WO2018060233A1 - Support de composant doté d'un dispositif thermoélectrique entièrement encapsulé - Google Patents

Support de composant doté d'un dispositif thermoélectrique entièrement encapsulé Download PDF

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Publication number
WO2018060233A1
WO2018060233A1 PCT/EP2017/074472 EP2017074472W WO2018060233A1 WO 2018060233 A1 WO2018060233 A1 WO 2018060233A1 EP 2017074472 W EP2017074472 W EP 2017074472W WO 2018060233 A1 WO2018060233 A1 WO 2018060233A1
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WIPO (PCT)
Prior art keywords
component carrier
surface layer
thermoelectric device
component
layer
Prior art date
Application number
PCT/EP2017/074472
Other languages
English (en)
Inventor
Jonathan Silvano De Sousa
Original Assignee
At&S Austria Technologie & Systemtechnik Aktiengesellschaft
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Application filed by At&S Austria Technologie & Systemtechnik Aktiengesellschaft filed Critical At&S Austria Technologie & Systemtechnik Aktiengesellschaft
Publication of WO2018060233A1 publication Critical patent/WO2018060233A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10219—Thermoelectric component

Definitions

  • thermoelectric device Component carrier with fully encapsulated thermoelectric device
  • the invention relates to a component carrier, to a method of manufac- turing a component carrier, to method of operating a component carrier, and to a method of use.
  • component carriers equipped with one or more components and increasing miniaturization of such components as well as a rising number of components to be mounted on the component carriers such as printed circuit boards
  • increasingly more powerful array-like components or packages having several components are being employed, which have a plurality of contacts or connections, with ever smaller spacing between these contacts. Removal of heat generated by such compo- nents and the component carrier itself during operation becomes an increasing issue.
  • component carriers shall be mechanically robust and electrically reliable so as to be operable even under harsh conditions.
  • thermoelectric module comprising at least a support element, wherein the support member has at least one heat- conducting area for heat conduction between two opposite sides of the support member, wherein the heat-conducting area has a higher thermal conductivity than other areas of the support member. Further, the thermoelectric module comprises at least one thermoelectric member fixed in the heat-conducting area of the support member, said thermoelectric module is thermally coupled to the heat-conducting area. Finally the thermoelectric module comprises at least one cover member which is arranged on one side, opposite to the support member, of the thermoelectric module and at least partially covers the thermoelectric module.
  • US 2011/248846 discloses a wireless sensing module with extended service life containing at least one sensor of a physical parameter, a data acquisition hardware acquiring output electrical signals from at least one sensor and converting It into digital measurement data, a microcontroller, a non-volatile memory, at least one transceiver for wireless communication with external wireless devices, at least one battery, including at least one re- chargeable battery, at least one energy harvesting device, a power manage- ment circuit, and at least one antenna. All components of the wireless sensing module are mounted on a printed circuit board and placed into an enclosure providing mechanical, chemical, electrical and environmental protection. The wireless sensing modules can be used in different applications, including long- term condition monitoring of structures.
  • a component carrier In order to achieve the object defined above, a component carrier, a method of manufacturing a component carrier, a method of operating a component carrier, and a method of use according to the independent claims are provided.
  • a component carrier which comprises a heat absorbing and thermally conductive surface layer (in particular a planar layer) configured for being heated by an external heat source (such as a hot machine part, the sun, etc.), and a thermoelectric device (such as a thermocouple) fully surrounded by (i.e. forming not even part of an exterior surface of the component carrier) material of the component carrier, thermally coupled with the surface layer and config- ured for transferring thermal energy of the heated surface layer into electric energy.
  • an external heat source such as a hot machine part, the sun, etc.
  • a thermoelectric device such as a thermocouple
  • a method of manufacturing a component carrier comprises interconnecting (in particular at least partly by laminating) a layer stack (i.e. an interconnected stack of at least two structures, which may be electrically insulating and/or electrically conductive) comprising a heat absorb- ing and thermally conductive surface layer which is arranged at a surface of the layer stack and at a surface of the component carrier for being heatable by an external heat source, thermally coupling a thermoelectric device with the surface layer for transferring thermal energy of the heated surface layer into electric energy, and fully surrounding (such as embedding, integrating in, building in, providing native or encapsulating) the thermoelectric device by material of the layer stack.
  • a layer stack i.e. an interconnected stack of at least two structures, which may be electrically insulating and/or electrically conductive
  • a thermoelectric device with the surface layer for transferring thermal energy of the heated surface layer into electric energy
  • fully surrounding such as embedding, integrating in, building in, providing native or encapsulating
  • a method of operating a component carrier having the above-mentioned fea- tures wherein the surface layer is arranged without physical contact (in particular with a gap in between) to an external heat source, in particular a moving body (such as a hot machine part) or the sun, providing thermal energy to be absorbed.
  • a component carrier having the above-mentioned features is used as at least one of the group consisting of an energy harvesting device (i.e. a device for generating electric energy based on thermal energy), a thermometer (i.e. a device for measuring temperature, in particular for measuring temperature of the external heat source), a light sensor and a light intensity sensor.
  • an energy harvesting device i.e. a device for generating electric energy based on thermal energy
  • a thermometer i.e. a device for measuring temperature, in particular for measuring temperature of the external heat source
  • a light sensor i.e. a device for measuring temperature, in particular for measuring temperature of the external heat source
  • a light intensity sensor i.e. a light intensity sensor.
