EP2815176A1 - Carte à circuit imprimé pour module d'éclairage - Google Patents

Carte à circuit imprimé pour module d'éclairage

Info

Publication number
EP2815176A1
EP2815176A1 EP13704935.9A EP13704935A EP2815176A1 EP 2815176 A1 EP2815176 A1 EP 2815176A1 EP 13704935 A EP13704935 A EP 13704935A EP 2815176 A1 EP2815176 A1 EP 2815176A1
Authority
EP
European Patent Office
Prior art keywords
circuit board
light
light module
housing
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13704935.9A
Other languages
German (de)
English (en)
Inventor
Thomas Preuschl
Dieter EISENHUT
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2815176A1 publication Critical patent/EP2815176A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H01R13/08—Resiliently-mounted rigid pins or blades

Definitions

  • the invention relates to a light module circuit board having at least one electrical contact, which therefore to
  • the invention further relates to a light module having at least one such light module circuit board.
  • LED light emitting diode
  • the geometric form factors of the LED modules are specified by single-sided boards. LED modules containing multiple boards are typically connected by cable connections.
  • Luminous module hereinafter referred to as “light module circuit board” with at least one electrical contact, wherein at least one electrical contact at least one
  • the spring contact may be an elastic, electrically conductive spring element, e.g. a leaf spring, which allows a simple design.
  • the spring contact may in particular be a spring contact pin.
  • a spring contact pin may in particular have two mutually elastically displaceable parts, in particular a sleeve with a resiliently displaceably mounted therein pin.
  • the light module circuit board may have other electrical contacts, e.g. Bond pads and / or bushings or holes.
  • Printed circuit board has been applied. This has the advantage that the spring contacts do not have to be applied in a separate method, if at least one further component (or component or component) applied to the light module printed circuit board also has a reflow element.
  • Soldering is applied.
  • Such components are often used, e.g. surface-mounted components (SMD components).
  • SMD components surface-mounted components
  • Operating voltage may include, for example, a low voltage or a mains voltage.
  • the operating voltage may include, for example, a low voltage or a mains voltage.
  • the light module circuit board can also carry electronic components, such as capacitors, diodes, integrated circuits or semiconductor light-emitting elements, in particular light-emitting diodes.
  • the object is also achieved by a lighting module with at least one printed circuit board, wherein at least one
  • This light module allows the same advantages as the light module circuit board and can be designed analog.
  • a light module in particular a light
  • radiating unit or module are understood, which is not intended for independent lighting, but typically for installation in a parent
  • Lighting unit is provided, e.g. in a lamp or a lighting system. This is how the light bulb points
  • the lighting module is typically not as simple as a lamp or a lighting device
  • the light-emitting module has a housing with an open rear side, the light module printed circuit board is accommodated in the housing, the open rear side is closed by a closure element which has at least one plated-through hole, and at least one spring contact of the light module printed circuit board is at least contacted a via of the closure element.
  • Spring contacts can be a simple, safe and secure
  • the light-emitting module is sealingly closed in the housing and in particular can meet various protection classes, eg Class I, II or III protection classes.
  • the light module PCB is thus also before a touch, etc.
  • the housing is electrically conductive, e.g. made of metal.
  • a protective conductor can be connected to the housing.
  • a good thermal conductivity and thus heat dissipation is provided.
  • closure element has the same number of plated-through holes as
  • closure element has a higher number of plated-through holes
  • Locking element simplified with each different light module circuit boards.
  • the closure element has a smaller number of plated-through holes than spring elements are present on the light module printed circuit board. This makes it possible to use a through-connection for supplying current to a plurality of spring contacts, and thus a simplified construction, in particular wiring of the light-emitting module printed circuit board.
  • the symmetry axis of the lighting module is configured rotationally symmetrical.
  • a rotationally independent contacting of the lighting module is made possible in a lighting device receiving the lighting device, such as a lamp, a lighting system, etc.
  • the closure element can be easily screwed into the housing.
  • the symmetry axis of the lighting module is configured rotationally symmetrical.
  • a rotation-independent contacting of the lighting module is made possible in a lighting device accommodating the lighting device, e.g. a lamp, a lighting system, etc. Even so the closure element may be easily screwed into the housing.
  • the symmetry axis of the lighting module is configured rotationally symmetrical.
  • Through-hole is designed annular.
  • Through-contacts are understood, each having on one or both sides of the closure element annular and / or rotationally symmetrical contact surfaces, wherein the shape of the connection between the contact surfaces can be designed arbitrarily.
