EP3530087A1 - Dispositif d'impression et procédé d'impression pour appliquer une matière visqueuse ou pâteuse - Google Patents

Dispositif d'impression et procédé d'impression pour appliquer une matière visqueuse ou pâteuse

Info

Publication number
EP3530087A1
EP3530087A1 EP17781090.0A EP17781090A EP3530087A1 EP 3530087 A1 EP3530087 A1 EP 3530087A1 EP 17781090 A EP17781090 A EP 17781090A EP 3530087 A1 EP3530087 A1 EP 3530087A1
Authority
EP
European Patent Office
Prior art keywords
template
opening
partial
printing
viscous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP17781090.0A
Other languages
German (de)
English (en)
Inventor
Guenter Gera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP3530087A1 publication Critical patent/EP3530087A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0121—Patterning, e.g. plating or etching by moving electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes

Definitions

  • the invention relates to a printing device and a printing method for
  • solder paste takes place for example by means of screen printing, stencil printing or dispensing.
  • stencil printing process the underside of a sheet-like metal stencil is pressed with stencil openings onto a printed circuit board.
  • a solder paste is used as pasty solder flux Mixture applied to the top of the stencil.
  • the solder paste is then pulled over the template and thereby also pressed into the template openings.
  • the solder paste dissolves within the template openings and remains as a single Lotpastendepots on each imprinting - the connection pads - the circuit board.
  • This triggering behavior is influenced by a number of factors, such as the template opening geometry, the surface condition of the inner wall of the template opening, the material properties of the solder paste, etc. Further information can be found in the Guidelines for template design IPC 7525. This standard gives guidance in the design and manufacture of suitable stencils intended for the application of solder pastes and assembly adhesives for the assembly of SMT components. Standard values are given, such that only for an aperture ratio (AspectRatio)> 1.5 and an area ratio (AreaRatio)> 0.66 a stable process for a solder paste or adhesive application is possible.
  • the AspectRatio defines the smallest opening width of the stencil opening that shapes the paste geometry in relation to the stencil thickness.
  • the standard value for the AspectRatio ensures that, for example, when soldering in solder paste, it can be reliably introduced into the opening of the template to be filled.
  • the AreaRatio in turn gives the ratio of the projected area of the
  • Template opening to the lateral surface (inner wall) of the template opening With the guideline value for the AreaRatio, a process-reliable triggering of the template from the material geometry to be printed is made possible.
  • the AspectRatio and the AreaRatio limit the possibilities for printing particularly small structures of solder paste or adhesive depots.
  • the invention is based on the object to enable the imprint of particularly fine and small structures of a viscous or pasty material by means of stencil printing on a carrier substrate.
  • the task is aimed at improving the stable printable area and opening ratios in stencil printing.
  • circuit substrate with printed by means of stencil printing material depots, which allow as a bonding material electrical contacting of electrical and / or electronic components, in particular S MD components (surface mounted devices), with a line structure under the aspect of a high degree of miniaturization.
  • S MD components surface mounted devices
  • a printing device for applying a viscous or pasty material to a carrier substrate and molding a defined material geometry by means of a template.
  • the template provided for application and molding has at least one through opening.
  • the printing device in this case comprises, for example, a support for receiving and additionally preferably for aligning a carrier substrate to be printed.
  • the template is thereby adjacent to the surface, for example via its underside, on the printing surface of the carrier substrate hung up. Preferably, it is held stationary by fixing means for the printing process, for example.
  • the side of the opening facing the carrier substrate then acts as a job opening surface. This corresponds to the printing surface of the viscous or pasty material formed after the application or the printing process and connecting to the carrier substrate.
  • an outer boundary for the outer surface of the material geometry to be formed is formed by the opening, in particular by its inner wall.
  • the template is designed in such a way as to overcome an adhesive force of the viscous or pasty material relative to the inner wall of the opening by means of a relative movement, in particular with respect to the carrier substrate.
  • the relative movement is achieved, for example, by a positioning device brought into operative connection with the template.
  • the template is advantageously formed as a stack composite of at least two sub-templates which are adjacent to one another in a connection region.
  • the partial templates each have at least one partial opening, through which the inner wall of the opening is divided into proportionate shaping surfaces of the partial templates. Furthermore, mutually corresponding connection surfaces of the partial openings are formed in the connection region.
  • the partial templates are each reversibly separable from each other in the connection area.
  • Stencil printing were not printable.
  • the limitation of the printability was given, for example, by a detachment of the printed material on the pressure surface when lifting the stencil.