  • component carrier may particularly denote any support structure which is capable of accommodating one or more components thereon and/or therein for providing mechanical support and/or electrical connectivity.
  • a component carrier may be configured as a mechanical and/or electronic carrier for components.
  • a component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate.
  • a component carrier may also be a hybrid board combining different ones of the above mentioned types of component carriers.
  • thermoelectric de- vice or thermoelectric generator may particularly denote a solid state device that converts heat or temperature differences directly into electrical energy through a thermoelectric effect.
  • the thermoelectric effect relates to the direct conversion of heat or temperature differences to electric voltage.
  • a thermoelectric device may create an electric voltage when there is a tempera- ture difference between opposing sides of the thermoelectric device.
  • an applied temperature gradient causes charge carriers in the material to diffuse from the hot side to the cold side.
  • a thermoelectric effect which can be advantageously used in a thermoelectric device may make use of the Seebeck effect which, in turn, denotes the conversion of heat directly into electricity at the junction of different types of (in particular metallic) materials.
  • thermoelec- tric device is completely embedded within an interior of a component carrier so that the thermoelectric device is not exposed to a surface of the component carrier but is fully buried therein.
  • at least a surface portion of the component carrier Is defined by a simply manufacturable layer-type and preferably continuous or non-perforated heat absorbing and thermally conduc- tive surface structure which is therefore highly prone to be efficiently heated by an external heat source and to forward corresponding thermal energy to the thermoelectric device for the generation of electricity.
  • thermoelectric device By completely shielding the thermoelectric device with regard to an environment in an interior of the component carrier, any damage of the sensitive thermoelectric device during operation can be safely prevented, even under harsh conditions, so that high reliability of the component carrier as a whole can be achieved. Furthermore, the manufacture of a corresponding component carrier is very simple, since it is dispensable to form any exterior access to expose a surface of the thermoelectric device. It is sufficient to provide a for instance continu- ous surface layer which accomplishes heat absorption from the environment. Moreover, contaminants (such as moisture causing corrosion, aggressive chemicals which may deteriorate an Interior of the component carrier, dirt or dust which may weaken heat transfer, etc.) can be prevented from entering into an interior of the component carrier up to the thermoelectric device, thereby further increasing reliability.
  • contaminants such as moisture causing corrosion, aggressive chemicals which may deteriorate an Interior of the component carrier, dirt or dust which may weaken heat transfer, etc.
  • thermal energy may be con- verted at least partially into electric energy
  • excessive heating of the compo- nent carrier (which may conventionally result in warpage, delam!nation, etc.) may be advantageously prevented, thereby significantly improving thermal management of the component carrier.
  • thermoelectric device is embedded within an in- terconnected layer stack comprising the surface layer, at least one electrically insulating layer structure and/or at least one electrically conductive layer structure.
  • the thermoelectric device may be interconnected with the remaining layer structures by lamination, i.e. the application of thermal energy and/or mechanical pressure.
  • the thermoelectric device is a Seebeck element.
  • the thermoelectric device may comprise a metal-metal junction, in particular a metal-metal junction of the group consisting of an iron-bismuth junction, a copper-nickel junction, and a copper-constantan junction.
  • the thermoelectric device is a Peltier element.
  • the thermoelectric device may comprise a semiconductor-semiconductor junction. Such thermoelectric devices can be properly Implemented by embedding them in component carrier material such as resin and copper.
  • the surface layer has an absorption coefficient, in particular for at least one of visible light and infrared light, of at least 0.8, in particular at least 0.95.
  • the surface layer has a thermal conductivity of at least 1 W/(mK), in particular of at least 50 W/(mK), more particularly of at least 100 W/(mK).
  • the absorbed thermal energy can be conducted with low losses to one main surface of the (preferably sheet-shaped or plate-shaped) thermoelectric element.
  • the surface layer comprises at least one of the group consisting of a metal with roughened surface, graphite, diamond, a black coating, carbon nanotubes, and photonic crystals.
  • a metal with roughened surface graphite, diamond, a black coating, carbon nanotubes, and photonic crystals.
  • Such materials combine an extremely high thermal conductivity with a very high absorption capability of thermal energy and electromagnetic radiation in the relevant wavelength range (In particular the optical, infrared, and if desired ultraviolet range).
  • component carrier in particular printed circuit board, PCB
  • the surface layer is positioned at a surface of a layer stack constituting the component carrier or part thereof.
  • the surface layer may be interconnected with one or more further electrically conductive layer structures and/or one or more further electrically insulating layer struc- tures of the layer stack, in particular by lamination.
  • the surface layer is a continuous layer or a closed layer.
  • a surface layer may fully cover, in particular directly (i.e. without any structure in between surface layer and thermoelectric device) or indirectly (i.e. with a structure, such as a heat storage structure, between surface layer and thermoelectric device), a main surface of the thermoelectric device.
  • Such a continuous surface layer may be free of through holes or perforations and may therefore properly shield a surface portion of the component carrier with regard to contaminants such as moisture, chemicals and dirt.
  • a continuous layer can be formed with low effort, for instance by bonding, lamination or deposition.
