EP2723816A1 - Hydrosilylierungsreaktionsinhibitoren und ihre verwendung zur herstellung von stabilen, härtbaren silikonzusammensetzungen - Google Patents
Hydrosilylierungsreaktionsinhibitoren und ihre verwendung zur herstellung von stabilen, härtbaren silikonzusammensetzungenInfo
- Publication number
- EP2723816A1 EP2723816A1 EP12735925.5A EP12735925A EP2723816A1 EP 2723816 A1 EP2723816 A1 EP 2723816A1 EP 12735925 A EP12735925 A EP 12735925A EP 2723816 A1 EP2723816 A1 EP 2723816A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- silicone composition
- ppm
- inhibitor
- platinum
- methyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 72
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 57
- 238000006459 hydrosilylation reaction Methods 0.000 title claims abstract description 12
- 239000002683 reaction inhibitor Substances 0.000 title description 2
- 239000003112 inhibitor Substances 0.000 claims abstract description 32
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 56
- 229910052697 platinum Inorganic materials 0.000 claims description 27
- 239000003054 catalyst Substances 0.000 claims description 26
- 239000002253 acid Substances 0.000 claims description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 238000006243 chemical reaction Methods 0.000 claims description 14
- 238000004132 cross linking Methods 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000000123 paper Substances 0.000 claims description 6
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- 230000005764 inhibitory process Effects 0.000 claims description 4
- 150000003058 platinum compounds Chemical class 0.000 claims description 4
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000001913 cellulose Substances 0.000 claims description 3
- 229920002678 cellulose Polymers 0.000 claims description 3
- 239000000806 elastomer Substances 0.000 claims description 3
- 238000011065 in-situ storage Methods 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000002985 plastic film Substances 0.000 claims description 3
- 229920006255 plastic film Polymers 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- SMCLTAARQYTXLW-UHFFFAOYSA-N 1,1-diphenylprop-2-yn-1-ol Chemical compound C=1C=CC=CC=1C(C#C)(O)C1=CC=CC=C1 SMCLTAARQYTXLW-UHFFFAOYSA-N 0.000 claims description 2
- KJOFBMLTQUHDCL-UHFFFAOYSA-N 1-[4-(1-hydroxycyclohexyl)buta-1,3-diynyl]cyclohexan-1-ol Chemical compound C1CCCCC1(O)C#CC#CC1(O)CCCCC1 KJOFBMLTQUHDCL-UHFFFAOYSA-N 0.000 claims description 2
- MUYNZFHFJRJANX-UHFFFAOYSA-N 1-but-1-ynylcyclopentan-1-ol Chemical compound CCC#CC1(O)CCCC1 MUYNZFHFJRJANX-UHFFFAOYSA-N 0.000 claims description 2
- UTISCLIDFORRJP-UHFFFAOYSA-N 1-prop-1-ynylcyclohexan-1-ol Chemical compound CC#CC1(O)CCCCC1 UTISCLIDFORRJP-UHFFFAOYSA-N 0.000 claims description 2
- CTTGTRXRTUKVEB-UHFFFAOYSA-N 2,3,6,7-tetramethyloct-4-yne-3,6-diol Chemical compound CC(C)C(C)(O)C#CC(C)(O)C(C)C CTTGTRXRTUKVEB-UHFFFAOYSA-N 0.000 claims description 2
- DNGHNLPQAQCIRR-UHFFFAOYSA-N 2,3-dimethylpent-4-yne-2,3-diol Chemical compound CC(C)(O)C(C)(O)C#C DNGHNLPQAQCIRR-UHFFFAOYSA-N 0.000 claims description 2
- LXOFYPKXCSULTL-UHFFFAOYSA-N 2,4,7,9-tetramethyldec-5-yne-4,7-diol Chemical compound CC(C)CC(C)(O)C#CC(C)(O)CC(C)C LXOFYPKXCSULTL-UHFFFAOYSA-N 0.000 claims description 2
- PJHQIDULUZCWAP-UHFFFAOYSA-N 2,5,8-trimethylnon-1-en-3-yn-5-ol Chemical compound CC(C)CCC(C)(O)C#CC(C)=C PJHQIDULUZCWAP-UHFFFAOYSA-N 0.000 claims description 2
- IHJUECRFYCQBMW-UHFFFAOYSA-N 2,5-dimethylhex-3-yne-2,5-diol Chemical compound CC(C)(O)C#CC(C)(C)O IHJUECRFYCQBMW-UHFFFAOYSA-N 0.000 claims description 2
