EP3480338B1 - Dépôt autocatalytique d'alliage de nickel-phosphore et électrolyte correspondant - Google Patents
Dépôt autocatalytique d'alliage de nickel-phosphore et électrolyte correspondant Download PDFInfo
- Publication number
- EP3480338B1 EP3480338B1 EP18201278.1A EP18201278A EP3480338B1 EP 3480338 B1 EP3480338 B1 EP 3480338B1 EP 18201278 A EP18201278 A EP 18201278A EP 3480338 B1 EP3480338 B1 EP 3480338B1
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- European Patent Office
- Prior art keywords
- group
- electrolyte
- hydrogen atom
- nickel
- salts
- Prior art date
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- 239000003792 electrolyte Substances 0.000 title claims description 29
- 229910001096 P alloy Inorganic materials 0.000 title claims description 12
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical group [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 title claims description 9
- 230000008021 deposition Effects 0.000 title description 18
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 15
- 150000003839 salts Chemical class 0.000 claims description 15
- 235000010323 ascorbic acid Nutrition 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 239000011668 ascorbic acid Substances 0.000 claims description 9
- 229960005070 ascorbic acid Drugs 0.000 claims description 8
- -1 nickel cations Chemical class 0.000 claims description 8
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- ZPSJGADGUYYRKE-UHFFFAOYSA-N 2H-pyran-2-one Chemical compound O=C1C=CC=CO1 ZPSJGADGUYYRKE-UHFFFAOYSA-N 0.000 claims description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- CIWBSHSKHKDKBQ-DUZGATOHSA-N D-isoascorbic acid Chemical compound OC[C@@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-DUZGATOHSA-N 0.000 claims description 4
- 235000010350 erythorbic acid Nutrition 0.000 claims description 4
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 claims description 4
- 229940026239 isoascorbic acid Drugs 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 3
- 239000008139 complexing agent Substances 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 description 19
- 229910052698 phosphorus Inorganic materials 0.000 description 19
- 239000011574 phosphorus Substances 0.000 description 19
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 18
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- YIKYNHJUKRTCJL-UHFFFAOYSA-N Ethyl maltol Chemical compound CCC=1OC=CC(=O)C=1O YIKYNHJUKRTCJL-UHFFFAOYSA-N 0.000 description 5
- 229910000990 Ni alloy Inorganic materials 0.000 description 5
- 150000001768 cations Chemical class 0.000 description 5
- 229940093503 ethyl maltol Drugs 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- JVTAAEKCZFNVCJ-REOHCLBHSA-N L-lactic acid Chemical compound C[C@H](O)C(O)=O JVTAAEKCZFNVCJ-REOHCLBHSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 239000004287 Dehydroacetic acid Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 235000019258 dehydroacetic acid Nutrition 0.000 description 3
- 229940061632 dehydroacetic acid Drugs 0.000 description 3
- JEQRBTDTEKWZBW-UHFFFAOYSA-N dehydroacetic acid Chemical compound CC(=O)C1=C(O)OC(C)=CC1=O JEQRBTDTEKWZBW-UHFFFAOYSA-N 0.000 description 3
- PGRHXDWITVMQBC-UHFFFAOYSA-N dehydroacetic acid Natural products CC(=O)C1C(=O)OC(C)=CC1=O PGRHXDWITVMQBC-UHFFFAOYSA-N 0.000 description 3
- 238000010348 incorporation Methods 0.000 description 3
- BEJNERDRQOWKJM-UHFFFAOYSA-N kojic acid Chemical compound OCC1=CC(=O)C(O)=CO1 BEJNERDRQOWKJM-UHFFFAOYSA-N 0.000 description 3
- 229960004705 kojic acid Drugs 0.000 description 3
- WZNJWVWKTVETCG-UHFFFAOYSA-N kojic acid Natural products OC(=O)C(N)CN1C=CC(=O)C(O)=C1 WZNJWVWKTVETCG-UHFFFAOYSA-N 0.000 description 3
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 239000012736 aqueous medium Substances 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 229940046892 lead acetate Drugs 0.000 description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 2
- 230000001603 reducing effect Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
- KOUDKOMXLMXFKX-UHFFFAOYSA-N sodium oxido(oxo)phosphanium hydrate Chemical compound O.[Na+].[O-][PH+]=O KOUDKOMXLMXFKX-UHFFFAOYSA-N 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 150000003464 sulfur compounds Chemical class 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- 150000000996 L-ascorbic acids Chemical class 0.000 description 1
- CIWBSHSKHKDKBQ-VHUNDSFISA-N L-isoascorbic acid Chemical compound OC[C@H](O)[C@@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-VHUNDSFISA-N 0.000 description 1
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- 229910001439 antimony ion Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 229940072107 ascorbate Drugs 0.000 description 1
- 229910001451 bismuth ion Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 229940085605 saccharin sodium Drugs 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
Definitions
- the present invention relates to a chemical, i. H. externally electroless process for generating a nickel alloy by electroless metal deposition in an aqueous electrolyte and a corresponding electrolyte.