  • the detachment is due to the excessive adhesive forces of the material to be printed on the inner wall of the template opening.
  • the minimum opening width within a partial template can therefore be reduced to a dimension corresponding to the template thickness.
  • the template has a total area ratio as the ratio of the area of the inner wall to the application opening area of ⁇ 0.66.
  • a demoulding of the material geometry to be printed overall is furthermore made possible by dividing it by partial dividing with time.
  • the total areaRatio can be chosen to be arbitrarily small by increasing the number of partial slices and ensuring a triggering behavior of a respective partial template.
  • small structures can be printed stably, in particular, in a total area ratio between 0.3 to 0.5 and / or a number of 2 to 5 partial templates.
  • the triggering behavior of the Ensure partial template is shifted to the level of a partial template.
  • the provision of a partial template with a minimum stencil thickness of 10 ⁇ m is possible, in particular for the printing of solder paste depots.
  • At least one, several or preferably all Partial templates of the stacked composite have a respective template thickness within a range of 10 ⁇ m to 150 ⁇ m, preferably between 40 ⁇ m and 120 ⁇ m.
  • a simple embodiment of the printing device comprises a conventional squeegee, by means of which the viscous or pasty material is pressed by peeling over the template only mechanically into the opening of the template.
  • the template has a total aspect ratio as the ratio of the smallest opening width of the opening to the template stencil thickness of> 1.5.
  • the stencil thickness of the template results as the sum of the stencil thicknesses of all partial stencils contained in the stacked composite.
  • the printing device has a closed overpressure squeegee for introducing the viscous or pasty material into the at least one through opening of the template.
  • the closed overpressure squeegee is formed, for example, by a print head which rests on the template and an entry opening surface of the template facing away from the carrier substrate is completely covered and designed to introduce the viscous or pasty material under pressure into the opening.
  • the template can now have a total AspectRatio of ⁇ 1.5. In this way, even the smallest stable printable material geometries can be carried out, in particular also those in which the stencil requires an overall area ratio that becomes smaller and smaller than 0.6. Especially economically, small structures can be stably printed with a total Aspect Ratio of between 0.6 and 1.0.
  • the thickness of a partial template of the stacked composite in ⁇ the number of equally thick sub-templates in the stack composite, the total height of the stack composite formed from the number of equally thick sub-templates in ⁇
  • the lines Bl to B4 show limits of known printing techniques with only one template for larger circular diameter, exemplary of a small
  • the lines Dl to D5 consider the application of a pressure geometry at a constant pressure height of 150 ⁇ and similar circular diameters as in the embodiments of line Bl to B4 and Cl to C4 for certain types of components, varying from the number of sub-templates and their thicknesses.
  • the consideration within the above tabular overview is based on the achievement of a smallest part-related area ratio of 0.66 and the use of at least two sub-templates within a stack grouping.
  • Embodiments with integral AspectRation only insignificantly below 1.5 can remain uncritical under optimized process conditions even using a purely mechanical doctor. This can in principle also be ensured by the use of a closed overpressure squeegee.
  • the consideration can be continued in the same way compared to the provision of other printing geometries, in particular square, rectangular, oval or derived geometries.
  • This also applies to designs with a partially related area ratio of> 0.66, the provision of more than 3 sub-templates and / or different sub-template thicknesses within a batch network. In the simplest way can be realized by printing geometries that are not possible by the known printing techniques.
  • the at least one opening forming partial openings of at least two partial templates in the stack composite in their respective geometry and / or size are formed differently.
  • the possibility of realization results from a multiplicity of printable different material geometries.
  • those material geometries can also be implemented in which different cross-sectional areas and shapes merge into one another over different sectional planes, in particular as step geometries.
  • the number of parting planes between different cross-sectional areas and shapes of a defined material geometry therefore simply defines the required connection levels of a minimum number of partial templates.
  • at least two partial openings of a partial template may differ in their respective geometry and / or size. This results in a further flexibility in the ability to perform on a carrier substrate any printed pattern of spaced-apart material geometries by means of stencil printing.
  • the cross section of a partial opening can have a circular, an oval or a rectangular cross section. These cross sections can be made particularly simple, for example by a punching or laser cutting process.
  • a respective stencil thickness of at least two sub-templates arranged in the stacked composite is different.
  • different requirements can be taken into account with respect to a partial template, for example, the preservation of an advantageous partially related area ratio, a simple production in the case of cross-sectional jumps within the material geometry to be produced, and others.
  • the template has a plurality of openings, in particular in a pattern arrangement.
