EP3344403A1 - Dispositif pour le nettoyage de surfaces de cuisson - Google Patents

Dispositif pour le nettoyage de surfaces de cuisson

Info

Publication number
EP3344403A1
EP3344403A1 EP16760472.7A EP16760472A EP3344403A1 EP 3344403 A1 EP3344403 A1 EP 3344403A1 EP 16760472 A EP16760472 A EP 16760472A EP 3344403 A1 EP3344403 A1 EP 3344403A1
Authority
EP
European Patent Office
Prior art keywords
baking
laser
target area
laser source
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP16760472.7A
Other languages
German (de)
English (en)
Inventor
Johannes Haas
Josef Haas
Stefan Jiraschek
Martin KALLER
Johann Sachsenhofer
Bernhard HAIDENBAUER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Haas Food Equipment GmbH
Original Assignee
Haas Food Equipment GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Haas Food Equipment GmbH filed Critical Haas Food Equipment GmbH
Publication of EP3344403A1 publication Critical patent/EP3344403A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21B—BAKERS' OVENS; MACHINES OR EQUIPMENT FOR BAKING
    • A21B3/00—Parts or accessories of ovens
    • A21B3/006—Means for cleaning the baking cavity
    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21B—BAKERS' OVENS; MACHINES OR EQUIPMENT FOR BAKING
    • A21B3/00—Parts or accessories of ovens
    • A21B3/16—Machines for cleaning or greasing baking surfaces
    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21B—BAKERS' OVENS; MACHINES OR EQUIPMENT FOR BAKING
    • A21B1/00—Bakers' ovens
    • A21B1/42—Bakers' ovens characterised by the baking surfaces moving during the baking
    • A21B1/46—Bakers' ovens characterised by the baking surfaces moving during the baking with surfaces suspended from an endless conveyor or a revolving wheel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • A—HUMAN NECESSITIES
    • A21—BAKING; EDIBLE DOUGHS
    • A21B—BAKERS' OVENS; MACHINES OR EQUIPMENT FOR BAKING
    • A21B5/00—Baking apparatus for special goods; Other baking apparatus
    • A21B5/02—Apparatus for baking hollow articles, waffles, pastry, biscuits, or the like
    • A21B5/023—Hinged moulds for baking waffles

