EP3444892B1 - Power divider/combiner - Google Patents

Power divider/combiner Download PDF

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Publication number
EP3444892B1
EP3444892B1 EP17806061.2A EP17806061A EP3444892B1 EP 3444892 B1 EP3444892 B1 EP 3444892B1 EP 17806061 A EP17806061 A EP 17806061A EP 3444892 B1 EP3444892 B1 EP 3444892B1
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EP
European Patent Office
Prior art keywords
input
line
output terminal
power divider
combiner
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EP17806061.2A
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German (de)
English (en)
French (fr)
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EP3444892A1 (en
EP3444892A4 (en
Inventor
Hideharu Yoshioka
Akimichi Hirota
Naofumi Yoneda
Hidenori Ishibashi
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H01P5/19—Conjugate devices, i.e. devices having at least one port decoupled from one other port of the junction type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/32—Non-reciprocal transmission devices

Definitions

  • the present invention relates to a power divider/combiner configured to divide or combine mainly high frequency signals of a microwave band and a millimeter wave band.
  • power dividers/combiners are widely used to divide or combine high frequency signals.
  • a Wilkinson power divider/combiner among those power dividers/combiners is used in a case where an isolation is required to be secured between output terminals when the Wilkinson power divider/combiner functions as a divider, or an isolation is required to be secured between input terminals when the Wilkinson power divider/combiner functions as the combiner.
  • the related-art Wilkinson power divider/combiner includes one common terminal and two input/output terminals.
  • the common terminal becomes an input terminal during signal division, and becomes an output terminal during signal combining.
  • the two input/output terminals become output terminals during signal division, and become input terminals during signal combining.
  • the common terminal and each input/output terminal are connected to each other by a quarter-wave ( ⁇ /4) impedance transformer. Further, the input/output terminals are connected to each other via one isolation resistor called an absorption resistor.
  • Patent Literature 1 there is disclosed a configuration of such a Wilkinson power divider/combiner, in which a transmission line whose electrical length is half a wavelength ( ⁇ /2) of an operating frequency or an integer multiple of half the wavelength is provided between each input/output terminal and an isolation resistor.
  • the power divider/combiner described in Patent Literature 1 employs such a configuration of a transmission line that a phase difference between a route that connects two input/output terminals via two quarter-wave impedance transformers and a route that connects two input/output terminals via an isolation resistor (absorption resistor) is an odd multiple of 180 degrees on a power propagation route that connects the input/output terminals, to thereby achieve improvement of a degree of design freedom.
  • the integer multiple of half the wavelength relates to a frequency, and is therefore a multiple of a natural number (1, 2, 3 ...) except 0 and negative numbers, strictly speaking (the same applies below).
  • Patent Literature 2 there is disclosed a Wilkinson power divider/combiner employing a configuration in which a transmission line and a stub are provided between each input/output terminal and an isolation resistor.
  • the power divider/combiner described in Patent Literature 2 includes a distributed constant line as a transmission line between each input/output terminal and the isolation resistor.
  • the power divider/combiner enabling improvement of reflection characteristics of each input/output terminal, which have deteriorated due to an influence of a capacitive reactance of the isolation resistor, and an isolation between the input/output terminals.
  • the power divider/combiner capable of reducing a line length of the distributed constant line by inserting a stub in the transmission line provided between each input/output terminal and the isolation resistor, to thereby miniaturize a circuit.
  • US 2016/064791 A1 provides an impedance converter including a plurality of disposed characteristic impedance elements and at least one stub.
  • the disposed characteristic elements each have an electric length corresponding to a particular frequency, with their line length being the same and nearly equal to a quarter wavelength of a fundamental frequency.
  • the at least one stub is formed on a characteristic impedance element formed on a signal input side among the plurality of characteristic input elements, with potential additional stubs located in between the impedance elements.
  • Some Wilkinson power dividers/combiners formed by a multilayer board adopt such a structure that a strip conductor pattern, for example, a quarter-wave impedance transformer, is provided in a multilayer board inner layer, a chip resistor is provided as an isolation resistor on an outer surface of the multilayer board, and those strip conductor pattern and chip resistor are connected to each other by an inter-layer connection conductor called a via.
