EP2872821B1 - Module assembly having pivotable semiconductor modules for a headlamp - Google Patents

Module assembly having pivotable semiconductor modules for a headlamp Download PDF

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Publication number
EP2872821B1
EP2872821B1 EP13732540.3A EP13732540A EP2872821B1 EP 2872821 B1 EP2872821 B1 EP 2872821B1 EP 13732540 A EP13732540 A EP 13732540A EP 2872821 B1 EP2872821 B1 EP 2872821B1
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EP
European Patent Office
Prior art keywords
semiconductor light
heat sink
ball socket
module
light module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP13732540.3A
Other languages
German (de)
French (fr)
Other versions
EP2872821A1 (en
Inventor
Gerd PAWLICZEK
Richesh Thomas THANAPAUL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hella GmbH and Co KGaA
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Hella GmbH and Co KGaA
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Filing date
Publication date
Application filed by Hella GmbH and Co KGaA filed Critical Hella GmbH and Co KGaA
Publication of EP2872821A1 publication Critical patent/EP2872821A1/en
Application granted granted Critical
Publication of EP2872821B1 publication Critical patent/EP2872821B1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/151—Light emitting diodes [LED] arranged in one or more lines
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/19—Attachment of light sources or lamp holders
    • F21S41/192—Details of lamp holders, terminals or connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/49—Attachment of the cooling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Definitions

