EP3103145A1 - Système électronique et procédé de production d'un système électronique - Google Patents

Système électronique et procédé de production d'un système électronique

Info

Publication number
EP3103145A1
EP3103145A1 EP15701724.5A EP15701724A EP3103145A1 EP 3103145 A1 EP3103145 A1 EP 3103145A1 EP 15701724 A EP15701724 A EP 15701724A EP 3103145 A1 EP3103145 A1 EP 3103145A1
Authority
EP
European Patent Office
Prior art keywords
micromechanical
thermoelectric generator
electronic system
thermal energy
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15701724.5A
Other languages
German (de)
English (en)
Inventor
Tobias ZOLLER
Tjalf Pirk
Johannes Kenntner
Ricardo Ehrenpfordt
Frederik ANTE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP3103145A1 publication Critical patent/EP3103145A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention further provides a sensor system with the sensor according to the invention.
  • the sensor system further comprises a power circuit for switching a voltage generated by the thermoelectric generator, a microcontroller for controlling the thermoelectric generator, an energy storage for storing the of the
  • thermoelectric generator generated energy, a wireless module for wireless transmission of sensor data and an antenna.
  • Embodiments of the invention mediate. They illustrate
  • first contact region 14 and a second contact region 15 are provided, which are arranged on an underside of the substrate 12.
  • the first contact region 14 and the second contact region 15 are connected to the thermal energy store 16 by means of thermal conductor paths (not shown in FIG. 1).
  • the thermal conductor paths are formed by copper inserts in the present exemplary embodiment.
  • the thermal conductor paths may also be provided as metallic vias, metallic interconnects, thermally highly conductive polymers, or as thermally poorly conductive polymers with thermally conductive spacers.
  • the electronic system 1 further comprises a housing 18, which is designed such that it is placed on the substrate 12 and the micromechanical component 10 as well as the thermal

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)

Abstract

L'invention concerne un système électronique comprenant un composant micromécanique ou microélectronique (10), un substrat (12) servant à loger le composant micromécanique ou microélectronique (10), au moins une zone de contact (14) en contact avec le substrat (12) et servant à la mise en contact avec une source de chaleur, et un premier accumulateur d'énergie thermique (16), lequel couple thermiquement la ou les zones de contact (14) et le composant micromécanique ou microélectronique (10). L'invention concerne en outre un procédé de production d'un système électronique, un capteur ainsi qu'un système de détection.
EP15701724.5A 2014-02-05 2015-01-20 Système électronique et procédé de production d'un système électronique Withdrawn EP3103145A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014202008.5A DE102014202008A1 (de) 2014-02-05 2014-02-05 Elektronisches System und Verfahren zum Herstellen eines elektronischen Systems
PCT/EP2015/050952 WO2015117814A1 (fr) 2014-02-05 2015-01-20 Système électronique et procédé de production d'un système électronique

Publications (1)

Publication Number Publication Date
EP3103145A1 true EP3103145A1 (fr) 2016-12-14

Family

ID=52434761

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15701724.5A Withdrawn EP3103145A1 (fr) 2014-02-05 2015-01-20 Système électronique et procédé de production d'un système électronique

Country Status (4)

Country Link
EP (1) EP3103145A1 (fr)
CN (1) CN105940513A (fr)
DE (1) DE102014202008A1 (fr)
WO (1) WO2015117814A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180306524A1 (en) * 2015-10-21 2018-10-25 Soreq Nucelar Research Center Ultra-compact cooling systems based on phase change material heat reservoirs
WO2018060233A1 (fr) * 2016-09-27 2018-04-05 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Support de composant doté d'un dispositif thermoélectrique entièrement encapsulé
CN106404821B (zh) * 2016-10-31 2023-05-23 华南理工大学 一种材料相变行为表征用电-热耦合处理系统
DE102017206744B9 (de) * 2017-04-21 2023-01-12 Infineon Technologies Ag Mems package mit hoher wärmekapazität und verfahren zum herstellen selbiger

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT190151B (de) 1955-10-25 1957-06-11 Landis & Gyr Ag Rücklaufhemmung mit Signalgabe für elektrische Meßinstrumente, insbesondere Elektrizitätszähler
JP3051919B2 (ja) * 1998-11-13 2000-06-12 セイコーインスツルメンツ株式会社 熱発電式電子機器
DE10324156A1 (de) * 2003-05-22 2004-12-16 Siemens Ag Verfahren und Anordnung zum thermischen Schutz elektronischer Einheiten in einem elektronischen Gerät
DE10347518A1 (de) * 2003-10-13 2005-05-25 Siemens Ag Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher
FR2961956B1 (fr) * 2010-06-23 2012-08-17 Commissariat Energie Atomique Thermogenerateur a materiaux a changement de phase
US20120152297A1 (en) * 2010-12-15 2012-06-21 The Boeing Company Power generation using a thermoelectric generator and a phase change material

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
None *
See also references of WO2015117814A1 *

Also Published As

Publication number Publication date
CN105940513A (zh) 2016-09-14
WO2015117814A1 (fr) 2015-08-13
DE102014202008A1 (de) 2015-08-06

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