  • a strip conductor pattern for example, a quarter-wave impedance transformer
  • the distributed constant line is provided as a transmission line whose electrical length (approximately 164 deg (physical length: 42.6 mm)) is close to half a wavelength of an operating frequency (2.16 GHz) between each input/output terminal and the isolation resistor, and thus it is possible to absorb an influence of the electrical length of the via that connects the isolation chip resistor on the outer surface and the strip conductor pattern in the inner layer.
  • the reflection characteristics of each input/output terminal and the isolation between the input/output terminals deteriorate due to the influence of the impedance discontinuity occurring at the via portion.
  • Patent Literature 2 Although, through insertion of a stub in a transmission line provided between each input/output terminal and the isolation resistor in the power divider/combiner employing the configuration described in Patent Literature 2, it is possible to reduce a transmission line whose electrical length is close to half the wavelength of the operating frequency, in Patent Literature 2, there is no suggestion or explicit indication of improvement of reflection characteristics of each input/output terminal and the isolation between the input/output terminals that deteriorate due to an influence of impedance discontinuity occurring at a via portion.
  • the present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a power divider/combiner that adopts a structure suitable for a small and stacked structure when the power divider/combiner is formed by using a multilayer board, and has satisfactory reflection characteristics and isolation characteristics of a common terminal and each input/output terminal.
  • a power divider/combiner including: a common terminal configured to receive input of a high frequency signal to be divided, or output a combined high frequency signal; a first input/output terminal and a second input/output terminals, which are configured to output a divided high frequency signal or receive input of a high frequency signal to be combined; a first quarter-wave impedance transformer including one end connected to the common terminal and another end connected to the first input/output terminal; a second quarter-wave impedance transformer including one end connected to the common terminal and another end connected to the second input/output terminal; an isolation resistor configured to prevent an interference between a high frequency signal of the first input/output terminal and a high frequency signal of the second input/output terminal; a first line configured to connect the isolation resistor and the first input/output terminal, and having a length that is an integer multiple of half a wavelength; and a second line configured to connect the isolation resistor and the second input/output terminal, and having
  • the power divider/combiner that adopts the structure suitable for a small and stacked structure when the power divider/combiner is formed by using a multilayer board, and has satisfactory reflection characteristics and isolation characteristics of the common terminal and each input/output terminal.
  • a power divider/combiner is configured as a Wilkinson power divider/combiner formed by a multilayer board.
  • a strip conductor pattern that forms a quarter-wave ( ⁇ /4) impedance transformer is provided in a multilayer board inner layer, and a chip resistor is provided as an isolation resistor on an outer surface of the multilayer board.
  • the strip conductor pattern and the chip resistor are connected to each other by a transmission line that includes a via and a strip conductor, and has a length that is an integer multiple of half a wavelength ( ⁇ /2).
  • the strip conductor arranged between the via and an input/output terminal is provided with a stub.
  • an even/odd mode operation of the power divider/combiner can achieve improvement of reflection characteristics of the input/output terminal mainly during an odd mode operation. Consequently, it is possible to suppress an influence of impedance discontinuity caused by the via, and to keep satisfactory reflection characteristics of the common terminal and each input/output terminal, and a satisfactory isolation between the input/output terminals.
  • the strip conductor pattern and the chip resistor are connected to each other by a transmission line that includes the via and the strip conductor and has a length that is an integer multiple of half the wavelength ( ⁇ /2) and is an odd multiple of half the wavelength
  • the strip conductor pattern and the chip resistor are not limited to this pattern.
  • the strip conductor pattern and the chip resistor may be connected to each other by a transmission line that includes the via and the strip conductor and has a length that is the integer multiple of half the wavelength ( ⁇ /2) and is an even multiple of half the wavelength.
