EP3392910B1 - Boitier hermetique de composant electronique, en particulier pour capteur d'image - Google Patents

Boitier hermetique de composant electronique, en particulier pour capteur d'image Download PDF

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Publication number
EP3392910B1
EP3392910B1 EP18166608.2A EP18166608A EP3392910B1 EP 3392910 B1 EP3392910 B1 EP 3392910B1 EP 18166608 A EP18166608 A EP 18166608A EP 3392910 B1 EP3392910 B1 EP 3392910B1
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EP
European Patent Office
Prior art keywords
zone
peripheral wall
closing plate
glue
casing
Prior art date
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Application number
EP18166608.2A
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German (de)
English (en)
French (fr)
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EP3392910A1 (fr
Inventor
Philippe Sandri
Pierre Reber
Charlotte Alluis
Laurent Riondet
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Teledyne e2v Semiconductors SAS
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Teledyne e2v Semiconductors SAS
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14698—Post-treatment for the devices, e.g. annealing, impurity-gettering, shor-circuit elimination, recrystallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures

Definitions

  • the invention relates to a hermetic electronic component housing, particularly for aerospace applications.
  • the invention applies in particular to image sensors.
  • the encapsulation of an electronic component (bare chip or component) in a hermetic case offers mechanical and chemical protection against attacks linked to its external operational environment. In certain cases, it is also a question of maintaining a more or less high vacuum (absence of gas or controlled nature and quantity of gas) in the internal cavity of the case to allow correct operation of the electronic component placed in this cavity.
  • FIG. 1 illustrates for example the encapsulation of an integrated circuit chip.
  • the chip 1 is glued to the bottom of a cavity 2 of a box, using transfer glue 3; the connection pads of the chip are electrically connected by any known technique, for example by soldering conductive wires 4 to connection pads provided inside the housing and these pads are interconnected to pins 5 (in the example of solder pins) of the case interface connector.
  • the cavity is then hermetically closed (sealed) by a closing plate 6.
  • the closing plate is or integrates a window transparent to the useful radiation (detected by the sensor image) and this window is located above the photosensitive surface.
  • the closing plate is or incorporates a transparent window when the component must emit or receive (detect) optical radiation.
  • the transparent window is generally provided with an anti-reflective layer on its internal face and/or on its external face. These are the layers respectively referenced 7 and 8 on the figure 1 .
  • the hermetic seal is ensured by a bead of glue 9, present all along the upper part of the peripheral wall 10 of the housing, which connects the plate to the wall of the housing all the way around. This is obtained in the following way: we deposit, by screen printing for example, a bead of closing glue 9, pre-polymerized, on the internal face of the plate ( figure 2 ).
  • the plate provided with its bead of glue is attached over the wall of the box, and the bead of glue is sandwiched between the plate and the flat upper part of the wall 10.
  • the assembly is put under a press and placed in an oven to polymerization/crosslinking of the glue.
  • the bead of glue forms an airtight seal between the plate and the case. Its thickness is determined to absorb the deformations of the plate materials and the housing whose expansion coefficients are generally different.
  • a thermal resistance test is notably planned to verify and quantify the effects of rapid temperature variation cycles on the components, and in particular, not restrictively: their lifespan, the hermeticity or tightness of the case, the degassing of volatile compounds, the hardening of materials, mechanical deformations or cracks, etc., making it possible to determine the ability of the component to function correctly in an aerospace environment .
  • the components are placed in a thermal enclosure and the temperature inside the enclosure is varied, following a cycle of more or less abrupt variation, a certain number of times. For example, at each cycle, the temperature is varied between -55°C and +125°C, with a slope which can go from a few degrees to more than 15 degrees per minute.
  • the test When it comes to qualifying a (new) component, the test requires a large number of variation cycles, for example 1000 temperature variation cycles. After qualification, the components must still be tested at the end of the manufacturing line: this involves detecting any components that do not meet the specifications making it possible to guarantee the operational life of the component. To do this, we use reliability tests which are lighter versions of qualification tests. In particular, the thermal resistance test is then limited to around ten cycles.
