EP3066722B1 - Ensemble de liaison électrique - Google Patents

Ensemble de liaison électrique Download PDF

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Publication number
EP3066722B1
EP3066722B1 EP14789794.6A EP14789794A EP3066722B1 EP 3066722 B1 EP3066722 B1 EP 3066722B1 EP 14789794 A EP14789794 A EP 14789794A EP 3066722 B1 EP3066722 B1 EP 3066722B1
Authority
EP
European Patent Office
Prior art keywords
contact plate
compression spring
contact
connection arrangement
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14789794.6A
Other languages
German (de)
English (en)
Other versions
EP3066722A1 (fr
Inventor
Joachim Hein
Nico Herzberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF CV Systems Hannover GmbH
Original Assignee
Wabco GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wabco GmbH filed Critical Wabco GmbH
Publication of EP3066722A1 publication Critical patent/EP3066722A1/fr
Application granted granted Critical
Publication of EP3066722B1 publication Critical patent/EP3066722B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H01R12/718—Contact members provided on the PCB without an insulating housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/33—Contact members made of resilient wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
    • H01R12/7011—Locking or fixing a connector to a PCB
    • H01R12/707—Soldering or welding

Definitions

  • the invention relates to a connection arrangement for the electrical connection of at least one solenoid valve with at least one conductor of a printed circuit board, wherein the at least one solenoid valve has at least one compression spring for electrically conductive connection, and the at least one compression spring mechanically biased between the at least one solenoid valve and the circuit board is arranged.
  • Contact surfaces for particularly corrosion-resistant and electrically conductive connections between electronic circuit boards and other electronic or electrical components are usually made of tin, silver or gold.
  • further contacts are known, which are based on spring elements and connection structures with a complex geometry. These spring elements and connection structures are provided with a surface finish of tin, silver or gold and then electrically connected to the circuit board.
  • the complexity of the spring elements and the connection structures used causes high production costs and often requires a larger installation space.
  • electrical contacts using a on a conductor track or a contact pad of a circuit board supporting metallic compression spring for electrical connection of an external component, such as a solenoid valve or a sensor are also known.
  • an external component such as a solenoid valve or a sensor
  • contact partners for example, a gold-plated contact spring and a gold-plated at least in the contact zone trace with copper as the base material used, which is largely insensitive to harmful corrosive climatic influences and therefore enable reliable electrical connection.
  • a barrier layer of nickel is necessary to prevent diffusion processes.
  • this barrier layer has, however, in particular in connection with the known press-fit technology, in which electrical components in metallized or provided with metallic sleeves PCB holes mechanically fixed by simply pressing and at the same time be contacted with the tracks of the circuit board, as sensitive to climatic Influences, which can lead to the formation of cracks, subterranean and local corrosion in the contact points.
  • contact spring and conductor track Even with other material pairings of contact spring and conductor track, such as silver-silver, silver-tin or silver solder can at adverse climatic influences, with vibration relative movements between the contact spring and the conductor and / or in the case of higher current loads, chemical corrosion effects and / or Reibkorrosionserscheinept occur, the consequences extend to a total failure of the affected electrical contact point.
  • a pressure sensor assembly with an electrical connection for a measuring element is known.
  • the external electrical connection of the pressure sensor assembly takes place with a plurality of spring contacts designed in the manner of a helical compression spring, which are each guided through an opening of a threading funnel, which in turn is arranged in a pressure sensor housing.
  • the spring contacts are supported between the contacts in the contact carrier and an external abutment.
  • the spring contact Within the pressure sensor housing, the spring contact is axially rigidly wound on block, while the spring contact outside of the pressure sensor housing in the axial Can deflect direction.
  • a direct electrical connection of a circuit board by means of the spring contacts is not provided.
  • DE 10 2011 075 901 A1 discloses a coil assembly and identification transmitter for an access control system.
  • US 6,174,174 B1 and US 2004/0075168 A1 disclose connection arrangements for the electrical connection of a semiconductor chip to a printed circuit board, wherein the electrical connection is effected by means of contact springs.
  • the invention has for its object to present a structurally simple design and especially resistant to fretting corrosion and against other corrosion processes connection arrangement for electrically reliable connection of a solenoid valve to a circuit board.