  • a rotationally symmetrical contact track can be connected via a pin-shaped intermediate element to a further rotationally symmetrical contact track on the opposite side.
  • Connection point are present, which is arranged concentrically to the at least one annular through-hole. This simplifies, for example, one
  • Luminous module circuit board and / or the closure element have a circular disk-shaped basic shape. It is also an embodiment that a contact surface of the at least one spring contact and / or a contact surface of the at least one via has a surface layer with a high abrasion resistance.
  • Surface layer may in particular be thick gold or a Ni / Au mixture, in particular alloy. This provides a mechanically particularly robust and fail-safe contacting.
  • Closure element is a printed circuit board, in particular of the type FR or CEM. This type of circuit board enables a particularly simple and inexpensive possibility of a
  • At least one light source substrate electrically connected to the light module printed circuit board having at least one light source attached thereto and the light module printed circuit board at least one electrical and / or electronic component or module for operating the at least one
  • Light source such as an integrated circuit, resistor, capacitor, etc. This allows a special high occupation density of light sources on the
  • Light source substrate and a protected housing of the driver required to operate the light sources may also be referred to as a 'driver board' or the like. be referred to, but in general as a functional substrate o.a.
  • the light sources are arranged on the light source substrate and the driver (or its electrical and electronic components)
  • the at least one light source has at least one semiconductor light source.
  • the at least one semiconductor light source has at least one semiconductor light source.
  • Semiconductor light source at least one light emitting diode.
  • a color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). This can also be done by the at least one
  • LED emitted light is an infrared light (IR LED) or an ultraviolet light (UV LED).
  • Light emitting diodes can produce a mixed light; e.g. a white mixed light.
  • the at least one light-emitting diode may contain at least one wavelength-converting phosphor
  • the phosphor may alternatively or additionally be arranged remotely from the light-emitting diode ("remote phosphor").
  • the at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate (“submount").
  • the at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,
  • organic LEDs eg polymer OLEDs
  • the at least one semiconductor light source may, for example, comprise at least one diode laser.
  • the substrate is a ceramic substrate, in particular of an electrically insulating ceramic such as A1N. Ceramics have the advantage of typically very good heat conduction of
  • A1N of about 180 W / (m-K).
  • Substrate is a printed circuit board or board, e.g. a
  • Light source substrate with the light module printed circuit board via at least one electrically conductive contact pin is electrically connected.
  • the at least one contact pin can, for example, in a respective,
  • the contact pin may preferably be electromechanically connected to the light module circuit board, e.g. by soldering or a respective soldering point.
  • Light source substrate is disposed outside of the housing. This allows a high light output without one
  • a cover may, for example, for one or more lighting modules together by the lamp, etc.
  • the housing When using a contact pin for electrical connection of the light source substrate with the light module circuit board, the housing has a corresponding Execution on. It becomes easy contact
  • an outwardly guided by the housing end surface of the contact pin serves as an electrical contact surface.
  • the contact surface can, for example, as
  • the bonding wire may e.g. made of gold, silver, copper and / or aluminum.
  • the contact surface may be used to make or improve its bondability with one
  • suitable material layer e.g. Ni / Au for
  • the contact pin may be surrounded by an electrically insulating sheath to prevent an electrical connection to the housing. It is also a development that the housing at least one fastening device for (optionally) attaching at least one of the at least one light source
  • the at least one optic may, for example, at least one translucent
  • the fastening device has a groove arranged on an outer side of the housing, at least sector-wise (in particular completely).
  • the groove likes
  • Light source substrate is disposed within the housing.
  • a dense housing is also the
  • Light source substrate and thus the light sources allows.
  • the housing can then be radiated by the
  • At least one light source produced light for example, a translucent, especially the front side
  • Closure element is plate-shaped and has at its side edge recesses, in which at one
  • Closing element can be realized in the housing.
  • the protrusions may be one in cross section, for example
  • the recess and the projection are in particular circumferentially formed, the recess e.g. in the form of an annular groove.
  • the light module circuit board is encapsulated in the housing. This has the advantage that it is particularly firmly fastened in the housing. In addition, such an effective electric
  • Light module circuit board and the light source substrate can also be encapsulated, which also strengthens their electrical insulation and mechanical attachment.
  • Potting compound is filled and in particular a movable
  • the light module circuit board may have at least one channel
  • a plurality of channels e.g.
