EP2815176A1

EP2815176A1 - Luminous module printed circuit board

Info

Publication number: EP2815176A1
Application number: EP13704935.9A
Authority: EP
Inventors: Thomas Preuschl; Dieter EISENHUT
Original assignee: Osram GmbH
Current assignee: Osram GmbH
Priority date: 2012-02-16
Filing date: 2013-02-14
Publication date: 2014-12-24
Also published as: DE102012202353A1; US20150300574A1; CN104114941A; WO2013120958A1

Abstract

The luminous module printed circuit board (15) is equipped with at least one electrical contact, wherein the at least one electrical contact has at least one spring contact, more particularly spring contact pin (32, 33). A luminous module (11) is equipped with at least one printed circuit board, wherein at least one printed circuit board is a luminous module printed circuit board (15).

Description

description

Light module circuit board

The invention relates to a light module circuit board having at least one electrical contact, which therefore to

Use with a light module is provided and designed. The invention further relates to a light module having at least one such light module circuit board.

So far, light emitting diode (LED) modules are created in different structures. This makes it difficult in practice

considerably, identical parts concepts for such LED modules

implement. The geometric form factors of the LED modules are specified by single-sided boards. LED modules containing multiple boards are typically connected by cable connections.

It is the object of the present invention to at least partially overcome the disadvantages of the prior art and in particular to provide lighting modules which have an improved suitability for identical-part concepts.

This object is achieved according to the characteristics of the independent

Claims solved. Preferred embodiments are

in particular the dependent claims.

The problem is solved by a printed circuit board (a

Luminous module, hereinafter referred to as "light module circuit board") with at least one electrical contact, wherein at least one electrical contact at least one

Has spring contact.

This provides a simple, without further soldering us emanating electrical contact.

Consequently, in particular, a reduction in the

Assembly required thermal processes allows. So a particularly compact design is possible. In addition, the spring contacts simplify the use of

Identical part concepts. The spring contact may be an elastic, electrically conductive spring element, e.g. a leaf spring, which allows a simple design.

The spring contact may in particular be a spring contact pin. A spring contact pin may in particular have two mutually elastically displaceable parts, in particular a sleeve with a resiliently displaceably mounted therein pin. In addition to the at least one spring contact, the light module circuit board may have other electrical contacts, e.g. Bond pads and / or bushings or holes.

It is an embodiment that the at least one

Spring contact in a reflow soldering on the

Printed circuit board has been applied. This has the advantage that the spring contacts do not have to be applied in a separate method, if at least one further component (or component or component) applied to the light module printed circuit board also has a reflow element.

Soldering is applied. Such components are often used, e.g. surface-mounted components (SMD components).

It is still an embodiment that at least two

Spring contacts for connecting an operating voltage to the light module circuit board are provided. The

Operating voltage may include, for example, a low voltage or a mains voltage. The operating voltage may

especially between 10 and 250 volts.

The light module circuit board can also carry electronic components, such as capacitors, diodes, integrated circuits or semiconductor light-emitting elements, in particular light-emitting diodes.

The object is also achieved by a lighting module with at least one printed circuit board, wherein at least one

PCB a light module PCB as above

is described. This light module allows the same advantages as the light module circuit board and can be designed analog.

Under a light module, in particular a light

radiating unit or module are understood, which is not intended for independent lighting, but typically for installation in a parent

Lighting unit is provided, e.g. in a lamp or a lighting system. This is how the light bulb points

typically no own power connector o.a. on. On the other hand, the lighting module is typically not as simple as a lamp or a lighting device

Consumable provided.

It is an embodiment that the light-emitting module has a housing with an open rear side, the light module printed circuit board is accommodated in the housing, the open rear side is closed by a closure element which has at least one plated-through hole, and at least one spring contact of the light module printed circuit board is at least contacted a via of the closure element.

By contacting the end plate over the

Spring contacts can be a simple, safe and secure

Provide versatile electrical contacting that supports identical part concepts. This embodiment

allows, inter alia, the advantage that the light-emitting module is sealingly closed in the housing and in particular can meet various protection classes, eg Class I, II or III protection classes. The light module PCB is thus also before a touch, etc.

protected.