  • the thermoelectric device is integrated within and/or on a layer stack constituting the component carrier or part thereof.
  • the thermoelectric device may be placed in a cavity of a cured core or of other PCB material and may be connected thereto by gluing, laminating, etc. This allows to accommodate the thermoelectric device within an interior of the component carrier without extending up to the surface of the component carrier. Thus, the thermoelectric device may be properly protected.
  • thermoelectric device is shaped as a sheet or a plate. With such a shape or geometry, It is possible to embed the thermoelec- trie device by well-known PCB manufacturing procedures such as embedding by lamination.
  • thermoelectric device is at least partly surround- ed (for instance at least at one main surface of the thermoelectric device which opposes another main surface of the thermoelectric device being covered directly or indirectly with the surface layer) by thermally poorly conductive material, in particular material comprising resin and optionally reinforcing fibers (such as prepreg or F 4), of a layer stack constituting the component carrier.
  • thermally poorly conductive material in particular material comprising resin and optionally reinforcing fibers (such as prepreg or F 4), of a layer stack constituting the component carrier.
  • a plate-shaped thermoelectric device may be thermally coupled at one main surface thereof with the properly heat absorb- ing and highly thermally conductive surface layer, and may be thermally coupled at an opposing other main surface with poorly thermally conductive material (in particular having a thermal conductivity of less than 5 W/(mK), more particularly of less than 2 W/(mK), still more particularly of less than 1 W/(mK)) in an interior of the component carrier.
  • poorly thermally conductive material in particular having a thermal conductivity of less than 5 W/(mK), more particularly of less than 2 W/(mK), still more particularly of less than 1 W/(mK)
  • a high temperature difference may be established between the two opposing main surfaces of the thermoelectric device due to the significantly different values of the thermal conductivity and amounts of supplied thermal energy.
  • Conventional component carrier materi- als (such as prepreg or FR4) are properly compatible with the requirements of the thermally poorly conductive material.
  • At least part of the surface layer comprises a coating being transparent for electromagnetic radiation to be absorbed.
  • a coating may render the exterior surface of the surface layer and hence of the compo- nent carrier even more robust against mechanical load acting thereon during operation. Therefore, the component carrier may be employed also in a harsh environment. At the same time, the transparent property of the coating will not significantly reduce the absorption efficiency of the surface layer.
  • the component carrier comprises a heat storage structure, in particular a heat storage layer, arranged between the surface layer and the thermoelectric device for temporarily storing energy from the heated surface layer.
  • a heat storage structure in particular a heat storage layer
  • sort of thermal buffer may be sandwiched between the surface layer and the thermoelectric device in form of the heat storage structure.
  • excessive supply of thermal energy which the thermoelectric device cannot properly handle, can be prevented.
  • some amount of the absorbed thermal energy can be stored in the heat storage layer and may be later forwarded to the thermoelectric device for conversion into electricity.
  • the heat storage structure comprises or consists of a phase change material.
  • a phase-change material may be denoted as a sub- stance with a high heat of fusion which, melting and solidifying at a certain temperature, is capable of storing and releasing large amounts of energy. Heat is absorbed or released when the material changes from solid state to liquid state, and wee versa.
  • other kinds of energy storage structures may be implemented as well (such as a battery, a capacitance, etc.).
  • the at least one component can be selected from a group consisting of an electrically non-conductive inlay, an electrically conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (for example a heat pipe), an electronic component, or combinations thereof.
  • the component can be an active electronic component, a passive electronic component, an electronic chip, a storage device (for instance a DRAM or another data memory), a filter, an integrated circuit, a signal pro- cessing component, a power management component, an optoelectronic interface element, a voltage converter (for example a DC/DC converter or an AG/DC converter), a cryptographic component, a transmitter and/or receiver, an electromechanical transducer, a sensor, an actuator, a microelectro me- chanical system (MEMS), a microprocessor, a capacitor, a resistor, an induct- ance, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit.
  • a voltage converter for example a DC/DC converter or an AG/DC converter
  • a cryptographic component for example a transmitter and/or receiver
  • an electromechanical transducer for example a DC/DC converter or an AG/DC converter
  • MEMS microelectro me- chan
  • a magnetic element can be used as a component.
  • a magnetic element may be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element or a ferrimagnetic element, for instance a ferrite core) or may be a paramagnetic element.
  • the component may also be a further component carrier, for exam- ple in a board-in-board configuration.
  • the component may be surface mounted on the component carrier and/or may be embedded in an interior thereof.
  • other components in particular those which generate and emit electromagnetic radiation and/or are sensitive with regard to electromagnetic radiation propagating from an environment, may be used as component.
  • the component is electrically coupled to the thermo- electric device so that at least part of generated electric energy is supplyable from the thermoelectric device to the component for providing operation energy to the component (for instance when the latter is embodied as chip or sensor).
  • an external supply of energy to such a surface mounted or embedded component may be dispensable or may be reduced.
  • the component carrier may operate autonomously in terms of energy supply, because the generated electric energy may be supplied by the inte- grated thermoelectric device.
  • operation energy for the component may be supplied partially from the thermoelectric device, and partially from a separate (for instance component carrier internal or compo- nent carrier external) energy supply.
  • the component is a sensor, in particular at least one of the group consisting of a temperature sensor, a humidity sensor, an air quality sensor, a chemical sensor, and a luminosity sensor.