  • this configuration can achieve improvement of reflection characteristics of the input/output terminals mainly during the even mode operation of the even/odd mode operation of the power combiner/divider. Therefore, it is possible to suppress an influence of the impedance discontinuity caused by the via, and to keep satisfactory reflection characteristics of the common terminal and each input/output terminal, and a satisfactory isolation between the input/output terminals.
  • FIG. 1 is a configuration diagram for illustrating an example of a power divider/combiner according to the first embodiment of the present invention, and is a transparent perspective view thereof.
  • a description is given of a Wilkinson power divider/combiner that is formed mainly by a multilayer board, and adopts a structure in which a strip conductor pattern of a quarter-wave ( ⁇ /4) impedance transformer is provided in a multilayer board inner layer, a chip resistor is provided as an isolation resistor on an outer surface of the multilayer board, and the strip conductor pattern and the chip resistor are connected to each other by a transmission line that includes a via and a strip conductor and has a length that is an integer multiple of half a wavelength ( ⁇ /2).
  • a common terminal 1001 an input/output terminal 1011, an input/output terminal 1012, a quarter-wave impedance transformer strip conductor 2001, a quarter-wave impedance transformer strip conductor 2002, a transmission line strip conductor 2111, a transmission line strip conductor 2112, a transmission line strip conductor 2121, a transmission line strip conductor 2122, a stub 2401, and a stub 2402 are arranged between a dielectric layer 5001 and a dielectric layer 5002.
  • the ground conductor 3001 is arranged on a surface of the dielectric layer 5001 opposite to a surface on which the dielectric layer 5002 is arranged.
  • a via 2201 and a via 2202 are arranged so as to penetrate the dielectric layer 5002.
  • the ⁇ /4 impedance transformer strip conductor 2001 connects the common terminal 1001 and the input/output terminal 1011.
  • the ⁇ /4 impedance transformer strip conductor 2002 connects the common terminal 1001 and the input/output terminal 1012.
  • the transmission line strip conductor 2111, the stub 2401, the transmission line strip conductor 2121, the via 2201, and the chip resistor mounting conductor pattern 2301 connect the input/output terminal 1011 and the chip resistor 4001.
  • the transmission line strip conductor 2112, the stub 2402, the transmission line strip conductor 2122, the via 2202, and the chip resistor mounting conductor pattern 2302 connect the input/output terminal 1012 and the chip resistor 4001.
  • the chip resistor mounting conductor 2301 and the chip resistor mounting conductor 2302 are arranged in a cutout 6001 formed in the ground conductor 3002.
  • the chip resistor 4001 which serves as an isolation resistor, connects the chip resistor mounting conductor pattern 2301 and the chip resistor mounting conductor pattern 2302.
  • One end of the chip resistor 4001 is mounted to be located above the chip resistor mounting conductor pattern 2301, and the other end of the chip resistor 4001 is mounted to be located above the chip resistor mounting conductor pattern 2302.
  • the stub 2401 is provided between the transmission line strip conductor 2111 and the transmission line strip conductor 2121.
  • the stub 2402 is provided between the transmission line strip conductor 2112 and the transmission line strip conductor 2122.
  • FIG. 2A to FIG. 2C are views for illustrating a result of simulation indicated by a Smith chart related to an even/odd mode operation of a power divider/combiner illustrated in a transparent perspective view of FIG. 3 , which is obtained by forming a power divider/combiner of a related-art structure disclosed in Patent Literature 1 by a multilayer board, and the power divider/combiner according to the first embodiment of the present invention illustrated in FIG. 1 .
  • a case of Patent Literature 1 is indicated by A
  • a case of the first embodiment of the present invention is indicated by B.
  • a total length of the transmission line strip conductor 2111, the transmission line strip conductor 2121, the chip resistor mounting conductor pattern 2301, and the via 2201, and a total length of the transmission line strip conductor 2112, the transmission line strip conductor 2122, the chip resistor mounting conductor pattern 2302, and the via 2202 are odd multiples of half the wavelength ( ⁇ /2).