  • the invention is based on the knowledge that external components can be contacted with the aid of compression springs in a structurally simple manner and, moreover, electrically reliably with conductor tracks of a printed circuit board.
  • the invention therefore relates to a connection arrangement for the electrical connection of at least one solenoid valve with at least one conductor of a printed circuit board, wherein the at least one solenoid valve has at least one compression spring for electrically conductive connection, and the at least one compression spring mechanically biased between the at least one solenoid valve and the circuit board is arranged ,
  • a printed circuit board facing the contact end of the at least one compression spring to ensure a reliable electrical Connection rests against a contact plate which is electrically connected to the conductor track.
  • connection arrangement which allows a vibration-proof and corrosion-resistant connection of an external component, such as the solenoid valve, to an electronic circuit board. Since this connection arrangement makes gold plating of printed conductors unnecessary, the printed circuit board can be produced cost-effectively and is easily compatible with the use of the press-fit technology.
  • the compression spring allows axial tolerance compensation and the compensation of thermal expansion and manufacturing tolerances.
  • the last turn of the Druckendabitess the compression spring is ground flat. Furthermore, for this purpose, the last turns of the Whyendabitess the compression spring wound on block and thereby be formed axially compressive stiff.
  • corrosion is understood to mean friction corrosion processes as well as chemical and electrochemical corrosion processes.
  • Reibkorrosionsvone occur when, for example, vibration relative movements between the compression spring and the contact plate occur.
  • microscopically small metal particles are detached as a result of the movement of the contact partners and rubbed off, as a result, the effective metallic contact surface is reduced, which can cause, inter alia, an increase in the electrical contact resistance.
  • chemical corrosion concerns primarily chemical reactions of a usually metallic material with substances from its environment.
  • electro-chemical corrosion processes an electrical current flow is present in addition to a material change.
  • the number of compression springs corresponds to the number of contact plates.
  • the diameter of the spring wire used to wind the compression spring, the outer diameter of the compression spring in relation to their total length or height and the number of turns or the pitch angle of the turns are dimensioned so that the compression spring, taking into account the selected to create a sufficient contact pressure mechanical bias and all in real operation of the terminal assembly occurring mechanical loads does not buckle in the radial direction.
  • the thickness of the contact plate is at least twice as large as the thickness of the conductor track electrically conductively connected to the contact plate. This results in a high abrasion resistance of the contact plate, which makes them particularly insensitive to reibkorrosiven processes.
  • the contact plate is formed from or with a copper-tin alloy, in particular as a CuSn6 alloy.
  • a copper-tin alloy in particular as a CuSn6 alloy.
  • the CuSn6 alloy from the large group of bronzes, which is only given by way of example here, it is also possible to use other bronze alloys or other metal alloys for the contact plate.
  • the conductor tracks of the printed circuit board are preferably formed from chemically pure copper or with a copper alloy.
  • the compression spring is at least partially provided with a passivated silver coating. This results in a high electrical surface conductivity of the compression spring at the same time good corrosion resistance. Basically, the application of the passivated silver coating sufficiently in the contact end section of the compression spring, since the actual electrical contacting takes place there.
  • an upper side of the contact plate facing the contact end section of the pressure spring is provided with a passivated silver coating. This results in a low electrical contact resistance of the contact end of the compression spring to the contact plate at a high climatic corrosion resistance.
  • the outer surfaces or the outer edges of the contact plate can also be provided with a passivated silver coating in order to achieve very good corrosion protection.
  • the silver coating of the compression spring and the silver coating of the contact plate are the same thickness.
  • the respective silver coating is preferably applied by electroplating.
  • the layer thickness of the silver coating of the compression spring and the layer thickness of the silver coating of the contact plate be 2 microns to 5 microns. These layer thicknesses are quite large and thus allow a very good corrosion and abrasion resistance of the contact partners.
  • the susceptibility to corrosion of the arranged under such thin layers of copper conductor tracks is correspondingly low.
  • a chemically applied coating of gold additionally requires a barrier layer of nickel.
  • one of the at least one conductor track facing underside of the contact plate is tinned at least partially.
