EP2937624B1 - Lampe à del - Google Patents

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Publication number
EP2937624B1
EP2937624B1 EP13850606.8A EP13850606A EP2937624B1 EP 2937624 B1 EP2937624 B1 EP 2937624B1 EP 13850606 A EP13850606 A EP 13850606A EP 2937624 B1 EP2937624 B1 EP 2937624B1
Authority
EP
European Patent Office
Prior art keywords
light source
source support
led lamp
gas flow
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP13850606.8A
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German (de)
English (en)
Other versions
EP2937624A1 (fr
EP2937624A4 (fr
Inventor
Masayuki Matsuzaki
Takayoshi Imanari
Moriyuki SEKINE
Masayuki NAMIE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iwasaki Denki KK
Original Assignee
Iwasaki Denki KK
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Publication date
Application filed by Iwasaki Denki KK filed Critical Iwasaki Denki KK
Publication of EP2937624A1 publication Critical patent/EP2937624A1/fr
Publication of EP2937624A4 publication Critical patent/EP2937624A4/fr
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30—Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED lamp.
  • lighting lamps have been successively developed as incandescent light bulbs, fluorescent lamps, HID lamps, and LED lamps, and have been put to practical use.
  • An LED lamp is a lamp using a light-emitting diode element as a light source. LED lamps have enabled the white light emission by the development of a blue LED element, and recently have been spread to be used as lighting lamps.
  • Figs. 1(A) to 1(C) are diagrams illustrating an example of currently widely sold LED lamps. These LED lamps 100 are generally lamps having the output of 10 watts or less (typically about 7 watts). As shown in Figs. 1(A) to 1(C) , the lamps have various shapes, and basically include base 102, heat radiating portion 104, and globe 106. Heat radiating portion 104 is formed of aluminum die-casting, and in most cases, heat radiating fins are formed on the outer peripheral surface thereof. Globe 106 is made of translucent resin.
  • an LED element is a semiconductor element, and therefore, is not needed to be disposed in a vacuum atmosphere or a predetermined gas atmosphere. Therefore, aluminum die cast portion 104 and globe 106 are fixed with a suitable adhesive. Therefore, the internal space formed by aluminum die cast portion 104 and globe 106 is not hermetically sealed from the outside of the lamp.
  • the present inventors know that the following related art literature related to the present invention is present.
  • the lamps disclosed in the related Patent Literature 1 to 5 are different in the following respects.
  • the LED lamp disclosed in the present application covers that LED elements are hermetically sealed with a hermetically sealed glass container and that the hermetically sealed glass container is filled with a low molecular weight gas as a cooling and heat radiating means.
  • Patent Literature 1 illustrates resin and glass as the case member, and Patent Literature 1 discloses the effect that the internal light emitting diode is protected from the external environment when the glass is used, and furthermore, that any moisture does not remain and the glass does not fog up when a gas without any moisture (in the example, a nitrogen gas) is sealed in the glass container.
  • a gas without any moisture in the example, a nitrogen gas
  • the low molecular weight gas as a cooling and heat radiating means.
  • Patent Literature 2 a valve for accommodating the LED lamp is formed of a resin material, and there is no description or suggestion on the hermetic sealing described in relation to the present invention.
  • the translucent cover is made of a polycarbonate resin, and the heat radiating portion is made of a metal such as aluminum.
  • the lamp corresponds to the LED lamp illustrated in Fig. 1 , and there is no description or suggestion on the hermetic sealing.
  • Patent Literature 4 discloses, "The lamp (100) according to the present invention is a lamp in which a gas is sealed, and includes globe (10) and LED module (20) which is housed in the globe (10) and which includes a base board (21) and LED (22) disposed on the base board (21).
  • the gas in lamp (100) includes any of hydrogen, helium and nitrogen, and is sealed in globe (10) so as to surround the LED module (20).
  • (Abstract) there is no description on the cooling gas flow channel formed by the light source support, the cooling gas flowing therethrough, and the slit being the inlet and outlet of the cooling gas flow, and the like, which are disclosed in the present application.