- Electroless nickel Phosphorus is used as protection against corrosion and wear. d. Usually deposited on metallic materials in the form of a nickel coating. In contrast to galvanic nickel processes, no electronic current is used for the deposition.
- nickel alloys are nickel-phosphorus alloys that are used in particular in functional areas of application.
- the layer properties can be controlled via the phosphorus deposited in the layer. A distinction is made between a high (10-14% by weight), medium (9-12% by weight) and low (3-7% by weight) phosphorus content.
- a method for producing a lead-free nickel alloy in which a metallic substrate is immersed in an aqueous electrolyte containing nickel cations, hypophosphite ions, bismuth ions in a concentration of bismuth of at most 0.3 ppm and antimony ions in a concentration of antimony of at least 10 Contains ppm.
- An electrolyte for the production of lead-free nickel layers generated externally without current is from the U.S. 2,884,344 known. According to the method described there, at least two cations are added to the electrolyte, selected from the group of antimony, arsenic and bismuth.
- the electrolyte contains a metal salt, with at least one salt consisting of metal acetate, metal formate, metal oxalate, metal propionate, metal citrate and metal ascorbate, particularly preferably metal acetate, so that pore-free and crack-free coatings with constant layer properties and high phosphorus contents can be produced at an increased deposition rate.
- the resulting layers have significantly improved corrosion resistance and hardness due to the co-deposited phosphorus.
- nickel alloys with a particularly high phosphorus content are desired.
- the object of the invention is therefore to provide a method for producing a nickel alloy generated externally in a currentless manner which brings about a particularly high rate of incorporation or co-deposition of phosphorus. Another task is to provide a suitable electrolyte.
- nickel-phosphorus alloys can be produced which have a phosphorus content of greater than 10% by weight based on all components of the alloy.
- a high deposition rate is preferably achieved that a phosphorus content of more than 11% by weight based on all components of the alloy is achieved.
- the pyrones of the formula I can therefore be, inter alia, ethyl maltol, kojic acid or dehydroacetic acid (DHA).
- DHA dehydroacetic acid
- R1 represents a hydroxyl group
- R2 represents an ethyl group
- R3 and R4 represent a hydrogen atom in a pyrone of the formula I.
- ethyl maltol as an additive is particularly preferred and particularly good results are obtained with this pyrone with regard to the phosphorus content achieved. This enables phosphorus alloy proportions of over 11% by weight to be achieved.
- the electrolyte additionally contains ascorbic acid, iso- ascorbic acid or their salts, in addition to a high rate of phosphorus incorporation, the deposition of phosphorus can also be accelerated without the aid of sulfur-containing compounds or other semimetals such as selenium and Tellurium.
- a deposition rate of generally more than 12 ⁇ m, more particularly more than 16 ⁇ m and ideally more than 20 ⁇ m per hour can be achieved.
- ascorbic acid or iso- ascorbic acid or their salts in no way leads to a loss of stability.
- ascorbic acid stabilizes the system, as is to be expected from a bidentate ligand.
- ascorbic acids accelerate the deposition in a similar way to what is known from sulfur compounds.
- the known sulfur compounds can be used.
- the two types of acceleration are not mutually exclusive and can be added, ie in addition to ascorbic acid, sulfur-containing compounds of a known type can also be used. It is therefore possible to accelerate medium-phosphorous processes to up to 40 ⁇ m per hour and high-phosphorous processes to over 20 ⁇ m per hour.