  • spots are indicative of the presence of a certain quantity of gas inside the closed cavity of the case: these are gas condensates trapped on the internal face of the transparent window, and more precisely, on the anti-reflective layer covering this face (if this layer is indeed present). That is to say that the spots observed correspond to a condensation of gaseous species favored by the temperature rise cycles of the test.
  • the glue joint after polymerization must have a certain thickness, to play its role of absorbing deformations of the case and plate materials (different expansion coefficients), under operational constraints (temperature).
  • closure glue there are a few different compositions of closure glue that meet the TML and CVCM qualification tests for the aerospace industry; and at the end of the tests, none of these glue compositions proved to be significantly better than another on this point. That is, spots appear in all cases.
  • getter materials, capable of trapping on the surface all or part of the gases present inside the cavity.
  • the term “getter” is the term used in technical literature. These getter materials are well known. Zirconium, titanium, niobium, vanadium are metals commonly used as getters, alone or in alloys. This involves producing a getter material that is reactive to the gaseous species present. Requests US2010/0025845 Or EP2004542 discuss the use of such getter materials, especially in the context of microelectromechanical systems (MEMS) chips. In particular, the efficiency of these getter materials requires a large exchange surface. If we place the getter material at the bottom of the package, close to the chip, we significantly increase the dimensions of the cavity.
  • MEMS microelectromechanical systems
  • getter material on the internal surface of the closing plate. This solution is generally not suitable when the chip must detect or emit radiation through the closure plate.
  • getter materials brings other considerations/constraints: additional stages of formation of the getter material (structure of layer(s)) and suitability with the encapsulation/sealing temperatures, activation temperature of the getter effect, progressive saturation of the getter surface, etc.
  • the requests EP1796168 , EP1523045 Or EP 2164102 use re-entrant cavity closure techniques.
  • the invention aims to solve the technical problem of degassing gaseous species inside the housing during and after the sealing operation.
  • the housing is sealed by a closing plate and a bead of glue between the closing plate and the flat upper surface of the peripheral wall, which forms a seal over the entire peripheral length of the wall.
  • the idea underlying the invention consists of a modification of the relief of the upper surface of the wall, so that structurally, the bead of glue is isolated from the interior side of the cavity, and from the exterior side of the housing. , with a surface in the open air, so as to force the degassing of glue towards the outside of the box via this surface.
  • Structuring the upper wall surface according to the invention is effective both during sealing and after sealing. It is easy and inexpensive to implement and does not bring any particular constraints. Also, and this is an advantage, it does not influence the dimensions of the case, that is to say that it can be implemented with constant dimensions of the case.
  • the invention therefore relates to a hermetic integrated circuit housing comprising a bottom, a peripheral wall rising from the bottom which defines an interior cavity of the housing and contains an integrated circuit and a closing plate glued to the upper part of the wall peripheral.
  • the upper part of the peripheral wall is a relief surface comprising on the one hand a first flat zone in direct contact with the closing plate, without the interposition of glue, over the entire length of the peripheral wall on the interior side of the cavity, except where flatness defects prevent contact, and on the other hand, outside this first flat zone, a recess zone which is not in direct contact with the closing plate.
  • a bead of glue is present in the separation zone and connects the closing plate and the upper part of the peripheral wall over the entire peripheral length thereof.
  • Cord of glue presents a surface in the open air between said closing plate and said recess zone, on the exterior side of the housing.
  • the first flat area is in direct contact, without interposition of glue, with the closing plate over the entire length of the peripheral wall.
  • the glue joint has then a surface, interior side of the housing, which is exposed to the atmosphere inside the cavity.
  • the total joint surface exposed on the interior side of the housing due to flatness defects is much less than the glue joint surface exposed to the open air on the exterior side of the housing: glue degassing mainly occurs towards the exterior of the case.