  • the present invention relates to a module assembly for a headlight with at least one semiconductor light module and a method for adjusting the semiconductor light module which is accommodated on a support frame, the semiconductor light module comprising a heat sink with at least one semiconductor light source accommodated on the heat sink.
  • Headlamps of a more recent design have module assemblies for emitting light with one and preferably a plurality of semiconductor light modules, and the module assemblies have support frames with which the one or more semiconductor light modules are accommodated in the headlight.
  • the support frame serves to hold the semiconductor light modules in the housing of the headlamp.
  • Each individual semiconductor light module forms part of the light field that is generated with the headlight in front of the vehicle. Consequently, the individual semiconductor light modules must have an exact adjustment position in the support frame. Manufacturing tolerances that arise during the manufacture of the semiconductor light modules with the heat sink and the add-on parts, but also manufacturing tolerances during the manufacture of the support frame, can lead to position errors of the semiconductor light modules that already exceed permissible limits.
  • one or preferably several semiconductor light sources in the form of individual emitters are received on the heat sink, which emit light into a reflector arranged on the heat sink, and from the reflector the light reaches the area in front of the vehicle through the cover lens of the headlight.
  • the position of the heat sink in the support frame is decisive for the part of the light field emitted by the individual semiconductor light module.
  • the semiconductor light source is arranged directly on the heat sink, so that it can be heated by the heat sink, the heat sink in the present case basically describing each support body for forming the semiconductor light module and which can emit heat via convection via its surface.
  • the semiconductor light module comprises a heat sink on which a semiconductor light source is arranged on the front, and on the rear the heat sink has a plurality of cooling fins for cooling the semiconductor light source.
  • the light emitted by the semiconductor light source passes through a lens and the heat sink is received in the support frame via three screw-on points.
  • the position of the heat sink relative to the lens can be adjusted by adjusting the screws in the screw-on points.
  • the screw elements in the screw-on points have adjustment axes that run parallel to each other.
  • the US 7,972,049 B2 shows a semiconductor light module with a heat sink, on which a semiconductor light source is arranged, and a reflector can be attached to the heat sink via two screw elements.
  • the connection points between the reflector and the heat sink have adjustment ramps, and depending on the rotation of the adjustment ramps, the reflector can be rotated about an axis in order to be aligned relative to the semiconductor light source.
  • a module assembly with a plurality of semiconductor light modules is shown in a support frame, and a semiconductor light source is received on each of the semiconductor light modules and a reflector can also be attached via a screw element.
  • a semiconductor light source is received on each of the semiconductor light modules and a reflector can also be attached via a screw element.
  • three defined contact points are determined, so that an accurate position of the reflector on the heat sink is made possible, but an adjustability of the reflector on the heat sink is not provided.
  • the JP 2009 021135 A discloses a vehicle headlight with an LED and a reflector.
  • a heat sink, which carries the LED, is adjustably attached to a housing via a ball joint.
  • a similar arrangement is shown in the US 2008/0225546 A1 known.
  • the US 2012/049733 A1 discloses a replaceable LED module in a headlight.
  • An LED is held on a heat sink with a convex surface.
  • the heat sink rests on a concave surface of a metal block, so that the alignment of the LED module in the headlight can be adjusted.
  • the invention includes the technical teaching that the support frame has at least one ball socket, in which the semiconductor light module with the heat sink is pivotably seated about a ball socket center.
  • the invention is based on the idea of providing the mounting of the semiconductor light module on the support frame via a ball socket, so that the semiconductor light module with the heat sink can be pivoted in several axes about a ball socket center in the ball socket. Consequently, the semiconductor light module on the support frame can be adjusted in a simple manner about a Y axis transverse to the direction of light propagation and about a vertical axis Z, which forms the vertical direction Z of the headlight. Consequently, separate adjustment means are no longer required, since adjustment by swiveling the semiconductor light module around the ball socket center is sufficient.
  • the ball socket is geometrically designed such that the ball socket center point, for example, approximately between the Is semiconductor light source and a reflector, which can be arranged on the heat sink and is also part of the semiconductor light module.
  • the ball socket center can, for example, also form a kind of optical center of the semiconductor light module, which can be present in particular if the semiconductor light module is constructed from at least one semiconductor light source and a lens.
  • the heat sink has a spherical cap, which is designed for sitting in the ball socket in the support frame.
  • a sliding shell element is provided, which is arranged between the spherical cap and the ball socket.
  • the spherical cap is designed to slide in the sliding shell element in order to create a pivoting of the semiconductor light module about the Y axis transversely to the direction of light propagation X.
  • a guide rib is arranged on the spherical cap, which is seated in a guide groove in the sliding shell element for guiding the pivoting about the Y axis. Consequently, the semiconductor light module is pivoted about the Y axis transversely to the direction of light propagation, that is to say to adjust the emitted height of the light which is provided by the semiconductor light module, by sliding the spherical cap relative to the sliding shell element in the latter.
  • the sliding shell element can be designed to slide in the ball socket in order to create a pivoting of the semiconductor light module about the Z axis, which forms the vertical axis Z of the headlamp.
  • a transverse rib arranged on the sliding shell element can be provided, which sits in a transverse groove made in the ball socket. Consequently, the semiconductor light module is pivoted about the vertical axis Z by the sliding shell element sliding together with the heat sink of the semiconductor light module in the ball socket.
  • the guide ribs are in the guide groove for the respective guidance of the sliding movements used to fit, and also the cross rib in the transverse groove is also used to fit. The directions of extension of the guide rib with the guide groove and the transverse rib with the transverse groove intersect approximately perpendicular to one another.
  • a pin can be arranged on the spherical cap, which extends through the guide groove and through a through groove in the ball socket, so that the pin extends out on the ball socket rear side of the support frame.
  • the pin can serve to introduce an adjusting force into the semiconductor light module, which can be done manually or by means of a technical adjusting device.
  • fastening means can be provided with which the spherical cap can be fixed in the ball socket, in particular with the sliding shell element located in between.
  • the fastening means can be formed, for example, by screw elements and a fastening plate which is applied to the back of the supporting frame.
  • the pin can extend through the fastening plate, the screw elements being able to be screwed into the spherical cap and in particular into the guide rib.
  • the invention further relates to a method for adjusting a semiconductor light module in a headlight, the semiconductor light module being received on a support frame in the headlight and the semiconductor light module comprising a heat sink and at least one semiconductor light source received on the heat sink.
  • the at least one semiconductor light module with the heat sink is pivoted about a ball socket center, the ball socket center being formed by at least one ball socket formed in the supporting frame and receiving the semiconductor light module.
  • the semiconductor light module is fastened in the ball socket by the fastening means.
  • fastening means include screw elements, for example, these can be slightly tightened before the semiconductor light module is pivoted in the ball socket of the support frame. so that movement of the semiconductor light module, in particular the heat sink, is still possible in the ball socket. Once the semiconductor light module on the support frame has been adjusted, the screwing elements can be finally tightened to ensure that the position of the semiconductor light module on the support frame no longer changes.
  • FIG. 1 shows a perspective view of a module assembly 1 with a support frame 11, on which five semiconductor light modules 10 are included as an example.
  • Each of the semiconductor light modules 10 is essentially composed of a heat sink 12 formed, and the heat sink 12 forms a base body of the semiconductor light module 10, the base body being shown only by way of example with cooling fins, and the present designation of the heat sink 12 basically describes each body 12 on which a semiconductor light source 13 can be arranged.
  • a semiconductor light module 10 thus forms a light unit for emitting light with a heat sink 12, a semiconductor light source 13 and a reflector 26.
  • FIG 2 is shown in a perspective view of the support frame 11 without semiconductor light modules 10.
  • the support frame 11 can be accommodated in the headlight via mounting points 27.
  • the support frame 11 is designed to hold five semiconductor light modules 10, for which purpose the support frame 11 has five ball sockets 14, in which the semiconductor light modules 10 with the heat sink 12 can be pivotably received around a ball socket center 15 in order to form the module assembly 1 according to the invention.
  • Each of the ball sockets 14 is assigned its own ball socket center 15.
  • the ball socket center 15 forms the point about which a radius R can be moved in order to define the concave surface of the ball socket 14.
  • the ball socket center 15 can be in a position between the semiconductor light source 13 and the surface of the reflector 26, as in FIG Figure 1 shown.
  • transverse grooves 21 which, for example, run horizontally with respect to the installation position of the support frame 11.
  • Sliding shell elements 17, which are formed by the same radius of curvature as the ball sockets 14, as in FIG Figure 5 shown.
  • the sliding shell element 17 can slide flush in the ball socket 14.
  • a transverse rib 20 is arranged on the contact surface of the sliding shell element 17 and can be seated in the transverse groove 21 in the ball socket 14.
  • a separate sliding shell element 17 can be inserted into each of the ball sockets 14, each of which can be pivoted about the vertical axis Z with respect to the ball socket center 15 by guiding the transverse ribs 20 in the transverse grooves 21.
  • the heat sink 12 is in accordance with Figure 3 and Figure 4 formed with a spherical cap 16, and the spherical cap 16 has a radius of curvature, so that the spherical cap 16 of the heat sink 12 can sit and slide in the sliding shell element 17 in a surface-closing manner.
  • a guide rib 18 is arranged on the surface of the spherical cap 16, which can slide in a coherent manner in a guide groove 19 which is introduced in the sliding shell element 17.
  • the heat sink 12 can be pivoted about the center of the ball socket 15 about an axis Y which extends in an extension direction transverse to the direction of light propagation X.
  • the arrangement of the guide rib 18 on the spherical cap 16 of the heat sink 12 is shown in FIG Figure 3 shown, the sliding shell member 17 by Figure 5 is shown in perspective.
  • Figure 4 shows the heat sink 12 in a perspective view, wherein a reflector 26 is also shown, which can be arranged on the heat sink 12.
  • a pin 22 is attached, which, for example, sits centrally on the guide rib 18, see Figure 3 , If the sliding shell element 17 is arranged in the ball socket 14 and the heat sink 12 is subsequently inserted into the sliding shell element 17, the pin 22 extends through the guide groove 19 and a through groove 23 which is introduced into the ball socket 14.
  • screw elements 24 and a fastening plate 25 which can be arranged on the rear of the support frame 11 in the region of the ball sockets 14. If the heat sink 12 and the sliding shell elements 17 are inserted in the ball sockets 14, the heat sink 12 can be fastened to the support frame 11 with the screw elements 24 and the fastening plate 25.
  • the screw elements 24 can initially only be tightened slightly, so that an adjustment of the heat sink 12 in the ball sockets 14 is still possible.
  • the adjustment by the pin 22 can, for example, manually or with a Automatic adjustment takes place, and when the desired position of the heat sink 12 on the support frame 11 is reached, the screw elements 24 can be finally tightened in order to ensure the position of the semiconductor light modules 10 on the support frame 11.
  • the embodiment of the invention is not limited to the preferred exemplary embodiment specified above. Rather, a number of variants are conceivable which make use of the solution shown, even in the case of fundamentally different types.

Description

Die vorliegende Erfindung betrifft eine Modulbaugruppe für einen Scheinwerfer mit wenigstens einem Halbleiterlichtmodul und ein Verfahren zur Justierung des Halbleiterlichtmoduls, das an einem Tragrahmen aufgenommen ist, wobei das Halbleiterlichtmodul einen Kühlkörper mit wenigstens einer am Kühlkörper aufgenommenen Halbleiterlichtquelle umfasst.The present invention relates to a module assembly for a headlight with at least one semiconductor light module and a method for adjusting the semiconductor light module which is accommodated on a support frame, the semiconductor light module comprising a heat sink with at least one semiconductor light source accommodated on the heat sink.

