DE102014202008A1 - Elektronisches System und Verfahren zum Herstellen eines elektronischen Systems - Google Patents
Elektronisches System und Verfahren zum Herstellen eines elektronischen Systems Download PDFInfo
- Publication number
- DE102014202008A1 DE102014202008A1 DE102014202008.5A DE102014202008A DE102014202008A1 DE 102014202008 A1 DE102014202008 A1 DE 102014202008A1 DE 102014202008 A DE102014202008 A DE 102014202008A DE 102014202008 A1 DE102014202008 A1 DE 102014202008A1
- Authority
- DE
- Germany
- Prior art keywords
- micromechanical
- thermoelectric generator
- electronic system
- thermal energy
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 title description 3
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 238000004377 microelectronic Methods 0.000 claims abstract description 41
- 238000004146 energy storage Methods 0.000 claims description 33
- 239000012782 phase change material Substances 0.000 claims description 19
- 239000002470 thermal conductor Substances 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 238000004382 potting Methods 0.000 claims description 6
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- 239000000853 adhesive Substances 0.000 claims description 4
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- 230000001133 acceleration Effects 0.000 claims description 3
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- 238000001721 transfer moulding Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 239000002131 composite material Substances 0.000 claims description 2
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- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
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- QBWKPGNFQQJGFY-QLFBSQMISA-N 3-[(1r)-1-[(2r,6s)-2,6-dimethylmorpholin-4-yl]ethyl]-n-[6-methyl-3-(1h-pyrazol-4-yl)imidazo[1,2-a]pyrazin-8-yl]-1,2-thiazol-5-amine Chemical compound N1([C@H](C)C2=NSC(NC=3C4=NC=C(N4C=C(C)N=3)C3=CNN=C3)=C2)C[C@H](C)O[C@H](C)C1 QBWKPGNFQQJGFY-QLFBSQMISA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 229940125846 compound 25 Drugs 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000002918 waste heat Substances 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 229920001940 conductive polymer Polymers 0.000 description 2
- 238000013461 design Methods 0.000 description 2
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- 230000009885 systemic effect Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Micromachines (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014202008.5A DE102014202008A1 (de) | 2014-02-05 | 2014-02-05 | Elektronisches System und Verfahren zum Herstellen eines elektronischen Systems |
| EP15701724.5A EP3103145A1 (fr) | 2014-02-05 | 2015-01-20 | Système électronique et procédé de production d'un système électronique |
| PCT/EP2015/050952 WO2015117814A1 (fr) | 2014-02-05 | 2015-01-20 | Système électronique et procédé de production d'un système électronique |
| CN201580007202.1A CN105940513A (zh) | 2014-02-05 | 2015-01-20 | 电子系统和用于制造电子系统的方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014202008.5A DE102014202008A1 (de) | 2014-02-05 | 2014-02-05 | Elektronisches System und Verfahren zum Herstellen eines elektronischen Systems |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102014202008A1 true DE102014202008A1 (de) | 2015-08-06 |
Family
ID=52434761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102014202008.5A Withdrawn DE102014202008A1 (de) | 2014-02-05 | 2014-02-05 | Elektronisches System und Verfahren zum Herstellen eines elektronischen Systems |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3103145A1 (fr) |
| CN (1) | CN105940513A (fr) |
| DE (1) | DE102014202008A1 (fr) |
| WO (1) | WO2015117814A1 (fr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017068476A1 (fr) * | 2015-10-21 | 2017-04-27 | Soreq Nuclear Research Center | Systèmes de refroidissement ultra compacts basés sur des accumulateurs de chaleur à matériau à changement de phase |
| WO2018060233A1 (fr) * | 2016-09-27 | 2018-04-05 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Support de composant doté d'un dispositif thermoélectrique entièrement encapsulé |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106404821B (zh) * | 2016-10-31 | 2023-05-23 | 华南理工大学 | 一种材料相变行为表征用电-热耦合处理系统 |
| DE102017206744B9 (de) * | 2017-04-21 | 2023-01-12 | Infineon Technologies Ag | Mems package mit hoher wärmekapazität und verfahren zum herstellen selbiger |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT190151B (de) | 1955-10-25 | 1957-06-11 | Landis & Gyr Ag | Rücklaufhemmung mit Signalgabe für elektrische Meßinstrumente, insbesondere Elektrizitätszähler |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3051919B2 (ja) * | 1998-11-13 | 2000-06-12 | セイコーインスツルメンツ株式会社 | 熱発電式電子機器 |
| DE10324156A1 (de) * | 2003-05-22 | 2004-12-16 | Siemens Ag | Verfahren und Anordnung zum thermischen Schutz elektronischer Einheiten in einem elektronischen Gerät |
| DE10347518A1 (de) * | 2003-10-13 | 2005-05-25 | Siemens Ag | Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher |
| FR2961956B1 (fr) * | 2010-06-23 | 2012-08-17 | Commissariat Energie Atomique | Thermogenerateur a materiaux a changement de phase |
| US20120152297A1 (en) * | 2010-12-15 | 2012-06-21 | The Boeing Company | Power generation using a thermoelectric generator and a phase change material |
-
2014
- 2014-02-05 DE DE102014202008.5A patent/DE102014202008A1/de not_active Withdrawn
-
2015
- 2015-01-20 EP EP15701724.5A patent/EP3103145A1/fr not_active Withdrawn
- 2015-01-20 CN CN201580007202.1A patent/CN105940513A/zh active Pending
- 2015-01-20 WO PCT/EP2015/050952 patent/WO2015117814A1/fr active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT190151B (de) | 1955-10-25 | 1957-06-11 | Landis & Gyr Ag | Rücklaufhemmung mit Signalgabe für elektrische Meßinstrumente, insbesondere Elektrizitätszähler |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017068476A1 (fr) * | 2015-10-21 | 2017-04-27 | Soreq Nuclear Research Center | Systèmes de refroidissement ultra compacts basés sur des accumulateurs de chaleur à matériau à changement de phase |
| WO2018060233A1 (fr) * | 2016-09-27 | 2018-04-05 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Support de composant doté d'un dispositif thermoélectrique entièrement encapsulé |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015117814A1 (fr) | 2015-08-13 |
| CN105940513A (zh) | 2016-09-14 |
| EP3103145A1 (fr) | 2016-12-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |