EP3066722A1 - Ensemble de liaison électrique - Google Patents
Ensemble de liaison électriqueInfo
- Publication number
- EP3066722A1 EP3066722A1 EP14789794.6A EP14789794A EP3066722A1 EP 3066722 A1 EP3066722 A1 EP 3066722A1 EP 14789794 A EP14789794 A EP 14789794A EP 3066722 A1 EP3066722 A1 EP 3066722A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- contact plate
- compression spring
- arrangement according
- connecting arrangement
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000006835 compression Effects 0.000 claims abstract description 67
- 238000007906 compression Methods 0.000 claims abstract description 67
- 239000004020 conductor Substances 0.000 claims abstract description 43
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 24
- 229910052709 silver Inorganic materials 0.000 claims description 24
- 239000004332 silver Substances 0.000 claims description 24
- 238000000576 coating method Methods 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 21
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 19
- 230000007797 corrosion Effects 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 15
- 239000000126 substance Substances 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- 230000005499 meniscus Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000006056 electrooxidation reaction Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- OGFYIDCVDSATDC-UHFFFAOYSA-N silver silver Chemical compound [Ag].[Ag] OGFYIDCVDSATDC-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
- H01R12/718—Contact members provided on the PCB without an insulating housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/33—Contact members made of resilient wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7005—Guiding, mounting, polarizing or locking means; Extractors
- H01R12/7011—Locking or fixing a connector to a PCB
- H01R12/707—Soldering or welding
Definitions
- the invention relates to a connection arrangement for the electrical connection of at least one sensor or actuator with at least one conductor of a printed circuit board, wherein the at least one sensor or actuator has at least one compression spring for electrically conductive connection, and the at least one compression spring mechanically biased between the at least one sensor or actuator and the circuit board is arranged.
- Contact surfaces for particularly corrosion-resistant and electrically conductive connections between electronic circuit boards and other electronic or electrical components are usually made of tin, silver or gold.
- further contacts are known, which are based on spring elements and connection structures with a complex geometry. These spring elements and connection structures are provided with a surface finish of tin, silver or gold and then electrically connected to the circuit board.
- the complexity of the spring elements and the connection structures used causes high production costs and often requires a larger installation space.
- electrical contacts are also known using a metallic compression spring supported on a conductor track or a contact pad of a printed circuit board for the electrical connection of an external component, such as a solenoid valve or a sensor.
- the contact partners used are, for example, a gold-plated contact spring and a gold-plated conductor track, at least in the contact zone, with copper as base material, which is largely unaffected by harmful corrosive climatic influences. allow sensitive and therefore reliable electrical connection.
- a barrier layer of nickel for Unterbin ⁇ dung of diffusion processes is necessary.
- this barrier layer has, however, in particular in connection with the known press-fit technology, in which electrical components in metallized or provided with metallic sleeves PCB holes mechanically fixed by simply pressing and at the same time be contacted with the tracks of the circuit board, as sensitive to climatic Influences, which can lead to the formation of cracks, subterranean and local corrosion in the contact points.
- contact spring and conductor track Even with other material pairings of contact spring and conductor track, such as silver-silver, silver-tin or silver solder can at adverse climatic influences, with vibration relative movements between the contact spring and the conductor and / or in the case of higher current loads, chemical corrosion effects and / or Friction corrosion phenomena occur whose consequences extend to a total failure of the affected electrical contact point.
- a pressure sensor assembly with an electrical connection for a measuring element is known.
- the external electrical connection of the pressure sensor assembly takes place with a plurality of spring contacts designed in the manner of a helical compression spring, which are each guided through an opening of a threading funnel, which in turn is arranged in a pressure sensor housing.
- the spring contacts are supported between the contacts in the contact carrier and an external abutment.
- the spring contact Within the pressure sensor housing, the spring contact is axially rigidly wound on block, while the spring contact outside of the pressure sensor housing in the axial Can deflect direction.
- a direct electrical connection of a circuit board by means of the spring contacts is not provided.
- the invention has for its object to present a structurally simple design and in particular against fretting corrosion and against other corrosion processes resistant connection assembly for electrically reliable connection of a sensor and / or an actuator to a circuit board.
- the invention is based on the knowledge that external components can be contacted with the aid of compression springs in a structurally simple manner and, moreover, electrically reliably with conductor tracks of a printed circuit board.