  • the pattern arrangement results, for example, from a connection diagram of an electrical and / or electronic component, in particular an S MD component, which requires printed solder paste or adhesive depots corresponding to the connection diagram on a printed circuit board.
  • symmetry points or axes of the respective openings are used and their smallest spacing from one another is determined.
  • a very simple determination results in an overall symmetrical pattern arrangement itself and / or in similar openings.
  • At least one of the partial templates are formed, for example as a metal template, preferably of stainless steel, and / or as a sheet metal template.
  • the connection region of two adjacent partial templates within the stacked composite, and preferably the contact surface of the partial template adjacent to the carrier substrate are located within a respective plane. More preferably, the support surface as well as all connection areas contained within the stack composite are arranged parallel to each other. Furthermore, a removal direction of at least one of the partial templates, preferably of all partial templates, is aligned perpendicular to the intended printing surface on the carrier substrate.
  • the printing device in particular the partial templates, at least one alignment element for the defined arrangement of the partial templates.
  • the stack composite containing the partial templates replicates the material geometry to be printed in the correct shape.
  • One possibility is to provide the partial template with registration marks, for example, which allow a reference orientation of the partial templates to one another. chen. These can also be detected by an optical system, in particular a camera system, and specify a position correction for individual partial templates. Alternatively or additionally, stop pins for mechanical alignment of the partial templates can be provided.
  • the printing device comprises at least one positioning device for carrying out a relative movement of at least one partial template within the stacked composite.
  • the positioning device is designed to separate sub-templates from each other and to allow a Operaentformung the outer surface of the material geometry of a respective sub-template.
  • the separation of the partial templates takes place synchronized with one another in terms of time and / or in a separation sequence, which also becomes more apparent in the later description of the printing method.
  • the printing device further comprises at least one guide element for the guided change in position of at least one partial template, for example during the position correction and / or during the relative movement for a Clausentformung.
  • a guiding function can also be assumed in at least one or two or three spatial directions by the positioning device.
  • Suitable printable viscous or pasty materials are, in particular, materials which, after application of the material and molding, define a defined one
  • solder pastes or conductive adhesives but in addition also thermal compounds or conductive pastes.
  • solder resist or elastic materials for example silicones, for forming vibration-damping buffer elements or structures, in particular for vibration-sensitive sensors.
  • Further processing results for example, in the form of a drying process or a physical or chemical curing process. This can be done while maintaining the molded material geometry, for example, the formation of a defined Lackstoppgeometrie o- or Schwingpuffergeometrie.
  • the originally formed material geometry as far as possible or at least partially lost.
  • the molded material geometry comprises at least one defined shape and
  • the printing device is designed as a solder paste printing device with a Lotpastenschablone for receiving a solder paste or the printing device is designed as an adhesive printing device with an adhesive template for receiving an adhesive. Additional guidelines for the design and manufacture of these stencils can be found in the aforementioned IPC 7525 standard.
  • the invention also leads to a printing method for applying a viscous or pasty material to a carrier substrate and forming a defined material geometry by means of a template. Such a printing method can be carried out, for example, by one of the previously described embodiments of a printing device according to the invention.
  • the stencil has at least one through opening with an application opening surface facing the carrier substrate.
  • the opening with its inner wall forms an outer boundary for the specialtyformende outer surface of the material geometry.
  • a particular advantage results in particular from the fact that a maximum shaping surface of the template is determined for a peripheral outer surface section of the material geometry, with which a relative force of the stencil, in particular to the carrier substrate, an adhesive force of the viscous or pasty material are still overcome to the forming surface can. It is further provided that it is started with a time offset to each other, at least two outer surface portions of the material geometry, each with up to an area size of the particular molding surface through the
  • the proportional shaping surface can be designed up to a value of the determined maximum molding surface.
  • the separation from the stacked composite is preferably carried out according to the order of arrangement of the partial templates within the stacked composite. Accordingly, in the stack composite from the carrier substrate furthest outboard sub-template is the first separated from the stack composite. This is followed by the lifting and separating respectively of the next partial template to the last separate partial template. The partial template initially resting on the carrier substrate is then finally lifted off the carrier substrate. The formation of the stack composite in preparation for a printing process is then carried out in reverse order by a corresponding placement of the partial templates.