  • FIG. 2A is an illustration of reflection characteristics of the input/output terminal 1011 or the input/output terminal 1012 during the odd mode operation
  • FIG. 2B is an illustration of reflection characteristics of the input/output terminal 1011 or the input/output terminal 1012 during the even mode operation
  • FIG. 2C is an illustration of a range of 20% in fractional band of the reflection characteristics of the common terminal 1001 during the even mode operation.
  • the power divider/combiner according to the present invention illustrated in FIG. 1 can obtain characteristics close to a center (reflection zero point) of the Smith chart compared to the related-art power divider/combiner illustrated in FIG. 3 .
  • the reflection characteristics of the input/output terminal 1011 or the input/output terminal 1012 during the even mode operation of FIG. 2B and reflection characteristics of the common terminal 1001 during the even mode operation of FIG. 2C do not substantially change between the related-art power divider/combiner illustrated in FIG. 3 and the power divider/combiner according to the present invention illustrated in FIG. 1 .
  • FIG. 4A and FIG. 4B are views for illustrating a result of simulation during power distribution related to reflection characteristics and isolation characteristics of the related-art power divider/combiner formed by the multilayer board illustrated in FIG. 3 and the power divider/combiner adopting the structure according to the present invention illustrated in FIG. 1 .
  • FIG. 4A is an illustration of a result of the related-art power divider/combiner illustrated in FIG. 3 .
  • FIG. 4B is an illustration of a result of the power divider/combiner according to the present invention illustrated in FIG. 1 .
  • dotted lines A indicate reflection characteristics of the common terminal 1001
  • long broken lines B indicate reflection characteristics of the input/output terminal 1011 or the input/output terminal 1012
  • solid lines C indicate pass characteristics (division characteristics) from the common terminal 1001 to the input/output terminal 1011 or the input/output terminal 1012
  • dashed-dotted lines D indicate isolation characteristics between the input/output terminal 1011 and the input/output terminal 1012.
  • FIG. 4A focusing on the reflection characteristics of the input/output terminal 1011 or the input/output terminal 1012 indicated by the long broken line B and the isolation characteristics between the input/output terminal 1011 and the input/output terminal 1012 indicated by the dashed-dotted line D while, for example, a normalized frequency is 1, it is found that the simulation result related to the related-art power divider/combiner exhibits degraded values of -17 dB in reflection amount and -16 dB in isolation amount.
  • the power divider/combiner according to the first embodiment includes the stub 2401 and the stub 2402, and thus it is possible to obtain an effect of providing the power divider/combiner that can improve the reflection characteristics of the input/output terminal during the odd mode operation, which have deteriorated due to an influence of impedance discontinuity caused by the transmission line strip conductor 2121, the via 2201, and the chip resistor mounting conductor pattern 2301, and impedance discontinuity caused by the transmission line strip conductor 2122, the via 2202, and the chip resistor mounting conductor pattern 2302, and has satisfactory various reflection characteristics and isolation characteristics during a power dividing operation and a power combining operation.
  • FIG. 5 is an equivalent circuit diagram of the power divider/combiner according to the first embodiment of the present invention in FIG. 1 .
  • FIG. 6 is an equivalent circuit diagram of the power divider/combiner of the related-art structure formed by the multilayer board illustrated in FIG. 3 .
  • a transmission line 0131 and a transmission line 0132 which are transmission lines on a side of input/output terminals 0011 and 0012 in FIG. 6 , are replaced with a transmission line 0331, a transmission line 0431, and a stub 0051, and a transmission line 0332, a transmission line 0432, and a stub 0052 in FIG. 5 , respectively.
  • a transmission line 0231 has an impedance different from those of the transmission line 0331 and the transmission line 0431
  • a transmission line 0232 has an impedance different from those of the transmission line 0332 and the transmission line 0432, and therefore impedance discontinuity occurs.
  • the power divider/combiner is formed by the multilayer board including two layers of the dielectric layers 5001 and 5002.
  • the power divider/combiner is not limited to this, and may be formed by a multilayer board including three or more dielectric layers.
  • FIG. 7 is a configuration diagram for illustrating the power divider/combiner according to the first embodiment of the present invention, which is formed by a multilayer board including four dielectric layers, and is a transparent perspective view thereof.