  • the structuring of the upper surface of the peripheral wall of the housing which is proposed in the invention has the technical effect, if degassing of closing glue there is, whether during the sealing operation, during the tests thermal, or even under operational constraints, to force the degassing of the closing glue mainly towards the outside of the case.
  • the step-off zone comprises a second flat zone lower than the first flat zone.
  • a third flat zone higher than the second flat zone is provided along the wall on the exterior side of the housing.
  • the recess zone extends to the outer edge of the wall and includes a raised protuberance at a distance from the outer edge of the housing.
  • the flank between a higher zone (first or third zone) and the bottom of the step-off zone may have a profile defining a width of the higher zone which widens from the upper surface in direct contact with the plate. closing towards the level of the stall zone.
  • the upper raised part of the peripheral wall is a frame, made of metal or ceramic.
  • the invention implemented for the encapsulation of image sensors makes it possible to solve the problem of the appearance of stains on the closing plate window. But we understand that it applies more generally to the encapsulation of electronic components in a hermetic case, since it prevents the degassing of the closing glue towards the inside of the cavity.
  • the invention therefore relates to an encapsulation box for an electronic component.
  • the housing includes a peripheral wall which rises from a bottom of the housing and defines a cavity. It is closed by a closing plate attached and glued to the upper part of the peripheral wall. A bead of glue connects the closure plate to the peripheral wall over the entire length of the wall.
  • the upper surface of the peripheral wall has a relief such that the bead of glue is isolated from the interior side of the cavity, and from the side exterior to the housing, presents an exchange surface with the exterior atmosphere of the housing.
  • the relief is defined by a raised flat zone all along the peripheral wall, on the interior side of the cavity housing and a recess zone outside the raised flat zone.
  • the flat area is intended to be in direct contact with the closing plate of the housing over the entire length of the peripheral wall, without interposition of glue between the two, but surface flatness defects over this length can cause them to be slightly spaced from place to place.
  • the separation zone is not in direct contact with the closing plate, and contains a bead of glue which connects the closing plate and the upper part of the peripheral wall over the entire peripheral length thereof.
  • the bead of glue has an open surface between the closing plate and the release zone, on the exterior side of the box. In the event of degassing of the closing glue, the gaseous species exit through this surface towards the outside of the housing.
  • the figures have not been drawn to scale, to better highlight the aspects of the invention, in particular the relief of the upper surface of the wall, the height of the relief corresponding in practice to the height (thickness) of the glue bead at the end of the sealing operation, of the order of ten microns. It should also be noted that for the sake of simplification, the same elements have the same references in all of the figures 1 to 8 .
  • the closing plate 6 illustrated has a window transparent to useful radiation (for the electronic component, transmitter, or receiver).
  • the plate can be a glass plate, that is to say a window, entirely transparent, as illustrated in the figures; or the plate can integrate a transparent window in a frame, which can then be in the same material as the case.
  • an anti-reflective layer is present on each of the faces (layers 7 and 8 in the figures), but this is not obligatory.
  • the housing comprises a cavity 2 delimited by a peripheral wall 10 which rises from a bottom of the housing P.
  • An integrated circuit 1 (a bare chip in the example illustrated) is glued to the bottom of this cavity and electrically connected to the pins of the electrical connector of the box, in the example via soldered wires 4 and interconnection pads connected to pins of the connector.
  • connection and encapsulation are well known and relate to connection and encapsulation techniques well known to those skilled in the art.
  • a first embodiment of the invention is shown on the figures 3 to 5 .
  • the closure plate surface is smaller than the housing surface delimited by the external edge of the peripheral wall.
  • the external edge (b) of peripheral wall 10 has a positive projection D relative to the edge (b') of closing plate 6.
  • FIG. 3 represents the housing P and the closing plate 6 before sealing.
  • the closure plate 6 is provided with a bead of closure glue 9 of determined thickness h1.
  • the glue was deposited in the form of a paste, by screen printing or syringe. It is a thermosetting material, usually a resin, and can be one- or two-component.