Scheinwerfer neuerer Bauart besitzen Modulbaugruppen zur Aussendung von Licht mit einem und vorzugsweise mehreren Halbleiterlichtmodulen, und die Modulbaugruppen weisen Tragrahmen auf, mit denen das eine oder die mehreren Halbleiterlichtmodule im Scheinwerfer aufgenommen sind. Der Tragrahmen dient dabei zur haltenden Anordnung der Halbleiterlichtmodule im Gehäuse des Scheinwerfers. Dabei bildet jedes einzelne Halbleiterlichtmodul ein Teil des Lichtfeldes, das mit dem Scheinwerfer vor dem Fahrzeug erzeugt wird. Folglich müssen die einzelnen Halbleiterlichtmodule eine genaue Justageposition im Tragrahmen aufweisen. Fertigungstoleranzen, die bei der Herstellung der Halbleiterlichtmodule mit dem Kühlkörper und den Anbauteilen entstehen, jedoch auch Fertigungstoleranzen bei der Herstellung des Tragrahmens, können zu Lagefehlern der Halbleiterlichtmodule führen, die bereits zulässige Grenzen überschreiten. Am Kühlkörper sind beispielsweise eine oder vorzugsweise mehrere Halbleiterlichtquellen in Form von einzelnen Emittern aufgenommen, die Licht in einen am Kühlkörper angeordneten Reflektor aussenden, und vom Reflektor gelangt das Licht durch die Abschlussscheibe des Scheinwerfers in den Bereich vor das Fahrzeug. Dabei ist die Lage des Kühlkörpers im Tragrahmen entscheidend für den vom einzelnen Halbleiterlichtmodul ausgesendeten Teil des Lichtfeldes. Die Halbleiterlichtquelle ist direkt am Kühlkörper angeordnet, sodass diese durch den Kühlkörper entwärmt werden kann, wobei der Kühlkörper vorliegend grundsätzlich jeden Trägerkörper zur Bildung des Halbleiterlichtmoduls beschreibt, und der über seine Oberfläche Wärme durch Konvektion abgeben kann.Headlamps of a more recent design have module assemblies for emitting light with one and preferably a plurality of semiconductor light modules, and the module assemblies have support frames with which the one or more semiconductor light modules are accommodated in the headlight. The support frame serves to hold the semiconductor light modules in the housing of the headlamp. Each individual semiconductor light module forms part of the light field that is generated with the headlight in front of the vehicle. Consequently, the individual semiconductor light modules must have an exact adjustment position in the support frame. Manufacturing tolerances that arise during the manufacture of the semiconductor light modules with the heat sink and the add-on parts, but also manufacturing tolerances during the manufacture of the support frame, can lead to position errors of the semiconductor light modules that already exceed permissible limits. For example, one or preferably several semiconductor light sources in the form of individual emitters are received on the heat sink, which emit light into a reflector arranged on the heat sink, and from the reflector the light reaches the area in front of the vehicle through the cover lens of the headlight. The position of the heat sink in the support frame is decisive for the part of the light field emitted by the individual semiconductor light module. The semiconductor light source is arranged directly on the heat sink, so that it can be heated by the heat sink, the heat sink in the present case basically describing each support body for forming the semiconductor light module and which can emit heat via convection via its surface.

STAND DER TECHNIKSTATE OF THE ART

Aus der US 2009/0303726 A1 ist ein Halbleiterlichtmodul bekannt, das in einem Tragrahmen aufgenommen ist. Das Halbleiterlichtmodul umfasst einen Kühlkörper, auf dem vorderseitig eine Halbleiterlichtquelle angeordnet ist, und rückseitig besitzt der Kühlkörper zur Kühlung der Halbleiterlichtquelle mehrere Kühlrippen. Das von der Halbleiterlichtquelle emittierte Licht gelangt durch eine Linse, und der Kühlkörper ist über drei Anschraubpunkte im Tragrahmen aufgenommen. Durch Verstellung der Schrauben in den Anschraubpunkten kann die Lage des Kühlkörpers relativ zur Linse verstellt werden. Die Schraubelemente in den Anschraubpunkten weisen Verstellachsen auf, die jeweils parallel zueinander verlaufen.From the US 2009/0303726 A1 a semiconductor light module is known, which is accommodated in a support frame. The semiconductor light module comprises a heat sink on which a semiconductor light source is arranged on the front, and on the rear the heat sink has a plurality of cooling fins for cooling the semiconductor light source. The light emitted by the semiconductor light source passes through a lens and the heat sink is received in the support frame via three screw-on points. The position of the heat sink relative to the lens can be adjusted by adjusting the screws in the screw-on points. The screw elements in the screw-on points have adjustment axes that run parallel to each other.

Die US 7,972,049 B2 zeigt ein Halbleiterlichtmodul mit einem Kühlkörper, an dem eine Halbleiterlichtquelle angeordnet ist, und an den Kühlkörper kann über zwei Schraubelemente ein Reflektor angebracht werden. Dabei weisen die Verbindungspunkte zwischen dem Reflektor und dem Kühlkörper Justagerampen auf, und je nach Verdrehung der Justagerampen kann der Reflektor um eine Achse verdreht werden, um relativ zur Halbleiterlichtquelle ausgerichtet zu werden. Dabei ist jedoch eine Montage des Halbleiterlichtmoduls in einem Tragrahmen nicht möglich.The US 7,972,049 B2 shows a semiconductor light module with a heat sink, on which a semiconductor light source is arranged, and a reflector can be attached to the heat sink via two screw elements. The connection points between the reflector and the heat sink have adjustment ramps, and depending on the rotation of the adjustment ramps, the reflector can be rotated about an axis in order to be aligned relative to the semiconductor light source. However, it is not possible to mount the semiconductor light module in a support frame.

