Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
  • B23K3/06—Solder feeding devices; Solder melting pans
  • B23K3/0607—Solder feeding devices
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/005—Soldering by means of radiant energy
  • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K1/00—Soldering, e.g. brazing, or unsoldering
  • B23K1/018—Unsoldering; Removal of melted solder or other residues
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
  • B23K3/04—Heating appliances
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
  • B23K3/06—Solder feeding devices; Solder melting pans
  • B23K3/0607—Solder feeding devices
  • B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
  • B23K3/08—Auxiliary devices therefor

Definitions

• the present invention relates to a device for the scattered application of soldering material depots, in particular solder balls, with a conveying device for occasionally conveying the soldering material deposits from a soldering material reservoir to an application device, wherein the conveying device has transport holes formed as through holes, which in each case are from a receiving position in which a soldering material depot is taken from the Lotmaterialreservoir, are movable into a transfer position in which the solder material depot is acted upon with compressed gas and from which the solder material depot is transferred to the application device in an application position.
• a device of the type mentioned is known from DE 195 41 996 AI. This device has been proven in practice for many years and usually allows error-free operation. Due to the relative movement in the device between the solder material reservoirs transferred from the solder material reservoir to the conveyor and the transport receptacles, deposits of the solder material on the conveyor and, in particular, accumulations of material at the edge of the through holes can occur, which can lead to insufficient maintenance of the device that sporadically in the transport receptacles of the conveyor arranged solder material deposits are not transferred from the transfer position to the application position, but stick in the transport recording.
• the present invention is therefore based on the object to further develop the known device so that the overall maintenance can be reduced.
• a removal device for removing a solder material depot from a transport receptacle arranged in a removal position is provided downstream in the conveying direction of the transfer position, wherein the removal device for triggering the removal function is connected to a detector device which measures the state of the transport receptacle checks in the transfer position.
• the removal device has a withdrawal channel for the coaxial arrangement of a channel end of the withdrawal channel with a transport receptacle arranged in the removal position, and a negative pressure connection for acting on the withdrawal channel with negative pressure and a coupling device for connection to an energy source which is suitable for applying an in the transport receptacle arranged Vietnamesesmaterialdepots serves.
• a loading of a solder material depot arranged in the transport receptacle with energy for melting the solder material depot and also a vacuum for removing the molten solder material depot from the transport receptacle can take place through one and the same removal channel.
• the removal channel is formed in a connecting piece of the removal device, which enables a releasable mechanical connection of the removal device with a device housing, such that the removal channel is arranged coaxially to a arranged in the removal position transport receptacle.
• This makes possible a modular design of the removal device, which can be added as a module to the device and is not necessarily integrally formed in the device.
• the operator of the device for the occasional application of solder material depots a standard If necessary, supplement the device, which has been prepared moderately or prefabricated, subsequently with a removal device.
• the coupling device is designed such that it not only serves to connect to an energy source, but at the same time also forms the vacuum connection for acting on the removal channel with negative pressure.
• the energy loading of the soldering material depot for removal from the transport receptacle designed, when the coupling device allows coupling of the sampling device with a laser radiation emitting laser source, which allows rapid heating and Verflüssi s Trent of the soldering material in the transport receptacle, which subsequently by negative pressure from the Transport pickup can be removed.
• the coupling device fundamentally enables the connection of an energy source or, in particular, a laser source emitting laser radiation to the removal device, independently of a further laser radiation emitting laser source, which serves for loading the solder material depots in the application device.