  • the Substrate of the contact plate may optionally be provided in regions with a suitable adhesive for securing against slipping prior to the soldering process.
  • Another development of the invention provides that the surface of the contact plate on all sides projects beyond the outer diameter of the Whyendabitess the compression spring. As a result, a reliable electrical contact with a maximum electrical contact zone is given.
  • the surface of the at least one conductor track in the region of the contact plate projects beyond it on all sides.
  • the contact plate in the region of its top has a recess for at least partially receiving the Kunststoffendab songs the at least one compression spring.
  • a position assurance of the compression spring is given in relation to the contact plate.
  • the depression within the contact plate may at the same time be adapted to the shaping of the contact end section in order to provide the greatest possible contact area and to increase the current conductivity of the connection arrangement.
  • the compression spring is a cylindrical helical compression spring.
  • Such a trained compression spring can be relatively easily and inexpensively.
  • the contact plate has an at least quadrangular circumferential geometry, a circular peripheral geometry, an elliptical peripheral geometry, an oval peripheral geometry or a combination of at least two of the aforementioned peripheral geometries.
  • the peripheral geometry of the contact plate corresponds to the geometries of pads or contact surfaces commonly used on printed circuit boards.
  • connection assembly 10 has a solenoid valve 12 which is connected by means of a pressure spring 18 designed as a helical compression spring 16 electrically conductive with a contact plate 20, which in turn is electrically conductively connected to a printed circuit board 24 arranged on a conductor track 22.
  • a pressure spring 18 designed as a helical compression spring 16 electrically conductive with a contact plate 20, which in turn is electrically conductively connected to a printed circuit board 24 arranged on a conductor track 22.
  • An underside 26 of the contact plate 20 is thermally joined to the conductor track 22 by means of a soldered connection 28 for producing an electrically conductive connection and for mechanically fastening the contact plate 20 to the printed circuit board 24.
  • a solder joint 28 can also others Joining methods are used, which allow a comparatively low-resistance connection between the contact plate 20 and the conductor track 22.
  • a sensor-side end section 30 of the helical compression spring 16 directed away from the printed circuit board 24 is integrated into a housing 34 of the solenoid valve 12 in the region of a housing underside 32 in order to electrically connect the measuring elements, not shown, and an optional measuring electronics within the solenoid valve 12.
  • the helical compression spring 16 thus represents the electrical connection of the solenoid valve 12 to the circuit board 24.
  • a leading away from the valve-side end portion 30 and the printed circuit board 24 facing the contact end portion 36 of the helical compression spring 16 is located with a mechanical bias of suitable strength at an upper side 38 of the contact plate 20 for making an electrical contact.
  • the circuit board side end portion 40 of the helical compression spring 16 is ground flat.
  • the surface geometry of the top 38 of the contact plate 20 may be formed corresponding to the geometry of the front end of the contact end portion 36.
  • a longitudinal central axis 42 of the cylindrical helical compression spring 16 extends approximately perpendicular to the top 38 of the contact plate 20 and to the housing bottom 32 of the housing 34 of the solenoid valve 12th
  • the thickness 44 of the contact plate 20 is significantly greater than a thickness 46 of the conductor track 22 in order to ensure a sufficient mechanical stability and in particular a sufficient abrasion resistance of the contact plate 20.
  • an optional, for example cup-shaped recess 48 may be formed in order to achieve a positional securing of the contact end section 36 with respect to mechanical forces acting parallel to the upper side 38 of the contact plate 20.
  • the surface geometry of the bottom 50 of the pot-like recess 48 may in turn be designed so that they minimize the electrical contact resistance with the frontal shaping the Kunststoffendabitess 36 of the helical compression spring 16 corresponds, so that the surface grinding of the circuit board-side end portion 40 of the helical compression spring 16 can be omitted.
  • the upper side 38 of the contact plate 20 has such a large areal extent that it preferably protrudes on all sides beyond the contact end section 36 of the helical compression spring 16, resulting in a maximum electrical contact area.
  • both the cylindrical helical compression spring 16 and the contact plate 20 are preferably provided over the entire surface with a passivated silver coating 60, 62.
  • the base material of the contact plate 20 is preferably a bronze alloy or a copper-tin alloy, in particular a CuSn6 alloy.