Aus der US 7,798,690 B2 ist eine Modulbaugruppe mit mehreren Halbleiterlichtmodulen in einem Tragrahmen gezeigt, und an den Halbleiterlichtmodulen ist jeweils eine Halbleiterlichtquelle aufgenommen und über ein Schraubelement kann ferner ein Reflektor angebracht werden kann. Um den Reflektor positionsgenau am Kühlkörper anzubringen, werden drei definierte Kontaktpunkte bestimmt, sodass eine lagegenaue Anordnung des Reflektors am Kühlkörper ermöglicht wird, eine Justierbarkeit des Reflektors am Kühlkörper ist jedoch nicht vorgesehen.From the US 7,798,690 B2 A module assembly with a plurality of semiconductor light modules is shown in a support frame, and a semiconductor light source is received on each of the semiconductor light modules and a reflector can also be attached via a screw element. In order to position the reflector on the heat sink in an exact position, three defined contact points are determined, so that an accurate position of the reflector on the heat sink is made possible, but an adjustability of the reflector on the heat sink is not provided.

Die JP 2009 021135 A offenbart einen Fahrzeugscheinwerfer mit einer LED und einem Reflektor. Ein Kühlkörper, der die LED trägt, ist über ein Kugelgelenk an einem Gehäuse einstellbar befestigt. Eine ähnliche Anordnung ist aus der US 2008/0225546 A1 bekannt.The JP 2009 021135 A discloses a vehicle headlight with an LED and a reflector. A heat sink, which carries the LED, is adjustably attached to a housing via a ball joint. A similar arrangement is shown in the US 2008/0225546 A1 known.

Die US 2012/049733 A1 offenbart ein austauschbares LED Modul in einem Scheinwerfer. Eine LED ist auf einem Kühlkörper mit konvexer Fläche gehalten. An der konvexen Fläche liegt der Kühlkörper an einer konkaven Fläche eines Metallblocks an, so dass die Ausrichtung des LED-Moduls im Scheinwerfer einstellbar ist.The US 2012/049733 A1 discloses a replaceable LED module in a headlight. An LED is held on a heat sink with a convex surface. On the convex surface, the heat sink rests on a concave surface of a metal block, so that the alignment of the LED module in the headlight can be adjusted.

OFFENBARUNG DER ERFINDUNGDISCLOSURE OF THE INVENTION

Es ist die Aufgabe der vorliegenden Erfindung, eine Modulbaugruppe für einen Scheinwerfer mit wenigstens einem Halbleiterlichtmodul zu schaffen, die eine vereinfachte Justage des Halbleiterlichtmoduls im Tragrahmen der Modulbaugruppe ermöglicht.It is the object of the present invention to create a module assembly for a headlight with at least one semiconductor light module, which enables a simplified adjustment of the semiconductor light module in the support frame of the module assembly.

Diese Aufgabe wird ausgehend von einer Modulbaugruppe mit wenigstens einem Halbleiterlichtmodul gemäß dem Oberbegriff des Anspruchs 1 mit den kennzeichnenden Merkmalen sowie durch ein Verfahren zur Justierung eines Halbleiterlichtmoduls in einem Scheinwerfer gemäß dem Anspruch 7 gelöst. Vorteilhafte Weiterbildungen der Erfindung sind in den jeweiligen Ansprüchen angegeben.This object is achieved on the basis of a module assembly with at least one semiconductor light module according to the preamble of claim 1 with the characterizing features and by a method for adjusting a semiconductor light module in a headlight according to claim 7. Advantageous developments of the invention are specified in the respective claims.

Die Erfindung schließt die technische Lehre ein, dass der Tragrahmen zumindest eine Kugelpfanne aufweist, in der das Halbleiterlichtmodul mit dem Kühlkörper um einen Kugelpfannenmittelpunkt verschwenkbar einsitzt.The invention includes the technical teaching that the support frame has at least one ball socket, in which the semiconductor light module with the heat sink is pivotably seated about a ball socket center.

Die Erfindung geht von dem Gedanken aus, die Aufnahme des Halbleiterlichtmoduls am Tragrahmen über eine Kugelpfanne vorzusehen, sodass das Halbleiterlichtmodul mit dem Kühlkörper um einen Kugelpfannenmittelpunkt in der Kugelpfanne in mehreren Achsen verschwenkbar ist. Folglich kann auf einfache Weise das Halbleiterlichtmodul am Tragrahmen um eine Y-Achse quer zur Lichtausbreitungsrichtung und um eine Hochachse Z, die die Vertikalrichtung Z des Scheinwerfers bildet, einjustiert werden. Folglich sind keine voneinander getrennten Justagemittel mehr erforderlich, da eine Einjustierung durch eine Verschwenkung des Halbleiterlichtmoduls um den Kugelpfannenmittelpunkt hinreichend ist. Die Kugelpfanne ist geometrisch so ausgebildet, dass der Kugelpfannenmittelpunkt beispielsweise etwa zwischen der Halbleiterlichtquelle und einem Reflektor liegt, der am Kühlkörper angeordnet sein kann und ebenfalls Bestandteil des Halbleiterlichtmoduls ist. Der Kugelpfannenmittelpunkt kann dabei beispielsweise auch eine Art optischen Mittelpunkt des Halbleiterlichtmoduls bilden, welcher insbesondere dann vorhanden sein kann, wenn das Halbleiterlichtmodul aus wenigstens einer Halbleiterlichtquelle und einer Linse aufgebaut ist.The invention is based on the idea of providing the mounting of the semiconductor light module on the support frame via a ball socket, so that the semiconductor light module with the heat sink can be pivoted in several axes about a ball socket center in the ball socket. Consequently, the semiconductor light module on the support frame can be adjusted in a simple manner about a Y axis transverse to the direction of light propagation and about a vertical axis Z, which forms the vertical direction Z of the headlight. Consequently, separate adjustment means are no longer required, since adjustment by swiveling the semiconductor light module around the ball socket center is sufficient. The ball socket is geometrically designed such that the ball socket center point, for example, approximately between the Is semiconductor light source and a reflector, which can be arranged on the heat sink and is also part of the semiconductor light module. The ball socket center can, for example, also form a kind of optical center of the semiconductor light module, which can be present in particular if the semiconductor light module is constructed from at least one semiconductor light source and a lens.

Ferner weist der Kühlkörper eine Kugelkalotte auf, die zum Einsitzen in der Kugelpfanne im Tragrahmen ausgebildet ist. Dabei ist ein Gleitschalenelement vorgesehen, das zwischen der Kugelkalotte und der Kugelpfanne angeordnet ist. Durch das Gleitschalenelement kann einerseits eine Verschwenkung des Halbleiterlichtmoduls um die Y-Achse quer zur Lichtausbreitungsrichtung und andererseits eine Verschwenkung um die Z-Achse, die die Hochachse Z des Scheinwerfers bildet, getrennt vorgenommen werden.Furthermore, the heat sink has a spherical cap, which is designed for sitting in the ball socket in the support frame. A sliding shell element is provided, which is arranged between the spherical cap and the ball socket. By means of the sliding shell element, on the one hand, the semiconductor light module can be pivoted about the Y axis transversely to the direction of light propagation and, on the other hand, it can be pivoted about the Z axis, which forms the vertical axis Z of the headlight.