  • Patent Literature 5 is an application filed by the present applicant, and is an application being the basis of the present invention. The difference between the present invention and the Patent Literature 5 will be described in detail below.
  • the LED element is a semiconductor element, and the temperature of the semiconductor junction and the element lifetime are closely related to each other. That is, the element life is a long term when the temperature of the junction during use is relatively low, but the element lifetime is suddenly shortened as the temperature increases. Therefore, in the LED lamp, the lamp lifetime is shortened and the lamp illuminance is also deteriorated when the temperature of the LED element is high.
  • the cooling and heat radiating means is an important matter in an electronic device using a semiconductor device, and in the same way, the cooling and heat radiating means is also an important matter in the LED lamp.
  • Patent Literature 5 the cooling gas (low molecular weight gas) is encapsulated in hermetically sealed lamp configurations of the lamp. Inside the lamp, a light source support having a shape longer in the lamp axial line direction is disposed, and mounts a plurality of LEDs on its periphery. Inside the light source support, a through-hole is formed along the lamp axial line as a cooling gas flow channel to cool the LEDs also from the back surface efficiently. For this idea, a constant cooling effect is confirmed to be present, and is shown in the graph of Fig. 6 in Patent Literature 5.
  • the present invention has an object to provide an LED lamp including a novel cooling and heat radiating means.
  • a LED lamp of the present invention is specified in claim 1 and comprises a plurality of LED elements; a light source support supporting the LED elements on a side surface, extending along a lamp axial line; and a hermetically sealed glass container surrounding the light source support and hermetically sealing to encapsulate a low molecular weight gas as a cooling gas therein, wherein the light source support surrounds a cooling gas flow channel along the lamp axial line and has a gas inlet and outlet between the end portions of the light source support in addition to a gas inlet and outlet at both end portions thereof.
  • the low molecular weight gas includes any of a helium gas, a hydrogen gas, and a neon gas, or a mixed gas of any combination of these.
  • the light source support may include a plurality of light source support pieces disposed so as to surround the cooling gas flow channel
  • the gas inlet and outlet disposed between the end portions of the light source support may include a slit between adjacent light source supports.
  • the light source support may be a rod-shaped body extending along the lamp axial line
  • the cooling gas flow channel is formed in a through hole formed along the lamp axial line in the light source support
  • the gas inlet and outlet between the end portions of the light source support may be an opening leading from the side surface to the through hole of the light source support.
  • a mounting board on which the plurality of LEDs is mounted may be fixed to the light source support.
  • a mounting board on which the plurality of LEDs is mounted may be fixed to the light source support, and the mounting board may be made of a metal core board.
  • the light source support may include a member having a good thermal conductivity containing at least one of aluminum, copper, and a heat conductive resin.
  • the light source support may include a plurality of light source support pieces disposed so as to surround the cooling gas flow channel
  • the gas inlet and outlet disposed between the end portions of the light source support may include an opening slit or a mesh hole leading from a surface to the cooling gas flow channel of the light source support.
  • the light source support has shapes expanded at both the end portions, and a cross-sectional area of the cooling gas flow channel is relatively narrower at a central portion as compared to both the end portions.
  • the light source support pieces may have a thickness of a central portion formed thicker as compared to both the end portions, and a cross-sectional area of the cooling gas flow channel may be relatively narrower at a central portion as compared to both the end portions.
  • the lamp further may comprise a heat transfer device inside a top portion of the hermetically sealed glass container opposite to the base, the heat transfer device fixed to the light source support and made of a thermal conductivity resin.
  • the lamp further may comprise an additional heat radiator in a top portion outside the hermetically sealed glass container, having a thermal conductivity relationship with the heat transfer device across the hermetically sealed glass container.
  • the lamp further may comprises a gas flow acceleration fan in the vicinity of an upper end, a lower end, or the both of the light source support.
  • a nitrogen gas may be encapsulated in addition to the low molecular weight gas inside the hermetically sealed glass container.
  • an LED lamp including a novel cooling and heat radiating means.
  • Figs. 2(A) and 2(B) are views showing an example of a LED lamp according to the first embodiment of the present invention.
