EP4111547A1 - Carte de circuit imprimé avec un point de contact - Google Patents

Carte de circuit imprimé avec un point de contact

Info

Publication number
EP4111547A1
EP4111547A1 EP21703209.3A EP21703209A EP4111547A1 EP 4111547 A1 EP4111547 A1 EP 4111547A1 EP 21703209 A EP21703209 A EP 21703209A EP 4111547 A1 EP4111547 A1 EP 4111547A1
Authority
EP
European Patent Office
Prior art keywords
contact
circuit board
support element
contact point
contact spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21703209.3A
Other languages
German (de)
English (en)
Inventor
Markus Deeg
Andreas Eisenberger
Karin Pohley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Knorr Bremse Systeme fuer Nutzfahrzeuge GmbH
Original Assignee
Knorr Bremse Systeme fuer Nutzfahrzeuge GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Knorr Bremse Systeme fuer Nutzfahrzeuge GmbH filed Critical Knorr Bremse Systeme fuer Nutzfahrzeuge GmbH
Publication of EP4111547A1 publication Critical patent/EP4111547A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
    • B60T13/00—Transmitting braking action from initiating means to ultimate brake actuator with power assistance or drive; Brake systems incorporating such transmitting means, e.g. air-pressure brake systems
    • B60T13/10—Transmitting braking action from initiating means to ultimate brake actuator with power assistance or drive; Brake systems incorporating such transmitting means, e.g. air-pressure brake systems with fluid assistance, drive, or release
    • B60T13/66—Electrical control in fluid-pressure brake systems
    • B60T13/662—Electrical control in fluid-pressure brake systems characterised by specified functions of the control system components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/33—Contact members made of resilient wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/26—Connectors or connections adapted for particular applications for vehicles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/1053—Mounted components directly electrically connected to each other, i.e. not via the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a circuit board with a contact point for an electrical contact in a vehicle, to a structural unit for a vehicle with the circuit board, and to a method for producing a circuit board with a contact point, and in particular to a contact for an actuator / Sensor in the commercial vehicle via a contact spring with a preform counterpart on the circuit board.
  • a common realization of an electrical contact between electrical components in a vehicle is done by a contact spring, i.e. a spiral-shaped conductor structure, which is connected to one of the components by structural measures and possibly an electrical contact, for example to another, using material and shape-related stress effects electrical component produced by system or attachment.
  • a contact spring i.e. a spiral-shaped conductor structure
  • This contact surface can in particular be designed as part of a printed circuit board or an attachment on a printed circuit board.
  • contacts of this type can be found in brake systems of commercial vehicles, in which, for example, sensor units with actuators (for example in electronic brake systems, or air treatment systems, with integrated electronic control, which can represent an active mechanical part of an electronic parking brake) and possibly other components electrical contacts are connected in a vibration-tolerant manner.
  • the circuit boards are often equipped with SMD (surface mounted devices) in the context of industrial production, typically in a reflow process (reflow soldering).
  • SMD surface mounted devices
  • the circuit board interspersed with conductor tracks is first attached to an already formed circuit board Provide contact fields (lands, connector pads, contact pads) with a solder paste made from a powdery tin-solder compound and a flux (for example printed in a screen or stencil printing process).
  • the subsequently applied SMDs temporarily adhere to the circuit board due to the solder paste.
  • the solder paste is melted with outgassing of parts of the flux.
  • Surface tension effects adjust the SMD, which are fixed by the cooled solder.
  • a manufacturing method for a contact point on which a contact spring rests or sits can advantageously be integrated into an existing reflow method with as little effort as possible.
  • DE 102015008334 A1 discloses the formation of the contact point by means of a contact plate that is single or multi-layered and / or designed as an SMD, the materials nickel or copper and with a silver or gold layer to improve conductivity or to increase abrasion resistance is provided.
  • a disadvantage of forming the contact point with the aid of a contact plate is the additional production and material costs that arise for the contact plate.
  • the present invention relates to a circuit board with a contact point for making contact with a contact spring for an electrical contact in a vehicle, wherein the contact point has a support element made of tin, which is soldered to the circuit board by means of a reflow process.
  • the circuit board is a carrier for an electrical circuit with one or more electrical lines and possibly electrical components which have been applied to the circuit board, for example in the reflow process.
  • the support element can consist entirely of tin, which has been completely or partially liquefied during the reflow process, and which rests directly on a contact surface of the circuit board.
  • the contact area (English, connector pad, contact pad) is a predetermined area for the position of the support element in the context of the reflow process, at which one or more conductor tracks on the surface of the circuit board end.
  • the support element has a height of at least 50 micrometers and at most 150 micrometers above the circuit board in order to ensure a vibration-resistant contact.
  • the contact is made by placing a conductor on the surface of the support element. Vibrations and / or shocks, caused for example by the movement of a vehicle encompassing the circuit board and the conductor, can lead to mutual movements of the support element and the adjacent conductor. As a result of the movements and / or pressure of the conductor on the support element, material can be removed from areas of the surface of the support element.
  • the height of the support element above the circuit board is advantageously chosen so that long-term contact is ensured.
  • the support element has one of the following base areas:
  • a base area is advantageous for attaching the contact point to the circuit board, for securing a position of an electrical conductor adjacent to the contact point and / or for producing the support element, for example as a solder preform.
  • the present invention also relates to a structural unit for a vehicle, in particular a utility vehicle, with a printed circuit board that has a contact point as described above, and also with a contact spring and with a component that connects via the contact spring to the support element of the contact point of the printed circuit board is in electrical connection.
  • the contact spring is a suitably curved conductor piece, for example a spirally wound or coil-shaped wire, which rests or sits on the surface of the support element.
  • the contact spring can exert mechanical pressure on the support element.
  • the contact spring is also attached to the component; For this purpose, it can for example be riveted, clamped, soldered, welded, plugged in, held by a holding device such as a dielectric housing, or designed as the end of an electrical conductor.
  • one end of the contact spring rests against a surface of the support element, the surface of the support element being larger than the cross-sectional area of the adjacent end of the contact spring.
  • a surface of the support element protruding beyond the cross-sectional area of the contact spring can, for example, ensure a tolerance for a position of the end of the contact spring, in particular also under vibration or shock.