Die Kugelkalotte ist zum Abgleiten im Gleitschalenelement ausgebildet, um eine Verschwenkung des Halbleiterlichtmoduls um die Y-Achse quer zur Lichtausbreitungsrichtung X zu schaffen. Zudem ist an der Kugelkalotte eine Führungsrippe angeordnet, die zur Führung der Verschwenkung um die Y-Achse in einer Führungsnut im Gleitschalenelement einsitzt. Folglich erfolgt eine Verschwenkung des Halbleiterlichtmoduls um die Y-Achse quer zur Lichtausbreitungsrichtung, also zur Verstellung der ausgesendeten Höhe des Lichtes, das durch das Halbleiterlichtmodul bereitgestellt wird, indem die Kugelkalotte gegenüber dem Gleitschalenelement in diesem abgleitet.The spherical cap is designed to slide in the sliding shell element in order to create a pivoting of the semiconductor light module about the Y axis transversely to the direction of light propagation X. In addition, a guide rib is arranged on the spherical cap, which is seated in a guide groove in the sliding shell element for guiding the pivoting about the Y axis. Consequently, the semiconductor light module is pivoted about the Y axis transversely to the direction of light propagation, that is to say to adjust the emitted height of the light which is provided by the semiconductor light module, by sliding the spherical cap relative to the sliding shell element in the latter.

Weiterführend kann das Gleitschalenelement zum Abgleiten in der Kugelpfanne ausgebildet sein, um eine Verschwenkung des Halbleiterlichtmoduls um die Z-Achse zu schaffen, die die Hochachse Z des Scheinwerfers bildet. Dafür kann eine am Gleitschalenelement angeordnete Querrippe vorgesehen sein, die in einer in der Kugelpfanne eingebrachten Quernut einsitzt. Folglich erfolgt eine Verschwenkung des Halbleiterlichtmoduls um die Hochachse Z, indem das Gleitschalenelement gemeinsam mit dem Kühlkörper des Halbleiterlichtmoduls in der Kugelpfanne abgleitet. Zur jeweiligen Führung der Gleitbewegungen sind die Führungsrippen in der Führungsnut passgenau eingesetzt, und ferner ist die Querrippe in der Quernut ebenfalls passgenau eingesetzt. Dabei kreuzen sich die Erstreckungsrichtungen der Führungsrippe mit der Führungsnut und der Querrippe mit der Quernut etwa senkrecht zueinander.In addition, the sliding shell element can be designed to slide in the ball socket in order to create a pivoting of the semiconductor light module about the Z axis, which forms the vertical axis Z of the headlamp. For this purpose, a transverse rib arranged on the sliding shell element can be provided, which sits in a transverse groove made in the ball socket. Consequently, the semiconductor light module is pivoted about the vertical axis Z by the sliding shell element sliding together with the heat sink of the semiconductor light module in the ball socket. The guide ribs are in the guide groove for the respective guidance of the sliding movements used to fit, and also the cross rib in the transverse groove is also used to fit. The directions of extension of the guide rib with the guide groove and the transverse rib with the transverse groove intersect approximately perpendicular to one another.

Gemäß einer weiterbildenden Maßnahme kann an der Kugelkalotte ein Zapfen angeordnet sein, der sich durch die Führungsnut und durch eine Durchgangsnut in der Kugelpfanne hindurch erstreckt, sodass sich der Zapfen auf der Kugelpfannenrückseite des Tragrahmens heraus erstreckt. Beispielsweise kann der Zapfen dazu dienen, eine Verstellkraft in das Halbleiterlichtmodul einzuleiten, was manuell oder mittels einer technischen Verstelleinrichtung erfolgen kann. Um sicherzustellen, dass das Halbleiterlichtmodul in der Kugelpfanne des Tragrahmens gehalten wird, können Befestigungsmittel vorgesehen sein, mit denen die Kugelkalotte in der Kugelpfanne insbesondere mit dem dazwischen liegenden Gleitschalenelement fixierbar ist. Die Befestigungsmittel können beispielsweise durch Schraubelemente und eine Befestigungsplatte gebildet werden, die rückseitig auf den Tragrahmen aufgebracht wird. Der Zapfen kann sich dabei durch die Befestigungsplatte hindurch erstrecken, wobei die Schraubelemente in die Kugelkalotte und insbesondere in die Führungsrippe hineingeschraubt werden können.According to a further development measure, a pin can be arranged on the spherical cap, which extends through the guide groove and through a through groove in the ball socket, so that the pin extends out on the ball socket rear side of the support frame. For example, the pin can serve to introduce an adjusting force into the semiconductor light module, which can be done manually or by means of a technical adjusting device. In order to ensure that the semiconductor light module is held in the ball socket of the support frame, fastening means can be provided with which the spherical cap can be fixed in the ball socket, in particular with the sliding shell element located in between. The fastening means can be formed, for example, by screw elements and a fastening plate which is applied to the back of the supporting frame. The pin can extend through the fastening plate, the screw elements being able to be screwed into the spherical cap and in particular into the guide rib.