  • a temperature sensor in particular at least one of the group consisting of a thermocouple, a thermocouple, a thermocouple, a thermocouple, a thermocouple, a thermocouple, a thermocouple, a thermocouple, a thermocouplea, a thermocouplea, a thermocouplea, a thermometer, a temperature sensor, a humidity sensor, an air quality sensor, a chemical sensor, and a luminosity sensor.
  • Other kind of sensors may be implemented as well.
  • the senor comprises a sensing element configured for generating a sensor signal (in particular an electric sensor signal) indicative of a sensor event (for instance light has been switched on) or a sensor param- eter (for instance a concentration of a specific gas in a surrounding of the component carrier) to be sensed and comprises a processing element (such as a processor, for instance a chip) electrically coupled with the sensing element and configured for processing the sensed and supplied sensor signal.
  • a processing element such as a processor, for instance a chip
  • An output of the processing element may be the information as to whether the sensor event has occurred or not, or the value of the sensor parameter.
  • the senor comprises a communication unit config- ured for communicating sensed information to a communication partner device of the component carrier.
  • a communication unit may be an antenna or a communication chip.
  • the communication may be preferably wirelessly, or in another embodiment wire based.
  • the operation energy for the communication unit may be provided at least partially from the electric energy generated by the thermoelectric device.
  • an electrically conductive layer structure of a layer stack constituting the component carrier is configured for electrically coupling the sensing element and/or the processing element and/or the communication unit.
  • a wiring structure for instance composed of patterned metal layers and patterned vertical through connections such as vias, both for instance made of copper
  • the component carrier may be used synergistically for signal communication in terms of sensing and communicating the sensor results.
  • the surface layer is configured for being heated by at least one of the group consisting of electromagnetic radiation, in particular by at least one of visible light and infrared light, emitted by the external heat source, and a hot external heat source when in contact with or being suffi- ciently neighbored to the surface layer.
  • the heat transfer may be accomplished by heat radiation and/or heat conduction, optionally also heat convection.
  • the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conduc- tive layer structure.
  • the component carrier may be a laminate of the mentioned electrically insulating layer structure(s) and electrically conduc- tive layer structure(s), in particular formed by applying mechanical pressure, if desired supported by thermal energy.
  • the mentioned stack may provide a plate-shaped component carrier capable of providing a large mounting surface for further components and being nevertheless very thin and compact.
  • layer structure may particularly denote a continuous layer, a patterned layer or a plurality of non-consecutive islands within a common plane.
  • the component carrier is shaped as a plate. This contributes to the compact design, wherein the component carrier neverthe- less provides a large basis for mounting components thereon. Furthermore, in particular a naked die as example for an embedded electronic component, can be conveniently embedded, thanks to its small thickness, into a thin plate such as a printed circuit board.
  • the component carrier is configured as one of the group consisting of a printed circuit board, and a substrate (in particular an IC substrate).
  • PCB printed circuit board
  • a component carrier which may be plate-shaped (I.e. planar), three-dimensionally curved (for instance when manufactured using 3D printing) or which may have any other shape) which is formed by laminating several electrically conductive layer structures with several electrically Insulating layer structures, for instance by applying pressure, if desired accompanied by the supply of thermal energy.
  • the electrically conductive layer structures are made of copper, whereas the electrically insulating layer structures may comprise resin and/or glass fibers, so-called prepreg or FR4 material.
  • the various electrically conductive layer structures may be connected to one another in a desired way by forming through-holes through the laminate, for instance by laser drilling or mechanical drilling, and by filling them with electrically conductive material (in particular copper), thereby forming vias as through-hole connections.
  • electrically conductive material in particular copper
  • a printed circuit board is usually configured for accommodating one or more components on one or both opposing surfaces of the plate-shaped printed circuit board. They may be connected to the respective main surface by soldering.
  • a dielectric part of a PCB may be composed of resin with reinforcing fibers (such as glass fibers).
  • the term "substrate” may particularly denote a small component carrier having substantially the same size as a component (in particular an electronic component) to be mounted thereon. More specifically, a substrate can be understood as a carrier for electrical connections or electrical networks as well as component carrier comparable to a printed circuit board (PCB), however with a considerably higher density of laterally and/or vertically arranged connections. Lateral connections are for example conductive paths, whereas vertical connections may be for example drill holes. These lateral and/or vertical connections are arranged within the substrate and can be used to provide electrical and/or mechanical connections of housed components or unhoused components (such as bare dies), particularly of IC chips, with a printed circuit board or
  • substrate also includes W IC substrates.
  • a dielectric part of a substrate may be composed of resin with reinforcing spheres (such as glass spheres).
  • the at least one electrically insulating layer structure comprises at least one of the group consisting of resin (such as reinforced or non-reinforced resins, for instance epoxy resin or Bismaleimide-Triazine resin, more specifically FR-4 or FR-5), cyanate ester, polyphenylene derlvate, glass (in particular glass fibers, multi-layer glass, glass-like materials), prepreg material, polyimide, polyamide, liquid crystal polymer (LCP), epoxy-based Build-Up Film, polytetrafluoroethylene (Teflon), a ceramic, and a metal oxide. Reinforcing materials such as webs, fibers or spheres, for example made of glass (multilayer glass) may be used as well.