Definitions

  • the invention relates to an arrangement for cleaning baking surfaces
  • the invention relates to an arrangement of a baking machine for the production of baked products, the one or more baking surface (n ) and with at least one arrangement for cleaning the baking surface (s).
  • Baking machines such as, for example, wafer baking machines for the industrial production of wafers, comprise a furnace section in which open and closable baking tongs are guided revolvingly driven.
  • the dough to be baked or baking compound to be baked is introduced between the two baking plates of the baking tongs and baked under the action of temperature and optionally pressure. After baking, the baking tongs are opened and the finished waffle can be removed.
  • Baking mass coming into contact baking surfaces of the baking plate residues remain. These residues include, for example, oils, fats, starchy deposits, sugar deposits, etc. To prevent these deposits from the baking plate residues.
  • baking tongs are individually opened in a cleaning mode of the baking machine and brushed by manual brushing.
  • a further possibility which corresponds to the state of the art, is the blowing off of the baking surfaces with compressed air, which, however, eliminates only loose baking waste and not encrustations.
  • the surface when brushing the baking surfaces, the surface may be roughened or damaged. On the other hand, it is gentler
  • laser cleaning systems which can be retrofitted to existing systems and can be delivered as a modular device in case of need or are designed as an integral part of the baking machine.
  • These laser cleaning systems are usually designed such that an interface for connection to the baking machine is provided, and that the laser arrangement is coupled mechanically and / or tax technology with the baking machine.
  • the angle at which the laser radiation strikes the surface to be cleaned is variable.
  • the laser head is arranged rotatably about two axes, so that a choice of the radiation angle of the laser can be done.
  • a disadvantage of these constructions is that the components for rotating the laser head enlarge the device, whereby an introduction between the baking plates of a partially opened unfolding baking tongs is not possible.
  • the complete opening of a baking plate for cleaning requires one
  • the invention relates to a laser assembly for cleaning relief-like designed baking surfaces and optionally for cleaning steam or Dichtleisen baking plates of a baking machine, comprising a laser source for outputting a laser beam to a locally selectable target area by continuously changing the output direction of the laser beam and driving off the target area forming contour, a distant from the laser source and arranged in the target region of the laser source deflection optics for deflecting the laser beam and for projecting the target area formed by the contour on the back plate to be cleaned along a projection direction.
  • the deflection optics has an adjustment possibility for changing the direction of projection and the exit direction of the laser beam.
  • the deflection optics at least two
  • the deflection optics which divert the outgoing laser beam from the laser source in different angles, or that the deflection optics at least two as Reflection elements such as in particular designed as a mirror deflecting elements, which are arranged opposite to the laser source at different angles, or that the deflection optics at least one deflecting element for deflecting the
  • Laser beam having at least two selectable positions, so that at least two selectable, different projection directions are provided.
  • the deflection optics or their deflection element (s) is arranged to be movable or, and / or that the deflection optics or their
  • Deflection element (s) is arranged rotatable about a rotational axis, pivotable or rotatable or are, wherein the axis of rotation approximately in the central output direction of the
  • Laser beam from the laser source corresponds.
  • a projecting from a base body, in particular tubular-shaped support member is provided that the
  • Deflection optics provided in the region of the free end of the support member and in particular fixedly connected to the support element.
  • the carrier element via a
  • Carrier element drive movable, rotatable or rotatable about the axis of rotation.
  • Laser source are arranged in the region of the base body or on the base body.
  • the target area of the laser source is selectively directed to one of the deflection elements or to one of the deflecting elements designed as reflection elements.
  • the target area and the contour forming the target area are strip-shaped or linear, or that the target area and the contour forming the target area are strip-shaped or linear and are oscillated or repeatedly traveled by the laser beam.
  • a control cam is provided, which is scanned by a scanning element for activating or deactivating the laser source, and that the scanning element relative to the control cam by actuation of the
  • Carrier element drive and optionally by rotation of the support member is or is moved and that thereby the laser source as a function of the
  • Projection direction is activated or deactivated.
  • Suction line projects into the region in which the laser beam emerges or at which the laser beam strikes the object to be cleaned.
  • a movement device is provided for translational movement of the carrier element or the deflection optics, wherein the
  • the laser arrangement as a with a
  • Baking machine connectable or connected module is formed.
  • the invention relates to an arrangement comprising a baking apparatus with an endless conveyor, wherein on the endless conveyor baking tongs are arranged, wherein the baking tongs each comprise a lower plate and a top plate pivotally connected to the lower plate, wherein the baking tongs along the endless conveyor in each case successively: from a feeder to Order one