It is a development that the housing is electrically conductive, e.g. made of metal. As a result

in particular, a protective conductor can be connected to the housing. In addition, as well as a good thermal conductivity and thus heat dissipation is provided.

It is a further development that the closure element has the same number of plated-through holes as

Spring elements are present on the light module circuit board. Thus, a light module is provided with a relatively low cost of materials.

It is still a development that the closure element has a higher number of plated-through holes

Spring elements are present on the light module circuit board. So will be a use of a standardized

Locking element simplified with each different light module circuit boards.

It is also a development that the closure element has a smaller number of plated-through holes than spring elements are present on the light module printed circuit board. This makes it possible to use a through-connection for supplying current to a plurality of spring contacts, and thus a simplified construction, in particular wiring of the light-emitting module printed circuit board.

It is another embodiment that at least one

Through contact of the closure element

is configured rotationally symmetrical. As a result, a rotationally independent contacting of the lighting module is made possible in a lighting device receiving the lighting device, such as a lamp, a lighting system, etc. Also like that the closure element can be easily screwed into the housing. For this purpose, the symmetry axis of the

rotationally symmetrical through-hole expediently together with the axis of rotation of the closure element.

It is another embodiment that at least one

Through contact of the closure element

is configured rotationally symmetrical. As a result, a rotation-independent contacting of the lighting module is made possible in a lighting device accommodating the lighting device, e.g. a lamp, a lighting system, etc. Even so the closure element may be easily screwed into the housing. For this purpose, the symmetry axis of the

It is yet another embodiment that at least

Through-hole is designed annular.

As an annular and / or rotationally symmetric

Through-connection in this sense should also

Through-contacts are understood, each having on one or both sides of the closure element annular and / or rotationally symmetrical contact surfaces, wherein the shape of the connection between the contact surfaces can be designed arbitrarily. Thus, for example, a rotationally symmetrical contact track can be connected via a pin-shaped intermediate element to a further rotationally symmetrical contact track on the opposite side.

In particular, a through hole in the form of a

Connection point are present, which is arranged concentrically to the at least one annular through-hole. This simplifies, for example, one

confusion-proof contacting. It is also a continuing education that the housing a

hollow cylindrical basic shape, what a

Rotation-independent installation simplified. So will

For example, a provision of an external thread on the outer lateral surface of the housing for installation of the light module allows. It is a further development of that

Luminous module circuit board and / or the closure element have a circular disk-shaped basic shape. It is also an embodiment that a contact surface of the at least one spring contact and / or a contact surface of the at least one via has a surface layer with a high abrasion resistance. The

Surface layer may in particular be thick gold or a Ni / Au mixture, in particular alloy. This provides a mechanically particularly robust and fail-safe contacting.

It is also an embodiment that the

Closure element is a printed circuit board, in particular of the type FR or CEM. This type of circuit board enables a particularly simple and inexpensive possibility of a

Integration of galvanic processes. It is a development of this that has a base material of the circuit board CEM-1 to CEM-5, in particular CEM- 3. Alternatively or additionally may like a base material of the circuit board FR-2 to FR-5, in particular FR-4 have. It is also an embodiment that the light module

at least one light source substrate electrically connected to the light module printed circuit board having at least one light source attached thereto and the light module printed circuit board at least one electrical and / or electronic component or module for operating the at least one

Light source, such as an integrated circuit, resistor, capacitor, etc. This allows a special high occupation density of light sources on the

Light source substrate and a protected housing of the driver required to operate the light sources. In particular, in this case, the light module circuit board may also be referred to as a 'driver board' or the like. be referred to, but in general as a functional substrate o.a.

It is a development of the fact that the light sources are arranged on the light source substrate and the driver (or its electrical and electronic components)

are arranged exclusively on the light module circuit board.