- the invention therefore relates to a connection arrangement for the electrical connection of at least one sensor or actuator with at least one conductor of a printed circuit board, wherein the at least one sensor or actuator has at least one compression spring for electrically conductive connection, and the at least one compression spring mechanically biased between the at least one sensor or Actuator and the circuit board is arranged.
- a contact end section of the printed circuit board facing the at least one compression spring rests against a contact plate to ensure a reliable electrical connection, which is electrically conductively connected to the conductor track.
- connection arrangement which is a vibration-resistant and corrosion-resistant connection of an external component, such as a sensor or an actuator, to an electronic circuit board allows. Since this connection arrangement eliminates the need for gold plating of printed conductors, the printed circuit board can be produced cost-effectively and is easily compatible with the use of press-fit technology.
- the compression spring allows axial tolerance compensation and the compensation of thermal expansion and manufacturing tolerances.
- the last turn of the Druckendabitess the compression spring is ground flat. Furthermore, for this purpose, the last turns of the Whyendabitess the compression spring wound on block and thereby be formed axially compressive stiff.
- corrosion is understood to mean friction corrosion processes as well as chemical and electrochemical corrosion processes.
- Reibkorrosionsvone occur when, for example, vibration relative movements between the compression spring and the contact plate occur.
- microscopically small metal particles are detached as a result of the movement of the contact partners and rubbed off, as a result, the effective metallic contact surface is reduced, which can cause, inter alia, an increase in the electrical contact resistance.
- chemical corrosion concerns primarily chemical reactions of a usually metallic material with substances from its environment.
- electrochemical corrosion processes an electrical current flow is present in addition to a material change.
- pressure sensors, temperature sensors, rotational speed sensors, displacement sensors, acceleration sensors and magnetic sensors may be considered as sensors without any claim to completeness
- the actuators may be, for example, solenoid valves, servo motors, electromagnets, so-called piezo stacks or the like.
- the number of compression springs corresponds to the number of contact plates.
- the diameter of the spring wire used for winding the compression spring, the outer diameter of the compression spring in relation to their total length or height and the number of turns or the pitch angle of the turns are dimensioned so that the compression spring, taking into account the selected to create a sufficient contact pressure mechanical bias and all in real operation of the terminal assembly occurring mechanical loads does not buckle in the radial direction.
- the thickness of the contact plate is at least twice as large as the thickness of the conductor track electrically conductively connected to the contact plate. This results in a high abrasion resistance of the contact plate, which makes them particularly insensitive to reibkorrosiven processes.
- the contact plate is formed from or with a copper-tin alloy, in particular as a CuSn6 alloy.
- a copper-tin alloy in particular as a CuSn6 alloy.
- the CuSn6 alloy from the large group of bronzes, which is only given by way of example here, it is also possible to use other bronze alloys or other metal alloys for the contact plate.
- the conductor tracks of the printed circuit board are preferably formed from chemically pure copper or with a copper alloy.
- the compression spring is at least partially provided with a passivated silver coating. This results in a high electrical surface conductivity of the compression spring at the same time good corrosion resistance.
- the application of the passivated silver coating in the contact end portion of the compression spring is sufficient because the actual electrical contacting takes place there.
- an upper side of the contact plate facing the contact end section of the pressure spring is provided with a passivated silver coating. This results in a low electrical contact resistance of the contact end of the compression spring to the contact plate at a high climatic corrosion resistance.
- the outer surfaces or the outer edges of the contact plate can also be provided with a passivated silver coating in order to achieve very good corrosion protection.
- the silver coating of the compression spring and the silver coating of the contact plate are the same thickness.
- the respective silver coating is preferably applied by electroplating.
- the layer thickness of the silver coating of the compression spring and the layer thickness of the silver coating of the contact plate 2 [to 5 ⁇ amount, although larger layer thicknesses are possible. These layer thicknesses are quite large and thus allow a very good corrosion and abrasion resistance of the contact partners.
- a chemical coating of the compression spring and / or the contact plate with silver only in layer thicknesses of 0.15 ⁇ to 0.45 [im possible, and a passivation of chemically applied silver is not common.
- the susceptibility to corrosion of the arranged under such thin layers of copper conductor tracks is correspondingly low.