- the electrolyte additionally contains a monohydroxy carboxylic acid or its salts, a further improvement in the phosphorus content can be achieved while maintaining the deposition rate.
- the pyrones of the formula I are contained in an amount between 5 ppm and the solubility limit, preferably between 0.1 g / L and 25 g / L, particularly preferably between 0.5 g / L and 20 g / L .
- the process is carried out at a temperature of the electrolyte of at least 85 ° C., preferably at least 92 ° C., a significant increase in the deposition rate can be achieved. This increase does not take place continuously, but in stages. This means that there are three discrete temperature ranges: (i) below 85 ° C there is practically no deposition, analogous to the known processes, (ii) between 86 and 91 ° C it is 50 to 70% faster than traditional processes Deposition takes place and (iii) from 92 ° C. the deposition rate is at least doubled.
- representatives (e.g. ethyl maltol, kojic acid, DHA) of the mentioned class of substances have pK values between 5 and 10, which makes it possible to increase the pH value of the coating solution to above 5 without reducing the concentration of free nickel ions would be increased in aqueous solution.
- This increase in the pH value favors the reducing properties of the hypophosphite, which more than doubles the rate of separation together with the ascorbic acid, without impairing the phosphorus incorporation.
- a particularly high separation speed is achieved when the pH value is increased to above 5 and when ascorbic acid is used at the same time.
- the invention accordingly also relates to an aqueous electrolyte for the production of nickel-phosphorus alloys containing at least nickel cations, hypophosphite ions, stabilizers, complexing agents and reducing agents, characterized in that the electrolyte additionally contains pyrons of the formula I or their salts (which release the corresponding compound in the aqueous medium), where R1 is a hydrogen atom or a hydroxyl group, R2 is a methyl group, an ethyl group or a hydroxymethyl group, R3 is a hydrogen atom or a hydroxyl group and R4 is a hydrogen atom, a hydroxyl group or a methyl ketone group.
- aqueous solution consisting of 5 g / L Ni 2+ cations, used as nickel sulfate, 40 g / L sodium hypophosphite monohydrate, 35 g / L iso-ascorbic acid, 45 g / L lactic acid, 35 g / L ethyl maltol, 2 g / L sodium saccharin and 1 ppm Pb 2+ cations, used as lead acetate, were heated to 93 ° C. at a pH of 4.5 (adjusted with sodium carbonate).
- a stainless steel / steel plate with a total surface area of 1 dm 2 which was previously cleaned for 15 minutes in a commercially available hot degreasing system with ultrasound and then activated for 4 minutes in a 10 percent hydrochloric acid solution, was coated for one hour.
- the weight of the platelet was weighed, the layer was etched off with half-concentrated nitric acid, the weight was again determined and the nickel and phosphorus content in the etching solution by ICP-OES (inductively coupled plasma atomic emission spectroscopy; instrument from Agilent Technologies (720 Series)) DIN ISO 4527 determined.
- ICP-OES inductively coupled plasma atomic emission spectroscopy
- the layer had a P alloy content of 11.2% by weight (based on all components of the alloy).
- a stainless steel / steel plate was coated there in accordance with the above information and then examined.
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemically Coating (AREA)
Claims (10)
- Procédé de production d'un alliage nickel-phosphore, procédé dans lequel un substrat métallique est immergé dans un électrolyte aqueux qui contient au moins des cations nickel, des ions hypophosphite, des stabilisants et des agents complexants, caractérisé en ce que l'électrolyte contient en outre des pyrones de la formule I
R2 représentant un groupe méthyle, un groupe éthyle ou un groupe hydroxyméthyle, R3 représentant un atome d'hydrogène ou un groupe hydroxyle et R4 représentant un atome d'hydrogène, un groupe hydroxyle ou un groupe méthylcétone. - Procédé selon la revendication 1, caractérisé en ce que R1 représente un groupe hydroxyle, R2 représente un groupe éthyle et R3 et R4 représentent un atome d'hydrogène dans un pyrone de la formule I.
- Procédé selon la revendication 1 ou 2, caractérisé en ce que l'électrolyte contient en outre de l'acide ascorbique, de l'acide iso-ascorbique et/ou leurs sels, de préférence dans une quantité comprise entre 0,5 g/L et 100 g/L.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que l'électrolyte contient en outre un acide mono-hydroxy-carboxylique ou ses sels.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que les pyrones de la formule I ou leurs sels sont contenus dans une quantité comprise entre 5 ppm et la limite de solubilité, de préférence entre 0,1 g/L et 25 g/L.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que le procédé est mis en œuvre à une température de l'électrolyte d'au moins 85 °C, de préférence d'au moins 92 °C.