Die Erfindung bezieht sich ferner auf ein Verfahren zur Justierung eines Halbleiterlichtmoduls in einem Scheinwerfer, wobei das Halbleiterlichtmodul an einem Tragrahmen im Scheinwerfer aufgenommen ist und wobei das Halbleiterlichtmodul einen Kühlkörper und wenigstens eine am Kühlkörper aufgenommene Halbleiterlichtquelle umfasst. Zur Ausführung des Verfahrens ist vorgesehen, dass das wenigstens eine Halbleiterlichtmodul mit dem Kühlkörper um einen Kugelpfannenmittelpunkt verschwenkt wird, wobei der Kugelpfannenmittelpunkt durch zumindest eine im Tragrahmen ausgebildete und das Halbleiterlichtmodul aufnehmende Kugelpfanne gebildet wird. Als weiterer Verfahrensschritt kann vorgesehen sein, dass nach Einjustierung des Halbleiterlichtmoduls am Tragrahmen das Halbleiterlichtmodul in der Kugelpfanne durch die Befestigungsmittel befestigt wird. Umfassen die Befestigungsmittel beispielsweise Schraubelemente, können diese vor der Verschwenkung des Halbleiterlichtmoduls in der Kugelpfanne des Tragrahmens geringfügig angezogen werden, sodass eine Bewegung des Halbleiterlichtmoduls, insbesondere des Kühlkörpers, in der Kugelpfanne noch ermöglicht ist. Ist eine Einjustierung des Halbleiterlichtmoduls am Tragrahmen erfolgt, so können die Schraubelemente endgültig festgezogen werden, um sicherzustellen, dass sich die Lage des Halbleiterlichtmoduls am Tragrahmen nicht mehr verändert.The invention further relates to a method for adjusting a semiconductor light module in a headlight, the semiconductor light module being received on a support frame in the headlight and the semiconductor light module comprising a heat sink and at least one semiconductor light source received on the heat sink. To carry out the method, it is provided that the at least one semiconductor light module with the heat sink is pivoted about a ball socket center, the ball socket center being formed by at least one ball socket formed in the supporting frame and receiving the semiconductor light module. As a further method step it can be provided that after adjustment of the semiconductor light module on the support frame, the semiconductor light module is fastened in the ball socket by the fastening means. If the fastening means include screw elements, for example, these can be slightly tightened before the semiconductor light module is pivoted in the ball socket of the support frame. so that movement of the semiconductor light module, in particular the heat sink, is still possible in the ball socket. Once the semiconductor light module on the support frame has been adjusted, the screwing elements can be finally tightened to ensure that the position of the semiconductor light module on the support frame no longer changes.

BEVORZUGTES AUSFÜHRUNGSBEISPIEL DER ERFINDUNGPREFERRED EMBODIMENT OF THE INVENTION

Weitere, die Erfindung verbessernde Maßnahmen werden nachstehend gemeinsam mit der Beschreibung eines bevorzugten Ausführungsbeispiels der Erfindung anhand der Figuren näher dargestellt. Es zeigt:

Figur 1
eine perspektivische Ansicht eines Tragrahmens mit mehreren Halbleiterlichtmodulen, die in jeweiligen Kugelpfannen am Tragrahmen aufgenommen sind und um Kugelpfannenmittelpunkte verschwenkbar sind,
Figur 2
eine perspektivische Ansicht des Tragrahmens mit einer zugeordneten Anzahl von Kugelpfannen,
Figur 3
eine Detailansicht des Kühlkörpers mit der Kugelpfanne,
Figur 4
eine perspektivische Ansicht des Kühlkörpers mit einem zugeordneten Reflektor und
Figur 5
eine perspektivische Ansicht des Gleitschalenelementes, das zwischen der Kugelpfanne und der Kugelkalotte angeordnet werden kann.
Further measures improving the invention are described below together with the description of a preferred embodiment of the invention with reference to the figures. It shows:
Figure 1
2 shows a perspective view of a support frame with a plurality of semiconductor light modules which are received in respective ball sockets on the support frame and can be pivoted about ball socket centers,
Figure 2
2 shows a perspective view of the supporting frame with an assigned number of ball sockets,
Figure 3
a detailed view of the heat sink with the ball socket,
Figure 4
a perspective view of the heat sink with an associated reflector and
Figure 5
a perspective view of the sliding shell element, which can be arranged between the ball socket and the spherical cap.

Figur 1 zeigt in einer perspektivischen Darstellung eine Modulbaugruppe 1 mit einem Tragrahmen 11, an dem beispielhaft fünf Halbleiterlichtmodule 10 aufgenommen sind. Jedes der Halbleiterlichtmodule 10 ist im Wesentlichen aus einem Kühlkörper 12 gebildet, und der Kühlkörper 12 bildet einen Grundkörper des Halbleiterlichtmoduls 10, wobei der Grundkörper lediglich beispielhaft mit Kühlrippen gezeigt ist, und die vorliegende Bezeichnung des Kühlkörpers 12 beschreibt dabei grundsätzlich jeden Körper 12, an dem eine Halbleiterlichtquelle 13 angeordnet werden kann. Figure 1 shows a perspective view of a module assembly 1 with a support frame 11, on which five semiconductor light modules 10 are included as an example. Each of the semiconductor light modules 10 is essentially composed of a heat sink 12 formed, and the heat sink 12 forms a base body of the semiconductor light module 10, the base body being shown only by way of example with cooling fins, and the present designation of the heat sink 12 basically describes each body 12 on which a semiconductor light source 13 can be arranged.

Am Kühlkörper 12 jedes der Halbleiterlichtmodule 10 ist eine Halbleiterlichtquelle 13 angeordnet, mit der Licht emittiert werden kann. Wird die Halbleiterlichtquelle 13 in Betrieb genommen, so leuchtet diese Licht in einen Reflektor 26, der ebenfalls am Kühlkörper 12 aufgenommen ist. Somit bildet ein Halbleiterlichtmodul 10 jeweils eine Lichteinheit zur Aussendung von Licht mit einem Kühlkörper 12, einer Halbleiterlichtquelle 13 sowie einem Reflektor 26.A semiconductor light source 13, with which light can be emitted, is arranged on the heat sink 12 of each of the semiconductor light modules 10. If the semiconductor light source 13 is put into operation, this light shines into a reflector 26, which is also received on the heat sink 12. A semiconductor light module 10 thus forms a light unit for emitting light with a heat sink 12, a semiconductor light source 13 and a reflector 26.