- XXWIEGOAVMLISY-UHFFFAOYSA-N 3,4,4-trimethylpent-1-yn-3-ol Chemical compound CC(C)(C)C(C)(O)C#C XXWIEGOAVMLISY-UHFFFAOYSA-N 0.000 claims description 2
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 claims description 2
- BOTYRBNMRCLTIL-UHFFFAOYSA-N 3,6-diethylnon-1-yn-3-ol Chemical compound CCCC(CC)CCC(O)(CC)C#C BOTYRBNMRCLTIL-UHFFFAOYSA-N 0.000 claims description 2
- VSSPEZDVPCUEIR-UHFFFAOYSA-N 3,6-dimethylhept-6-en-4-yn-3-ol Chemical compound CCC(C)(O)C#CC(C)=C VSSPEZDVPCUEIR-UHFFFAOYSA-N 0.000 claims description 2
- OWRXWSVBJIIORE-UHFFFAOYSA-N 3,7,11-trimethyldodec-1-yn-3-ol Chemical compound CC(C)CCCC(C)CCCC(C)(O)C#C OWRXWSVBJIIORE-UHFFFAOYSA-N 0.000 claims description 2
- INASARODRJUTTN-UHFFFAOYSA-N 3-methyldodec-1-yn-3-ol Chemical compound CCCCCCCCCC(C)(O)C#C INASARODRJUTTN-UHFFFAOYSA-N 0.000 claims description 2
- ZBDMJPAJZFSKPR-UHFFFAOYSA-N 3-methyloct-1-yn-3-ol Chemical compound CCCCCC(C)(O)C#C ZBDMJPAJZFSKPR-UHFFFAOYSA-N 0.000 claims description 2
- YWAZTRHBPXOSHC-UHFFFAOYSA-N 3-methylpentadec-1-yn-3-ol Chemical compound CCCCCCCCCCCCC(C)(O)C#C YWAZTRHBPXOSHC-UHFFFAOYSA-N 0.000 claims description 2
- CUUQUEAUUPYEKK-UHFFFAOYSA-N 4-ethyloct-1-yn-3-ol Chemical compound CCCCC(CC)C(O)C#C CUUQUEAUUPYEKK-UHFFFAOYSA-N 0.000 claims description 2
- CSNWKQHTZXPWJS-UHFFFAOYSA-N 4-ethynyl-2,6-dimethylheptan-4-ol Chemical compound CC(C)CC(O)(C#C)CC(C)C CSNWKQHTZXPWJS-UHFFFAOYSA-N 0.000 claims description 2
- VBARYRPUABJYGW-UHFFFAOYSA-N 5-(dimethylamino)-2-methylpent-3-yn-2-ol Chemical compound CN(C)CC#CC(C)(C)O VBARYRPUABJYGW-UHFFFAOYSA-N 0.000 claims description 2
- 230000001464 adherent effect Effects 0.000 claims description 2
- 230000015556 catabolic process Effects 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims description 2
- 238000006731 degradation reaction Methods 0.000 claims description 2
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical compound CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 claims description 2
- 230000036961 partial effect Effects 0.000 claims description 2
- SJZSEHKYVTZQSS-UHFFFAOYSA-N 2,5-dimethylhex-5-en-3-yn-2-ol Chemical compound CC(=C)C#CC(C)(C)O SJZSEHKYVTZQSS-UHFFFAOYSA-N 0.000 claims 1
- 230000002401 inhibitory effect Effects 0.000 abstract description 5
- 239000002243 precursor Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 description 12
- 239000003921 oil Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 9
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 8
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 7
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 description 7
- -1 polysiloxane Polymers 0.000 description 7
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid Chemical compound CCCCCCC(O)=O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 5
- 125000001183 hydrocarbyl group Chemical group 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000113 differential scanning calorimetry Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000000265 homogenisation Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 230000000181 anti-adherent effect Effects 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 231100000989 no adverse effect Toxicity 0.000 description 2
- 235000011007 phosphoric acid Nutrition 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- LQMDOONLLAJAPZ-UHFFFAOYSA-N 1-ethynylcyclopentan-1-ol Chemical compound C#CC1(O)CCCC1 LQMDOONLLAJAPZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 239000007798 antifreeze agent Substances 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000003899 bactericide agent Substances 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 150000004005 nitrosamines Chemical class 0.000 description 1