  • Fig. 2(A) is a front view of the LED lamp
  • Fig. 2(B) is a perspective view seen obliquely from below so that the positional relationship of the four light source support pieces can be seen.
  • This LED lamp 10 primarily targets a higher output LED lamp of about 20 watts, rather than a lower output LED lamp of about 7 watts, currently widely advertised and sold, described in Fig. 1 . Therefore, the cooling and heat radiating means becomes a furthermore important consideration matter.
  • LED lamp 10 shown in Fig. 2(A) includes a plurality of LED elements 18 disposed inside outer bulb 6, one end of which is hermetically sealed with base 2. A plurality of LED elements 18 is mounted at appropriate intervals on light source support 14 to be fixed.
  • the light source support 14 is positioned and supported in an appropriate place inside outer bulb 6 by support column 20 extending from stem 8 fixed to one end of outer bulb 6.
  • support column 20 extending from stem 8 fixed to one end of outer bulb 6.
  • a part of support column 20 adjacent to light source support 14 is covered by an insulating tube (not shown), whereby the electrical insulation between light source support 14 and support column 20 is secured.
  • heat shielding member 24 may be disposed inside outer bulb 6 near base 2.
  • Heat shielding member 24 is formed of, for example, ceramics, a metal plate, a mica plate, and the like. The function of heat shielding member 24 will be described below in relation to the manufacturing method shown in Fig. 9 .
  • low molecular weight gas means a gas having large specific heat and good thermal conductivity, typically helium gas.
  • the gas may be neon gas, hydrogen gas, or a mixed gas of these.
  • hydrogen gas has high reactivity; therefore, a mixed gas of hydrogen gas and helium gas with reduced reactivity may be used.
  • hydrogen gas or helium gas see also the eighth embodiment described below.
  • Base 2 may be a screw type (E type) or a plug type used in incandescent light bulbs and HID lamps.
  • Outer bulb 6 is, for example, a BT tube made of translucent hard glass such as borosilicate glass. However, it may be any shape. Outer bulb 6 may be any one of transparent type or diffusing type (frosted glass type). As with the known incandescent lamp and HID lamp, the gap between base 2 and outer bulb 6 is hermetically sealed, and the space between the outer bulb internal space and the external space is in a hermetically sealed state.
  • this LED lamp 10 includes a light source support 14 containing four light source support pieces 14-1 to 14-4, and one or two or more LED elements 18 are mounted on each light source support piece.
  • Fig. 3A is a diagram illustrating the light source support 14.
  • the outer shape of light source support pieces 14-1 to 14-4 is a plate-like body, and the light source support piece is made of a material having good thermal conductivity, such as copper, aluminum, and a thermal conductivity resin.
  • the thermal conductivity resin is a resin having a high coefficient of thermal conductivity by being mixed with the metal powder, or metal piece.
  • Light source support pieces 14-1 to 14-4 are disposed so as to generally form a rectangle as viewed in the axial direction cross section. Furthermore, the adjacent light source support pieces are not connected to each other, and are disposed at intervals of slit (gap) 26.
  • Light source support 14 shown in the figure is disposed so that the axial direction cross section forms a rectangle when the four light source support pieces are viewed in the axial direction cross section; but not limited to this. That is, light source support 14 may be disposed with three light source support pieces so that the axial direction cross section forms a triangle, and may be disposed with any number (n) of light source support pieces so that the axial direction cross section forms any polygon (n-gon).
  • the power supply to each of LED elements 18 is performed by lead wires (not shown) connecting the LED elements in series.
  • the light source support may also be used as a power supply line.
  • Fig. 3B is a diagram illustrating light source support 14 according to the second embodiment. As compared to the light source support according to the first embodiment, the second embodiment is different in that LED elements 18 are mounted on mounting board 16, and that mounting board 16 is fixed on light source support 14.
  • mounting boards 16 are fixed on the outer peripheral side surfaces of light source support 14.