  • Baking mass in an open baking tongs to a device for closing the baking tongs, through a heated oven, on to a device for opening the baking tongs, and then transported to a product removal device for taking the baked products from the baking tongs, wherein a
  • Inventive laser arrangement is provided.
  • a device for opening the baking tongs and a device for closing the baking tongs are provided, and that the
  • Back tongs between the two device are opened by an opening angle, and that the deflection optics and at least a portion of the support member laterally, ie transversely to the direction of movement of the endless conveyor in the baking tongs and between the
  • Top plate and the lower plate protrudes.
  • the projection direction by rotation of the deflection optics or by rotation of the connected to the deflection optics is provided.
  • Support element is selectively directed to the inside of the top plate or from the inside to the lower plate.
  • the angle of incidence of the projection direction on the baking tongs can be changed by selectively directing the target area of the laser source onto one of the deflection elements or onto one of the reflection elements.
  • the deflection optics at least two
  • Deflection elements that the target area of the laser source is selectively directed to one of the two deflecting elements, that when the target area of the laser source is directed to the one deflecting element, the projection direction a first
  • Angle of incidence on the baking plate to be cleaned that when the target area of the laser source is directed to the other deflecting element, the projection direction has a second angle of incidence on the back plate to be cleaned, and that the two angles of incidence in opposite directions from a perpendicular to the baking plate falling angle of incidence differ.
  • the deflection optics at least three
  • Reflection elements comprises that the target area of the laser source is selectively directed to one of the three reflection elements, that when the target area of the laser source is directed to the one reflection element, the projection direction has a first angle of incidence on the back plate to be cleaned, that if the target area of the laser source is directed to a further reflection element, the projection direction has a second angle of incidence on the back plate to be cleaned, that the two angles of incidence in opposite directions from a perpendicular to the baking plate deviate incidence angle, and that when the target area of the laser source is directed to a third reflection element, the projection direction a third
  • Incident angle has to be cleaned to the baking plate, which lies between the first and the second angle of incidence, and in particular runs substantially perpendicular to the back plate to be cleaned.
  • the laser arrangement or the arrangement preferably comprises a plurality of degrees of freedom.
  • Projecting direction emerging laser radiation can optionally be changed by pivoting or rotating the deflection optics.
  • the change in angle preferably takes place essentially in a normal plane of the axis of rotation of this movement.
  • This axis of rotation is optionally arranged in a normal plane of the movement direction of the baking tongs by the endless conveyor.
  • this axis of rotation and possibly also the carrier element extend transversely to the direction of movement of the baking tongs and preferably laterally into the opened baking tongs.
  • Another relative movement can be done by a movement of the baking tongs themselves. If the laser arrangement is held substantially stationary, wherein the projection direction is directed to a baking surface of the baking tongs, and subsequently the endless conveyor of the baking device is actuated, then a strip of the baking tongs can be cleaned. If the endless conveyor is moved further, it is possible to clean a strip of several or all of the baking plates covered by the laser beam. In order to expand the cleaning area, the deflection optics or the
  • emerging laser radiation may also be moved translationally by a moving device.
  • This translatory movement or its direction preferably runs transversely to the conveying direction of the baking tongs along the endless conveyor and in particular along the axis of rotation of the laser arrangement.
  • the laser source can be configured in all embodiments such that a laser beam can be output in different or in selectable directions.
  • Such lasers are, for example, as a marking laser for marking or
  • Such laser sources are usually compact modules that have a Program interface or control interface can be controlled so that the laser beam is emitted in the desired direction.
  • the laser source is arranged on a base body according to a preferred embodiment.
  • the laser source or the main body can be arranged in particular translationally movable with a carrier element.
  • This deflection optics may, for example, deflecting elements such as mirrors, reflection elements, or other optical elements which are suitable for deflecting a laser beam.
  • the deflection optics comprises an adjustment for changing the projection direction and the exit angle of the laser beam.
  • Adjustment can be a emerging from the laser source laser beam in
  • the deflection optics comprises several
  • the laser source is adapted or adapted to direct a laser beam selectively on at least one of the deflection elements.
  • the exit angle of the laser beam can be changed depending on the choice of the deflection.
  • the laser beam cleans as large an area as possible in the shortest possible time.
  • the laser beam is preferably not static, point-directed to the baking surface to be cleaned but directed to a selectable target area.
  • This target area is formed, in particular, by a contour which the laser beam travels. The contour can be traversed periodically or oscillating.
  • the contour can be traveled repeatedly or repeatedly. Due to the fast traversing of the target area, the sphere of action of the laser becomes increased.