  • the upper surface of the peripheral wall 10 of the housing is not uniformly flat. It is a structured surface with a relief forming a groove made along the entire length of the peripheral wall (which goes around the cavity).
  • a substantially flat zone z2 of width 12 (the groove) framed by two raised flat zones on each side: a raised zone z1 on the interior side of the housing and a raised zone z3 on the exterior side to the box.
  • FIG 4 shows the case hermetically closed by the plate, after sealing (passage in a press oven, to polymerize the closing glue) and the figure 5 shows in more detail the assembly of the plate on the upper part A of the housing wall: the raised flat zone z1 is in direct contact, without interposition of glue, with the closing plate 6; but it has been explained that the two parts (zone z1 and plate 6) can be spaced apart in certain places due to surface flatness defects along the length of the peripheral wall; the bead of glue is contained between the side f connecting the raised flat zone z1 to the bottom (zone z2) of the groove, the internal face of the closing plate 6 and the bottom of the groove (z2).
  • the closing plate is spaced from the bottom of the groove by the thickness of the glue; And it does not cover the entire width l2 of the groove: as shown in the figure, the interior edge b" of the raised flat zone z3 has a positive projection d (d ⁇ D) relative to the edge b' of the plate.
  • the bead of glue has a surface in the open air on the exterior side of the case which serves as an exchange surface Se with the exterior atmosphere of the case.
  • Zone z3 can serve as a support surface during subsequent integration of the component into system equipment. This zone z3 can be at the same level as zone z1 as illustrated; but it could also be higher or a little lower, depending on the needs expressed by the equipment manufacturers.
  • zone z1 forms with the closing plate, a mechanical insulating barrier between the interior of the cavity (2) and the bead of glue 9.
  • Zone z1 is preferably as narrow as possible for a surface optimal glue adhesion on the plate 6. The limits depend on the mechanical resistance characteristics of the housing material. For example, for a ceramic case, the width e1 of zone z1 could be of the order of a millimeter.
  • the glue adhesion surface on the plate can advantageously be optimized by profiling the flank of zone z1, on the groove side, so as to gradually widen the width from the upper surface of zone z1 in direct contact with the plate towards the bottom. of groove z2.
  • the profile can for example be S (sigmoid) or bevel.
  • the width e'1 of zone z1 at the level of the closing plate can for example be 100 microns, and reach a few millimeters at zone z2 (bottom of the groove) .
  • zone z1 side also advantageously makes it possible to adapt to the dimensions of the wall, for a given component, more especially its width L.
  • the peripheral wall may be more or less wide.
  • the dimensions of zone z2 are constrained by the dimensions of the glue bead after sealing (pressure cooking), to have the desired adhesion and sealing effect between the plate and the box.
  • the adjustment variables making it possible to achieve the adhesion zone z2 are thus the widths and/or profiles of zones z1 and/or z3.
  • zone z3 can be profiled with a steep side or beveled, as for zone z1.
  • the thickness h1 of glue (before heating under pressure) and the dimensions of the groove h2, l2 are defined according to the characteristics of the glue to ensure the qualities of adhesion and hermeticity between the closing plate and the wall of the housing.
  • the height h1 of glue on the plate, before sealing is 50 or 80 microns ( Figure 3 )
  • the groove z2 has a depth h2 of the order of 10 to 60 microns and a width l2 of the order of a millimeter, or less, for example 500 microns.
  • the bead of glue closing the plate is pressed against the bottom of the groove and spreads, filling the space defined by the bottom of the groove z2, the side f of zone z1 and the closing plate, without extending onto the flat surface of zone z1 which is pressed in direct contact against (or close to) the closing plate.
  • the adhesion surface between the plate and the housing wall includes the side f, and at least part of the groove width (this could be the entire groove width l2), and this ensures solid and airtight anchoring of the plate to the case.
  • THE figures 7 and 8 show two alternative embodiments which can be used when it is not expected that the housing provides on the outer edge of the wall, a support surface for integration into external equipment. In this case, it is not necessary to provide the area external raised z3 of figures 3 to 6 .
  • Zone z2 is then defined no longer as a groove, but more generally as a zone of recess z2 relative to the raised zone z1, which extends to the outer edge of the wall.
  • the glue can then spread over the width of the separation zone z2.