• an energy source or, in particular, a laser source emitting laser radiation to the removal device, independently of a further laser radiation emitting laser source, which serves for loading the solder material depots in the application device.
• the coupling device is designed so that a non-contact coupling with the laser source is made possible, so that in the case of disassembly or maintenance of the device for occasional application of solder material depots no manual decoupling of the laser source from the device, that is about the removal of a connecting device, becomes necessary.
• the coupling device may be designed as a connection device for an optical fiber transmitting the laser radiation of the laser source.
• the coupling device it is also possible for the coupling device to be designed as a connection device for an optical fiber transmitting the laser radiation of the laser source.
• FIG. 1 shows a device for isolated application of connecting material depots in an isometric view
• FIG. 2 shows the apparatus shown in FIG. 1 in a sectional representation
• FIG. 3 shows a conveying device of the device illustrated in FIG. 2 in plan view
• FIG. 4 is a plan view of a device housing of FIG. 1.
• FIG. 5 is a sectional view of a removal device of the device shown in FIG. 1; FIG.
• solder material depots 1 1 are formed in the present case as solder balls, which are received for storage in a Lotmaterialreservoir 12, which on an upper side 13 of a housing shell 14 of a device housing 15 is arranged.
• a connection opening 16 In the upper housing part 14 below a connection opening 16 (FIG. 4) a Lotmaterialkanal 17 is formed, which allows the s, as shown in Fig. 1, Lotmaterialdepots 1 1 from the Lotmaterialreservoir 12 formed as through holes transport receivers
• a housing ring 22 is arranged concentrically to the conveyor 19.
• a sender at its drive 23 with a motor drive not shown here coupled För- derwelle 24, the szapfen about arranged at its output end 25 drive 26 in the engagement openings 27 of the shown in Fig. 3
• Actuate conveyor 19 a rotary drive of the conveyor 19 allows about a rotation axis 28.
• the conveyor 19 in addition to the
• Transport receptacles 18 which are arranged equidistantly on a conveyor belt 29 of the conveyor 19, a control circuit 30 which is arranged concentrically and in the present case within the conveyor circuit 29 and each on a common radial axis 50 with the transport receptacles 18 control bores 3 1.
• control bores 3 1 cooperate with a light barrier device arranged in the device housing 15, not shown here, and allow the control of a clocked circular conveying movement of the conveyor 19 about the axis of rotation 28, such that in the conveying direction 32 of the conveyor 19 the transport receptacles 18 from a receiving position PI below the Lotmaterialreservoir 12 associated Lotmaterialkanals 17 are each moved forward by a pitch t of the conveyor circuit 29 in the conveying direction 32 and reach a transfer position P2, in which the transport receptacles 18 in coaxial or aligned arrangement with a in the lower housing 20 trained supply channel 41, which extends from the transfer position P2 to the application device 33 and opens with an output end 34 in an application channel 35 of the application device 33.
• the application device 33 has, at its lower end, an application mouthpiece 36 which is arranged exchangeably on the housing lower part 20 and has an application opening 37, which in the present case is in FIG their diam dimensioned smaller than the diam of the water material Lot 1 1, so that s passes from the transfer position P2 to the application mouthpiece 36 Lotmaterialdepot 1 1 in an application position P3 to rest against an opening edge of the application opening 37.
• the application mouthpiece 36 is screwed in the present case by means of a union nut 62 with the lower housing part 20, wherein the Anschlus s of the application mouthpiece 36 to the lower housing part 20 to seal against the lower housing part 20 has a seal 58.
• a coupling device 38 Arranged at the upper end of the application channel 35 and in the upper housing part 14 of the device 10 is a coupling device 38, which in the present case is provided with a transparent coupling surface 39 on the upper side 13 of the upper housing part 14.
• the coupling surface 39 By means of the coupling surface 39, the solder material reservoir 1 1 arranged in the application position P 3 can be acted upon by laser radiation 40, which is emitted by a laser source (not illustrated here).
• the coupling device 38 is sleeve-shaped and is sealed at its lower end projecting into the housing lower part 20 with a seal 57 formed here as an O-ring relative to the housing lower part 20.
• the lower end of the coupling device 38 is also provided with a transparent gas-tight Verschlus s 60 which limits a trained in the application channel 35 above the application port 37 pressure chamber 61 upwards.