  • the target area is substantially strip-shaped or linear. This target area can preferably be selectively directed to one of the deflecting elements, so that the target area is deflected and projected onto the baking surface. The projection of this target area occurs along a projection direction. The projection direction can now be changed by the adjustment of the deflection optics.
  • the deflection optics is designed to be essentially passive and essentially comprises mirrors connected rigidly to a carrier element.
  • the support member may be formed, for example, as a cantilevered support member.
  • the support member may also be tubular and comprise at its free ends the deflection optics.
  • the free end of the support member may be designed to save space, whereby the laser assembly between the acute-angled unfolded baking plates can be introduced.
  • the baking plates only have to have the opening angle that they in the conventional operation of
  • Baking machine have. This angle is for example between 30 ° and 60 °, in particular about 35 ° to 40 °.
  • the projection direction can be rotated or moved by a further degree of freedom.
  • box-shaped baking plates are cleaned, have the sealing strips and / or steam strips.
  • the rotation effect of the advantageous effect causes the projection direction or the laser radiation can be directed by actuation of the carrier element drive from the lower baking plate to the upper baking plate or from the upper baking plate to the lower baking plate.
  • the cleaning of the upper baking plate and the lower baking plate is preferably done in the same way.
  • a control cam and a scanning element are optionally provided. These elements are designed such that the
  • Laser source is disabled when the projection direction is directed to any baking plate.
  • the deflection optics can also be designed such that the projection direction is not limited to a plane parallel to a sealing or
  • Backing surfaces and steam or sealing strips of baking plates may, for example, comprise one or more of the following steps:
  • the baking device can be put into a cleaning mode in which no dough infusion takes place.
  • the baking device can be put into a cleaning mode in which no dough infusion takes place.
  • Laser arrangement can be activated.
  • the laser arrangement can be designed, for example, as a module which can be docked or docked to the baking device.
  • baking tongs are open during normal baking operation for dough infusion and for product removal.
  • Cleaning mode projects the laser assembly between the baking plates to perform a cleaning. Accordingly, in the case of a modularly designed laser arrangement, it may be necessary first to establish a connection with the baking device. In particular, the connection is done mechanically and / or control technology.
  • the laser source is activated so that laser radiation of the laser source is emitted into a target area.
  • this target area is the
  • Arranged deflection optics by which the laser radiation is deflected and directed in particular to one of the two baking plates of the baking tongs.
  • one degree of freedom of the laser arrangement can be used to guide the laser beam over the entire baking plate.
  • the endless conveyor of the baking device is actuated to effect a relative movement between the laser beam and the baking plates.
  • the laser arrangement or the laser beam is moved translationally, transversely to the conveying direction of the baking plates, so that a second, parallel to the first strip extending second strip of all baking tongs is cleaned.
  • This process can be repeated until all sub-plates and / or all top plates have been cleaned.
  • the angle of incidence of the projection direction can be adjusted.
  • Incidence angles are caused in particular by the adjustment of the deflection optics.
  • the different angles of incidence preferably lie in a plane which corresponds to a normal plane of the conveying direction of the baking tongs.
  • the deflecting optics can be rotated by 180 °, for example, so that the laser beams are directed onto the upper baking plates.
  • the cleaning of the top plates, in particular the strip-like cleaning, can be carried out analogously to the cleaning of the lower plates.
  • the laser arrangement may comprise an extraction, which in particular can suck off the combustion gases or chips that are released during the cleaning.
  • the invention optionally relates to an arrangement with a baking device, wherein a laser arrangement is provided, wherein an interface for connection to the laser arrangement is provided, wherein the interface is a mechanical interface for coupling the laser assembly with the baking machine and / or a
  • Control interface for coupling the control of the baking machine with the control of the laser assembly wherein the laser assembly comprises a laser head comprises, is guided by the laser radiation on a processing area on the baking surface and that the laser head and the baking surface relative to each other at least have a drivable degree of freedom and / or wherein the baking surface and / or the laser head are drivable and movable by at least one drive.
  • any form of laser arrangement can be used which is suitable for removing the contaminants from the baking surface.
  • Marking laser used. The laser processes by oscillation one
  • the baking surface For example, 10 to about 120mm wide strips of the baking surface, wherein the strip is preferably about 1 6mm wide.
  • the baking surface is not cleaned in one, but in several passes. If the width of the processing region of the laser arrangement corresponds to the width of the baking plate, the processing can also take place in one step.
  • solid-state lasers or CO2 lasers pulsed or im are preferred.
  • solid-state lasers or CO2 lasers pulsed or im are preferred.
  • Suitable laser arrangements are a TEA-CO2 laser or a solid-state laser with a wavelength of 10.6 ⁇ m.
  • the laser power can be between 20 and 500 watts. Preferably, the power is about 100 to 200 watts. Fiber lasers with a wavelength of 1. 06 ⁇ and a power of about 60 watts have proven to be particularly advantageous in practice.
  • the actually required laser power is also optionally from the