  • the wire diameter d of a metallic spring wire used for producing the cylindrical helical compression spring 16 and the outer diameter D of the helical compression spring 16 itself are dimensioned in relation to a total length L and the number of turns or pitch angle ⁇ of the turns so that the helical compression spring 16 under the creation of a sufficient Contact pressure selected mechanical bias and all loads acting beyond the operation in the radial direction does not buckle.
  • the total length L corresponds to the vertical distance h between the housing bottom 32 of the solenoid valve 12 and the top 38 of the contact plate 20 in the assembled state of the connection assembly 10th
  • connection assembly 10 with only one helical compression spring 16 is a Variety of compression springs with a corresponding number of contact plates and helical compression springs necessary to electrically contact sensors and / or actuators with more than one electrical connection and / or a larger number of sensors and / or actuators with the conductor 22 and other tracks of the circuit board 24 ,
  • more than one pressure spring it is possible in this case for more than one pressure spring to be supported on a respective contact plate in order in particular to optimize the current conductivity of the connection arrangement 10.
  • soldered to the circuit board 24 contact plate 20 is to be judged in terms of manufacturing costs compared to previously known technical solutions as neutral, as this can be processed, for example, with the same SMD placement and soldering, which also for loading and soldering by means of the circuit board 24th interconnected electronic and electrical components are used.
  • the application of the passivated silver coatings 60, 62 on the contact plate 20 and at least the contact portion of the helical compression spring 16 can also be done in the course of the manufacturing process of the circuit board 24 by means of known coating methods.
  • the passivated silver coating 62 of the contact plate 20 facilitates the soldering process thereof with the trace 22. After completing the connection assembly 10, the portions of the trace 22 not covered by the solder joint 28 can still be protected with those of chemically pure copper or with a copper alloy formed tracks better protect against harmful corrosive influences.
  • a protective coating for example, a suitable protective lacquer or the like can be used.
  • Fig. 2 shows a plan view of the contact plate 20 of Fig. 1 without the helical compression spring 16 with the underlying trace 22. From the illustration, it is initially apparent that the contact plate 20 is a circular Has peripheral contour, which concentrically surrounds the cross-sectional geometry of the here indicated only with dashed radial boundary lines cylindrical helical compression spring 16 and thereby creates the largest possible contact area between the contact plate 20 and the helical compression spring 16.
  • the diameter 54 of the contact plate 20 is preferably at least slightly smaller than a width 56 of the conductor 22 of the circuit board 24 to provide a narrow, the contact plate 20 concentrically surrounding edge zone for an annular meniscus 58 of the solder joint 28 here.
  • the dimensions of the contact plate 20 and the printed conductor 22 on the printed circuit board 24 are preferably always dimensioned so that the printed conductor 22 projects on all sides at least slightly beyond the contact plate 20.
  • Fig. 3 shows a further embodiment of a contact plate 70 with an approximately square peripheral contour with four, but each slightly rounded corners and the underlying conductor 22.
  • the contact plate 70 is in turn connected by a solder connection 72 conductively connected to the conductor 22 of the circuit board 24.
  • the width 74 and the length 76 of the contact plate 70 are each the same size and in this case preferably slightly smaller than the width 56 of the conductor 22 of the circuit board 24 to provide a contact plate 70 peripheral edge zone for a meniscus 78 of a solder joint 72.
  • FIGS. 4 and 5 show a third embodiment of a contact plate 80 with a circumferential geometry which corresponds to that of an equilateral octagon, and a fourth embodiment of a contact plate 90 which has a square or square peripheral geometry without rounded corners.
  • Said contact plates 80, 90 are respectively positioned on the underlying conductor track 22 of the printed circuit board 24, but not yet soldered to the conductor track 22.
  • Two narrow edge zones 82, 92 surround the contact plates that have not yet been soldered to the conductor track 22 of the printed circuit board 24 80, 90 preferably on all sides and serve as a propagation space for the menisci of not shown here or not yet existing solder joints.
  • FIGS. 2 to 5 Shown embodiments are also contact plates with an oval, an elliptical or any combination of oval and / or elliptical peripheral geometries with at least one of the in the FIGS. 2 to 5 shown peripheral geometries possible.
  • a circumferential geometry of a contact plate may have any, for example, also multiply curved course, as long as the contact plate protrudes on all sides over the Dodgeendabschnitt its associated at least one helical compression spring 16 over and also protrudes at any side on the associated conductor track.
  • a thickness of the applied passivated silver coating applied in the edge region may be reduced compared with other surface zones of the contact plate.