  • resin such as reinforced or non-reinforced resins, for instance epoxy resin or Bismaleimide-Triazine resin, more specifically FR-4 or FR-5
  • cyanate ester polyphenylene derlvate
  • glass in particular glass fibers, multi-layer glass, glass-like
  • prepreg or FR4 are usually preferred, other materials may be used as well.
  • high-frequency materials such as polytetrafluoroethylene, liquid crystal polymer and/or cyanate ester resins may be implemented in the component carrier as electrically insulating layer structure.
  • the at least one electrically conductive layer struc- ture comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten.
  • copper is usually preferred, other materials or coated versions thereof are possible as well, in particular coated with supra-conductive material such as graphene.
  • the component carrier is a laminate-type component carrier.
  • the component carrier is a compound of multiple layer structures which are stacked and connected together by apply- ing a pressing force, if desired accompanied by heat.
  • Figure 1 illustrates a component carrier according to an exemplary embodiment of the invention.
  • Figure 2A Illustrates a cross-sectional view
  • Figure 2B illustrates a plan view
  • Figure 2C illustrates a schematic overview of a component carrier with power autonomous sensor function according to an exemplary embodiment of the invention.
  • Figure 3 illustrates how the component carrier according to Figure 2A to Figure 2C is implementab!e in combination with a moving external heat source.
  • Figure 4 schematically illustrates cooperation of surface layer and thermoelectric device of a component carrier according to an exemplary embodiment of the invention.
  • Figure 5 shows an experimental set up for a proof of principle of a component carrier with integrated power harvesting arrangement according to an exemplary embodiment of the invention.
  • Figure 6 shows the function of a thermoelectric device of a component carrier according to an exemplary embodiment of the invention.
  • Figure 7 is a diagram illustrating the dependency of temperature difference and output power of a thermoelectric device of a component carrier according to an exemplary embodiment of the invention.
  • Figure 8 illustrates an arrangement of a component carrier according to an exemplary embodiment of the invention in combination with an external heat source in the context of a temperature measurement application.
  • a component carrier with an integrated thermoelectric device which can be used as a light energy harvesting device, a thermometer, a light sensing sensor and/or a light intensity sensor.
  • a component carrier which may be based on PCB technology, may for instance be used to power an autonomous sensor system.
  • Autonomous sensor systems are highly advantageous for many applications, for example concerning industry 4.0 applications, automotive applications and aerospace applications.
  • the sensing of very different parameters is possible, such as temperature, humidity, air quality, chemicals, luminosity conditions, etc.
  • exemplary embodiments of the invention make it possible to render component carrier based sensor systems autonomous, it may be possible to simplify presently complicated design constructions where unnecessary wiring Is used, to reduce weight in automotive and aerospace products, etc.
  • An idea of an exemplary embodiment of the invention is the provision of a compact component carrier-based system, in particular PCB- (printed circuit board) based system, that can absorb energy in form of light and/or heat and convert it into electricity.
  • This generated electricity can be used for powering one or more electrical systems (such as one or more surface mounted and/or embedded components) being installed In and/or on the same component carrier.
  • the energy is converted into heat by the absorbing structure.
  • the light and/or heat will subsequently be converted into electricity by one or more embedded thermoelectric elements.
  • thermoelectric element The physical principle realized by a PCB integrated thermoelectric element according to an exemplary embodiment of the invention is the conversion of absorbed light into thermal energy and then into electricity.
  • the thermoelectric device fully embedded within the component carrier may be free of any mechanical contact to the heat source in order to convert heat energy into electricity.
  • a component carrier in particular PCB
  • an advantageous measure which may be taken according to an exemplary embodiment of the invention is the integration of a native energy harvester in form of one or more thermoelectric devices directly in the body of the component carrier (in particular PCB) or package. Consequently, an energy harvester being fully integrated to a package can be obtained.
  • an energy harvester is fully or substantially fully made out of PCB material, such as FR4 and copper.
  • Exemplary applications of component carriers according to exemplary embodiments of the invention are autonomous sensors, wearables, remote sensors and/or actuators, machine monitoring, communication, smart integrated systems, etc.
  • Exemplary embodiments of the invention may allow to meet the demand for sensor systems that are autonomous and, for this reason, can be used remotely to monitor different applications (such as engines, plants, manufacture machines, health applications, wearables, etc.).
  • applications such as engines, plants, manufacture machines, health applications, wearables, etc.
  • the integration of an energy harvesting system into the packaging is highly advantageous.
  • Exemplary embodiments of the invention may correspondingly add an additional energy harvesting functionality to a component carrier.
  • an autonomous energy harvester integrated as a thermoelectric device in a component carrier such as a PCB can be used in virtually any sensing system where small amounts of energy are sufficient.
  • Figure 1 illustrates a cross-sectional view of a component carrier 100, which is here embodied as printed circuit board (PCB), according to an exemplary embodiment of the invention.
  • the component carrier 100 according to Figure 1 is configured as a fully autonomous sensor system with energy harvesting capability to thereby generate the operation energy of the component carrier 100 by itself.
  • the component carrier 100 comprises a highly heat absorbing (for instance black) and highly thermally conductive surface layer 102 arranged on an exterior surface of the component carrier 100.