  • the closure element has at least one channel, preferably a plurality of channels, e.g. Grouting / venting holes.
  • Fig.l shows a sectional view in side view
  • Lighting module according to a first embodiment 2 shows the lighting module according to the first
  • Section of a lighting module according to a third embodiment Section of a lighting module according to a third embodiment.
  • Fig.l shows a light module 11 for installation in a lamp, a lighting system, etc.
  • the lighting module 11 has a metallic housing 12 with a hollow cylinder-like basic shape, which has a
  • circular-shaped light module printed circuit board 15 housed with CEM-3 or FR-4 as their base material.
  • the light module printed circuit board 15 is electrically connected to a light source substrate 18 via two vertically standing, electrically conductive contact pins 17.
  • Light source substrate 18 is outside of the housing 12
  • Light source substrate 18 is provided with a plurality of light sources in the form of, e.g. white luminous, light emitting diodes 20 equipped, as shown in Fig.2.
  • the light source substrate 18 is made of aluminum nitride (A1N), so that the LEDs 20 are electrically insulated from the housing 12, but are connected via a low thermal resistance with the then acting as a heat sink housing 12.
  • the contact pins 17 on the one hand lead through respective narrow passages 21 through the light module circuit board 15 and are electrically and mechanically connected to this back at a solder joint 41 with this.
  • the contact pins 17 protrude through corresponding passages 22 of the housing 12 and the light source substrate 18.
  • Solder pad or 'Solderpad' can be used.
  • the end surface 24 of the contact pin 17 may have a particularly good bondable or solderable layer (o.Fig.).
  • the light module circuit board 15 has a plurality of electrical and / or electronic components 26, which form a driver for operating the light emitting diodes 20.
  • the light module circuit board 15 thus serves as a driver board.
  • the components 26 are at least partially SMD components, which facilitates their simple application, in particular by means of a reflow soldering method.
  • a fastening device for fastening at least one light emitting diode 20 connected together optics
  • the fastening device is in the form of a radially laterally aligned, circumferentially around the
  • Light source substrate 18 and the light-emitting diodes 20 circumferential groove 27 formed which, for. Breakthroughs for attachment by means of a plug / turn connection or bayonet connection may have.
  • Shutter circuit board 29 has an inner punctiform through-hole 30 and a concentrically arranged outer annular through-hole 31. This form of plated-through holes 30, 31 allows a
  • the plated-through holes 30, 31 can be contacted in any manner, e.g. by soldering.
  • the shutter board 29 seals the housing 12 and the housing received therein
  • Luminous module printed circuit board 15 from, e.g. to achieve a desired protection class.
  • the plated-through holes 30, 31 have upper side (directed into the housing 12) and lower side (outside)
  • the spring contact pins 32, 33 have been attached to the underside of the light module circuit board 15 by reflow soldering and generate at the vias 30 and 31, a pressure contact. At the contact surfaces 30o, 30u, 31o, 31u of the plated-through holes
  • abrasion resistant surface layer in the form of e.g. a Ni / Au alloy.
  • Shutter plate 29 on its side edge sawtooth-shaped recesses 36, in which on an inner wall of the Housing 12 arranged, conformal projections 37 engage detent.
  • the light module circuit board 15 is encapsulated in the housing 12, e.g. with silicone as potting 38th.
  • Shutter plate 29 a plurality of continuous channels in the form of potting / vent holes 39, wherein the
  • FIG. 4 shows a sectional side view of a section of a light module 51.
  • the light module 51 is similar to the light module 11 constructed, except that now the contact pins 52, one of which is shown here by way of example, for connecting the light module circuit board 15 with the Light source substrate 18 as kaltversch dobare or
  • the contact pin 52 has at its attached to the light module circuit board 15 (lower) end a
  • Passage 21 is inserted and slightly down
  • the sleeve 54 serves as
  • Connection method can be dispensed with.
  • the insulating sheath 23 is present only at a portion of the contact pin 52 above the end portion 53.
  • FIG. 5 shows a sectional side view of a section of a lighting module 61 according to a third
  • the light-emitting module 51 is constructed similarly to the light-emitting module 11, except that now the electrically insulating sheath 62 at its (upper) end region introduced into the light source substrate 18 has a circumferential taper, here in the form of a peripheral step 63, to lengthen a creepage distance and to provide a stop for a mechanism.
  • the present invention is not limited to the embodiment shown.
  • the cold-curable contact pins may additionally or alternatively be cold-caulked or cold-caulked on the light source substrate 18.
  • an upper-side end portion of the contact pin extending in the light source substrate may not have an insulating sheath.
  • the light module circuit boards may preferably be electrically connected to one another by contact pins.
  • the occupancy of the printed circuit board (s) / substrate (s) is not limited to light sources or driver components.
  • the printed circuit board (s) / substrate (s) can be used as
  • Light source substrate as a possible formation of a first functional substrate and the light module circuit board as a possible formation of a second