• the solder material depot 1 1 As a result of the laser loading of the solder material depot 1 1 takes place at least partial melting of the solder material depot 1 1, so that by means of a Druckgasbeetzstoffung the solder material 1 1 via the opening into the application channel 35 feed channel 41, the solder material depot 1 1 ejected through the application port 37 of the application mouth piece 36 and against a contact surface 5 1 of a substrate 52 can be applied.
• the upper housing part 14 has a Druckgasanschlus s 42 shown in FIGS. 1 and 4, which via a compressed gas channel 43 with a housing upper part 14 above the transfer position P2 opposite the upper end of the 20 formed in the lower housing part 20 feed channel formed Lotmaterialdepot- Recording room 53 is connected.
• both the solder material reservoir 1 1 is transferred to the application position P 3 at the application opening 37 of the application mouthpiece and indirectly via a pressure sensor 44 a triggering of the laser application in the application position P 3 is arranged Lot material depots 1 1.
• a pressure sensor 44 is connected via a pressure bore 45 to the pressure chamber 61 defined in the application channel 35 of the application device 33 between the application opening 37 and the closure 60 of the coupling device 38.
• the pressure sensor 44 erfas st itself in the pressure chamber 61 forming overpressure, which then arises when the application port 37 is closed by a arranged in the application position P3 solder material depot 1 1. Controlled via the pressure sensor 44, the laser application is thus triggered only when a solder material depot 11 is in the application position P3.
• the pressure sensor 44 is not only used for triggering the laser application of the solder material deposit 1 1 located in the application position P 3, but also serves for triggering or activating a removal device 46, which, in particular, is a combination of FIGS. 1, 4, 5 6, with a connection piece 54 is thus arranged on the upper housing part 14 of the device 10, the s a removal channel 47 of the removal device 46 in coaxial or aligned arrangement with a arranged in a removal position P4 transport receptacle 1 8 of the conveyor 19 is located.
• a channel end 48 of the removal channel 47 is arranged directly above the transport receptacle 18.
• the removal device 46 has at the upper end of the removal channel 47, a coupling device 49, which in the present case both for connection of a vacuum device, not shown, as well as for s connection of a laser radiation in the withdrawal channel 47 initiating and here also not shown optical fiber used.
• the Auslö solution or activation of the removal device 46 is carried out by the pressure sensor 44 in the case when no pressure increase defined height is detected by the pressure sensor 44 following a Druckgasbeetzschung arranged in the transfer position P2 solder material 1 1, which is typical for the case s the previously arranged in the transfer position P2 solder material depot 1 1 has entered the application position P3 and the application port 37 of the application mouthpiece 36 blocked. If this pressure increase is not detected, then this is an indication that the s in the transfer position P2 recorded in the transport receptacle 18 Lotmaterialdepot 1 1 is not or not completely out of the transport receptacle 18, ie by the solder material depot 1 1 or components of the solder material depot. 1 1 is a blockage of the transport receptacle 18 and no transfer of the solder material depot 1 1 can be carried out in the application position P4.
• the conveyor 19 is now further clocked by a pitch t, so that s the application of the solder material depot 1 1 can be made up. Due to the continued timing of the conveyor 19 in the conveying direction 32 reaches the Lotmaterial- depot 1 1, the blocked transport receptacle 18 for a defined
• the removal device 46 can be activated and via the coupling device 49, an admission of the the transport receptacle 18 blocking Lasermaterialdepots 1 1 with laser radiation 55 with the result of melting the solder material depot 1 1 takes place.
• the molten solder material reservoir 1 1 is pressurized with negative pressure 56 so that the solder material depot 1 1 is removed from the transport receptacle 18 and returned to the receiving position PI for receiving solder material depots 1 1 from the solder material reservoir 12 is available.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Laser Beam Processing (AREA)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

Country Status (7)

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Family Cites Families (12)

• 2013
  • 2013-10-16 DE DE102013017159.8A patent/DE102013017159B3/de active Active
• 2014
  • 2014-07-03 EP EP14742161.4A patent/EP3057732A1/de not_active Withdrawn
  • 2014-07-03 JP JP2016517394A patent/JP6364072B2/ja active Active
  • 2014-07-03 WO PCT/EP2014/064164 patent/WO2015055328A1/de active Application Filing
  • 2014-07-03 KR KR1020167008501A patent/KR101841857B1/ko active IP Right Grant
  • 2014-07-03 US US15/027,611 patent/US10286470B2/en active Active
  • 2014-08-15 TW TW103128007A patent/TWI600490B/zh active

Non-Patent Citations (2)

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