  • the surface layer 102 is a double layer composed of a graphite layer 177 covered by a thin optically and infrared transparent coating 114 with high robustness, for instance an appropriate varnish.
  • the surface layer 102, in particular the graphite layer 177 thereof, is configured for being heated by an external heat source 104, in the shown embodiment the schematically illustrated sun.
  • the thermal conductivity of the graphite layer 177 (for instance embodied as Pyrolytic Highly Oriented Graphite Sheet) may be several hundred or even more than thousand W/mK.
  • the material of the graphite layer 177 has a high absorption coefficient for optical and infrared light. Consequently, a significant amount of the thermal energy from the heat source 104 impinging on the surface layer 102 will be absorbed by the latter. As shown in Figure 1, the surface layer 102 may be arranged without physical contact to the external heat source 104 for providing thermal energy to be absorbed.
  • the component carrier 100 additionally comprises a thermoelectric device 106 which is fully embedded or built in within material of the component carrier 100 without surface access, so that the thermoelectric device 106 does not form part of an exterior surface of the component carrier 100.
  • the thermoelectric device 106 is buried and fully shielded by material of the component carrier 100 with regard to an environment. Thereby, It is safely prevented that the sensitive thermoelectric device 106 is mechanically damaged during operation of the component carrier 100. Furthermore, corrosive moisture, aggressive chemicals and thermally insulating dust or dirt can be prevented from negatively influencing the thermoelectric device 106. Therefore, a highly reliable component carrier 100 with a high lifetime may be obtained.
  • the continuous surface layer 102 can be applied easily and needs not be processed (for instance patterned) for accessing the thermoelectric device 106.
  • thermoelectric device 106 is thermally coupled with the surface layer 102 via an optional intermediate heat storage structure 116 which will be described below in further detail.
  • the thermoelectric device 106 is configured for transferring thermal energy supplied by the heated surface layer 102 into electric energy.
  • the thermoelectric device 106 may be fully surrounded by material of (in particular embedded or built in within) the interconnected layer stack 108 comprising the surface layer 102, a plurality of electrically insulating layer structures 110 (such as layers of prepreg) and a plurality of electrically conductive layer structures 112 (such as copper structures).
  • Stack 108 may be interconnected for Instance by lamination, i.e. the application of thermal energy and/or heat.
  • the plate-like thermoelectric device 106 may be a Seebeck element (implementing for instance a copper-nickel junction) or a Peltier element (implementing for instance a semiconductor-semiconductor junction).
  • thermoelectric device 106 At least a part of a lower main surface and of side surfaces of the thermoelectric device 106 is surrounded by thermally poorly conductive material in form of prepreg or FR4 of the layer stack 108.
  • an upper main surface of the thermoelectric device 106 is thermally coupled to the highly thermally conductive material of the surface layer 102.
  • the component carrier 100 comprises a layer-type heat storage structure 116 (which is here embodied as a layer of phase change material) sandwiched between the surface layer 102 and the thermoelectric device 106.
  • the heat storage structure 116 is capable of temporarily storing excessive amount of heat (or corresponding energy) generated in the surface layer 102. Thus, such energy may be buffered in the heat storage structure 116 before supplying this energy to the thermoelectric device 106. This further increases reliability of the operation of the component carrier 100, since a heat overflow in the thermoelectric device 106 may be safely prevented.
  • the component 100 comprises a stack of three components 118 which are all embedded in the component carrier 100, for instance may be laminated together with the layer stack 108.
  • the components 118 are electrically coupled to the thermoelectric device 106 via electrically conductive layer structures 112 so that generated electric energy can be conducted from the thermoelectric device 106 to the components 118 for providing operation energy to the components 118.
  • the components 118 form part of a chemical sensor system.
  • This sensor system comprises a chemical sensing element 120 (for instance a semiconductor chip with the capability of sensing a certain chemical in an environment of the component carrier 100) as a first one of the components 118 on an exterior surface of the component carrier 100.
  • the chemical sensing element 120 is configured for generating a sensor signal indicating the value of this chemical as sensor parameter.
  • the chemical sensing element 120 is electrically and communicatively coupled with a processing element 122 (for instance a further semiconductor chip serving as processing resource) as a second one of the components 118 and is configured for processing the sensor signal.
  • the processing element 122 may retrieve the value of the sensor parameter from the sensor signal.
  • the sensor system comprises a wireless communication unit 124 (for example yet another semiconductor chip having wireless communication capability) as a third one of the components 118.
  • the wireless communication unit 124 is electrically and communicatively coupled with the processing element 122 and is supplied with the retrieved value of the sensor parameter by the processing element 122.
  • the wireless communication unit 124 is further configured for wirelessly communicating this sensor information to a communication partner device (not shown in Figure 1).
  • the various components 118 are coupled to one another via directly connected pads 191.
  • the electrically conductive layer structures 112 (such as patterned metal foils and metal filled vias) of the layer stack 108 may be configured for electrically coupling the sensing element 120, the processing element 122 and the communication unit 124 with one another.
  • Figure 2A illustrates a cross-sectional view
  • Figure 2B illustrates a plan view
  • Figure 2C illustrates a schematic overview of a component carrier 100 with power autonomous sensor function according to an exemplary embodiment of the invention.