  • a dielectric layer 5003 is arranged on the surface of the dielectric layer 5002 opposite to the surface on which the dielectric layer 5001 is arranged, and a dielectric layer 5004 is arranged on a surface of the dielectric layer 5003 opposite to the surface on which the dielectric layer 5002 is arranged.
  • a ground conductor 3011 is arranged between the dielectric layer 5002 and the dielectric layer 5003, and a ground conductor 3012 is arranged between the dielectric layer 5003 and the dielectric layer 5004.
  • the ground conductor 3002, the chip resistor mounting conductor pattern 2301, the chip resistor mounting conductor pattern 2302, and the chip resistor 4001 are arranged on a surface of the dielectric layer 5004 opposite to a surface on which the dielectric layer 5003 is arranged.
  • the ground conductor 3011 is provided with a cutout 6111 and a cutout 6112, and the ground conductor 3012 is provided with a cutout 6121 and a cutout 6122.
  • a via 2211 and a via 2212 are arranged so as to penetrate the dielectric layer 5002, the dielectric layer 5003, and the dielectric layer 5004, penetrate the cutout 6111 and the cutout 6112 in the ground conductor 3011, and penetrate the cutout 6121 and the cutout 6122 in the ground conductor 3012.
  • the transmission line 2111, the stub 2401, the transmission line strip conductor 2121, the via 2211, and the chip resistor mounting conductor pattern 2301 connect the input/output terminal 1011 and the chip resistor 4001.
  • the transmission line 2112, the stub 2402, the transmission line strip conductor 2122, the via 2212, and the chip resistor mounting conductor pattern 2302 connect the input/output terminal 1012 and the chip resistor 4001.
  • FIG. 1 is an illustration of a configuration example in which the via 2201 and the via 2202 are made so as to penetrate only the dielectric layer 5002, the via 2201 and the via 2202 are not limited to this, and may adopt structures made so as to penetrate the dielectric layer 5001 as illustrated in FIG. 8 .
  • the power divider/combiner illustrated in the transparent perspective view of FIG. 8 can obtain the same effect as the above-mentioned example.
  • a dielectric layer 5011 is arranged on a surface of the dielectric layer 5001 opposite to the surface on which the dielectric layer 5002 is arranged. Further, the ground conductor 3001 is arranged on a surface of the dielectric layer 5011 opposite to the surface on which the dielectric layer 5001 is arranged.
  • the via 2201 may include the stub 2501
  • the via 2202 may include the stub 2502
  • the stub 2501 and the stub 2502 may adopt structures made so as to penetrate the dielectric layer 5001 as illustrated in FIG. 8 .
  • the dielectric layer 5011 is arranged on the surface of the dielectric layer 5001 opposite to the surface on which the dielectric layer 5002 is arranged.
  • the power divider/combiner uses vias configured to transmit power and signals.
  • the power divider/combiner is not limited to this, and may be a power divider/combiner that also uses vias configured to operate as ground conductors.
  • FIG. 9A and FIG. 9B are configuration diagrams for illustrating the power divider/combiner according to the first embodiment of the present invention that also uses the vias configured to operate as the ground conductors.
  • FIG. 9A is the same transparent perspective view as that of FIG. 1
  • FIG. 9B is a top view for illustrating the vias configured to operate as a strip conductor and a ground conductor arranged in the dielectric layer 5001 and the dielectric layer 5002 without the dielectric layer and the ground conductor.
  • ground outer conductor vias 7001 and ground outer conductor vias 7002 penetrate the dielectric layer 5001 and the dielectric layer 5002, and connect the ground conductor 3001 and the ground conductor 3002. Further, the plurality of ground outer conductor vias 7001 are arranged in parallel to the via 2201 surrounding the via 2201 in a plane perpendicular to an axial direction of the via 2201. Similarly, the plurality of ground outer conductor vias 7002 are also arranged in parallel to the via 2202 surrounding the via 2202 in a plane perpendicular to the axial direction of the via 2202.