  • thermal conductive sheets may be disposed by being interposed between the outer peripheral side surfaces of light source support 14 and mounting board 16. If the cross-sectional shape of light source support 14 is a n-gon, on the n outer peripheral side surfaces, respective mounting boards 16 are fixed. On each of mounting boards 16, one or two or more LED elements 18 are mounted.
  • Mounting board 16 includes a printed wiring board, and circuit patterns necessary for supplying power to the LED elements are formed in the printed wiring board.
  • Mounting board 16 is preferred to have a relatively thin thickness, or to be formed as a metal core board so as to enhance the heat radiating and cooling effect of LED element 18.
  • the metal core board is a known technology. Due to the good thermal conductivity of metal, a large heat radiating and cooling effect can be expected.
  • the adjacent light source support pieces are not connected to each other, and are disposed at intervals of slit (gap) 26. Furthermore, any number of the light source support pieces may be disposed so that they form any polygon.
  • the adjacent light source support pieces are not connected to each other, and are disposed at intervals of slit (gap) 26. The reason is as follows.
  • Fig. 4A is a diagram illustrating the flow of the cooling gas flow when there is no slit by mutually connecting these light source support pieces.
  • gas flow channel 15 in the axial direction is formed by being surrounded by four light source support pieces 14-1 to 14-4.
  • Light source support 14 is raised to a high temperature due to the heat generation of LED elements 18, and the cooling gas in gas flow channel 15 heated by the high-temperature light source support moves upward, becomes warm gas stream 23-2, and is released inside the lamp outer bulb from the upper end of the gas flow channel.
  • Fig. 4B is a diagram illustrating the flow of the cooling gas flow when light source support pieces 14-1 to 14-4 have a slit in-between.
  • the larger cooling effect is thought to be caused by that gas stream 23-3 flowing in to or flowing out from gas flow channel 15 through the slit increases in addition to gas streams 23-1 and 23-2 shown in Fig. 4A .
  • Table 1 is the experimental data. This experiment was performed under the following conditions.
  • Light source support one piece is 140 mm length ⁇ 25 mm width ⁇ 3 mm thick aluminum plate, four pieces Size of slit (distance between adjacent light source support pieces): 3.5 mm LED specification: 20 watts ⁇ 4 sheets Table 1: Cooling Effect by the Presence or Absence of the slit, considering the Lamp Lighting Direction BD: Vertical Lighting BH: Horizontal Lighting LED Drive Voltge Vf (V) LED Drive Current If (A) LED Drive Power P (W) TC-25°C Conversion Value (°C) LED Case Temp. TC (°C) Ambient Temp.
  • Model II (BD, with slits) 156.7 0.125 20 75.2 77.2 27 157.0 0.191 30 104.4 107.4 28 157.0 0.255 40 131.0 135.0 29
  • Model II (BD, without slits) 155.5 0.128 20 91.0 96.0 30 155.6 0.191 30 122.4 125.4 28 155.5 0.257 40 152.5 155.5
  • Model III (BH, with slits) 156.6 0.127 20 86.1 89.1 28 157.3 0.190 30 111.7 114.7 28 157.3 0.222 35 127.0 131.0 29
  • Model IV (BH, without slits) 155.3 0.130 20 100.4 102.4 27 155.7 0.191 30 128.3 130.3 27 155.2 0.224 35 148.7 150.7 27
  • Fig. 5A is a graph comparing the LED cooling effects due to the presence or absence of the slits between the light source support pieces when the lamp is lit vertically (BD).
  • Fig. 5B is a graph comparing the LED element temperatures due to the presence or absence of the slits between the light source support pieces when the lamp is lit horizontally (BH).
  • Fig. 6A is a graph comparing the LED cooling effects due to the vertical lighting (BD) and the horizontal lighting (BH) when there is a slit.
  • Fig. 6B is a graph comparing the LED cooling effects due to the vertical lighting (BD) and the horizontal lighting (BH) when there is no slit.
  • the case temperature in the vertical lighting (BD) is as low as 104.4°C.
  • the vertical lighting (BD) in Model IV had lower temperatures and the cooling effect was larger as compared to the horizontal lighting (BH) in Model III.
  • the case temperature in the vertical lighting (BD) is as low as 122.4°C.