  • the component carrier 100 according to Figure 2A to Figure 2C is a PCB- based energy harvesting packaging module which should preferably have a large area to be exposed to light sources, in the shown embodiment the sun, as external heat source 104.
  • the PCB-type component carrier 100 can be associated to light absorbing materials such as black coatings, carbon nanotubes, quantum dots, photonic crystals, graphite, etc. as a surface layer 102 that can absorb for example up to 99% of incident light 165 produced by the external heat source 104.
  • thermoelectric device 106 In these materials, the incident light 165 is basically converted into heat. Consequently, the PCB system carrying the black coating in form of the surface layer 102 experiences an increase in temperature.
  • Micro thermoelements forming the thermoelectric device 106 are used to convert the thermal energy into electricity to be supplied to an electrical system (see components 118) contained Into and/or onto the PCB- type component carrier 100. Such thermoelectric devices 106 may also be embedded or native in the PCB.
  • the device depicted in Figure 2A and Figure 2C is hence capable of converting visible and infrared radiation into electricity and to operate autonomously.
  • the PCB-body, see layer stack 108, is the mechanical support and the encapsulation of the electrical system.
  • the black surface of the PCB i.e.
  • the thermoelectric device 106 is connected to the remote sensor system via copper vias 167.
  • the remote sensor system may be composed by at least one sensing element 120, at least one signal processing element 122 and at least one communication unit 124 for wirelessly communicating with a communication partner device 126 (for instance a central unit) by emission of electromagnetic (Wi-Fi or RF, for example) or mechanical (infrasound or ultrasound, for example) waves 169.
  • the processed signal is sent via radio electromagnetic waves or mechanical waves 169 to the communication partner device 126, where the sensed data may be compiled.
  • thermoelectric device 106 relies on a temperature difference between its two opposing main surfaces. This is guaranteed by the almost thermally insulating FR4 and prepeg materials of electrically insulating layer structure HO that encloses a bottom portion of the thermoelectric device 106.
  • the component carrier 100 can absorb heat also from moving parts (for example turbines, motors, etc.) and/or remote bodies (for instance sunlight).
  • the component carrier 100 can also be activated in a contact mode.
  • Figure 2C illustrates communication partner device 126 as central unit being communicatively coupled with a plurality of component carriers 100 of the type shown in Figure 2A and Figure 2B forming a distributed sensing network.
  • FIG. 3 illustrates how the component carrier 100 according to Figure
  • FIG. 2A to Figure 2C is implementable in combination with a moving external heat source 104, in the shown embodiment a turbine.
  • a moving external heat source 104 in the shown embodiment a turbine.
  • Infrared thermal energy originating from the external heat source 104 and reaching the surface layer 102 of the component carrier 100 generates electrical energy used for self- empowering sensor system 120, 122, 124, for Instance to measure temperature of the moving external heat source 104.
  • Figure 4 schematically illustrates cooperation of surface layer 102 and thermoelectric device 106 of a component carrier 100 according to an exemplary embodiment of the invention for creation of an electric voltage V.
  • Reference 400 indicates incoming heat, for instance infrared thermal energy coming from a turbine.
  • Figure 5 shows an experimental set up for a proof of principle of a component carrier 100 with integrated power harvesting arrangement according to an exemplary embodiment of the invention.
  • Figure 5 shows the schematics and the setup of an experiment ran in applicant's laboratory to qualitatively differentiate the light absorption between common materials in a PCB.
  • Figure 5 shows the results for different materials, i.e. the temperature of the illuminated samples at steady-state.
  • reference numeral 206 is the material that is absorbing heat from an external source 200.
  • the external source 200 is a 150W infrared lamp that was placed 1,5 cm away from the sample (i.e. material 206) in order to achieve sufficiently high temperatures quickly.
  • Reference numeral 202 represents the infrared light rays that heated the sample (i.e. material 206).
  • the temperature of the heated surface (compare reference numeral 206) at steady state was measured by a thermometer 204. This experiment was carried out with the following materials 206:
  • This experiment emulates how exemplary embodiments of the invention can be used specially close to hot structures such as moving motor parts, airplane turbines (see Figure 4), melting metals, cooking meals, chemical reactions, etc., where the heat dissipation energy can be harvested without any mechanical contact.
  • FIG. 6 shows the function of a thermoelectric device 106 (with dimensions smaller than 1mm 3 ) of a component carrier 100 according to an exemplary embodiment of the invention.
  • thermoelectric device 106 When the thermoelectric device 106 is placed between a hot reservoir 210 and a cold reservoir 212, electrical power is output, see reference numeral 214.
  • Figure 7 is a diagram 700 illustrating the dependency of temperature difference (plotted along an abscissa 702) and output power (plotted along an ordinate 704 of a thermoelectric device 106 of a component carrier 100 according to an exemplary embodiment of the invention. Thus, Figure 7 illustrates the calculated maximum power versus temperature difference.
  • thermoelectric devices 106 which may be used according to exemplary embodiments of the invention to convert thermal power absorbed by the PCB into electric energy.
  • the dimensions of the thermoelectric device 106 according to Figure 6 allow these thermoelectric devices 106 to be embedded in a PCB.
  • Figure 7 shows the efficiency on energy conversion of these thermoelectric devices 106.
  • Another possibility is the production of thermoelectric devices 106 in the PCB with metal-metal junction devices (exploiting the Seebeck effect). This can be realized by applying layers of iron and bismuth, for example, in the build-up of the PCB.
