EP2872821B1 - Modulbaugruppe mit verschwenkbaren halbleitermodulen für einen scheinwerfer - Google Patents

Modulbaugruppe mit verschwenkbaren halbleitermodulen für einen scheinwerfer Download PDF

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Publication number
EP2872821B1
EP2872821B1 EP13732540.3A EP13732540A EP2872821B1 EP 2872821 B1 EP2872821 B1 EP 2872821B1 EP 13732540 A EP13732540 A EP 13732540A EP 2872821 B1 EP2872821 B1 EP 2872821B1
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EP
European Patent Office
Prior art keywords
semiconductor light
heat sink
ball socket
module
light module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP13732540.3A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2872821A1 (de
Inventor
Gerd PAWLICZEK
Richesh Thomas THANAPAUL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hella GmbH and Co KGaA
Original Assignee
Hella GmbH and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hella GmbH and Co KGaA filed Critical Hella GmbH and Co KGaA
Publication of EP2872821A1 publication Critical patent/EP2872821A1/de
Application granted granted Critical
Publication of EP2872821B1 publication Critical patent/EP2872821B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/49—Attachment of the cooling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Definitions

  • the present invention relates to a module assembly for a headlight with at least one semiconductor light module and a method for adjusting the semiconductor light module which is accommodated on a support frame, the semiconductor light module comprising a heat sink with at least one semiconductor light source accommodated on the heat sink.
  • Headlamps of a more recent design have module assemblies for emitting light with one and preferably a plurality of semiconductor light modules, and the module assemblies have support frames with which the one or more semiconductor light modules are accommodated in the headlight.
  • the support frame serves to hold the semiconductor light modules in the housing of the headlamp.
  • Each individual semiconductor light module forms part of the light field that is generated with the headlight in front of the vehicle. Consequently, the individual semiconductor light modules must have an exact adjustment position in the support frame. Manufacturing tolerances that arise during the manufacture of the semiconductor light modules with the heat sink and the add-on parts, but also manufacturing tolerances during the manufacture of the support frame, can lead to position errors of the semiconductor light modules that already exceed permissible limits.
  • one or preferably several semiconductor light sources in the form of individual emitters are received on the heat sink, which emit light into a reflector arranged on the heat sink, and from the reflector the light reaches the area in front of the vehicle through the cover lens of the headlight.
  • the position of the heat sink in the support frame is decisive for the part of the light field emitted by the individual semiconductor light module.
  • the semiconductor light source is arranged directly on the heat sink, so that it can be heated by the heat sink, the heat sink in the present case basically describing each support body for forming the semiconductor light module and which can emit heat via convection via its surface.
  • the semiconductor light module comprises a heat sink on which a semiconductor light source is arranged on the front, and on the rear the heat sink has a plurality of cooling fins for cooling the semiconductor light source.
  • the light emitted by the semiconductor light source passes through a lens and the heat sink is received in the support frame via three screw-on points.
  • the position of the heat sink relative to the lens can be adjusted by adjusting the screws in the screw-on points.
  • the screw elements in the screw-on points have adjustment axes that run parallel to each other.
  • the US 7,972,049 B2 shows a semiconductor light module with a heat sink, on which a semiconductor light source is arranged, and a reflector can be attached to the heat sink via two screw elements.
  • the connection points between the reflector and the heat sink have adjustment ramps, and depending on the rotation of the adjustment ramps, the reflector can be rotated about an axis in order to be aligned relative to the semiconductor light source.
  • a module assembly with a plurality of semiconductor light modules is shown in a support frame, and a semiconductor light source is received on each of the semiconductor light modules and a reflector can also be attached via a screw element.
  • a semiconductor light source is received on each of the semiconductor light modules and a reflector can also be attached via a screw element.
  • three defined contact points are determined, so that an accurate position of the reflector on the heat sink is made possible, but an adjustability of the reflector on the heat sink is not provided.
  • the JP 2009 021135 A discloses a vehicle headlight with an LED and a reflector.
  • a heat sink, which carries the LED, is adjustably attached to a housing via a ball joint.
  • a similar arrangement is shown in the US 2008/0225546 A1 known.
  • the US 2012/049733 A1 discloses a replaceable LED module in a headlight.
  • An LED is held on a heat sink with a convex surface.
  • the heat sink rests on a concave surface of a metal block, so that the alignment of the LED module in the headlight can be adjusted.
  • the invention includes the technical teaching that the support frame has at least one ball socket, in which the semiconductor light module with the heat sink is pivotably seated about a ball socket center.
  • the invention is based on the idea of providing the mounting of the semiconductor light module on the support frame via a ball socket, so that the semiconductor light module with the heat sink can be pivoted in several axes about a ball socket center in the ball socket. Consequently, the semiconductor light module on the support frame can be adjusted in a simple manner about a Y axis transverse to the direction of light propagation and about a vertical axis Z, which forms the vertical direction Z of the headlight. Consequently, separate adjustment means are no longer required, since adjustment by swiveling the semiconductor light module around the ball socket center is sufficient.
  • the ball socket is geometrically designed such that the ball socket center point, for example, approximately between the Is semiconductor light source and a reflector, which can be arranged on the heat sink and is also part of the semiconductor light module.
  • the ball socket center can, for example, also form a kind of optical center of the semiconductor light module, which can be present in particular if the semiconductor light module is constructed from at least one semiconductor light source and a lens.
  • the heat sink has a spherical cap, which is designed for sitting in the ball socket in the support frame.
  • a sliding shell element is provided, which is arranged between the spherical cap and the ball socket.
  • the spherical cap is designed to slide in the sliding shell element in order to create a pivoting of the semiconductor light module about the Y axis transversely to the direction of light propagation X.
  • a guide rib is arranged on the spherical cap, which is seated in a guide groove in the sliding shell element for guiding the pivoting about the Y axis. Consequently, the semiconductor light module is pivoted about the Y axis transversely to the direction of light propagation, that is to say to adjust the emitted height of the light which is provided by the semiconductor light module, by sliding the spherical cap relative to the sliding shell element in the latter.
  • the sliding shell element can be designed to slide in the ball socket in order to create a pivoting of the semiconductor light module about the Z axis, which forms the vertical axis Z of the headlamp.