  • a particular embodiment provides that at least one of the outer surface sections is completely removed from the mold with up to an area size of the determined maximum molding surface, before the demolding of at least one further outer surface section is started. In this way, a very stable process control can be set, since at a particular time of the printing process only a partial template is pressure-active.
  • An alternative embodiment of the printing method differs in that after a partial region of at least one outer surface section has already been removed from the mold, at least one further outer surface region is then demolded at the same time.
  • the simultaneous demoulding is carried out in such a way that at each subsequent time an area size of the residual surfaces of these outer surface sections still to be demoulded is smaller than the determined maximum forming area. This results in the advantage of a temporally optimized and fast printing speed.
  • the viscous or pasty material is formed as a material depot on a connection pad of a printed circuit board, a DBC, an LTCC, an IMC, a wafer or a solar cell with the defined material geometry.
  • This makes it possible to carry out a very flexible electronics production with very fine and small printing structures inexpensively and within the scope of a series production.
  • a solder paste, a thermal paste, a conductive paste or a conductive adhesive is printed as the viscous or pasty material on the carrier substrate, in particular on the above.
  • the invention also leads to a circuit carrier with a stencil-applied at least one material depot having a defined material geometry.
  • the circuit carrier comprises at least one line structure and can be equipped with an at least one electrical and / or electronic component after printing on material depots for electrical contacting with the line structure.
  • Such a circuit carrier can in particular be produced with one of the previously described embodiments of a printing method according to the invention and / or with one of the previously described embodiments of a printing device according to the invention.
  • the printed on at least one material depot in particular a solder paste or an adhesive depot, has an imprinting surface connected to the carrier substrate and the material geometry has an outer surface formed by an inner wall of an opening of the printing stencil, wherein a ratio of the outer surface to the imprinting surface ⁇ 0.66.
  • Such formed small pressure structures allow the implementation of a high degree of miniaturization.
  • the printed material depot has different cross-sectional areas and / or shapes parallel to the imprint area in sectional planes. This allows a wide range of application be covered by a flexible mapping of different material geometries of a required material depot.
  • a circuit carrier having a plurality of material depots in the form of a pattern arrangement is designed, for example, corresponding to a connection diagram of an electrical and / or electronic component, in particular an SMD component.
  • electrical and / or electronic components with a very small pitch in particular a pitch between 0.1 mm and 1.0 mm, with, for example, a printed circuit board, a DBC, an LTCC, an IMC, a wafer or a solar cell be material connected to the circuit carrier, for example, soldered or glued.
  • FIG. 2 shows a section of the printing stencil in a shaping area for a material geometry to be printed
  • FIG. 4 shows an alternative introduction of the viscous or pasty material into the opening of a template by means of an overpressure squeegee.
  • the printing device 100 comprises at least one support 10 for receiving a carrier substrate 20 to be printed, in particular a circuit carrier.
  • the carrier substrate 20 is, for example, a printed circuit board, a DBC, an LTCC, an IMC, a wafer or a solar cell.
  • the carrier substrate 20 rests with an underside on the support 10.
  • the carrier substrate 20 is aligned by means of an alignment and / or fixing unit 12 with a defined orientation within the printing device 100 and / or fixed in place on the support 10.
  • Support substrate 20 is formed at least one connection pad 25 for electrical contacting of an electrical and / or electronic component.
  • a material depot 26 with a defined material geometry 45 is subsequently to be printed on at least one connection pad 25.
  • a novel printing template as a stack composite
  • the stack composite 50 in this case comprises at least two partial templates 50.1, 50.2, whereby further partial templates 50.x may be included as needed.
  • 2 shows an enlarged detail of a cutout A of the printing stencil 50 in a shaping region for a material geometry 45 to be printed, for example a cylindrical material depot 26.
  • the material geometry 45 has an outer surface 46 to be shaped in a defined manner.
  • the outer surface 46 has been formed by a continuous opening 55 in a single template 50 '(shown schematically in the right side view).
  • the inner wall of the opening 55 forms, over a pressure height h, an outer boundary for the outer surface 46 of the material geometry 45 to be formed.
  • the side of the opening 55 facing the carrier substrate 20 acts as an order opening surface 50.1c. This agrees with the later imprint area on the carrier substrate 20.
  • the left-hand side view schematically shows the execution of the new printing stencils as a stacked composite 50 of at least two in a connecting stack 50. area 30 mutually adjacent sub-templates 50.1, 50.2. 50.x shown.