  • the power divider/combiner illustrated in FIG. 9A and FIG. 9B includes the vias 7001 and 7002 configured to function as the ground conductors around the vias 2201 and 2202 configured to function as signal conductors.
  • the power divider/combiner that can achieve signal transmission in a coaxial mode in an inter-layer connection portion, suppress power leakage, and achieve low loss, and to obtain the same effect as the above-mentioned example.
  • FIG. 10 is a configuration diagram for illustrating the power divider/combiner according to the first embodiment of the present invention that includes stubs that can be adjusted only during each mode of the even/odd mode operation, and is a transparent perspective view thereof.
  • a stub 2400 is arranged at a point at which the ⁇ /4 impedance transformer strip conductor 2001 and the ⁇ /4 impedance transformer strip conductor 2002 are connected.
  • the power divider/combiner illustrated in FIG. 10 includes the stub 2400, the stub 2401, and the stub 2402, and thus it is possible to obtain the power divider/combiner having a high degree of design freedom, and to obtain the same effect as that of the above-mentioned example.
  • FIG. 11 is a configuration diagram for illustrating a power divider/combiner that uses microstrip lines according to a second embodiment of the present invention, and is a transparent perspective view thereof.
  • the microstrip line adopts a structure that makes dielectric layers and outer conductors above inner conductors unnecessary in the strip line in each of the above-mentioned examples.
  • inner conductors denoted by reference numerals 1001, 2001, 1011, 2111, 2401, 2121, 2122, 2402, 2112, 1012 and 2002 in each of the above-mentioned examples are formed by the microstrip lines. Accordingly, ground conductors are not arranged on a surface of a dielectric layer 5002 opposite to a surface on which a dielectric layer 5001 is arranged.
  • the second embodiment it is possible to widen an impedance control range of each transmission line by using the microstrip lines, to thereby improve the degree of design freedom and obtain the same effect as that of the first embodiment.
  • the power divider/combiner that connects the common terminal 1001 and the input/output terminals 1011 and 1012 by each ⁇ /4 impedance transformer.
  • one end of the ⁇ /4 impedance transformer may be connected to the common terminal 1001
  • the other end of the ⁇ /4 impedance transformer and the input/output terminals 1011 and 1012 may be connected to each other by each ⁇ /4 transmission in the power divider/combiner.
  • FIG. 12 is a configuration diagram for illustrating a power divider/combiner according to a third embodiment of the present invention, and is a transparent perspective view thereof.
  • a quarter-wave ( ⁇ /4) impedance transformer strip conductor 2010 is connected to the common terminal 1001. Further, a terminal opposite to the terminal of the ⁇ /4 impedance transformer strip conductor 2010 connected to the common terminal 1001, and the input/output terminal 1011 are connected to each other by a quarter-wave ( ⁇ /4) strip conductor 2011. Further, a terminal opposite to a terminal of the ⁇ /4 impedance transformer strip conductor 2010 connected to the common terminal 1001, and the input/output terminal 1012 are connected to each other by a quarter-wave ( ⁇ /4) strip conductor 2012.
  • the ⁇ /4 impedance transformer strip conductor 2010 can form a low impedance transmission line through provision of the ⁇ /4 impedance transformer strip conductor 2010 between the common terminal 1001, and the ⁇ /4 strip conductor 2011 and the ⁇ /4 strip conductor 2012.
  • the ⁇ /4 impedance transformer strip conductor 2010 can improve the degree of design freedom of the power divider/combiner, and to obtain the same effect as that of the first embodiment.
  • a stub 2400 may be provided between the ⁇ /4 strip conductor 2011 and the ⁇ /4 strip conductor 2012 as illustrated in FIG. 14 .
  • a power divider/combiner including the chip resistor 4001 mounted on an outer surface of a multilayer board
  • a power divider/combiner may include the chip resistor 4001 mounted in a multilayer board inner layer.
  • FIG. 13 is a configuration diagram for illustrating a power divider/combiner according to a fourth embodiment of the present invention, and is a transparent perspective view thereof.