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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Measuring Leads Or Probes (AREA)

Claims (11)

  1. Arrangement de connexion (10) servant à la connexion électrique d'une électrovanne (12) avec au moins une piste conductrice (22) d'un circuit imprimé (24), l'électrovanne (12) possédant au moins un ressort de compression (18) servant au raccordement électriquement conducteur, et l'au moins un ressort de compression (18) étant disposé avec précontrainte mécanique entre l'électrovanne (12) ainsi que le circuit imprimé (24), une portion de contact (36) faisant face au circuit imprimé (24) de l'au moins un ressort de compression (18), en vue de garantir une connexion électrique fiable, reposant contre une plaque de contact (20, 70, 80, 90) qui est reliée de manière électriquement conductrice à la piste conductrice (22), le ressort de compression (18) étant pourvu d'un revêtement d'argent (60) passivé au moins au niveau de ses extrémités côté contact, un côté supérieur (38) de la plaque de contact (20, 70, 80, 90) faisant face à la portion de contact (36) du ressort de compression (18) étant pourvu d'un revêtement d'argent (62) passivé, le revêtement d'argent (60) du ressort de compression (18) et le revêtement d'argent (62) de la plaque de contact (20, 70, 80, 90) ayant la même épaisseur, l'épaisseur de couche du revêtement d'argent (60) du ressort de compression (18) et l'épaisseur de couche du revêtement d'argent (62) de la plaque de contact (20, 70, 80, 90) étant de 2 µm à 5 µm.
  2. Arrangement de connexion selon la revendication 1, caractérisé en ce que l'épaisseur (44) de la plaque de contact (20, 70, 80, 90) est au moins égale au double de l'épaisseur (46) de la piste conductrice (22) reliée de manière électriquement conductrice à la plaque de contact (20, 70, 80, 90).
  3. Arrangement de connexion selon l'une des revendications 1 ou 2, caractérisé en ce que la plaque de contact (20, 70, 80, 90) est formée avec un alliage de cuivre et d'étain.
  4. Arrangement de connexion selon la revendication 3, caractérisé en ce que la plaque de contact (20, 70, 80, 90) est constituée d'un alliage de CuSn6.
  5. Arrangement de connexion selon l'une des revendications 1 à 4, caractérisé en ce qu'un côté inférieur (26) de la plaque de contact (20, 70, 80, 90) faisant face à l'au moins une piste conductrice (22) est étamé au moins dans certaines zones.
  6. Arrangement de connexion selon la revendication 5, caractérisé en ce qu'au moins le côté inférieur (26) de la plaque de contact (20, 70, 80, 90) est brasé au moins dans certaines zones avec l'au moins une piste conductrice (22) du circuit imprimé (24).
  7. Arrangement de connexion selon l'une des revendications 1 à 6, caractérisé en ce que la surface de la plaque de contact (20, 70, 80, 90) fait saillie de tous les côtés de la portion de contact (36) du ressort de compression (18).
  8. Arrangement de connexion selon l'une des revendications 1 à 7, caractérisé en ce qu'une surface de l'au moins une piste conductrice (22) du circuit imprimé (24) dans la zone de la plaque de contact (20, 70, 80, 90) fait saillie de tous les côtés de celle-ci.
  9. Arrangement de connexion selon l'une des revendications 1 à 8, caractérisé en ce que la plaque de contact (20, 70, 80, 90) possède, dans la zone de son côté supérieur (38), un creux (48) servant à accueillir au moins partiellement la portion de contact (36) de l'au moins un ressort de compression (18).
  10. Arrangement de connexion selon l'une des revendications 1 à 9, caractérisé en ce que le ressort de compression (18) est un ressort de compression hélicoïdal cylindrique (16).
  11. Arrangement de connexion selon l'une des revendications 1 à 10, caractérisé en ce que la plaque de contact (20, 70, 80, 90) possède une géométrie périphérique au moins quadrangulaire, une géométrie périphérique circulaire, une géométrie périphérique elliptique, une géométrie périphérique ovale ou une combinaison d'au moins deux des géométries périphériques mentionnées.
EP14789794.6A 2013-11-09 2014-10-22 Ensemble de liaison électrique Active EP3066722B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201310018851 DE102013018851A1 (de) 2013-11-09 2013-11-09 Elektrische Verbindungsanordnung
PCT/EP2014/002849 WO2015067347A1 (fr) 2013-11-09 2014-10-22 Ensemble de liaison électrique