It is furthermore a development that the at least one light source has at least one semiconductor light source. Preferably, the at least one

Semiconductor light source at least one light emitting diode. at

If several LEDs are present, they can be lit in the same color or in different colors. A color may be monochrome (e.g., red, green, blue, etc.) or multichrome (e.g., white). This can also be done by the at least one

LED emitted light is an infrared light (IR LED) or an ultraviolet light (UV LED). Several

Light emitting diodes can produce a mixed light; e.g. a white mixed light. The at least one light-emitting diode may contain at least one wavelength-converting phosphor

(Conversion LED). The phosphor may alternatively or additionally be arranged remotely from the light-emitting diode ("remote phosphor"). The at least one light-emitting diode can be in the form of at least one individually housed light-emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount"). The at least one light emitting diode may be equipped with at least one own and / or common optics for beam guidance, e.g. at least one Fresnel lens,

Collimator, and so on. Instead of or in addition to inorganic light emitting diodes, eg based on InGaN or AlInGaP, organic LEDs (OLEDs, eg polymer OLEDs) can generally also be used. Alternatively, the at least one semiconductor light source may, for example, comprise at least one diode laser.

It is also a development of the fact that the substrate is a ceramic substrate, in particular of an electrically insulating ceramic such as A1N. Ceramics have the advantage of typically very good heat conduction of

For example, more than 50 W / (m-K), so A1N of about 180 W / (m-K).

It is an alternative development of that

Substrate is a printed circuit board or board, e.g. a

Metal core board.

It is also a development that the

Light source substrate with the light module printed circuit board via at least one electrically conductive contact pin, e.g. made of copper, is electrically connected. The at least one contact pin can, for example, in a respective,

in particular narrow, implementation be introduced by the light module circuit board, in particular be passed. The contact pin may preferably be electromechanically connected to the light module circuit board, e.g. by soldering or a respective soldering point.

It is an embodiment of that

Light source substrate is disposed outside of the housing. This allows a high light output without one

Influenced by the housing. In addition, an effective heat dissipation from the light sources is made possible by thermal convection. A cover may, for example, for one or more lighting modules together by the lamp, etc.

to be provided. When using a contact pin for electrical connection of the light source substrate with the light module circuit board, the housing has a corresponding Execution on. It becomes easy contact

preferred that an outwardly guided by the housing end surface of the contact pin serves as an electrical contact surface. The contact surface can, for example, as

Contact surface serve for a bonding wire, which

on the other hand connected to the light source substrate.

The bonding wire may e.g. made of gold, silver, copper and / or aluminum. The contact surface may be used to make or improve its bondability with one

suitable material layer, e.g. Ni / Au for

Bonding wires made of aluminum or Ni / Pd / Au for bonding wires made of gold. In particular, in the case that the light source substrate is disposed outside the housing, the contact pin may be surrounded by an electrically insulating sheath to prevent an electrical connection to the housing. It is also a development that the housing at least one fastening device for (optionally) attaching at least one of the at least one light source

has downstream optics. The at least one optic may, for example, at least one translucent

(transparent or diffuse) cover, reflector, lens,

Collimator, etc. include. It is a development of this that the fastening device has a groove arranged on an outer side of the housing, at least sector-wise (in particular completely). The groove likes

in particular the at least one light source substrate

be arranged laterally surrounding to allow a structurally simple coverage of the at least one light source.

It is an alternative embodiment of that

Light source substrate is disposed within the housing. Thus, a dense housing is also the

Light source substrate and thus the light sources allows. The housing can then be radiated by the

at least one light source produced light, for example, a translucent, especially the front side

arranged, have cover.

It is also an embodiment that the

Closure element is plate-shaped and has at its side edge recesses, in which at one

Inner wall of the housing arranged projections engage. As a result, a latching fastening of the closure element to the housing is made possible. The catch attachment may in particular without tools and by simply pressing the

Closing element can be realized in the housing. The protrusions may be one in cross section, for example

Have triangular shape or a sawtooth shape. The recess and the projection are in particular circumferentially formed, the recess e.g. in the form of an annular groove.