  • the Seebeck thermoelement can be build up using metals that are commons in the PCB construction, i.e. copper and nickel.
  • An efficient Seebeck thermoelement can be built with the combination of copper and constantan (i.e. an alloy of 55% copper and 45% nickel).
  • Figure 8 illustrates an arrangement of a component carrier 100 according to an exemplary embodiment of the Invention in combination with an external heat source 104.
  • the embodiment according to Figure 8 relates to the application of a wireless thermometer or light intensity detector.
  • Figure 8 describes how a component carrier 100 according to an exemplary embodiment of the invention can be used, for example, as a contactless thermometer.
  • the component carrier 100 is placed in the surrounding of the heat source 104 (for instance a heat emitting engine, moving part, melting metal, etc.), which generates infrared radiation (see reference numeral 400).
  • the infrared radiation is absorbed by the heat absorption unit, i.e. the surface layer 102, and is converted into a temperature increase (up to T 1 ).
  • a resulting temperature gradient through the component carrier 100 generates electric power in the thermoelement or thermoelectric device 106.
  • the temperature on the back side of the thermoelectric device 106 is monitored or even controlled with a thermometer (see control temperature unit 800 at temperature To).
  • thermometer can be a simple thermocouple or temperature dependent resistor.
  • the harvested energy is used to send the readings of the temperature or to empower any other sensor unit, depending on the case.
  • the device described in Figure 8 can be used as a light detector and luminosity sensor.
  • the reading is done simply by knowing T 1 and To (which can be monitored by conventional thermometers) in the modified Stefan-Boltzmann equation.
  • the reading of the power will indicate the light intensity that reaches the surface layer 102 of the device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un support de composant (100) qui comprend une couche de surface thermiquement absorbante et thermiquement conductrice (102) conçue pour être chauffée par une source de chaleur externe (104), et un dispositif thermoélectrique (106) entièrement entourée par un matériau du support de composant (100), couplé thermiquement à la couche de surface (102) et conçu pour transférer l'énergie thermique de la couche de surface chauffée (102) en énergie électrique.
PCT/EP2017/074472 2016-09-27 2017-09-27 Support de composant doté d'un dispositif thermoélectrique entièrement encapsulé WO2018060233A1 (fr)

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Application Number Priority Date Filing Date Title
DE102016118271.0 2016-09-27
DE102016118271 2016-09-27

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110248846A1 (en) 2010-04-13 2011-10-13 Green SHM Systems, Inc, Incorporated Wireless Sensing Module and Method of Operation
US20120201008A1 (en) * 2011-02-05 2012-08-09 Laird Technologies, Inc. Circuit assemblies including thermoelectric modules
US20130192655A1 (en) * 2007-08-29 2013-08-01 Texas Instruments Incorporated Thermoelectric device embedded in a printed circuit board
EP2790474A1 (fr) * 2013-04-09 2014-10-15 Harman Becker Automotive Systems GmbH Dispositif de refroidissement/chauffage thermoélectrique intégré dans une carte à circuit imprimé
EP2876697A2 (fr) * 2013-11-26 2015-05-27 Robert Bosch Gmbh Module électronique, procédé de fonctionnement d'un tel module électronique et procédé de fabrication d'un tel module électronique
WO2015090902A1 (fr) * 2013-12-19 2015-06-25 Robert Bosch Gmbh Dispositif thermoélectrique et procédé de fabrication d'un dispositif thermoélectrique
EP2903042A1 (fr) 2013-11-12 2015-08-05 Robert Bosch Gmbh Module thermoélectrique et procédé de fabrication d'un module thermoélectrique
DE102014202008A1 (de) * 2014-02-05 2015-08-06 Robert Bosch Gmbh Elektronisches System und Verfahren zum Herstellen eines elektronischen Systems

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130192655A1 (en) * 2007-08-29 2013-08-01 Texas Instruments Incorporated Thermoelectric device embedded in a printed circuit board
US20110248846A1 (en) 2010-04-13 2011-10-13 Green SHM Systems, Inc, Incorporated Wireless Sensing Module and Method of Operation
US20120201008A1 (en) * 2011-02-05 2012-08-09 Laird Technologies, Inc. Circuit assemblies including thermoelectric modules
EP2790474A1 (fr) * 2013-04-09 2014-10-15 Harman Becker Automotive Systems GmbH Dispositif de refroidissement/chauffage thermoélectrique intégré dans une carte à circuit imprimé
EP2903042A1 (fr) 2013-11-12 2015-08-05 Robert Bosch Gmbh Module thermoélectrique et procédé de fabrication d'un module thermoélectrique
EP2876697A2 (fr) * 2013-11-26 2015-05-27 Robert Bosch Gmbh Module électronique, procédé de fonctionnement d'un tel module électronique et procédé de fabrication d'un tel module électronique
WO2015090902A1 (fr) * 2013-12-19 2015-06-25 Robert Bosch Gmbh Dispositif thermoélectrique et procédé de fabrication d'un dispositif thermoélectrique
DE102014202008A1 (de) * 2014-02-05 2015-08-06 Robert Bosch Gmbh Elektronisches System und Verfahren zum Herstellen eines elektronischen Systems

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