  • the laser assembly is connected or coupled to a baking device.
  • both the baking machine and the laser arrangement optionally have an interface.
  • the interface can on the one hand a
  • Control interface and on the other hand be a mechanical interface.
  • the control interface optionally connects the means for controlling the laser arrangement and the means for controlling the baking machine with a
  • Control unit In this case, a single control unit for controlling the laser arrangement and the baking machine can be suitable and / or set up or in each case a control device for the laser arrangement and a
  • control device for the baking machine For example, the speed of the moving baking surfaces can be varied for cleaning. Furthermore, the control of the laser arrangement can be made dependent on the degree of soiling and the speed of the baking surface. So can
  • the connection via the interface control parameters such as the laser power, the oscillation frequency or the oscillation amplitude.
  • the interface also relates to the mechanical connection and / or coupling of the laser arrangement to the baking machine.
  • This interface is for example by conventional fasteners such as screws, bolts,
  • Connection means suitable that can serve for the production of an interface, in particular the desired positioning of a laser array on the
  • a light beam with high intensity preferably a laser beam passed to the baking surface.
  • the baking surfaces are preferably formed of a metallic body and have a smooth surface or predetermined pattern-shaped relief structure.
  • the laser beam hits the
  • Baking surface so a large part of the radiation is reflected. However, if the laser beam hits a dirty spot or a dirt particle, the laser beam is absorbed by the dirt. The energy is converted into heat energy, which heats the debris or soiled area until combustion or evaporation occurs.
  • Baking surfaces is a particularly efficient and gentle cleaning possible.
  • the cleaning process is thus a substantially thermal process.
  • the definition of the output directions or the course of the laser radiation, in particular the average output direction is indicated.
  • the direct connection between the laser source and the center of the target area or the center of the contour is defined as the output direction or as the average output direction.
  • the target area is deflected by the deflection optics or projected onto a baking surface.
  • the direction of projection is also defined as the direction corresponding to the mean direction of the oscillating or moving output and deflected laser radiation.
  • the angle of incidence of the projection direction on the baking plate is thus preferably defined as the direction of incidence of the mean radiation direction.
  • Figure 1 is a schematic representation of a baking tongs and a part of a
  • FIG. 3 shows a section of the carrier element of an exemplary deflection optics
  • FIG. 4 shows a schematic detail view of a part of an exemplary deflection optics
  • FIG. 5 shows a section with the control cam and a scanning element
  • FIG. 6 shows a schematic view of one Show arrangement with a baking device.
  • the reference numerals correspond to the following components: baking surface 1, sealing strip or evaporation strip 2, baking plate 3, baking machine 4, laser source 5, laser beam 6, target area 7, contour 8, deflection optics 9, projection direction 10, deflecting element 1 1, axis of rotation (FIG. the carrier element) 12, base body 13, carrier element 14, free end (of the carrier element) 15,
  • Carrier element drive 1 6 control cam 17, sensing element 18, suction 19,
  • Feeding device 26 device (for closing the baking tongs) 27,
  • Baking chamber 28 device (for opening the baking tongs) 29, angle of incidence 30,
  • FIG. 1 shows a schematic view of at least one part of a laser arrangement and an arrangement comprising a baking apparatus. From the baking device, a baking tongs 23 is exemplified, which comprises two baking plates 3, namely a top plate 24 and a bottom plate 25. The two plates 24, 25 are
  • a device 27, 29 for opening and closing the baking tongs 23.
  • Each baking plate 3 preferably comprises a baking surface 1.
  • This baking surface 1 is that surface of the baking plate 3 with which the dough or the baking material comes into contact and which can be cleaned by the arrangement according to the invention.
  • the baking plate 3 comprises one or more sealing or
  • Ausdampfent 2 These evaporation or sealing strips 2 are used to seal a baking mold formed by the baking plates 3 and optionally for restraint of the baking compound during evaporation of the water component contained in the baking mass.
  • the sealing or Ausdampfrucn 2 extend beyond the baking surface 1 of the baking plate 3 optionally, whereby an angle is formed, preferably from the
  • inventive arrangement is cleanable.
  • the laser arrangement comprises a laser source 5 for outputting a laser beam 6 in a target area 7.
  • a deflection optics 9 is provided, which is adapted to direct the laser beam 6 along several projection directions 10 onto the baking plate 3.
  • the laser arrangement comprises a plurality of degrees of freedom for changing the output direction or the projection direction 10 of the laser beam.
  • the laser arrangement comprises a carrier element 14, which in the present embodiment is substantially tubular.
  • the deflection optics 9 is provided at the free end 15 of the support member 14.
  • the movement of the support member 14 and in particular for moving the deflection optics 9 a is provided at the free end 15 of the support member 14.
  • Carrier element drive 1 6 provided.
  • the carrier element drive 16 is a rotary drive for rotating the carrier element 14 about the axis of rotation 12.
  • the laser arrangement comprises a main body 13, which is arranged substantially rigid or possibly movable.
  • an exhaust 19 is provided with a suction line 20 for the extraction of dirt particles or gases.