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

Carte à circuit imprimé (15) pour module d'éclairage, qui est pourvue d'au moins un contact électrique, ledit contact électrique comportant au moins un contact élastique, en particulier une broche de contact élastique (32, 33). Un module d'éclairage (11) est pourvu d'au moins une carte à circuit imprimé, au moins une carte à circuit imprimé étant une carte à carte à circuit imprimé (15) pour module d'éclairage.
EP13704935.9A 2012-02-16 2013-02-14 Carte à circuit imprimé pour module d'éclairage Withdrawn EP2815176A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012202353A DE102012202353A1 (de) 2012-02-16 2012-02-16 Leuchtmodul-Leiterplatte
PCT/EP2013/053002 WO2013120958A1 (fr) 2012-02-16 2013-02-14 Carte à circuit imprimé pour module d'éclairage

Publications (1)

Publication Number Publication Date
EP2815176A1 true EP2815176A1 (fr) 2014-12-24

Family

ID=47739246

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13704935.9A Withdrawn EP2815176A1 (fr) 2012-02-16 2013-02-14 Carte à circuit imprimé pour module d'éclairage

Country Status (5)

Country Link
US (1) US20150300574A1 (fr)
EP (1) EP2815176A1 (fr)
CN (1) CN104114941A (fr)
DE (1) DE102012202353A1 (fr)
WO (1) WO2013120958A1 (fr)

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EP3033570B1 (fr) * 2013-08-13 2018-10-17 OSRAM Opto Semiconductors GmbH Appareil d'éclairage
DE202014100948U1 (de) 2014-03-03 2015-06-09 Zumtobel Lighting Gmbh Leuchte mit auswechselbaren Leuchtmodulen
DE102014004580B4 (de) * 2014-03-28 2023-07-06 Ambright GmbH Leuchtvorrichtung
US10619829B2 (en) 2017-07-10 2020-04-14 Current Lighting Soutions, Llc Replaceable LED light source for an LED traffic signal application
EP3627978A1 (fr) * 2018-09-19 2020-03-25 Infineon Technologies AG Agencement d'un module semiconducteur de puissance et boîtier pour un agencement semiconducteur de puissance
US11293627B1 (en) * 2021-02-02 2022-04-05 Gary Lagasse Miniature LED lightbulb mounting device
DE102022002837A1 (de) 2022-08-04 2024-02-15 Baumer Optronic Gmbh Beleuchtungsvorrichtung

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DE10102353B4 (de) * 2001-01-19 2007-11-15 Siemens Ag LED-Signalmodul
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Also Published As

Publication number Publication date
US20150300574A1 (en) 2015-10-22
DE102012202353A1 (de) 2013-08-22
CN104114941A (zh) 2014-10-22
WO2013120958A1 (fr) 2013-08-22

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