- a chemically applied coating of gold additionally requires a barrier layer of nickel.
- one of the at least one conductor track facing underside of the contact plate at least partially tin-plated.
- the underside of the contact plate may optionally be provided in regions with a suitable adhesive for securing against slipping prior to soldering.
- Another development of the invention provides that the surface of the contact plate on all sides projects beyond the outer diameter of the Whyendabitess the compression spring. As a result, a reliable electrical contact with a maximum electrical contact zone is given.
- the surface of the at least one conductor track in the region of the contact plate projects beyond it on all sides.
- the contact plate in the region of its top has a recess for at least partially receiving the Kunststoffendab songs the at least one compression spring.
- a position assurance of the compression spring is given in relation to the contact plate.
- the depression within the contact plate may at the same time be adapted to the shaping of the contact end section in order to provide the greatest possible contact area and to increase the current conductivity of the connection arrangement.
- the compression spring is a cylindrical helical compression spring.
- Such a trained compression spring can be relatively easily and inexpensively.
- the contact plate has an at least quadrangular circumferential geometry, a circular peripheral geometry, an elliptical peripheral geometry, an oval peripheral geometry or a combination of at least two of the aforementioned peripheral geometries.
- the peripheral geometry of the contact plate corresponds to the geometries of pads or contact surfaces commonly used on printed circuit boards.
- FIG. 1 is a schematic side view of a connection arrangement according to the invention
- Fig. 2 is a plan view of the contact plate of Fig. 1 with an underlying trace
- Figures 3 to 5 is a plan view of further embodiments of contact plates with the respective underlying conductor track.
- the connecting arrangement 10 according to FIG. 1 has a sensor 14, which is exemplarily designed as a pressure sensor 12 and electrically connected to a contact plate 20 by means of a compression spring 18 designed as a helical compression spring 16, which in turn is electrically connected to a conductor track 22 arranged on a printed circuit board 24 is conductively connected.
- a sensor which is exemplarily designed as a pressure sensor 12 and electrically connected to a contact plate 20 by means of a compression spring 18 designed as a helical compression spring 16, which in turn is electrically connected to a conductor track 22 arranged on a printed circuit board 24 is conductively connected.
- an actuator such as a solenoid valve, a servomotor or the like, can be contacted electrically with the conductor track 22 of the printed circuit board 24 by means of the connection arrangement 10.
- An underside 26 of the contact plate 20 is thermally joined to the conductor track 22 by means of a soldered connection 28 for producing an electrically conductive connection and for mechanically fastening the contact plate 20
- a sensor-side end section 30 of the helical compression spring 16 directed away from the printed circuit board 24 is integrated into a housing 34 of the pressure sensor 12 in the region of a housing underside 32 in order to electrically connect the measuring elements, not shown, and an optional measuring electronics within the pressure sensor 12.
- the helical compression spring 16 thus represents the electrical connection of the pressure sensor 12 to the circuit board 24.
- a leading away from the sensor-side end portion 30 and the circuit board 24 facing Druckendab songs 36 of the helical compression spring 16 is located with a mechanical bias of suitable strength on an upper side 38 of the contact plate 20 for making an electrical contact.
- the circuit board side end portion 40 of the helical compression spring 16 is ground flat.
- the surface geometry of the top 38 of the contact plate 20 may be formed corresponding to the geometry of the front end of the contact end portion 36.
- a longitudinal central axis 42 of the cylindrical helical compression spring 16 extends approximately perpendicular to the upper side 38 of the contact plate 20 and to the housing bottom 32 of the housing 34 of the pressure sensor 12.
- the thickness 44 of the contact plate 20 is significantly greater than a thickness 46 of the conductor track 22 in order to ensure a sufficient mechanical stability and in particular a sufficient abrasion resistance of the contact plate 20.
- an optional, for example cup-shaped recess 48 may be formed to a position securing the Kunststoffendabsacrificings 36 opposite to the top 38 of the contact plate 20 attacking mechanical forces to achieve.
- the surface geometry of the bottom 50 of the pot-like recess 48 may in turn be designed so that it corresponds to minimize the electrical contact resistance with the frontal shaping of the Whyendabitess 36 of the helical compression spring 16 so that the surface grinding of the circuit board side end portion 40 of the helical compression spring 16 can be omitted.