  • the chip resistor 4001 is arranged in a dielectric layer 5003, and a ground conductor 3003 is arranged on a surface of the dielectric layer 5003 opposite to a surface on which a dielectric layer 5002 is arranged.
  • the chip resistor 4001 is arranged in the dielectric layer 5003, and thus it is possible to reduce an occupation area of a multilayer board outer surface, and to obtain the same effect as that of the above first embodiment.
  • the transmission line strip conductor 2111 and the transmission line strip conductor 2121 form the first conductor cascade line (2111, 2121) in each of the above-mentioned embodiments.
  • the transmission line strip conductor 2112 and the transmission line strip conductor 2122 form the second conductor cascade line (2112, 2122).
  • first conductor cascade line (2111, 2121) and the second conductor cascade line (2112, 2122) are both formed by connecting at least two or more line portions of different impedances in cascade.
  • the first conductor cascade line (2111, 2121) is provided with the first stub (2401) at a line portion located on a side closer to the first input/output terminal 1011 than a center in a longitudinal direction of the first conductor cascade line (2111, 2121).
  • the second conductor cascade line (2112, 2122) is provided with the second stub (2402) at a line portion located on a side closer to the second input/output terminal 1012 than a center in a longitudinal direction of the second conductor cascade line (2112, 2122).
  • the vias 2201 and 2202 form vertical connection conductors
  • the ground outer conductor via 7001 and the ground outer conductor via 7002 form ground vertical conductors.
  • stubs are provided one by one from the input/output terminal 1011 to the chip resistor mounting conductor pattern 2301 and from the input/output terminal 1012 to the chip resistor mounting conductor pattern 2302, but two or more stubs may be provided.
  • a total length of the transmission line strip conductor 2111, the transmission line strip conductor 2121, the chip resistor mounting conductor pattern 2301 and the via 2201, and a total length of the transmission line strip conductor 2112, the transmission line strip conductor 2122, the chip resistor mounting conductor pattern 2302, and the via 2202 are an odd multiple of an integer multiple of half a wavelength ( ⁇ /2) in each of the above embodiments, it is possible to provide an effect of providing a power divider/combiner that can adjust reflection characteristics of the input/output terminal during an odd mode operation, and have satisfactory various reflection characteristics and isolation characteristics during a power dividing operation and a power combining operation.
  • the total length of the transmission line strip conductor 2111, the transmission line strip conductor 2121, the chip resistor mounting conductor pattern 2301, and the via 2201, and the total length of the transmission line strip conductor 2112, the transmission line strip conductor 2122, the chip resistor mounting conductor pattern 2302, and the via 2202 are an even multiple of the integer multiple of half the wavelength ( ⁇ /2), it is possible to provide an effect of providing the power divider/combiner that can adjust reflection characteristics of the input/output terminal during an even mode operation, and have satisfactory various reflection characteristics and isolation characteristics during the power dividing operation and the power combining operation.
  • the number of stubs may be one or more in each case.
  • a first line which is formed by the transmission line strip conductor 2111, the transmission line strip conductor 2121, a transmission line strip conductor 2131, the chip resistor mounting conductor pattern 2301, and the via 2201, and has the length that is an even multiple of half the wavelength, is provided with the stub 2401 located at a line portion on a side closer to the input/output terminal 1011 than the center, and a stub 2411 located at a line portion that is apart by a quarter wavelength from the stub 2401 toward the input/output terminal 1011.
  • a second line which is formed by the transmission line strip conductor 2112, the transmission line strip conductor 2122, a transmission line strip conductor 2132, the chip resistor mounting conductor pattern 2302, and the via 2202, and has the length that is an even multiple of half the wavelength, is provided with the stub 2402 located at a line portion on a side closer to the input/output terminal 1012 than the center, and a stub 2412 located at a line portion that is apart by a quarter wavelength from the stub 2402 to the input/output terminal 1012.
  • FIG. 16 is a configuration diagram for illustrating the power divider/combiner that uses the microstrip lines according to the fifth embodiment of the present invention, and is a transparent perspective view thereof.