  • a transverse rib arranged on the sliding shell element can be provided, which sits in a transverse groove made in the ball socket. Consequently, the semiconductor light module is pivoted about the vertical axis Z by the sliding shell element sliding together with the heat sink of the semiconductor light module in the ball socket.
  • the guide ribs are in the guide groove for the respective guidance of the sliding movements used to fit, and also the cross rib in the transverse groove is also used to fit. The directions of extension of the guide rib with the guide groove and the transverse rib with the transverse groove intersect approximately perpendicular to one another.
  • a pin can be arranged on the spherical cap, which extends through the guide groove and through a through groove in the ball socket, so that the pin extends out on the ball socket rear side of the support frame.
  • the pin can serve to introduce an adjusting force into the semiconductor light module, which can be done manually or by means of a technical adjusting device.
  • fastening means can be provided with which the spherical cap can be fixed in the ball socket, in particular with the sliding shell element located in between.
  • the fastening means can be formed, for example, by screw elements and a fastening plate which is applied to the back of the supporting frame.
  • the pin can extend through the fastening plate, the screw elements being able to be screwed into the spherical cap and in particular into the guide rib.
  • the invention further relates to a method for adjusting a semiconductor light module in a headlight, the semiconductor light module being received on a support frame in the headlight and the semiconductor light module comprising a heat sink and at least one semiconductor light source received on the heat sink.
  • the at least one semiconductor light module with the heat sink is pivoted about a ball socket center, the ball socket center being formed by at least one ball socket formed in the supporting frame and receiving the semiconductor light module.
  • the semiconductor light module is fastened in the ball socket by the fastening means.
  • fastening means include screw elements, for example, these can be slightly tightened before the semiconductor light module is pivoted in the ball socket of the support frame. so that movement of the semiconductor light module, in particular the heat sink, is still possible in the ball socket. Once the semiconductor light module on the support frame has been adjusted, the screwing elements can be finally tightened to ensure that the position of the semiconductor light module on the support frame no longer changes.
  • FIG. 1 shows a perspective view of a module assembly 1 with a support frame 11, on which five semiconductor light modules 10 are included as an example.
  • Each of the semiconductor light modules 10 is essentially composed of a heat sink 12 formed, and the heat sink 12 forms a base body of the semiconductor light module 10, the base body being shown only by way of example with cooling fins, and the present designation of the heat sink 12 basically describes each body 12 on which a semiconductor light source 13 can be arranged.
  • a semiconductor light module 10 thus forms a light unit for emitting light with a heat sink 12, a semiconductor light source 13 and a reflector 26.
  • FIG 2 is shown in a perspective view of the support frame 11 without semiconductor light modules 10.
  • the support frame 11 can be accommodated in the headlight via mounting points 27.
  • the support frame 11 is designed to hold five semiconductor light modules 10, for which purpose the support frame 11 has five ball sockets 14, in which the semiconductor light modules 10 with the heat sink 12 can be pivotably received around a ball socket center 15 in order to form the module assembly 1 according to the invention.
  • Each of the ball sockets 14 is assigned its own ball socket center 15.
  • the ball socket center 15 forms the point about which a radius R can be moved in order to define the concave surface of the ball socket 14.
  • the ball socket center 15 can be in a position between the semiconductor light source 13 and the surface of the reflector 26, as in FIG Figure 1 shown.
  • transverse grooves 21 which, for example, run horizontally with respect to the installation position of the support frame 11.
  • Sliding shell elements 17, which are formed by the same radius of curvature as the ball sockets 14, as in FIG Figure 5 shown.
  • the sliding shell element 17 can slide flush in the ball socket 14.
  • a transverse rib 20 is arranged on the contact surface of the sliding shell element 17 and can be seated in the transverse groove 21 in the ball socket 14.
  • a separate sliding shell element 17 can be inserted into each of the ball sockets 14, each of which can be pivoted about the vertical axis Z with respect to the ball socket center 15 by guiding the transverse ribs 20 in the transverse grooves 21.
  • the heat sink 12 is in accordance with Figure 3 and Figure 4 formed with a spherical cap 16, and the spherical cap 16 has a radius of curvature, so that the spherical cap 16 of the heat sink 12 can sit and slide in the sliding shell element 17 in a surface-closing manner.
  • a guide rib 18 is arranged on the surface of the spherical cap 16, which can slide in a coherent manner in a guide groove 19 which is introduced in the sliding shell element 17.
  • the heat sink 12 can be pivoted about the center of the ball socket 15 about an axis Y which extends in an extension direction transverse to the direction of light propagation X.
  • the arrangement of the guide rib 18 on the spherical cap 16 of the heat sink 12 is shown in FIG Figure 3 shown, the sliding shell member 17 by Figure 5 is shown in perspective.
  • Figure 4 shows the heat sink 12 in a perspective view, wherein a reflector 26 is also shown, which can be arranged on the heat sink 12.
  • a pin 22 is attached, which, for example, sits centrally on the guide rib 18, see Figure 3 , If the sliding shell element 17 is arranged in the ball socket 14 and the heat sink 12 is subsequently inserted into the sliding shell element 17, the pin 22 extends through the guide groove 19 and a through groove 23 which is introduced into the ball socket 14.
  • screw elements 24 and a fastening plate 25 which can be arranged on the rear of the support frame 11 in the region of the ball sockets 14. If the heat sink 12 and the sliding shell elements 17 are inserted in the ball sockets 14, the heat sink 12 can be fastened to the support frame 11 with the screw elements 24 and the fastening plate 25.
  • the screw elements 24 can initially only be tightened slightly, so that an adjustment of the heat sink 12 in the ball sockets 14 is still possible.
  • the adjustment by the pin 22 can, for example, manually or with a Automatic adjustment takes place, and when the desired position of the heat sink 12 on the support frame 11 is reached, the screw elements 24 can be finally tightened in order to ensure the position of the semiconductor light modules 10 on the support frame 11.
  • the embodiment of the invention is not limited to the preferred exemplary embodiment specified above. Rather, a number of variants are conceivable which make use of the solution shown, even in the case of fundamentally different types.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Lighting Device Outwards From Vehicle And Optical Signal (AREA)
EP13732540.3A 2012-07-13 2013-06-29 Modulbaugruppe mit verschwenkbaren halbleitermodulen für einen scheinwerfer Active EP2872821B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012106314.1A DE102012106314A1 (de) 2012-07-13 2012-07-13 Modulbaugruppe mit verschwenkbaren Halbleiterlichtmodulen für einenScheinwerfer
PCT/EP2013/063757 WO2014009185A1 (de) 2012-07-13 2013-06-29 Modulbaugruppe mit verschwenkbaren halbleitermodulen für einen scheinwerfer