- the upper side 38 of the contact plate 20 has such a large areal extent that it preferably protrudes on all sides beyond the contact end section 36 of the helical compression spring 16, resulting in a maximum electrical contact area.
- both the cylindrical helical compression spring 16 and the contact plate 20 are preferably provided over the entire surface with a passivated silver coating 60, 62.
- the base material of the contact plate 20 is preferably a bronze alloy or a copper-tin alloy, in particular a CUSn6 alloy.
- the wire diameter d of a metallic spring wire used for producing the cylindrical helical compression spring 16 and the outer diameter D of the helical compression spring 16 itself are dimensioned in relation to a total length L and the number of turns or pitch angle ⁇ of the turns so that the helical compression spring 16 under the creation of a sufficient Contact pressure selected mechanical bias and all loads acting beyond the operation in the radial direction does not buckle.
- the total length L corresponds to the vertical distance h between the housing bottom 32 of the pressure sensor 12 and the top 38 of the contact plate 20 in the assembled state of the connection assembly 10th
- connection assembly 10 Deviating from the exemplified embodiment of the connection assembly 10 with only one helical compression spring 16 is a plurality of compression springs with a corresponding number of contact plates and helical compression springs necessary to sensors and / or actuators with more than one electrical connection and / or a larger number of sensors and / or actuators electrically to the conductor track 22 and other tracks of the circuit board 24 to contact.
- more than one pressure spring it is possible in this case for more than one pressure spring to be supported on a respective contact plate in order in particular to optimize the current conductivity of the connection arrangement 10.
- soldered to the circuit board 24 contact plate 20 is to be judged in terms of manufacturing costs compared to previously known technical solutions as neutral, as this can be processed, for example, with the same SMD placement and soldering, which also for loading and soldering by means of the circuit board 24th interconnected electronic and electrical components are used.
- the application of the passivated silver coatings 60, 62 on the contact plate 20 and at least the contact portion of the helical compression spring 16 can also be done in the course of the manufacturing process of the circuit board 24 by means of known coating methods.
- the passivated silver coating 62 of the contact plate 20 facilitates the soldering process thereof with the trace 22.
- the portions of the trace 22 not covered by the solder joint 28 can still be protected with those of chemically pure copper or with a copper alloy formed tracks better protect against harmful corrosive influences.
- a suitable protective coating or the like can be used.
- FIG. 2 shows a plan view of the contact plate 20 of FIG. 1 without the helical compression spring 16 with the underlying trace 22. From the illustration, it is initially apparent that the contact plate 20 has a circular peripheral contour, which the cross-sectional geometry of only here with dashed radial Border lines indicated cylindrical helical compression spring 16 concentrically encloses and thereby creates the largest possible contact area between the contact plate 20 and the helical compression spring 16.
- the diameter 54 of the contact plate 20 is preferably at least slightly smaller than a width 56 of the conductor 22 of the circuit board 24 to provide a narrow, the contact plate 20 concentrically surrounding edge zone for an annular meniscus 58 of the solder joint 28 here.
- the dimensions of the contact plate 20 and the printed conductor 22 on the printed circuit board 24 are preferably always dimensioned so that the printed conductor 22 projects on all sides at least slightly beyond the contact plate 20.
- Fig. 3 shows a further embodiment of a contact plate 70 with an approximately square peripheral contour with four, but each slightly rounded corners and the underlying conductor 22.
- the contact plate 70 is in turn connected by a solder connection 72 conductively connected to the conductor 22 of the circuit board 24.
- the width 74 and the length 76 of the contact plate 70 are each the same size and in this case preferably slightly smaller than the width 56 of the conductor 22 of the circuit board 24 to provide a contact plate 70 peripheral edge zone for a meniscus 78 of a solder joint 72.
- FIGS. 4 and 5 show a third embodiment of a contact plate 80 with a circumferential geometry, that of an equilateral octagon corresponds, and a fourth embodiment of a contact plate 90, which has a square or square peripheral geometry without meet ⁇ rounded corners.
- Said contact plates 80, 90 are respectively positioned on the underlying conductor track 22 of the printed circuit board 24, but not yet soldered to the conductor track 22.
- Two narrow edge zones 82, 92 surround the contact plates 80, 90 which are not yet soldered to the conductor track 22 of the printed circuit board 24, preferably on all sides, and serve as a propagation space for the menisci of the solder joints not shown here or not yet present.