  • the microstrip line adopts a structure that makes dielectric layers and outer conductors above inner conductors indicated as, for example, a ground conductor 3002 unnecessary on the strip lines of each of the above-mentioned examples.
  • a common terminal 0001 corresponds to the common terminal 1001
  • transmission lines 0021 and 0022 correspond to the ⁇ /4 impedance transformer strip conductors 2001 and 2002
  • input/output terminals 0011 and 0012 correspond to the input/output terminals 1011 and 1012
  • a resistor 0041 corresponds to the chip resistor 4001.
  • the transmission lines 0331, 0431 and 0231 of FIG. 5 correspond to the transmission line strip conductors 2111 and 2121, the chip resistor mounting conductor pattern 2301, and the via 2201, and further include the transmission line strip conductor 2131 in cases of FIG. 15 and FIG. 16 .
  • the transmission lines 0332, 0432 and 0232 correspond to the transmission line strip conductors 2112 and 2122, the chip resistor mounting conductor pattern 2302, and the via 2202, and further include the transmission line strip conductor 2132 in the cases of FIG. 15 and FIG. 16 .
  • the stub 0051 corresponds to the stub 2401, and further includes the stub 2411 in the cases of FIG. 15 and FIG. 16 .
  • the stub 0052 corresponds to the stub 2402, and further includes the stub 2412 in the cases of FIG. 15 and FIG. 16 .
  • the power divider/combiner according to the present invention is applicable to power divider/combiners to be used in a large number of fields.

Landscapes

  • Non-Reversible Transmitting Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Microwave Amplifiers (AREA)
  • Waveguide Aerials (AREA)
  • Waveguides (AREA)
EP17806061.2A 2016-06-03 2017-02-02 Power divider/combiner Active EP3444892B1 (en)

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PCT/JP2016/066555 WO2017208432A1 (ja) 2016-06-03 2016-06-03 電力分配合成器
PCT/JP2017/003817 WO2017208499A1 (ja) 2016-06-03 2017-02-02 電力分配合成器

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EP3444892A1 EP3444892A1 (en) 2019-02-20
EP3444892A4 EP3444892A4 (en) 2019-04-24
EP3444892B1 true EP3444892B1 (en) 2021-03-24

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CA3087290A1 (en) * 2018-02-28 2019-09-06 Raytheon Company Additive manufacturing technology (amt) low profile signal divider
WO2019187872A1 (ja) 2018-03-27 2019-10-03 株式会社村田製作所 アンテナモジュール
CN112189280B (zh) 2019-01-22 2021-06-04 株式会社村田制作所 天线模块和通信装置
CN111540997B (zh) * 2020-04-29 2022-04-01 西南电子技术研究所（中国电子科技集团公司第十研究所） 集成垂直过渡功分器
US11177547B1 (en) * 2020-05-05 2021-11-16 Raytheon Company Three-dimensional branch line coupler
JP2022121965A (ja) * 2021-02-09 2022-08-22 住友電気工業株式会社 ウィルキンソン分配器、ウィルキンソン合成器、及び増幅器
CN115588833A (zh) * 2021-07-05 2023-01-10 中兴通讯股份有限公司 内层带状功分器电路及功分器系统
CN117280541A (zh) * 2022-02-09 2023-12-22 株式会社藤仓 分离器-组合器和级联连接电路
CN114976554A (zh) * 2022-06-21 2022-08-30 中国电子科技集团公司第五十五研究所 一种基于P波段的小型化大功率Wilkinson功分器

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Publication number Publication date
US10930995B2 (en) 2021-02-23
JPWO2017208499A1 (ja) 2018-11-29
US20200235456A1 (en) 2020-07-23
CN109314300A (zh) 2019-02-05
WO2017208432A1 (ja) 2017-12-07
WO2017208499A1 (ja) 2017-12-07
EP3444892A1 (en) 2019-02-20
EP3444892A4 (en) 2019-04-24
JP6395980B2 (ja) 2018-09-26
CN109314300B (zh) 2021-06-01

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