- 229920001558 organosilicon polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- UORVCLMRJXCDCP-UHFFFAOYSA-N propynoic acid Chemical compound OC(=O)C#C UORVCLMRJXCDCP-UHFFFAOYSA-N 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- IENQTDRUPBYCHN-UHFFFAOYSA-N tetrakis(2-methylprop-1-enylsilyl) silicate Chemical compound CC(=C[SiH2]O[Si](O[SiH2]C=C(C)C)(O[SiH2]C=C(C)C)O[SiH2]C=C(C)C)C IENQTDRUPBYCHN-UHFFFAOYSA-N 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- 125000002348 vinylic group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/05—Alcohols; Metal alcoholates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/41—Compounds containing sulfur bound to oxygen
- C08K5/42—Sulfonic acids; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K15/00—Anti-oxidant compositions; Compositions inhibiting chemical change
- C09K15/04—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds
- C09K15/12—Anti-oxidant compositions; Compositions inhibiting chemical change containing organic compounds containing sulfur and oxygen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Definitions
- the present invention relates to the use of inhibiting compounds, in particular inhibiting compounds suitable for inhibiting the curing of a silicon elastomer precursor silicone composition obtained by a hydrosilylation reaction.
- Curing inhibitors are compounds that slow curing at ambient temperatures, but do not delay curing at higher temperatures. These curing inhibitors are sufficiently volatile to be removed from the coating compositions.
- acetylenic compounds such as acetylenic alcohols having a boiling point of less than 250 ° C., especially 2-methyl-3-butyne-2-ol and ethynylcyclohexanol, as hydrosilylation inhibitors in curable silicone compositions based on an organosilicon polymer bearing olefinically unsaturated substituents (vinylic in particular), an organohydrogensiloxane polymer and a platinum or platinum-type catalyst.
- the presence of these acetylenic compounds inhibits the platinum catalyst by preventing it from catalyzing the curing reaction at room temperature, but not at elevated temperature.
- curable silicone compositions which contain this type of inhibitor can be cured by increasing the temperature of the composition to a temperature above the boiling point or sublimation of the inhibitor, thus evaporating the inhibitor, or part of the inhibitor, and allowing the catalyst to catalyze the hydrosilylation reaction and thereby cure the silicone composition.
- compositions can be transported in one package instead of two. They can also be used to prolong the processing time or the pot life, in comparison with compositions that do not contain the acetylenic compound.
- These compositions can be deposited on substrates such as paper, for example by coating and thermally cured at a temperature of the order of 80 to 250 ° C., in particular between 100 and 220 ° C. See, for example, the FR-A- patents. 1,528,464 and FR-A-2,372,874.
- compositions have the drawback, for the preparation of anti-adhesive coatings, of being unable to crosslink on the support at a temperature below 80 ° C. and of having insufficient stability during coating on a machine, the gelling of the coating bath. already showing up after an hour. This is because these inhibitors are sublimable.
- This major disadvantage requires the use of significant amounts, which results in a strong inhibition of platinum activity and consequently a slower rate of crosslinking which requires reducing coating rates.