In Figur 2 ist in einer perspektivischen Darstellung der Tragrahmen 11 ohne Halbleiterlichtmodule 10 gezeigt. Der Tragrahmen 11 kann über Aufnahmepunkte 27 im Scheinwerfer aufgenommen werden. Der Tragrahmen 11 ist zur Aufnahme von fünf Halbleiterlichtmodulen 10 ausgebildet, wofür der Tragrahmen 11 fünf Kugelpfannen 14 aufweist, in denen die Halbleiterlichtmodule 10 mit dem Kühlkörper 12 um einen Kugelpfannenmittelpunkt 15 verschwenkbar aufgenommen werden können, um die erfindungsgemäße Modulbaugruppe 1 zu bilden. Jedem der Kugelpfannen 14 ist ein eigener Kugelpfannenmittelpunkt 15 zugeordnet. Der Kugelpfannenmittelpunkt 15 bildet dabei den Punkt, um den ein Radius R bewegt werden kann, um die konkave Oberfläche der Kugelpfanne 14 zu definieren. Dabei kann sich der Kugelpfannenmittelpunkt 15 in einer Position zwischen der Halbleiterlichtquelle 13 und der Oberfläche des Reflektors 26 befinden, wie in Figur 1 gezeigt.In Figure 2 is shown in a perspective view of the support frame 11 without semiconductor light modules 10. The support frame 11 can be accommodated in the headlight via mounting points 27. The support frame 11 is designed to hold five semiconductor light modules 10, for which purpose the support frame 11 has five ball sockets 14, in which the semiconductor light modules 10 with the heat sink 12 can be pivotably received around a ball socket center 15 in order to form the module assembly 1 according to the invention. Each of the ball sockets 14 is assigned its own ball socket center 15. The ball socket center 15 forms the point about which a radius R can be moved in order to define the concave surface of the ball socket 14. The ball socket center 15 can be in a position between the semiconductor light source 13 and the surface of the reflector 26, as in FIG Figure 1 shown.

In der Oberfläche der Kugelpfannen 14 sind Quernuten 21 eingebracht, die in Bezug auf die Einbaulage des Tragrahmens 11 beispielsweise horizontal verlaufen. In die Kugelpfannen 14 können Gleitschalenelemente 17 eingesetzt werden, die durch den gleichen Krümmungsradius gebildet sind, wie auch die Kugelpfannen 14, wie in Figur 5 dargestellt. Somit kann das Gleitschalenelement 17 flächenschlüssig in der Kugelpfanne 14 abgleiten. Auf der Kontaktoberfläche des Gleitschalenelementes 17 ist eine Querrippe 20 angeordnet, die in der Quernut 21 in der Kugelpfanne 14 einsitzen kann. In jede der Kugelpfannen 14 kann ein eigenes Gleitschalenelement 17 eingesetzt werden, die jeweils durch die Führung der Querrippen 20 in den Quernuten 21 um die Hochachse Z in Bezug auf den Kugelpfannenmittelpunkt 15 verschwenkt werden können.In the surface of the ball sockets 14 there are transverse grooves 21 which, for example, run horizontally with respect to the installation position of the support frame 11. Sliding shell elements 17, which are formed by the same radius of curvature as the ball sockets 14, as in FIG Figure 5 shown. Thus, the sliding shell element 17 can slide flush in the ball socket 14. A transverse rib 20 is arranged on the contact surface of the sliding shell element 17 and can be seated in the transverse groove 21 in the ball socket 14. A separate sliding shell element 17 can be inserted into each of the ball sockets 14, each of which can be pivoted about the vertical axis Z with respect to the ball socket center 15 by guiding the transverse ribs 20 in the transverse grooves 21.

Weiterhin ist der Kühlkörper 12 gemäß Figur 3 und Figur 4 mit einer Kugelkalotte 16 ausgebildet, und die Kugelkalotte 16 weist einen Krümmungsradius auf, sodass die Kugelkalotte 16 des Kühlkörpers 12 flächenschließend im Gleitschalenelement 17 einsitzen und abgleiten kann. Auf der Oberfläche der Kugelkalotte 16 ist eine Führungsrippe 18 angeordnet, die schlüssig in einer Führungsnut 19 abgleiten kann, die im Gleitschalenelement 17 eingebracht ist. Folglich kann der Kühlkörper 12 um eine Achse Y, die in einer Erstreckungsrichtung quer zur Lichtausbreitungsrichtung X verläuft, um den Kugelpfannenmittelpunkt 15 verschwenkt werden. Die Anordnung der Führungsrippe 18 auf der Kugelkalotte 16 des Kühlkörpers 12 ist in Figur 3 gezeigt, wobei das Gleitschalenelement 17 durch Figur 5 perspektivisch dargestellt ist.Furthermore, the heat sink 12 is in accordance with Figure 3 and Figure 4 formed with a spherical cap 16, and the spherical cap 16 has a radius of curvature, so that the spherical cap 16 of the heat sink 12 can sit and slide in the sliding shell element 17 in a surface-closing manner. A guide rib 18 is arranged on the surface of the spherical cap 16, which can slide in a coherent manner in a guide groove 19 which is introduced in the sliding shell element 17. As a result, the heat sink 12 can be pivoted about the center of the ball socket 15 about an axis Y which extends in an extension direction transverse to the direction of light propagation X. The arrangement of the guide rib 18 on the spherical cap 16 of the heat sink 12 is shown in FIG Figure 3 shown, the sliding shell member 17 by Figure 5 is shown in perspective.

Figur 4 zeigt den Kühlkörper 12 in einer perspektivischen Ansicht, wobei ferner ein Reflektor 26 gezeigt ist, der am Kühlkörper 12 angeordnet werden kann. In der Kugelkalotte 16 des Kühlkörpers 12 ist ein Zapfen 22 angebracht, der beispielhaft mittig auf der Führungsrippe 18 sitzt, siehe Figur 3. Wird das Gleitschalenelement 17 in der Kugelpfanne 14 angeordnet, und wird anschließend der Kühlkörper 12 in das Gleitschalenelement 17 eingesetzt, so erstreckt sich der Zapfen 22 durch die Führungsnut 19 und eine Durchgangsnut 23, die in der Kugelpfanne 14 eingebracht ist. Figure 4 shows the heat sink 12 in a perspective view, wherein a reflector 26 is also shown, which can be arranged on the heat sink 12. In the spherical cap 16 of the heat sink 12, a pin 22 is attached, which, for example, sits centrally on the guide rib 18, see Figure 3 , If the sliding shell element 17 is arranged in the ball socket 14 and the heat sink 12 is subsequently inserted into the sliding shell element 17, the pin 22 extends through the guide groove 19 and a through groove 23 which is introduced into the ball socket 14.