  • a vibration of the end of the contact spring can be used to advantage in order to counteract corrosion and / or oxidation of the surface of the support element by removing parts of the surface.
  • the surface of the support element has a depression and / or a curvature, which are designed to secure a position of the abutting end of the contact spring.
  • the depression can be trough-shaped, or it can be adapted to the cross-sectional contour of the contact spring in a ring shape and enclose a central curvature.
  • the depression can also be created by pressure of the contact spring on the support element and / or deepened further over time.
  • the component has an actuator and / or a sensor, the contact producing an electrical connection between the actuator and / or the sensor and the circuit board in a utility vehicle.
  • the present invention also relates to a method for producing a printed circuit board with a contact point, comprising the following steps:
  • the applied support element advantageously melts in the reflow process, so that direct contact is made with the conductor coming to the surface in the contact field of the circuit board.
  • the at least partial melting of the support element in the reflow process represents a compromise between the standard of applying an SMD and the standard of tinning.
  • the application of the support element includes printing the contact field with a solder paste, with existing solder liquefiers being used up to such an extent that they do not reduce the conductivity of the contact point when a conductor adjacent to the contact point is contacted.
  • the solder paste contains a flux which, when heated during the reflow process, emerges and leaves residues and / or, for example, can form on the surface of the solder, which can increase the conductivity of the Affect contact point. This would be the case in particular if the support element was dispensed with to form the contact point and, for example, only a solder paste was used. By suitable heating and / or by choosing a suitable geometry of the support element, such as, for example, a sufficient thickness, residues of additives on the surface of the contact point can be prevented.
  • At least one surface-mounted component is to be attached to the circuit board during the method, the step of connecting being a simultaneous soldering of the support element and the surface-mounted component.
  • the attachment of the contact point can thus be integrated into an existing reflow method for attaching surface-mounted components without requiring the introduction of additional method steps in the reflow method.
  • the tin of the support element can also contain additives such as lead, zinc, silver, iron, antimony, copper or a flux, which have a function of the support element as a contact point for applying an electrical conductor and / or a method for applying the support element to the Influence the printed circuit board advantageously without changing the mentioned features of the contact point or the method.
  • additives can also be incorporated into the support element in a continuous gradation in one direction.
  • Advantages of exemplary embodiments consist, for example, in a cost saving
  • Fig. 1 shows an embodiment according to the present invention for a circuit board with a contact point
  • Fig. 2 shows a support element on the left and a plan view of a circuit board with a contact surface on the right
  • Fig. 3 shows on the left a Aufla geelement placed on a contact surface with solder paste before heating and fusing in a reflow process, and on the right the bearing element on the contact surface after heating and fusing.
  • Fig. 4 shows a structural unit with a printed circuit board with a support element, a spring and a component.
  • FIG. 5 shows a method for manufacturing a printed circuit board with a contact point according to the present invention.
  • FIG. 1 shows, as an exemplary embodiment of the present invention, a circuit board 100 with a contact point for making contact with a contact spring 300 for an electrical contact in a vehicle, the contact point having a support element 200 made of tin which is attached to the circuit board 100 by means of a reflow process is soldered.
  • the contact spring 300 is not fixed to the support element 200, but only needs to lie against it.
  • FIG. 2 shows a view of an exemplary embodiment for the support element 200 as a solder preform made from tin.
  • a section of an exemplary embodiment for a printed circuit board 100 is shown in a plan view, in which a contact surface 110 is located.
  • the contact surface 110 is an area of the circuit board 100 in which a conductor track of the circuit board 100 (not shown here) comes to the surface of the circuit board.
  • Such conductor tracks can consist of copper, for example. Since oxidation processes impair the contactability of exposed copper over time, in one of the last method steps for producing the printed circuit board 100, the contact surface 110 is coated with an end surface (finish) made of, for example, tin, silver or gold.
  • FIG. 3 shows a local cross section through a printed circuit board 100 in a situation before solder is remelted in a reflow process.
  • a contact area 110 with an applied thereon Solder paste 210, on which a solder preform made of tin rests as a support element 200.
  • the tin of the support element 200 fuses with the solder paste 210, and possibly - for example, if the end surface of the contact surface 110 is made of tin - with the material of the end surface of the contact surface 110.
  • the printed circuit board 100 is shown with contact surface 110 and support element 200 after solder has been remelted in the reflow process.
  • contact surface 110 with an end surface made of tin
  • a contact point that is homogeneously adjoining the conductor track can be formed in this way.
  • FIG. 4 shows an elevation of an exemplary embodiment for a structural unit for a vehicle, in particular a commercial vehicle, with a printed circuit board 100 in which a contact surface 110 is formed, on which a support element 200 made of tin is attached as part of a reflow process.
  • a contact spring 300 which is part of a component 400, which is in electrical connection with the support element 200 of the contact point of the printed circuit board 100 via the contact spring 300, rests on the support element 200.
  • the printed circuit board 100 can, for example, be part of a sensor in a braking system of a vehicle.
  • An end surface of the contact surface 110 made of tin can, for example, have a thickness of one micrometer before the application of the support element 200. During the reflow process, this thickness is typically reduced, for example by 0.2 micrometers. This thickness would be insufficient for a contact spring 300 to be applied, since, for example, corrosion, oxidation and, when the contact spring 300 is in contact, also abrasion processes corrupt the end surface too quickly.
  • the support element 200 can advantageously have a height in a range of 50 to 150 micrometers above the circuit board 100, and thereby ensure long-term contact and protection of a conductor track of the circuit board 100 that ends at the contact surface 110. Since during the reflow Method can be partially reduced, the support element 200 has a greater height (for example by 10 to 50 micrometers) before it is placed on the contact surface 110 of the circuit board 100.
  • the component 400 can include, for example, an actuator such as a solenoid valve in a brake system of a vehicle.
  • FIG. 5 shows a method for producing a printed circuit board 100 with a contact point, with the following steps:
  • the support element 200 is liquefied by heating, it being able to fuse with a previously applied solder paste 210 and optionally with the material of an end surface of the contact point 110.
  • the reflow method can include the assembly of further components on the circuit board 100. In this way, the application of the contact point can be integrated into an existing reflow process without requiring the introduction of an additional process step.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Transportation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