  • the vertical lighting (BD) in Model II had lower temperatures and the cooling effect was larger as compared to the horizontal lighting (BH) in Model IV.
  • Fig. 7 is a graph comparing the LED element temperatures between Model III and Model II.
  • the case temperature of the LSI element in Model II is 122.4°C in TC-25°C conversion value
  • the case temperature in Model III is as low as 111.7°C.
  • the LED drive power is in the range of 20 to 40 watts
  • Model III had lower temperatures and the cooling effect was larger as compared to Model II.
  • the temperature of the LED element there was a following relation: Model III ⁇ Model II.
  • Model I ⁇ Models II and III ⁇ Model IV is obtained, from the results of Figs. 6A and 6B , Model I ⁇ Models III and II ⁇ Model IV is obtained, and from the result of Fig. 7 , Model III ⁇ Model II is obtained.
  • the LSI element temperature was found to increase in the following order. That is, the LED element temperature is kept higher as the order moves to the right side, and the temperature of LED element 18 is kept lower as the order move to the left side, and the cooling effect was found to be large.
  • the first factor contributing to the cooling is "with slits"
  • the second factor is the "vertical lighting (BD)”.
  • the lighting manner relating to the second factor is determined, in many cases, by the building, the lighting area, the lighting fixture, the customer needs, and the like where the lamp is installed. Therefore, it is important that the light source support is being "with slits”.
  • the cooling effect on the LED elements is further improved by providing cooling gas inlets and outlets also between the end portions of the light source support, in addition to the cooling gas inlets and outlets at both the end portions of light source support 14 forming gas flow channel 15".
  • FIG. 8A is a diagram showing an example where openings are disposed between both the end portions of the light source support according to the third embodiment of the present invention.
  • Fig. 8B is similarly a diagram illustrating an example where light source support 14 is formed in a lattice or mesh shape.
  • Light source support 14 shown in Fig. 8A does not include any slit mutually between light source support pieces, and includes a plurality of openings 26a as the cooling gas inlets and outlets also between the end portions, in addition to the cooling gas inlets and outlets at both the end portions.
  • the size, the shape, and the number of openings 26a may be any desired level.
  • the slit may be disposed mutually between the light source support pieces, and a plurality of openings 26a may be disposed as the cooling gas inlets and outlets also between the end portions.
  • Light source support 14 shown in Fig. 8B is formed in a lattice or mesh shape, and includes a plurality of openings or mesh holes 26b as the cooling gas inlets and outlets also between the end portions, in addition to the cooling gas inlets and outlets at both the end portions.
  • the size, the shape, and the number of the openings or mesh holes 26b may be any desired level. It should be noted that the slit may be disposed mutually between the light source support pieces, and a plurality of openings or mesh holes 26a may be disposed as the cooling gas inlets and outlets also between the end portions.
  • the light source support forming the cooling gas flow channel is not limited to the light source support where a plurality of light source support pieces is arranged in a rectangle or polygon as viewed in cross-section.
  • the cooling gas flow channel is substantially sufficient to be formed along the lamp axial line. As viewed in cross-section, one light source support having the cross-section of a circle, an ellipse, and the like may be used.
  • the cooling gas inlets and outlets between both the end portions are substantially sufficient if the inlets and outlets have the function of gas communication between the cooling gas inside the outer tube and the cooling gas in the cooling gas flow channel formed by the light source support.
  • the preferred opening area between both the end portions (the total area of the slits, openings, mesh holes, and the like) relative to the total surface area of the gas flow channel, that is, the preferred opening ratio, is left to the research and development in the future.
  • Fig. 9 is a flowchart of the method of manufacturing the LED lamp according to the present embodiment, and on the right side of each step, a simple diagram of the lamp in the corresponding stage is shown.
  • step S1 LED element 18 is fixed to light source support 14, the light source support is attached to support column 20 to form a mount, and stem 8 is attached thereto.
  • step S2 the mount is inserted inside the outer bulb of outer bulb 6, and stem 8 to which the mount is attached and outer bulb 6 are sealed by heating with a burner to seal hermetically.