  • the laser arrangement comprises a device for translational movement along a direction 21, or along two translational directions.
  • the direction 21 of the translatory movement essentially follows the axis of rotation 12 or the course of the carrier element 14.
  • the projection direction 10 can be directed by the special design of the deflection optics 9 in different angles of incidence 30 on the baking surface 1.
  • at least two different projection directions 10 can be achieved, wherein the two angles, starting from the deflection optics 9, are preferably pivoted on both sides of an orthogonal direction.
  • three different projection directions 10 can be achieved, wherein the two angles, starting from the deflection optics 9, are preferably pivoted on both sides of an orthogonal direction.
  • the central projection direction 10 essentially falls on the baking surface 1 at a 90-degree angle of incidence 30.
  • the two other projection directions 10 are pivoted at different angles from this 90-degree angle of incidence 30. It can thereby be ensured that the laser beams 6 of the laser source 5 can also penetrate into the corners of the sealing strips 2.
  • FIG. 2 shows a plan view of the laser arrangement shown in FIG. 1, wherein the components described in FIG. 1 correspond to the components of FIG.
  • the suction 19 comprises two
  • FIG. 3 shows a schematic sectional representation of parts of a laser arrangement according to the invention.
  • the support member 14 is substantially tubular and preferably closed-tubular, wherein in the region of the free end 15 of the
  • the deflection optics 9 comprises in all embodiments optionally an exit to the outlet
  • Laser radiation optionally by a transparent element, such as
  • the deflection optics 9 comprises at least one deflection element 1 1, which is provided in the target area 7 of the laser source 5, so that the laser beam 6 strikes the deflection element 1 1 of the deflection optics 9, in order to be deflected in the direction of projection 10.
  • the middle direction of the output laser radiation can be in all
  • the axis of rotation 12 of the support member 14 or the course of the support member 14 follow.
  • the support member 14, or its free end 15 running together or substantially conical, so that the laser assembly in the by the
  • Baking tongs formed gusset can be introduced.
  • a sealing, transparent pane such as a glass pane, is provided to spatially separate the interior region of the carrier element 14 from the laser source.
  • optical elements such as baffles or transparent panes include cooling, a scavenge air arrangement or a barrier air arrangement.
  • FIG. 4 shows a schematic view of part of a deflection optics 9
  • Umlenkoptik 9 comprises in the present embodiment, three deflecting elements 1 1. These three deflecting elements 1 1 are rigid at different angles with a
  • deflecting elements 1 1 may be provided at different angles.
  • one or more deflecting elements can also be arranged to be movable
  • the deflecting elements 1 1 are substantially rigidly connected to the base plate. The from the laser source. 5
  • exiting laser beam 6 is preferably directed into a target area 7.
  • the target area 7 is preferably formed by a contour 8.
  • the contour 8 is preferred
  • the target area 7 is substantially strip-shaped or linear.
  • the contour 8 thus corresponds to this strip or line.
  • either the target area 7 is directed to one of the deflecting elements 1 1.
  • the laser beam 6 of the laser source 5 is preferably directed to only one contour 8 or one of the marked target areas 7.
  • Projection direction 10 can be changed. Due to the strip-like or linear shape of the target area 7, a shape corresponding to this shape is also projected onto the baking plate 3.
  • the deflection elements 1 1 are formed in the present form as a reflection elements, or as a mirror. If necessary, however, it is also possible to use other elements which are suitable for redirecting or projecting the target area 7 of the laser source 5 onto the baking surface 1. For example, prisms would be possible alternatives.
  • FIG. 5 shows a schematic sectional illustration of the sectional profile A-A from FIG. 1.
  • the device comprises a control cam 17 and a scanning element 18.
  • the scanning element 18 is mechanically connected to the laser source 5, so that they can be activated or deactivated.
  • the laser source 5 can be deactivated when the projection direction is not on a
  • FIG. 6 shows a schematic view of parts of an arrangement according to the invention, comprising an endless conveyor 22 along the course of which a plurality of baking tongs 23 are arranged to be conveyed substantially along an upper and along a lower transport plane.
  • the baking tongs 23 each comprise two baking plates 3, namely a top plate 24 and a bottom plate 25.
  • the baking device comprises the following schematically illustrated components: a loading device 26, a device 27 for closing the baking tongs, a device 29 for opening the baking tongs, and a baking chamber 28th
  • the arrangement further comprises a laser source 5, which is a part of the laser arrangement according to the invention.
  • the laser assembly is designed as a module, which optionally fixed to the
  • Baking device is connected, or delivered if necessary and with the
  • Baking machine can be connected.
  • the connection or the arrangement of the laser arrangement takes place in a region in which the baking tongs 23 of the baking device are opened, for example in the region of the loading device 26 or in the region of the product take-off device 31, or between the
  • Carrier element 14 the deflection optics 9 and / or the laser arrangement causes.
  • the base body 13 is made rigid or floorstanding and optionally attached to a mobile cart.
  • the main body 13 is translationally movable, in particular along the directions 21 formed translationally movable and arranged on a floor standing or stationary base frame.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Food Science & Technology (AREA)
  • Laser Beam Processing (AREA)
  • Cleaning In General (AREA)