Publications (2)

Publication Number Publication Date
EP3066722A1 EP3066722A1 (fr) 2016-09-14
EP3066722B1 true EP3066722B1 (fr) 2019-07-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP14789794.6A Active EP3066722B1 (fr) 2013-11-09 2014-10-22 Ensemble de liaison électrique

Country Status (6)

Country Link
US (1) US9634416B2 (fr)
EP (1) EP3066722B1 (fr)
JP (1) JP6554097B2 (fr)
CN (1) CN105706308B (fr)
DE (1) DE102013018851A1 (fr)
WO (1) WO2015067347A1 (fr)

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CN105098542B (zh) * 2015-07-03 2017-11-17 华为技术有限公司 射频同轴连接器及板对板射频同轴连接器组合
KR101793717B1 (ko) * 2015-08-07 2017-11-03 조인셋 주식회사 전기접속단자
DE102016211594A1 (de) * 2016-06-28 2017-12-28 Voith Patent Gmbh Elektrokontakt-Kupplung
DE102016213853A1 (de) * 2016-07-28 2018-02-15 Schaeffler Technologies AG & Co. KG Optimiertes vibrationsrobustes Design eines Kontaktpads auf PCB und Führungselement zum Führen und Kontaktieren eines Kontaktfederelements
CN107884031A (zh) * 2016-09-30 2018-04-06 佛山市顺德区美的电热电器制造有限公司 用于烹饪器具的防溢检测装置和烹饪器具
DE102016224666B4 (de) * 2016-12-12 2019-04-11 Conti Temic Microelectronic Gmbh Verfahren zur Herstellung einer Fügeverbindung sowie eine Fügeverbindung
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US20160276770A1 (en) 2016-09-22
EP3066722A1 (fr) 2016-09-14
CN105706308B (zh) 2020-07-24
CN105706308A (zh) 2016-06-22
WO2015067347A1 (fr) 2015-05-14
DE102013018851A1 (de) 2015-05-13
US9634416B2 (en) 2017-04-25
JP6554097B2 (ja) 2019-07-31
JP2016535921A (ja) 2016-11-17

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