- Électrolyte aqueux destiné à la production d'alliages nickel-phosphore contenant au moins des cations nickel, des ions hypophosphite, des stabilisants et des agents complexants, caractérisé en ce que l'électrolyte contient en outre des pyrones de la formule I.
R2 représentant un groupe méthyle, un groupe éthyle ou un groupe hydroxyméthyle, R3 représentant un atome d'hydrogène ou un groupe hydroxyle et R4 représentant un atome d'hydrogène, un groupe hydroxyle ou un groupe méthylcétone. - Électrolyte aqueux selon la revendication 7, caractérisé en ce que l'électrolyte contient en outre de l'acide ascorbique, de l'acide iso-ascorbique et/ou leurs sels, de préférence dans une quantité comprise entre 0,5 g/L et 100 g/L et/ou un acide mono-hydroxy-carboxylique ou ses sels.
- Électrolyte aqueux selon la revendication 7 ou 8, caractérisé en ce que l'électrolyte contient les pyrones de la formule I ou leurs sels dans une quantité comprise entre 5 ppm et la limite de solubilité, de préférence entre 0,1 g/L et 25 g/L.
- Électrolyte aqueux selon l'une des revendications 7 à 9, caractérisé en ce que l'électrolyte contient un pyrone de la formule I dans laquelle R1 représente un groupe hydroxyle, R2 représente un groupe éthyle et R3 et R4 représentent un atome d'hydrogène.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL18201278T PL3480338T3 (pl) | 2017-11-07 | 2018-10-18 | Bezprądowe osadzanie stopu niklowo-fosforowego i odpowiedni elektrolit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102017125954.6A DE102017125954A1 (de) | 2017-11-07 | 2017-11-07 | Außen stromloses Verfahren zur Erzeugung einer Nickellegierung und entsprechender Elektrolyt |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3480338A1 EP3480338A1 (fr) | 2019-05-08 |
EP3480338B1 true EP3480338B1 (fr) | 2020-09-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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EP18201278.1A Active EP3480338B1 (fr) | 2017-11-07 | 2018-10-18 | Dépôt autocatalytique d'alliage de nickel-phosphore et électrolyte correspondant |
Country Status (4)
Country | Link |
---|---|
US (1) | US20190136382A1 (fr) |
EP (1) | EP3480338B1 (fr) |
DE (1) | DE102017125954A1 (fr) |
PL (1) | PL3480338T3 (fr) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2884344A (en) | 1957-10-07 | 1959-04-28 | Reynolds Metals Co | Nickel plating |
US6706418B2 (en) * | 2000-07-01 | 2004-03-16 | Shipley Company L.L.C. | Metal alloy compositions and plating methods related thereto |
DE10052960C9 (de) | 2000-10-25 | 2008-07-03 | AHC-Oberflächentechnik GmbH & Co. OHG | Bleifreie Nickellegierung |
DE10246453A1 (de) * | 2002-10-04 | 2004-04-15 | Enthone Inc., West Haven | Verfahren zur stromlosen Abscheidung von Nickel |
CN102268658A (zh) * | 2011-07-22 | 2011-12-07 | 深圳市精诚达电路有限公司 | 一种化学镀镍液及化学镀镍工艺 |
-
2017
- 2017-11-07 DE DE102017125954.6A patent/DE102017125954A1/de not_active Ceased
-
2018
- 2018-10-18 PL PL18201278T patent/PL3480338T3/pl unknown
- 2018-10-18 EP EP18201278.1A patent/EP3480338B1/fr active Active
- 2018-11-06 US US16/181,433 patent/US20190136382A1/en not_active Abandoned
Non-Patent Citations (1)
Title |
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None * |
Also Published As
Publication number | Publication date |
---|---|
US20190136382A1 (en) | 2019-05-09 |
PL3480338T3 (pl) | 2021-02-08 |
EP3480338A1 (fr) | 2019-05-08 |
DE102017125954A1 (de) | 2019-05-09 |
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