  • the sub-templates 50.1, 50.2. 50.x are each designed with a stencil thickness h1, h2, hx and each have at least one partial opening 55.1, 55.2, 55.x, through which the inner wall of the opening 55 rests on proportionate shaping surfaces 50.1a, 50.2a, 50. xa sub-templates 50.1, 50.2, 50.x is divided.
  • connection surfaces 50.1b, 50.2b, 50.xb of the partial openings 50.1, 50.2, 50.x are formed, via which the printing material 40 introduced into the partial openings 55.1, 55.2, 55.x merges seamlessly into one another.
  • proportionate shaping surfaces 50.1a, 50.2a, 50.xa corresponding outer surface sections 46.1, 46.2, 46.x are partially demoulded with respect to time. Overall, the execution as stack composite 50 allows a reduced total AreaRatio.
  • FIGS. 1b) to le the execution of a printing process is shown, wherein a further partial template 50.x has not been shown for reasons of clarity.
  • a viscous or pasty material 40 in the present example, a solder paste or a conductive adhesive for printing the connection pads 25, is provided via an applicator 65.
  • the application device 65 comprises, for example, a doctor blade, with the aid of which the solder paste or the conductive adhesive 40-as shown in FIG. 1c-is drawn over the surface of the most outermost sub-template 50.2 or 50.x.
  • the solder paste or the conductive adhesive 40 is mechanically pressed into the openings 55 of the stack assembly 50.
  • Part template 50.1 executed.
  • Fig. Le the lifting of the last resting on the carrier substrate 20 sub-template 50.1 is shown, whereby a total of the demolding of the entire material geometry 45 is carried out and the Druckvor- completed as such.
  • Partial templates 50.1, 50.2, 50.x by the positioning device 60 relative to the carrier substrate 20 and the support 10. Conversely, for example, the formation of the stack composite 50 is preferably carried out as well by the positioning device 60. In this case, for example, register marks 80 applied to the partial templates 50.1, 50.2, 50.x can be used for their alignment within the
  • Stack composite 50 are used. Other known Ausricht. come into question as well. Guiding elements 70 operatively connected to the sub-templates 50.1, 50.2, 50.x each ensure very precisely executed partial demouldings of the material geometry 45. Overall, after the printing process now solder paste depots or glue deposits 26 on the outer pads
  • solder paste depots or adhesive depots are designed in the form of a pattern arrangement, which corresponds in particular to the connection diagram of an electrical and / or electronic component to be electrically connected to the carrier substrate 20.
  • a material connection with the carrier substrate 20 can take place.
  • FIGS. 3a) to 3d different embodiments of a stack composite 50 with partial templates 50.1, 50.2, 50.x are shown. Common to all is that a certain material geometry 45 to be printed is imaged through an opening 55 in the stacked composite 50.
  • FIGS. 3a) to 3d different embodiments of a stack composite 50 with partial templates 50.1, 50.2, 50.x are shown. Common to all is that a certain material geometry 45 to be printed is imaged through an opening 55 in the stacked composite 50.
  • FIGS. 3a) to 3d different embodiments of a stack composite 50 with partial templates 50.1, 50.2, 50.x are shown. Common to all is that a certain material geometry 45 to be printed is imaged through an opening 55 in the stacked composite 50.
  • the stack composite 50 respectively comprises two partial templates 50. 1, 50. 2, while also more than two partial templates 50. 1, 50. 2, 50. X (3 partial templates shown by way of example in FIG. be used.
  • the partial templates 50. 1, 50. 2 have the same design. In this way, a material geometry 45 can be printed with the same cross-section.
  • the partial templates 50.1, 50.2 each have the same template thickness h1. However, the partial openings 55.1, 55.2 contained in the partial templates 50.1, 50.2 differ in their
  • Partial openings 55.1, 55.2, 55.x Overall, further embodiments of stack assemblies 50 are conceivable which result, for example, from a partial combination of two or more partial aspects of the embodiments of stack assemblies 50 shown in FIGS. 3 a) to d).
  • FIG. 4 shows an alternative introduction of the viscous or pasty printing material 40 into the openings 55 of the stack composite 50 by means of an overpressure doctor blade 65 '.
  • This includes, for example, a receiving chamber 66 with the printing material 40 contained therein.
  • the receiving chamber 66 is, for example, also designed as a print head, which rests on the template or the uppermost partial template 50.x of the stacked composite 50 when the printing material 40 is introduced.
  • the print head covers at least one entry opening area 56 of the template facing away from the carrier substrate 20.
  • the printhead is configured to introduce the printing material 40 into the at least one opening 55.
  • the printing material 40 is thereby forced out of the receiving chamber 66 via a feed device (not shown) and introduced into the opening 55 with overpressure Pr.
  • the overpressure Pr is in particular compared to. a present outside the receiving chamber 66 external pressure Pa, for example, the atmospheric pressure, increased accordingly.
  • the printed material 40 introduced into the opening 55 is finally separated from the Removing chamber 66 withdrawn from outside squeegee 67.
  • Fig. 4 shows the overpressure squeegee 65 'at a time of printing, which corresponds to that in Fig. Lc.
  • the center-to-center spacing (pitch) of two next adjacent apertures 55 is shown.
  • a plurality of material depots 26 are printed on the carrier substrate 20 in a pitch distance from one another in the form of a pattern arrangement 27.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Screen Printers (AREA)
  • Printing Methods (AREA)