Weiterhin gezeigt sind Schraubelemente 24 und eine Befestigungsplatte 25, die rückseitig an den Tragrahmen 11 im Bereich der Kugelpfannen 14 angeordnet werden kann. Sind der Kühlkörper 12 und die Gleitschalenelemente 17 in den Kugelpfannen 14 eingesetzt, können die Kühlkörper 12 mit den Schraubelementen 24 und der Befestigungsplatte 25 am Tragrahmen 11 befestigt werden. Dabei können die Schraubelemente 24 zunächst lediglich geringfügig angezogen werden, sodass eine Verstellung der Kühlkörper 12 in den Kugelpfannen 14 noch möglich ist. Dabei kann die Verstellung durch den Zapfen 22 beispielsweise manuell oder mit einem Justageautomaten erfolgen, wobei dann, wenn die Sollposition des Kühlkörpers 12 am Tragrahmen 11 erreicht ist, die Schraubelemente 24 endgültig festgezogen werden können, um die erreichte Position der Halbleiterlichtmodule 10 am Tragrahmen 11 sicherzustellen.Also shown are screw elements 24 and a fastening plate 25 which can be arranged on the rear of the support frame 11 in the region of the ball sockets 14. If the heat sink 12 and the sliding shell elements 17 are inserted in the ball sockets 14, the heat sink 12 can be fastened to the support frame 11 with the screw elements 24 and the fastening plate 25. The screw elements 24 can initially only be tightened slightly, so that an adjustment of the heat sink 12 in the ball sockets 14 is still possible. The adjustment by the pin 22 can, for example, manually or with a Automatic adjustment takes place, and when the desired position of the heat sink 12 on the support frame 11 is reached, the screw elements 24 can be finally tightened in order to ensure the position of the semiconductor light modules 10 on the support frame 11.

Die Erfindung beschränkt sich in ihrer Ausführung nicht auf das vorstehend angegebene bevorzugte Ausführungsbeispiel. Vielmehr ist eine Anzahl von Varianten denkbar, welche von der dargestellten Lösung auch bei grundsätzlich andersgearteten Ausführungen Gebrauch macht.The embodiment of the invention is not limited to the preferred exemplary embodiment specified above. Rather, a number of variants are conceivable which make use of the solution shown, even in the case of fundamentally different types.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11
Modulbaugruppemodule assembly
1010
HalbleiterlichtmodulSemiconductor light module
1111
Tragrahmensupporting frame
1212
Kühlkörperheatsink
1313
HalbleiterlichtquelleSemiconductor light source
1414
Kugelpfanneball socket
1515
KugelpfannenmittelpunktBall socket center
1616
Kugelkalottespherical cap
1717
GleitschalenelementGleitschalenelement
1818
Führungsrippeguide rib
1919
Führungsnutguide
2020
Querrippetransverse rib
2121
Quernuttransverse groove
2222
Zapfenspigot
2323
Durchgangsnutthrough groove
2424
Schraubelementscrew
2525
Befestigungsplattemounting plate
2626
Reflektorreflector
2727
Aufnahmepunktpick up point
RR
Radiusradius
XX
LichtausbreitungsrichtungLight propagation direction
YY
Achse, Erstreckungsrichtung quer zur LichtausbreitungsrichtungAxis, direction of extension transverse to the direction of light propagation
ZZ
Hochachse, VertikalrichtungVertical axis, vertical direction

Claims (7)

  1. Module assembly (1) for a headlight with at least one semiconductor light module (10) that is fastened to a carrier frame (11), where the semiconductor light module (10) comprises a heat sink (12) with at lease one semiconductor light source (13) fastened to the heat sink (12), where the carrier frame (11) features at least one ball socket (14) in which the semiconductor light module (10) with the heat sink (12) sits such that it can be pivoted around a ball socket center point (15), where the heat sink (12) features a ball joint (16) that is formed such as to sit in the ball socket (14) in the carrier frame (11), characterized in that a guide shell element (17) is provided that is arranged between the ball joint (16) and the ball socket (14), where the ball joint (16) is designed to slip in the guide shell element (17) to create a pivoting movement on the part of the semiconductor light module (10) around a Y-axis at a right angle to the light propagation direction (X) and where a guide rib (18) is arranged on the ball joint (16) that sits in a guide groove (19) in the guide shell element (17) for guiding the pivoting movement around the Y-axis.
  2. Module assembly (1) in accordance with Claim 1, characterized in that the guide shell element (17) is designed to slip in the ball socket (14) in order to create a pivoting movement of the semiconductor module (10) around a Z-axis that forms the vertical axis (Z) of the headlight.
  3. Module assembly (1) in accordance with one of the aforementioned claims, characterized in that a transverse rib (20)
    is arranged on the guide shell element (17) that sits in a transverse groove (21) introduced into the ball socket (14).
  4. Module assembly (1) in accordance with one of the aforementioned Claims, characterized in that a pin (22) is arranged on the ball joint (16) that extends through a guide groove (19) in the guide shell element (17) and through a groove (23) through the ball socket (14), such that the pin (22) extends out on the back of the ball socket of the carrier frame (11).
  5. Module assembly (1) in accordance with one of the aforementioned Claims, characterized in that fasteners (24, 25) are provided by means of which the ball joint (16) in the ball socket (14) can in particular be fixed with the guide shell element (17) between the two, especially where the fasteners (24, 25) comprise at least one screw element (24) and a mounting plate (25).
  6. Headlight with at least one module assembly (1) in accordance with one of the Claims 1 through 5.
  7. Method of adjusting a semiconductor light module (10) of a module assembly in accordance with Claims 1 through 5 in a headlight, where the semiconductor light module (10) is fastened to a carrier frame (11) in the headlight and where the semiconductor light module (10) comprises a heat sink (12) and at least one semiconductor light source (13) fastened to the heat sink (12), where the at least one semiconductor light module (10) with the heat sink (12) is pivoted around a ball socket center point (15), where the ball socket center point (15) is formed by at least one ball socket (14) formed in the carrier frame (11) and that holds the semiconductor module (10).
EP13732540.3A 2012-07-13 2013-06-29 Module assembly having pivotable semiconductor modules for a headlamp Active EP2872821B1 (en)

Applications Claiming Priority (2)

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DE102012106314.1A DE102012106314A1 (en) 2012-07-13 2012-07-13 Module assembly with pivotable semiconductor light modules for a headlight
PCT/EP2013/063757 WO2014009185A1 (en) 2012-07-13 2013-06-29 Module assembly having pivotable semiconductor modules for a headlamp

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EP2872821A1 EP2872821A1 (en) 2015-05-20
EP2872821B1 true EP2872821B1 (en) 2020-01-15

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US (1) US9638382B2 (en)
EP (1) EP2872821B1 (en)
CN (1) CN104428584B (en)
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WO (1) WO2014009185A1 (en)

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EP2872821A1 (en) 2015-05-20
US9638382B2 (en) 2017-05-02
CN104428584A (en) 2015-03-18
CN104428584B (en) 2017-03-08
WO2014009185A1 (en) 2014-01-16
US20150204499A1 (en) 2015-07-23

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