- contact plates having an oval, an elliptical or any combination of oval and / or elliptical peripheral geometries with at least one of the peripheral geometries shown in FIGS. 2 to 5 are possible.
- a circumferential geometry of a contact plate may have any, for example, also multiply curved course, as long as the contact plate protrudes on all sides over the Kunststoffendabexcellent its associated at least one helical compression spring 16 over and also protrudes at any side on the associated conductor track.
- a thickness of the applied passivated silver coating applied in the edge region may be reduced compared with other surface zones of the contact plate.
Landscapes
- Measuring Leads Or Probes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201310018851 DE102013018851A1 (de) | 2013-11-09 | 2013-11-09 | Elektrische Verbindungsanordnung |
PCT/EP2014/002849 WO2015067347A1 (fr) | 2013-11-09 | 2014-10-22 | Ensemble de liaison électrique |
Publications (2)
Publication Number | Publication Date |
---|---|
EP3066722A1 true EP3066722A1 (fr) | 2016-09-14 |
EP3066722B1 EP3066722B1 (fr) | 2019-07-03 |
Family
ID=51799072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP14789794.6A Active EP3066722B1 (fr) | 2013-11-09 | 2014-10-22 | Ensemble de liaison électrique |
Country Status (6)
Country | Link |
---|---|
US (1) | US9634416B2 (fr) |
EP (1) | EP3066722B1 (fr) |
JP (1) | JP6554097B2 (fr) |
CN (1) | CN105706308B (fr) |
DE (1) | DE102013018851A1 (fr) |
WO (1) | WO2015067347A1 (fr) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105098542B (zh) * | 2015-07-03 | 2017-11-17 | 华为技术有限公司 | 射频同轴连接器及板对板射频同轴连接器组合 |
KR101793717B1 (ko) * | 2015-08-07 | 2017-11-03 | 조인셋 주식회사 | 전기접속단자 |
DE102016211594A1 (de) * | 2016-06-28 | 2017-12-28 | Voith Patent Gmbh | Elektrokontakt-Kupplung |
DE102016213853A1 (de) * | 2016-07-28 | 2018-02-15 | Schaeffler Technologies AG & Co. KG | Optimiertes vibrationsrobustes Design eines Kontaktpads auf PCB und Führungselement zum Führen und Kontaktieren eines Kontaktfederelements |
CN107884031A (zh) * | 2016-09-30 | 2018-04-06 | 佛山市顺德区美的电热电器制造有限公司 | 用于烹饪器具的防溢检测装置和烹饪器具 |
DE102016224666B4 (de) * | 2016-12-12 | 2019-04-11 | Conti Temic Microelectronic Gmbh | Verfahren zur Herstellung einer Fügeverbindung sowie eine Fügeverbindung |
WO2018137227A1 (fr) * | 2017-01-25 | 2018-08-02 | 深圳市汇顶科技股份有限公司 | Dispositif, système et procédé de test de pression |
DE102018100025B4 (de) * | 2018-01-02 | 2022-07-28 | Saf-Holland Gmbh | Vorrichtung zum Überführen einer Leitung zwischen einem eingefahrenen Zustand und einem ausgefahrenen Zustand sowie entsprechendes System, entsprechende Verwendung und entsprechendes Verfahren |
DE102018104886B3 (de) | 2018-03-05 | 2019-07-04 | Schaeffler Technologies AG & Co. KG | Elektromechanischer Fahrwerksaktuator |
DE102018123995A1 (de) * | 2018-09-28 | 2020-04-02 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Kontaktiereinrichtung zum elektrischen Kontaktieren einer Leiterplatte mit einem Spulenkörper für ein Magnetventil für eine Bremseinrichtung für ein Fahrzeug, Magnetventil mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung |
DE102018123994B4 (de) * | 2018-09-28 | 2022-05-25 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Kontaktiervorrichtung zum federbaren Kontaktieren einer Platine mit einem Kontaktelement für eine Magnetspule oder einen Sensor für ein Fahrzeugsystem, Fahrzeugsystem mit einer Kontaktiervorrichtung und Verfahren zum Herstellen einer Kontaktiervorrichtung |