- US Pat. No. 5,496,906 describes an acid pretreatment of a filler used in a silicone composition in order to eliminate the nitrosamine derivatives during the formation of the elastomer after crosslinking.
- This filler is incorporated in a vinyl silicone oil and is treated by heating at a temperature between 70 and 80 ° C for one hour in the presence of a vinyltriethoxysilane, water and an acid.
- the mixture undergoes a "stripping" step at 140 ° C and under vacuum to remove all by-products of the reaction (see Example 1, column 6).
- One of the essential objectives of the present invention is to provide a novel inhibitor not having the disadvantages mentioned above.
- Another essential objective of the present invention is to provide a silicone composition X with a low platinum content, that is to say having less than 50 ppm by weight of platinum. relative to the total weight of the composition and capable of hardening by a polyaddition reaction which:
- the main object of the invention consists of a silicone composition X
- At least one organopolysiloxane A comprising, by molecule, at least two alkenyl radicals bonded to silicon atoms
- organohydrogenpolysiloxane B having, per molecule, at least two hydrogen atoms bonded to silicon atoms
- At least one catalyst C which is a platinum compound and even more preferably a Karsted platinum, the amount by weight of platinum of catalyst C relative to the total weight of silicone composition X is less than 50 ppm and preferably between 1 and 40 ppm and even more preferably between 5 and 25 ppm,
- At least one inhibitor D1 which is an acetylenic alcohol and preferably a cc-acetylenic alcohol, and
- At least one acid D2 having in aqueous solution and at 25 ° C at least one pKa ⁇ -0.9, preferably ⁇ -1, 0 and even more preferably within the following range -12.0 ⁇ pKa ⁇ -1, 0,
- constituents D1 and D2 being initially present in said silicone composition X in amounts sufficient to:
- Examples of the acid D2 which are useful according to the invention are, for example, chosen from the group consisting of the following acids:
- H 2 Cr0 - H 2 Cr0 4, Hl, HMn0 4l HN0 3, HRe0 4, H 2 S0 4, CF3SO 3 H, CH 3 SO 3 H, HCl, HBr, hci0 4, H 2 S0 4, HN0 3, H 2 Cr0, HCIO3 and H1.
- the acid D 2 is chosen from the group consisting of CF 3 SO 3 H and CH 3 SO 3 H and, in an even more advantageous mode, the acid D 2 is the methanesulfonic acid of formula CH 3 S0 3 H.
- the molar ratio [D1 inhibitor] / [D2 acid] is between
- the ratio by weight [inhibitor D1] / [catalyst C] is between 30 and 2000 and the molar ratio [acid D2] / [catalyst C] is between 1 and 200.
- Acetylenic alcohols D1 useful according to the invention may be chosen from the group consisting of the following compounds:
- Catalyst C which is a catalyst for the hydrosilylation reaction is also well known.
- Platinum or complexes of platinum and an organic product described in US Pat. Nos. 3,159,601 and 3,220,972 and European patents EP-A-0 057 459 can be used in particular.
- EP-A-0 188 978 and EP-A-0 190 530 the complexes of platinum and vinyl organosiloxanes described in US-A-3,419,593, US-A-3,715,334 and US Pat. 3,814,730.
- the proportions of the organopolysiloxane A and of the organohydrogenpolysiloxane B are such that the molar ratio of the silicon-bonded hydrogen atoms in the organohydrogenpolysiloxane B on the silicon-bonded alkenyl radicals in the organopolysiloxane A is between 0.4 and 10.
- the organopolysiloxane A according to the invention has:
- T is an alkenyl group
- Z is a monovalent hydrocarbon group, which has no adverse effect on the activity of the catalyst and is selected from the group consisting of alkyl groups having from 1 to 8 carbon atoms inclusive, optionally substituted with at least one halogen atom, and aryl groups, and
- a is equal to 1 or 2
- b is equal to 0, 1 or 2 and the sum a + b is between 1 and 3
- the organopolysiloxane A has a viscosity of at least 100 mPas and preferably less than 200,000 mPas. .