It is still an embodiment that the light module circuit board is encapsulated in the housing. This has the advantage that it is particularly firmly fastened in the housing. In addition, such an effective electric

Insulation of the current-carrying areas located on the light module circuit board against the housing are ensured (if the potting material is electrically insulating, for example made of silicone). In the presence of

Contact pins for electrical connection between the

Light module circuit board and the light source substrate, these can also be encapsulated, which also strengthens their electrical insulation and mechanical attachment.

It is a development that the housing is completely filled with the potting compound. It is an alternative

Design that the housing only partially with the

Potting compound is filled and in particular a movable

Part of the at least one spring contact leaves free, so it forms an exemption. This gives the advantage of having a Attachment, an adjustment and / or replacement of the cover even with introduced grouting is easily possible. It is a development that the potting compound an exemption with respect to the closure element

provides, so this is not shed.

For large-area distribution of the associated potting compound, the light module circuit board may have at least one channel,

preferably a plurality of channels, e.g.

Grouting / venting holes. In the event that the potting is to be carried out with the closure element already attached, it is preferred that the closure element has at least one channel, preferably a plurality of channels, e.g. Grouting / venting holes.

In the following figures, the invention will be described schematically with reference to an embodiment schematically. In this case, the same or equivalent elements may be provided with the same reference numerals for clarity.

Fig.l shows a sectional view in side view

Lighting module according to a first embodiment; 2 shows the lighting module according to the first

Embodiment in a view from above;

3 shows the lighting module according to the first

Embodiment in a view from below;

4 shows a sectional side view of a

Section of a lighting module according to a second embodiment; and

5 shows a sectional side view of a

Section of a lighting module according to a third embodiment.

Fig.l shows a light module 11 for installation in a lamp, a lighting system, etc. The lighting module 11 has a metallic housing 12 with a hollow cylinder-like basic shape, which has a

basically closed front side 13 and an open back 14 has. In the housing 12 is a

circular-shaped light module printed circuit board 15 housed with CEM-3 or FR-4 as their base material. to

simple and correct positioning of the light module circuit board 15 is this with an outer edge of its front on an inside projection 16 or

Rejuvenation of the housing 12.

The light module printed circuit board 15 is electrically connected to a light source substrate 18 via two vertically standing, electrically conductive contact pins 17. The

Light source substrate 18 is outside of the housing 12

arranged, and indeed it lies with its back surface on the front side 13 of the housing 12, here via a thermal adhesive 40. A free front 19 of the

Light source substrate 18 is provided with a plurality of light sources in the form of, e.g. white luminous, light emitting diodes 20 equipped, as shown in Fig.2. The light source substrate 18 is made of aluminum nitride (A1N), so that the LEDs 20 are electrically insulated from the housing 12, but are connected via a low thermal resistance with the then acting as a heat sink housing 12.

The contact pins 17 on the one hand lead through respective narrow passages 21 through the light module circuit board 15 and are electrically and mechanically connected to this back at a solder joint 41 with this. On the other hand, the contact pins 17 protrude through corresponding passages 22 of the housing 12 and the light source substrate 18. To a

electrical connection between the housing 12 and the respective contact pin 17 to prevent, with respect to the light module circuit board 15 front side portion of the contact pins 17 by an electrically insulating sheath 23, for example made of plastic, laterally surrounded. One through the case 12 outwardly guided end surface 24 of the contact pin 17 serves as an electrical contact surface for a respective bonding wire 25. The respective bonding wire 25 is in turn connected to the light source substrate 18, for example via a so-called. Bondpad 42 thereof. Bonding pads 42 are connected to light emitting diodes 20 via wirings, not shown. Instead of a bond pad 42, for example, a

Solder pad or 'Solderpad' can be used. The end surface 24 of the contact pin 17 may have a particularly good bondable or solderable layer (o.Fig.).

The light module circuit board 15 has a plurality of electrical and / or electronic components 26, which form a driver for operating the light emitting diodes 20. The light module circuit board 15 thus serves as a driver board. About the

Contact pins 17, an operating signal generated by means of the components 26 is applied to the light-emitting diodes 20. The components 26 are at least partially SMD components, which facilitates their simple application, in particular by means of a reflow soldering method.