Abstract

L'invention concerne un dispositif laser pour le nettoyage de surfaces de cuisson en relief (1) et le cas échéant pour le nettoyage de bandes de vapeur et/ou d'étanchéité (2) de plaques de cuisson (3) d'un appareil de cuisson (4), comprenant : une source laser (5) pour l'émission d'un rayon laser (6) sur une zone cible (7) sélectionnable spatialement par modification continue du sens d'orientation du rayon laser (6) et le suivi d'un contour (8) formant la zone cible (7) ; une optique de déviation (9) disposée à une certaine distance de la source laser (5) et dans la zone cible (7) de la source laser (5) pour la déviation du rayon laser (6) et pour la projection de la zone cible (7) formée par le contour (8) sur la plaque de cuisson (3) à nettoyer le long d'un sens de projection (10), caractérisé en ce que l'optique de déviation (9) présente une possibilité de réglage pour la modification du sens de projection (10) et du sens de sortie du rayon laser (6).
EP16760472.7A 2015-09-03 2016-09-02 Dispositif pour le nettoyage de surfaces de cuisson Withdrawn EP3344403A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP15183600.4A EP3138636A1 (fr) 2015-09-03 2015-09-03 Systeme de nettoyage de surfaces de cuisson
PCT/EP2016/070696 WO2017037222A1 (fr) 2015-09-03 2016-09-02 Dispositif pour le nettoyage de surfaces de cuisson

Publications (1)

Publication Number Publication Date
EP3344403A1 true EP3344403A1 (fr) 2018-07-11

Family

ID=54064165

Family Applications (2)

Application Number Title Priority Date Filing Date
EP15183600.4A Withdrawn EP3138636A1 (fr) 2015-09-03 2015-09-03 Systeme de nettoyage de surfaces de cuisson
EP16760472.7A Withdrawn EP3344403A1 (fr) 2015-09-03 2016-09-02 Dispositif pour le nettoyage de surfaces de cuisson

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP15183600.4A Withdrawn EP3138636A1 (fr) 2015-09-03 2015-09-03 Systeme de nettoyage de surfaces de cuisson

Country Status (6)

Country Link
US (1) US20190021345A1 (fr)
EP (2) EP3138636A1 (fr)
CN (1) CN107949443A (fr)
BR (1) BR112018001049A2 (fr)
RU (1) RU2705088C2 (fr)
WO (1) WO2017037222A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107433395B (zh) * 2017-08-09 2019-01-18 温州职业技术学院 一种折叠光路手持式自适应激光清洗装置
EP3520618A1 (fr) * 2018-02-01 2019-08-07 Haas Food Equipment GmbH Dispositif de cuisson destiné à la production de denrées alimentaires
DE102020201558A1 (de) * 2020-02-07 2021-03-18 Carl Zeiss Smt Gmbh Vorrichtung zur Reinigung einer Plasma-Strahlungsquelle
GB2592416B (en) * 2020-02-27 2022-08-03 Douwe Egberts Bv Improvements in or relating to capsule filling lines
CN111374568B (zh) * 2020-03-24 2021-11-30 广东智源机器人科技有限公司 一种接触式烹饪装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT372821B (de) * 1980-02-27 1983-11-25 Haas Franz Waffelmasch Dampfabschlussleiste fuer waffelbackplatten
US4379624A (en) * 1981-04-13 1983-04-12 The United States Of America As Represented By The Secretary Of The Navy Laser beam steering device
GB2098450B (en) * 1981-05-11 1985-06-12 Haas Franz Sen Wafer baking oven
JPS61251089A (ja) * 1985-04-29 1986-11-08 Mitsubishi Electric Corp 放電励起型レ−ザ装置
AT414203B (de) * 2000-12-22 2006-10-15 Haas Franz Waffelmasch Backofen zur herstellung von gebackenen formkörpern
DE10225387B4 (de) * 2002-06-07 2007-09-20 Mlt Micro Laser Technology Gmbh Vorrichtung zur Substratbehandlung mittels Laserstrahlung
DE102004058263A1 (de) * 2004-12-03 2006-06-08 Rehau Ag + Co Einrichtung zur Führung eines Strahles, insbesondere eines Laserstrahles, Vorrichtung zur optischen Bearbeitung, insbesondere zur Laserbearbeitung, und Verfahren zum Führen eines Strahles, insbesondere eines Laserstrahles
DE202010009009U1 (de) * 2010-11-11 2011-02-10 Trumpf Laser- Und Systemtechnik Gmbh Vorrichtung zur Lasermaterialbearbeitung mit einem Polygonspiegel
AT511404B1 (de) * 2011-05-11 2015-10-15 Haas Food Equipment Gmbh Backofen
DE102011113274A1 (de) * 2011-09-01 2013-03-07 Schmid Vacuum Technology Gmbh Beschichtungsanlage
US20130140286A1 (en) * 2011-12-06 2013-06-06 Herbert Chidsey Roberts, III Systems and methods for internal cavity formation using laser manipulation
AT513222B1 (de) * 2012-08-03 2016-11-15 Haas Food Equipment Gmbh Verfahren und Vorrichtung zur Reinigung von Backoberflächen
AT515106B1 (de) * 2014-04-29 2015-06-15 Haas Food Equipment Gmbh Backofen