L'invention concerne une carte de circuit imprimé (100) ayant un point de contact pour la mise en contact d'un ressort de contact (300) pour un contact électrique dans un véhicule, le point de contact comprenant un élément de support (200) en étain qui est soudé à la carte de circuit imprimé au moyen d'un processus de refusion.
EP21703209.3A 2020-02-28 2021-02-02 Carte de circuit imprimé avec un point de contact Pending EP4111547A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102020105298.7A DE102020105298A1 (de) 2020-02-28 2020-02-28 Leiterplatte mit einer Kontaktstelle
PCT/EP2021/052357 WO2021170351A1 (fr) 2020-02-28 2021-02-02 Carte de circuit imprimé avec un point de contact

Publications (1)

Publication Number Publication Date
EP4111547A1 true EP4111547A1 (fr) 2023-01-04

Family

ID=74550640

Family Applications (1)

Application Number Title Priority Date Filing Date
EP21703209.3A Pending EP4111547A1 (fr) 2020-02-28 2021-02-02 Carte de circuit imprimé avec un point de contact

Country Status (7)

Country Link
US (1) US20230105384A1 (fr)
EP (1) EP4111547A1 (fr)
JP (1) JP2023515833A (fr)
CN (1) CN115244785A (fr)
BR (1) BR112022014298A2 (fr)
DE (1) DE102020105298A1 (fr)
WO (1) WO2021170351A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022123912A1 (de) 2022-09-19 2024-03-21 Oechsler Ag Kontakteinrichtung, elektrische Bauteileinheit, Verfahren sowie Verwendung einer Kontakteinrichtung in einer elektrischen Bauteileinheit

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US6786391B2 (en) * 2002-10-16 2004-09-07 Kac Holdings, Inc. Method of controlling solder deposition utilizing two fluxes and preform
US8925793B2 (en) * 2012-01-05 2015-01-06 Dunan Microstaq, Inc. Method for making a solder joint
WO2020007583A1 (fr) * 2018-07-06 2020-01-09 Endress+Hauser SE+Co. KG Procédé de fabrication d'un joint brasé sans plomb résistant aux températures élevées, et joint brasé sans plomb résistant aux températures élevées

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JP3653131B2 (ja) * 1995-12-28 2005-05-25 日本発条株式会社 導電性接触子
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JP2023515833A (ja) 2023-04-14
WO2021170351A1 (fr) 2021-09-02
DE102020105298A1 (de) 2021-09-02
BR112022014298A2 (pt) 2022-09-20
US20230105384A1 (en) 2023-04-06
CN115244785A (zh) 2022-10-25

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