Also located on the front side 13 of the housing 12 is a fastening device for fastening at least one light emitting diode 20 connected together optics

(O.Abb.). The fastening device is in the form of a radially laterally aligned, circumferentially around the

Light source substrate 18 and the light-emitting diodes 20 circumferential groove 27 formed which, for. Breakthroughs for attachment by means of a plug / turn connection or bayonet connection may have.

On the outer or outer circumferential surface of the housing 12 is an external thread 28 for installation of the

Light module 11.

The open back 14 of the housing 12 with a

circular disk-shaped closure element in the form of a another circuit board, the shutter board 29,

closed, as shown in plan view in Figure 3. The

Shutter circuit board 29 has an inner punctiform through-hole 30 and a concentrically arranged outer annular through-hole 31. This form of plated-through holes 30, 31 allows a

Rotation-independent, comparatively non-interchangeable contacting. On the underside and thus on the outside, the plated-through holes 30, 31 can be contacted in any manner, e.g. by soldering. The shutter board 29 seals the housing 12 and the housing received therein

Luminous module printed circuit board 15 from, e.g. to achieve a desired protection class. The plated-through holes 30, 31 have upper side (directed into the housing 12) and lower side (outside)

widened contact surfaces 30o and 30u or 31o and 31u, which facilitates their contacting, soldering, etc. With the light module circuit board 15 are the

Through holes 30, 31 and their upper side

Contact surfaces 30o, 31o connected via two spring contact pins 32, 33. Consequently, the means of the components 26

formed drivers via the vias 30, 31 and further the spring contact pins 32, 33 powered or fed, e.g. with a mains voltage. The spring contact pins 32, 33 have been attached to the underside of the light module circuit board 15 by reflow soldering and generate at the vias 30 and 31, a pressure contact. At the contact surfaces 30o, 30u, 31o, 31u of the plated-through holes

30, 31 is an abrasion resistant surface layer in the form of e.g. a Ni / Au alloy.

For attachment to the housing 12, the

Shutter plate 29 on its side edge sawtooth-shaped recesses 36, in which on an inner wall of the Housing 12 arranged, conformal projections 37 engage detent.

In particular, also for electrical insulation with respect to the housing 12, the light module circuit board 15 is encapsulated in the housing 12, e.g. with silicone as potting 38th The

Contact pins 17 and their sheaths 23 are mitvergossen.

However, the spring contact pins 32, 33 and their

slidably mounted pins 34 not shed so that they remain movable. This is achieved by a corresponding exemption 35.

For large-area distribution of the associated potting compound 38, both the light module circuit board 15 and the

Shutter plate 29 a plurality of continuous channels in the form of potting / vent holes 39, wherein the

Potting / vent holes 39 of the shutter plate 29 are sealed.

4 shows a sectional side view of a section of a light module 51. The light module 51 is similar to the light module 11 constructed, except that now the contact pins 52, one of which is shown here by way of example, for connecting the light module circuit board 15 with the Light source substrate 18 as kaltverschweißbare or

kaltverstemmbare ('Pressfit-') contact pins 17 are configured. The contact pin 52 has at its attached to the light module circuit board 15 (lower) end a

cold deformable end portion 53, which in the narrow

Passage 21 is inserted and slightly down

like to stand out. For electrical contact and

mechanically stable holder is inserted into the passage of a metallic or metallized sleeve 54. The end portion 53 is first inserted into the sleeve 54 and then widened by cold staking so that it in a press fit in the sleeve 54 frictionally or

is frictionally secured. The sleeve 54 serves as

electrical contact of the light module circuit board 15, so that a soldering or other thermally stress

Connection method can be dispensed with.

The insulating sheath 23 is present only at a portion of the contact pin 52 above the end portion 53.

5 shows a sectional side view of a section of a lighting module 61 according to a third

Embodiment. The light-emitting module 51 is constructed similarly to the light-emitting module 11, except that now the electrically insulating sheath 62 at its (upper) end region introduced into the light source substrate 18 has a circumferential taper, here in the form of a peripheral step 63, to lengthen a creepage distance and to provide a stop for a mechanism.