Also Published As

Publication number Publication date
RU2018111425A (ru) 2019-10-03
CN107949443A (zh) 2018-04-20
EP3138636A1 (fr) 2017-03-08
BR112018001049A2 (pt) 2018-09-11
RU2705088C2 (ru) 2019-11-01
RU2018111425A3 (fr) 2019-10-03
WO2017037222A1 (fr) 2017-03-09
US20190021345A1 (en) 2019-01-24

Similar Documents

Publication Publication Date Title
EP3344403A1 (fr) Dispositif pour le nettoyage de surfaces de cuisson
EP2879500B1 (fr) Procédé et dispositif de nettoyage d'une surface d'une machine de cuisson
EP3774169B1 (fr) Procédé de découpage des parties d'une pièce
EP2319653A1 (fr) Dispositif de coupe de coquilles d'oeufs à l'aide de rayons laser d'au moins un laser destiné à ouvrir l'oeuf
DE19943005A1 (de) Verfahren zum Reinigen der Oberfläche eines Kunststoffgegenstands
EP2704580B1 (fr) Procédé de nettoyage de plaques de cuisson d'une installation de cuisson automatisée et dispositif de nettoyage
EP2186595A1 (fr) Dispositif de fabrication de modules de cellules solaires à couches minces
EP0237869B1 (fr) Presse filtrante
DD268421A5 (de) Verfahren und vorrichtung zum entfernen von beschichtungen mit einem laserstrahl
AT17940U1 (de) Fahrzeugwaschanlage
WO2022184554A1 (fr) Dispositif et procédé pour l'usinage d'une pièce de fabrication constituée de verre
EP3774163B1 (fr) Dispositif de découpage de parties de pièce
DE102007023032B4 (de) Verfahren zum Reinigen eines Brenners und Beflammungsanlage
DE2350591C3 (de) Vorrichtung zum Kühlen von erwärmten Glasscheiben für deren thermisches Vorspannen
DE10049161B4 (de) Vorrichtung zum Reinigen von Stickenwägen oder vergleichbaren großen Behältnissen
DE3447113A1 (de) Vorrichtung zum verschwenken eines rahmens o.dgl.
DE4130162A1 (de) Laserbearbeitungsvorrichtung
DE2719790A1 (de) Siebwechselvorrichtung und siebkassette zur verwendung bei der wechselvorrichtung
AT403911B (de) Verfahren und vorrichtung zum abtragen einer metallbeschichtung von glastafeln
EP3340801A1 (fr) Système et procédé de nettoyage de cavités de moule de pâtisserie en forme de demi-coque
EP2364935A2 (fr) Dispositif de nettoyage de bande
DE1265371B (de) Vorrichtung zum Garen von Speisen mittels hochfrequenter elektrischer Energie
DE3807150A1 (de) Vorrichtung zur reinigung der innenflaechen eines quaderfoermigen behaelters
DE3812757A1 (de) Vorrichtung zum positionieren von flaschen in reinigungsmaschinen
DE2724579B2 (de) Verfahren zum Reinigen der Oberfläche einer Mehrzahl von Substraten für Halbleiterbauelemente und Vorrichtung zur Durchführung dieses Verfahrens

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20180301

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20210910

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20220121