Abstract

L'invention concerne un dispositif d'impression destiné à appliquer une matière visqueuse ou pâteuse sur un substrat porteur et à former une géométrie de matière définie au moyen d'un gabarit. Le gabarit destiné à l'application et au formage comporte au moins une ouverture traversante. Le côté de l'ouverture qui est dirigé vers le substrat porteur agit alors comme une surface d'ouverture d'application. En outre, une limite extérieure destinée à la surface extérieure à former de la géométrie de matière est formée par l'ouverture, en particulier par sa paroi intérieure. Dans l'ensemble, le gabarit est conçu pour surmonter une force d'adhérence de la matière visqueuse ou pâteuse à la paroi intérieure de l'ouverture par un mouvement relatif, notamment par rapport au substrat porteur. Le gabarit est avantageusement formé comme une pile composite constituée d'au moins deux sous-gabarits qui sont adjacents l'un à l'autre dans une région de connexion. Les sous-gabarits comportent chacun au moins une ouverture partielle par laquelle la paroi intérieure de l'ouverture est divisée en surfaces de formage partagées des sous-gabarits. En outre, des surfaces de connexion mutuellement correspondantes des ouvertures partielles sont formées dans la région de connexion. De plus, les sous-gabarits sont chacun séparables l'un de l'autre de manière réversible dans la région de connexion.
EP17781090.0A 2016-10-21 2017-10-06 Dispositif d'impression et procédé d'impression pour appliquer une matière visqueuse ou pâteuse Withdrawn EP3530087A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016220678.8A DE102016220678A1 (de) 2016-10-21 2016-10-21 Druckvorrichtung und Druckverfahren zum Auftragen eines viskosen oder pastösen Materials
PCT/EP2017/075527 WO2018073024A1 (fr) 2016-10-21 2017-10-06 Dispositif d'impression et procédé d'impression pour appliquer une matière visqueuse ou pâteuse

Publications (1)

Publication Number Publication Date
EP3530087A1 true EP3530087A1 (fr) 2019-08-28

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EP17781090.0A Withdrawn EP3530087A1 (fr) 2016-10-21 2017-10-06 Dispositif d'impression et procédé d'impression pour appliquer une matière visqueuse ou pâteuse

Country Status (5)

Country Link
US (1) US20190320536A1 (fr)
EP (1) EP3530087A1 (fr)
CN (1) CN109845416A (fr)
DE (1) DE102016220678A1 (fr)
WO (1) WO2018073024A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11576266B2 (en) * 2020-09-03 2023-02-07 International Business Machines Corporation Multilayer screen printing stencil
CN115179641A (zh) * 2021-12-16 2022-10-14 广东盛唐新材料技术有限公司 印刷组件及其使用方法

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Also Published As

Publication number Publication date
DE102016220678A1 (de) 2018-04-26
WO2018073024A1 (fr) 2018-04-26
CN109845416A (zh) 2019-06-04
US20190320536A1 (en) 2019-10-17

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