  • step S3 the inside of the outer bulb already sealed is once evacuated to a vacuum state through the exhaust pipe. Then, a low molecular weight gas is encapsulated, and chipped off (the exhaust pipe is sealed by being dissolved on the burner).
  • step S4 the top portion and the side portion of base 2 are soldered.
  • step S5 LED lamp 10 is completed.
  • steps S2 to S4 the mounting portion, the stem, and the like of the outer bulb are heated to a high temperature of near 1000°C by a burner.
  • Heat shielding member 24 (see Figs. 2(A) and 2(B) ) is disposed between the base mounting portion of the outer bulb and LED elements 18 so that this heat does not damage LED elements 18 inside the outer bulb by not being transmitted to LED elements 18.
  • Fig. 10A is a diagram illustrating a light source support having expanded end portions according to the fourth embodiment of the present invention.
  • Fig. 10B is similarly a diagram illustrating a light source support where the thickness of the middle portion is thickened.
  • the cooling gas flow channel formed by the light source support has a smaller (narrower) cooling gas flow channel cross-sectional area in the central portion, as compared to the cooling gas flow channel cross-sectional area at both the end portions.
  • Light source support 14c shown in Fig. 10A has a relatively narrower central portion by both the end portions being expanded to trumpet-shape.
  • each support piece 10B has a relatively narrower central portion by the thickness of the middle portion of each support piece being made thicker than the thickness at both the end portions.
  • the cooling gas flow channel cross-sectional area in the central portion is narrowed, whereby it is expected that the gas flow is accelerated in the central portion, and that the cooling effect is increased.
  • Fig. 11 is a diagram illustrating a heat transfer device 28 according to the fifth embodiment and an additional heat radiator 30 according to the sixth embodiment of the present invention.
  • heat transfer device 28 is formed inside the outer bulb, whereby further improvement of cooling and heat radiating performance is aimed.
  • a thermal conductive resin is poured into the outer bulb, and cured to form heat transfer device 28.
  • the preformed heat transfer device 28 is not affected by the heat in the subsequent manufacturing process.
  • heat transfer device 28 was created by using a thermal conductive resin where the carbon fiber is mixed to silicon.
  • thermal conductive resins resins mixed with metal powder or metal pieces
  • the end portion of light source support 14 is directly fixed to the heat transfer device 28. In this case, so as to ensure the inlets and outlets of the cooling gas flow at the end portions of light source support 14, for example, a notch, a hole, and the like are disposed at the end portions of the light source support, or the end portion is made a plurality of legs shaped, whereby the inlets and outlets of the gas flow (not shown) are not blocked.
  • the end portion of light source support 14 is directly fixed to heat transfer device 28, whereby the heat generated in LED element 18 is efficiently thermally conducted from light source support 14 to heat transfer device 28, and the cooling and heat radiating effect is improved.
  • the sixth embodiment is an example where additional heat radiator 30 is additionally adopted in addition to the fifth embodiment.
  • additional heat radiator 30 is attached to the outside of the outer bulb for heat transfer device 28 of the fifth embodiment.
  • Additional heat radiator 30 is formed so as to meet the external shape of the top portion of the outer bulb, and is press-fitted or fixed with a suitable adhesive to the top portion of the outer bulb.
  • the material of additional heat radiator 30 may be the material having good thermal conductivity such as the same thermal conductivity resin as in heat transfer device 28.
  • Heat transfer device 28 inside the outer bulb and additional heat radiator 30 outside the outer bulb have a thermal conductive relationship through the outer bulb glass, and therefore, the heat of heat transfer device 28 is efficiently released to the outside air through additional heat radiator 30.
  • Fig. 12 is a diagram illustrating an example where a cooling air driving fan is disposed near the end portion of the light source support according to the seventh embodiment of the present invention.
  • Gas flow acceleration fan 32 may be disposed at the cooling gas inlet in the lower end portion of light source support 14.
  • Gas flow acceleration fan 32 may be disposed at the gas outlet in the upper end portion of light source support 14, and may be disposed in both the end portions.