  • the front f connecting zone z1 to the zone of separation z2 can be quite steep (steep front of the figures 5 And 7 ), or beveled or S profile ( figures 6 And 8 ), this last variant making it possible, as has been said, to reduce as best as possible the surface width of zone z1 in contact with the plate, without weakening this zone.
  • the z3 zone flank can also have a steep front ( Figure 5 ) or beveled or S profile.
  • the upper wall surface relief can be easily produced by machining, engraving or other suitable techniques to form the recess/groove zone z2, and the desired profiles of the raised zone(s) depending on the housing material (ceramic or metal, generally).
  • the upper part A of the wall delimited in dotted lines on the figures 5 to 8 in the form of a frame, for example a ceramic frame or even a metal frame, for example a metal frame made of Kovar (Ni-Fe-Co alloy).
  • the frame is then transferred and glued to the flat surface of the upper wall of the case (with a very thin layer of glue such as chip transfer glue or by soldering).
  • glue such as chip transfer glue or by soldering
  • the volatile species of the frame and of the glue or solder can be mostly or entirely evacuated by the forced degassing operation, prior to sealing, as described.
  • the frame height is determined as a function of the relief height h2, and the limits imposed by state-of-the-art shape molding techniques.
  • the frame has a height of a few hundred microns to a few millimeters, for example between 300 microns and 3 millimeters.
  • zone z3 may not be continuous over the entire length of the peripheral wall, but present in sections, forming as many support pads.
  • the profile of the upper part in cross section is then sometimes that of the figures 7 or 8 , and sometimes that of figures 5 and 6 .
  • the profile of the side of one can be different from the other, depending on the constraints and the respective dimensions.
  • the production in the form of a separate frame makes it possible in particular to produce different profile variants, making it possible to adapt a standard component housing to different equipment manufacturer specifications.
  • the invention which has just been explained and described with the aid of the figures, makes it possible to improve the reliability of components in hermetic housing, by forcing the degassing of the closing glue during sealing and afterwards, towards the outside of the housing, by the exchange surface Se on the exterior side of the housing.
  • image sensors in particular, the formation of spots on the transparent plate window is effectively prevented. This improves the reliability of these components for aerospace uses.
  • the invention can be applied more widely. It is not limited to the encapsulation of a particular type of electronic component, nor to a transparent window box. It was explained that residual gases inside electronic component enclosures are problematic in many ways.
  • the technical solution provided by the invention simple and inexpensive to implement, can therefore be applied generally to hermetic housings of electronic components whenever it is useful or necessary to prevent degradation of the surfaces, including the internal surface of the closing plate (degradation of transparency) and/or to control the atmosphere (pressure) inside the cavity.
  • the housing is generally a ceramic housing, but it can also be made of metal.
  • the relief can be obtained by surface machining (engraving) by any suitable means, or by transferring a frame as indicated. But the principle of the invention can also be applied to plastic cases. The relief shape will then generally be obtained by molding.
  • the closing plate when it is not entirely transparent (window in a frame), can be made for the non-transparent part in the same material as the case.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Casings For Electric Apparatus (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Measuring Fluid Pressure (AREA)
EP18166608.2A 2017-04-18 2018-04-10 Boitier hermetique de composant electronique, en particulier pour capteur d'image Active EP3392910B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1753335A FR3065318B1 (fr) 2017-04-18 2017-04-18 Boitier hermetique de composant electronique, en particulier pour capteur d'image

Publications (2)

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EP3392910A1 EP3392910A1 (fr) 2018-10-24
EP3392910B1 true EP3392910B1 (fr) 2023-12-13

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US (1) US10446597B2 (zh)
EP (1) EP3392910B1 (zh)
JP (1) JP7281871B2 (zh)
CN (1) CN108735768B (zh)
ES (1) ES2969244T3 (zh)
FR (1) FR3065318B1 (zh)
IL (1) IL258635B (zh)

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CN108735768B (zh) 2023-11-10
IL258635A (en) 2018-06-28
FR3065318B1 (fr) 2021-09-10
EP3392910A1 (fr) 2018-10-24
FR3065318A1 (fr) 2018-10-19
JP2018182329A (ja) 2018-11-15
IL258635B (en) 2022-09-01
US20180301489A1 (en) 2018-10-18
JP7281871B2 (ja) 2023-05-26
ES2969244T3 (es) 2024-05-17
US10446597B2 (en) 2019-10-15
CN108735768A (zh) 2018-11-02

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