Of course, the present invention is not limited to the embodiment shown. Thus, the cold-curable contact pins may additionally or alternatively be cold-caulked or cold-caulked on the light source substrate 18.

Also, for example, an upper-side end portion of the contact pin extending in the light source substrate may not have an insulating sheath.

In addition, several light module circuit boards may be accommodated in the housing, which in particular to each other

spaced apart and in particular are aligned parallel to each other. The light module circuit boards may preferably be electrically connected to one another by contact pins. In general, the occupancy of the printed circuit board (s) / substrate (s) is not limited to light sources or driver components. In general, the printed circuit board (s) / substrate (s) can be used as

Functional substrates, e.g. the

Light source substrate as a possible formation of a first functional substrate and the light module circuit board as a possible formation of a second

Functional substrate.

Reference sign list

11 light module

12 housing

13 closed front of the housing

14 open rear of the case

15 light module PCB

16 inside projection

17 contact pin

18 light source substrate

19 free front of the light source substrate

20 LED

21 Carrying out the light module circuit board

22 Implementation of the housing

23 insulating sheath

24 end surface of the contact pin

25 bonding wire

26 component

27 groove

28 external thread

29 closure circuit board

30 inner punctiform via

30o widened top side contact surface

30u underside widened contact surface

31 outer, annular through-hole

31o widened surface at the top

31u underside widened contact surface

32 spring contact pin

33 Spring contact pin

34 slidably mounted pin

35 time off

36 recess

37 advantage potting compound

Grouting / vent hole

Thermal Adhesive

soldered point

bonding pad

light module

end

shell

light module

insulating shell

step

Claims

claims

1. light module circuit board (15) with at least one

electrical contact, wherein the at least one

electrical contact at least one spring contact, in particular spring contact pin (32, 33).

Second light module circuit board (15) according to claim 1, wherein the at least one spring contact (32, 33) has been applied in a reflow soldering on the circuit board (15).

3. light module circuit board (15) according to one of

preceding claims, wherein at least two

Spring contacts (32, 33) for connecting a

Operating voltage are provided.

4. light module (11; 51; 61) with at least one

Printed circuit board, wherein at least one printed circuit board, a light module circuit board (15) according to one of

preceding claims.

5. lighting module (11; 51; 61) according to claim 4, wherein

- The light module (11; 51; 61) a housing (12) with

an open back (14),

- The light module circuit board (15) is housed in the housing (12),

- The open back (14) with a closure element (29) is closed, which has at least one through-hole (30, 31) and

- At least one spring contact (32, 33) of the light module circuit board (15) at least one through-contact (30, 31) of the closure element (29) contacted. 6. lighting module (11; 51; 61) according to claim 5, wherein

at least one via (30, 31) of the Closing element (29) is configured rotationally symmetrical.

A lighting module (11; 51; 61) according to claim 6, wherein

at least one via (31) is designed annular.

Lighting module (11; 51; 61) according to one of Claims 5 to

7, wherein a contact surface (34) of the at least one spring contact (32, 33) and / or a contact surface (30o, 30u, 31o, 31u) of the at least one plated through hole (30, 31) has a high surface area

Has abrasion resistance.

Lighting module (11; 51; 61) according to one of Claims 5 to

8, wherein the closure element is a printed circuit board (29), in particular of the type FR or CEM.

Lighting module (11; 51; 61) according to one of Claims 5 to

9, where

- the light module (11; 51; 61) has at least one light source substrate (18) electrically connected to the light module circuit board (15) and having at least one light source (20) attached thereto, and

- The light module circuit board (15) has at least one electrical and / or electronic component (26) for operating the at least one light source (20).

The light emitting module (11; 51; 61) of claim 10, wherein the light source substrate (18) is disposed outside the housing (12).

12. lighting module (11; 51; 61) according to one of claims 5 to 11, wherein the closure element (29) is designed plate-shaped and at its side edge recesses (36) into which engage on an inner wall of the housing (12) arranged projections (37).

A light module (11; 51; 61) according to any one of claims 5 to 12, wherein the light module circuit board (15) in the

Housing (12) is shed.