  • the eighth embodiment is an example of encapsulating another gas, in addition to the low molecular weight gas to be encapsulated in internal space 22 of outer bulb 6.
  • Hydrogen gas or helium gas of the low molecular weight gas has small molecules, and therefore the phenomenon that the gas gradually escapes from outer bulb 6 to the outside has been observed when the lamp is used for a long time.
  • the cooling gas escapes, the amount of the cooling gas in the outer bulb is decreased, then the temperature of LED element 18 is increased.
  • it is preferred that the gas is mixed with a gas having relatively large molecules difficult to escape to outside the outer bulb (typically nitrogen gas) to be encapsulated.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Claims (12)

  1. Lampe à DEL (10) pour un éclairage vertical comprenant :
    une pluralité d'éléments de DEL (18) ;
    un support de source de lumière (14) supportant les éléments de DEL (18) sur une surface de côté,
    un contenant en verre scellé hermétiquement (6) entourant le support de source de lumière et scellant hermétiquement pour encapsuler un gaz de faible poids moléculaire en tant que gaz de refroidissement à l'intérieur ; dans laquelle :
    le support de source de lumière (14) est supporté par une colonne de support (20) s'étendant depuis une tige (8) fixée à une portion d'extrémité du contenant en verre scellé hermétiquement (6) de façon à s'étendre le long d'une ligne axiale de lampe dans un espace interne du contenant en verre scellé hermétiquement, dans laquelle le support de source de lumière entoure un canal d'écoulement de gaz de refroidissement le long de la ligne axiale de lampe ; et
    le support de source de lumière (14) comprend :
    une première extrémité ouverte et une seconde extrémité ouverte définissant un trou traversant, dans lequel le canal d'écoulement de gaz de refroidissement est formé, entre la première extrémité ouverte et la seconde extrémité ouverte le long de la ligne axiale de lampe de sorte qu'un flux de gaz de refroidissement (23-1, 23-2) s'écoule de la première extrémité ouverte à la seconde extrémité ouverte ; et
    un orifice d'entrée et de sortie de gaz (26) disposé entre la première extrémité ouverte et la seconde extrémité ouverte du support de source de lumière,
    caractérisée en ce que le gaz de faible poids moléculaire comporte l'un quelconque parmi un gaz hélium, un gaz hydrogène et un gaz néon, ou un gaz mixte de toute combinaison de ceux-ci, et le support de source de lumière (14) a des formes agrandies au niveau des deux portions d'extrémité (14c), et une aire en coupe du canal d'écoulement de gaz de refroidissement est relativement plus étroite au niveau d'une portion centrale en comparaison aux deux portions d'extrémité.
  2. Lampe à DEL selon la revendication 1, dans laquelle le support de source de lumière (14) comporte une pluralité de pièces de support de source de lumière (14-1, 14-2, 14-3, 14-4) disposée de façon à entourer le canal d'écoulement de gaz de refroidissement,
    la pluralité de pièces de support de source de lumière est disposée de façon à former un n-gone (n = 3 ou plus) dans une vue en coupe perpendiculaire à la ligne axiale de lampe, et
    l'orifice d'entrée et de sortie de gaz (26) disposé entre les portions d'extrémité du support de source de lumière comporte une fente entre des pièces de support de source de lumière adjacentes.
  3. Lampe à DEL selon la revendication 1,
    dans laquelle le support de source de lumière (14) est un corps en forme de bâton s'étendant le long de la ligne axiale de lampe,
    le canal d'écoulement de gaz de refroidissement est formé dans le trou traversant formé le long de la ligne axiale de lampe dans le support de source de lumière, et l'orifice d'entrée et de sortie de gaz (26) entre les portions d'extrémité du support de source de lumière est une ouverture (26a) menant de la surface de côté au trou traversant du support de source de lumière.
  4. Lampe à DEL selon l'une quelconque des revendications 1 et 2,
    dans laquelle une plaque de montage (16) sur laquelle la pluralité de DEL (18) est montée est fixée au support de source de lumière (14).
