびはんだ継手
CN114227057B (zh) * 2021-12-10 2023-05-26 北京康普锡威科技有限公司 无铅焊料合金及其制备方法、用途
WO2023248664A1 (ja) * 2022-06-23 2023-12-28 パナソニックＩｐマネジメント株式会社 接合材料および接合構造体
CN115476069A (zh) * 2022-10-28 2022-12-16 云南锡业集团（控股）有限责任公司研发中心 低Ag高热稳定性和高韧性的五元或六元无铅锡基焊料
CN116536547B (zh) * 2023-07-06 2023-10-27 有研工程技术研究院有限公司 一种橡皮泥状金属材料及其制备方法和应用

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1398697A (zh) * 2001-07-25 2003-02-26 邓和升 无铅焊料
EP1614500A1 (en) * 2003-04-01 2006-01-11 Senju Metal Industry Co., Ltd. Solder paste and printed board
EP2689885A1 (en) * 2011-03-23 2014-01-29 Senju Metal Industry Co., Ltd. Lead-free solder alloy
EP2875898A1 (en) * 2012-07-19 2015-05-27 Harima Chemicals, Inc. Solder alloy, solder paste, and electronic circuit board
US20160279741A1 (en) * 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
WO2016179358A1 (en) * 2015-05-05 2016-11-10 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
WO2016185674A1 (ja) * 2015-05-19 2016-11-24 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2722917B2 (ja) 1992-02-21 1998-03-09 松下電器産業株式会社 高温はんだ
JP3180538B2 (ja) 1993-12-17 2001-06-25 松下電器産業株式会社 フラックスおよびクリーム半田
JP3223678B2 (ja) 1993-12-24 2001-10-29 三菱電機株式会社 はんだ付け用フラックスおよびクリームはんだ
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
SG98429A1 (en) * 1999-10-12 2003-09-19 Singapore Asahi Chemical & Solder Ind Pte Ltd Lead-free solders
JP2001334385A (ja) * 2000-05-22 2001-12-04 Hitachi Ltd 電子機器用Ｓｎ−Ａｇ−Ｃｕ−Ｂｉ−Ｉｎ系はんだ
JP2002120085A (ja) * 2000-10-12 2002-04-23 H Technol Group Inc 鉛無含有はんだ合金
PT1333957E (pt) * 2000-11-16 2005-09-30 Singapore Asahi Chemical & Solder Ind Pte Ltd Soldas isentas de chumbo
US8216395B2 (en) * 2001-06-28 2012-07-10 Senju Metal Industry Co., Ltd. Lead-free solder alloy
DE10319888A1 (de) 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
KR20100113626A (ko) * 2005-06-03 2010-10-21 센주긴조쿠고교 가부시키가이샤 납프리 땜납 합금
JP4787384B1 (ja) * 2010-10-29 2011-10-05 ハリマ化成株式会社 低銀はんだ合金およびはんだペースト組成物
CN102174676A (zh) * 2011-01-27 2011-09-07 天津大学 太阳能电池用锡铟锑系无铅焊料镀锡铜带的制备方法
WO2017164194A1 (ja) * 2016-03-22 2017-09-28 株式会社タムラ製作所 鉛フリーはんだ合金、フラックス組成物、ソルダペースト組成物、電子回路基板および電子制御装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1398697A (zh) * 2001-07-25 2003-02-26 邓和升 无铅焊料
EP1614500A1 (en) * 2003-04-01 2006-01-11 Senju Metal Industry Co., Ltd. Solder paste and printed board
EP2689885A1 (en) * 2011-03-23 2014-01-29 Senju Metal Industry Co., Ltd. Lead-free solder alloy
EP2875898A1 (en) * 2012-07-19 2015-05-27 Harima Chemicals, Inc. Solder alloy, solder paste, and electronic circuit board
US20160279741A1 (en) * 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
WO2016179358A1 (en) * 2015-05-05 2016-11-10 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
WO2016185674A1 (ja) * 2015-05-19 2016-11-24 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体

Also Published As

Publication number Publication date
US20190210161A1 (en) 2019-07-11
KR102494488B1 (ko) 2023-02-01
JP6230737B1 (ja) 2017-11-15
JP2018149558A (ja) 2018-09-27
WO2018164171A1 (ja) 2018-09-13
EP3593937A1 (en) 2020-01-15
CN110392621A (zh) 2019-10-29
KR20190126276A (ko) 2019-11-11

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