DE102020105298A1 (de) | 2020-02-28 | 2021-09-02 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Leiterplatte mit einer Kontaktstelle |
EP4025029A1 (fr) * | 2021-01-05 | 2022-07-06 | MEAS France | Dispositif capteur et connexion de mise à la terre |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5211160U (fr) * | 1975-07-14 | 1977-01-26 | ||
JPH0537274Y2 (fr) * | 1987-02-17 | 1993-09-21 | ||
JP2925986B2 (ja) * | 1995-09-08 | 1999-07-28 | 古河電気工業株式会社 | 接点部と端子部とからなる固定接点用材料又は電気接点部品 |
JPH09298018A (ja) * | 1996-03-04 | 1997-11-18 | Matsushita Electric Ind Co Ltd | プリント基板装着用電子部品 |
CH693478A5 (fr) * | 1996-05-10 | 2003-08-15 | E Tec Ag | Socle de connexion de deux composants électriques. |
JPH11204222A (ja) * | 1998-01-16 | 1999-07-30 | Sony Corp | Ic用ソケット |
KR100549731B1 (ko) * | 1998-01-16 | 2006-02-07 | 소니 가부시끼 가이샤 | Ic용 소켓 및 ic의 제조 방법 |
JP2002236035A (ja) * | 2001-02-08 | 2002-08-23 | Calsonic Kansei Corp | 指示計器 |
JP2002270320A (ja) * | 2001-03-12 | 2002-09-20 | Advanex Inc | 半導体パッケージ用ソケット |
KR100540434B1 (ko) * | 2001-07-13 | 2006-01-10 | 니혼 하츠쵸 가부시키가이샤 | 접촉자 |
DE10244760A1 (de) | 2002-02-26 | 2003-10-09 | Continental Teves Ag & Co Ohg | Drucksensorbaugruppe |
US6551112B1 (en) * | 2002-03-18 | 2003-04-22 | High Connection Density, Inc. | Test and burn-in connector |
JP2004140195A (ja) * | 2002-10-17 | 2004-05-13 | Nec Electronics Corp | 半導体装置及びその製造方法 |
US6866519B2 (en) * | 2003-07-10 | 2005-03-15 | Wei-Fang Fan | Adaptable resilient pin assembly for BGA based IC encapsulation |
DE102004041207A1 (de) * | 2004-08-25 | 2006-03-30 | Siemens Ag | Vorrichtung zur Verbindung von Leiterplatten |
JP2007035400A (ja) * | 2005-07-26 | 2007-02-08 | Yamaichi Electronics Co Ltd | 半導体デバイス用ソケット |
US7491069B1 (en) * | 2008-01-07 | 2009-02-17 | Centipede Systems, Inc. | Self-cleaning socket for microelectronic devices |
WO2010008257A2 (fr) * | 2008-07-18 | 2010-01-21 | Lee Jae Hak | Ensemble à ressorts et prise de test l'utilisant |
DE102010010331A1 (de) * | 2010-03-04 | 2011-09-08 | Phoenix Contact Gmbh & Co. Kg | Elektrische Kontaktanordnung |
DE102011075901A1 (de) * | 2011-05-16 | 2012-11-22 | Continental Automotive Gmbh | Spulenanordnung und Identifikationsgeber für ein Zugangskontrollsystem |
DE102013104237B4 (de) * | 2013-04-26 | 2019-12-19 | Semikron Elektronik Gmbh & Co. Kg | Schaltungsanordnung |
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2014
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- 2014-10-22 EP EP14789794.6A patent/EP3066722B1/fr active Active
- 2014-10-22 CN CN201480061300.9A patent/CN105706308B/zh active Active
- 2014-10-22 US US15/028,995 patent/US9634416B2/en active Active
- 2014-10-22 WO PCT/EP2014/002849 patent/WO2015067347A1/fr active Application Filing
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US9634416B2 (en) | 2017-04-25 |
US20160276770A1 (en) | 2016-09-22 |
DE102013018851A1 (de) | 2015-05-13 |
JP2016535921A (ja) | 2016-11-17 |
EP3066722B1 (fr) | 2019-07-03 |
JP6554097B2 (ja) | 2019-07-31 |
WO2015067347A1 (fr) | 2015-05-14 |
CN105706308B (zh) | 2020-07-24 |
CN105706308A (zh) | 2016-06-22 |
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