  5. Lampe à DEL selon l'une quelconque des revendications 1 et 2,
    dans laquelle une plaque de montage (16) sur laquelle la pluralité de DEL (18) est montée est fixée au support de source de lumière (14), et la plaque de montage est constituée d'une plaque à âme métallique.
  6. Lampe à DEL selon l'une quelconque des revendications 1 et 2,
    dans laquelle le support de source de lumière (14) comporte un organe ayant une bonne conductivité thermique contenant au moins l'un parmi l'aluminium, le cuivre et une résine conductrice de chaleur.
  7. Lampe à DEL selon l'une quelconque des revendications 1 et 2,
    dans laquelle le support de source de lumière (14) comporte une pluralité de pièces de support de source de lumière (14-1, 14-2, 14-3, 14-4) disposée de façon à entourer le canal d'écoulement de gaz de refroidissement, la pluralité de pièces de support de source de lumière est disposée de façon à former un n-gone (n = 3 ou plus) dans une vue en coupe perpendiculaire à la ligne axiale de lampe, et
    l'orifice d'entrée et de sortie de gaz (26) disposé entre les portions d'extrémité du support de source de lumière comporte une fente d'ouverture ou un trou à grille (26b) menant d'une surface au canal d'écoulement de gaz de refroidissement du support de source de lumière.
  8. Lampe à DEL selon l'une quelconque des revendications 1 et 2,
    dans laquelle les pièces de support de source de lumière (14-1, 14-2, 14-3, 14-4) ont une épaisseur d'une portion centrale formée plus épaisse en comparaison aux deux portions d'extrémité (14d), et une aire en coupe du canal d'écoulement de gaz de refroidissement est relativement plus étroite au niveau d'une portion centrale en comparaison aux deux portions d'extrémité.
  9. Lampe à DEL selon l'une quelconque des revendications 1 à 8, comprenant en outre
    un dispositif de transfert de chaleur (28) à l'intérieur d'une portion de dessus du contenant en verre scellé hermétiquement à l'opposé de la base, le dispositif de transfert de chaleur étant fixé au support de source de lumière et réalisé en une résine de conductivité thermique.
  10. Lampe à DEL selon la revendication 9, comprenant en outre
    un élément de rayonnement de chaleur supplémentaire (30) dans une portion de dessus à l'extérieur du contenant en verre scellé hermétiquement, ayant une relation de conductivité thermique avec le dispositif de transfert de chaleur à travers le contenant en verre scellé hermétiquement.
  11. Lampe à DEL selon la revendication 3, comprenant en outre
    un ventilateur d'accélération d'écoulement de gaz (32) à proximité d'une extrémité supérieure, d'une extrémité inférieure ou des deux, du support de source de lumière.
  12. Lampe à DEL selon la revendication 1,
    dans laquelle un gaz azote est encapsulé en plus du gaz de faible poids moléculaire à l'intérieur du contenant en verre scellé hermétiquement.
EP13850606.8A 2012-11-01 2013-10-08 Lampe à del Not-in-force EP2937624B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012242002A JP5818167B2 (ja) 2012-11-01 2012-11-01 Ｌｅｄランプ
PCT/JP2013/077327 WO2014069183A1 (fr) 2012-11-01 2013-10-08 Lampe à del

Publications (3)

Publication Number Publication Date
EP2937624A1 EP2937624A1 (fr) 2015-10-28
EP2937624A4 EP2937624A4 (fr) 2016-06-22
EP2937624B1 true EP2937624B1 (fr) 2017-08-30

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Application Number Title Priority Date Filing Date
EP13850606.8A Not-in-force EP2937624B1 (fr) 2012-11-01 2013-10-08 Lampe à del

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EP (1) EP2937624B1 (fr)
JP (1) JP5818167B2 (fr)
WO (1) WO2014069183A1 (fr)

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Also Published As

Publication number Publication date
EP2937624A1 (fr) 2015-10-28
EP2937624A4 (fr) 2016-06-22
JP5818167B2 (ja) 2015-11-18
JP2014093152A (ja) 2014-05-19
WO2014069183A1 (fr) 2014-05-08

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