Publications (2)

Publication Number Publication Date
EP2872821A1 EP2872821A1 (de) 2015-05-20
EP2872821B1 true EP2872821B1 (de) 2020-01-15

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EP13732540.3A Active EP2872821B1 (de) 2012-07-13 2013-06-29 Modulbaugruppe mit verschwenkbaren halbleitermodulen für einen scheinwerfer

Country Status (5)

Country Link
US (1) US9638382B2 (zh)
EP (1) EP2872821B1 (zh)
CN (1) CN104428584B (zh)
DE (1) DE102012106314A1 (zh)
WO (1) WO2014009185A1 (zh)

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DE102015119524A1 (de) 2015-11-12 2017-05-18 Hella Kgaa Hueck & Co. Lichtmodul mit einer Halbleiterlichtquelle zur justierbaren Aufnahme in einem Scheinwerfer
CN207364902U (zh) * 2017-04-11 2018-05-15 法雷奥照明湖北技术中心有限公司 发光模块以及包括该发光模块的机动车辆
DE102017115652A1 (de) 2017-07-12 2019-01-17 HELLA GmbH & Co. KGaA Modulbaugruppe mit mehreren Lichteinheiten zur Anordnung in einer Beleuchtungseinrichtung
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Also Published As

Publication number Publication date
EP2872821A1 (de) 2015-05-20
US20150204499A1 (en) 2015-07-23
WO2014009185A1 (de) 2014-01-16
CN104428584A (zh) 2015-03-18
CN104428584B (zh) 2017-03-08
US9638382B2 (en) 2017-05-02
DE102012106314A1 (de) 2014-01-16

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