- the organohydrogenpolysiloxane B according to the invention has: at least two, and preferably at least three, siloxyl units of formula (B.1):
- L is a monovalent hydrocarbon group, which has no adverse effect on the activity of the catalyst and is selected from the group consisting of alkyls having 1 to 8 carbon atoms inclusive, optionally substituted with at least one halogen atom, and the aryls,
- H is a hydrogen atom
- d is 1 or 2
- e is 0, 1 or 2
- the sum d + e is 1, 2 or 3
- L has the same meaning as above and g is 0, 1, 2 or 3.
- the dynamic viscosity of the organohydrogenpolysiloxane B is at least 10 mPa.s and preferably it is between 20 and 1000 mPa.s.
- the proportions of the siloxyl units (A.1) and (B.1) are such that the molar ratio of the silicon-bonded hydrogen atoms in the organohydrogenpolysiloxane B to the silicon-bonded alkenyl radicals in the organopolysiloxane A is between 0.4 and 10.
- the silicone composition X according to the invention may comprise one or more conventional additives in the field of silicone release coatings for solid support, for example paper. It may be for example an anti-misting additive such as silica particles, or branched polyorganosiloxanes, etc.
- the silicone composition X according to the invention may also comprise an adhesion modulator system as well as additives that are customary in this type of application, such as: bactericides, anti-freeze agents, wetting agents, anti-blocking agents - foams, fillers, synthetic latexes or dyes.
- an adhesion modulator system as well as additives that are customary in this type of application, such as: bactericides, anti-freeze agents, wetting agents, anti-blocking agents - foams, fillers, synthetic latexes or dyes.
- the present invention relates to a silicone elastomer Y obtained by crosslinking or curing the silicone composition X according to the invention and as described above, said crosslinking or curing being carried out at a temperature between 70 ° C and 200 ° C.
- the present invention also relates to the use of the silicone composition X according to the invention as a coating base for the production of crosslinked elastomeric anti-adhesive and water-repellent coatings on a solid support, preferably a flexible solid support such as a paper, a cardboard, a cellulose sheet, a metal sheet or a plastic film.
- a solid support preferably a flexible solid support such as a paper, a cardboard, a cellulose sheet, a metal sheet or a plastic film.
- Another subject of the invention consists of a solid support at least partly coated with the silicone composition X according to the invention and as described above, and crosslinked or cured by heating to a temperature of between 70.degree. ° C and 200 ° C or Y silicone elastomer according to the invention and as described above.
- the invention also relates to an inhibitor D of the hydrosilylation reaction which is obtainable by mixing:
- At least one inhibitor D1 according to the invention and as described above which is an acetylenic alcohol and preferably an ⁇ -acetylenic alcohol, and
- Another subject of the invention consists in the use of the inhibitor D of the hydrosilylation reaction according to the invention and as described above in curable or crosslinkable silicone compositions comprising:
- At least one organopolysiloxane A comprising, by molecule, at least two alkenyl radicals bonded to silicon atoms
- At least one catalyst C which is a platinum compound and even more preferably a Karsted platinum and the amount by weight of platinum of the catalyst C relative to the total weight of the silicone composition X is less than 50 ppm and preferably between 1 and 40 ppm and even more preferably between 5 and 25 ppm.
- the present invention finally relates to a method for rendering soft material sheets non-adherent to surfaces to which they adhere normally, characterized in that it consists in applying a quantity of the composition silicone X according to the invention and as described above, between 0.1 and 5 g per m 2 of surface to be coated and then crosslink the composition by heating at a temperature between 70 ° C and 200 ° C.
- the silicone composition X according to the invention can be applied using devices used on industrial paper coating machines such as a five-roll coating head, air knife or equalizer systems.
- the passage time in these furnaces is a function of the temperature; this is usually from 5 to 15 seconds at a temperature of 100 ° C and from 1.5 to 3 seconds at a temperature of 180 ° C.
- the silicone composition X can be deposited on any flexible material or substrate such as papers of various types (supercalendré, coated, glassine), cardboard, cellulose sheets, metal sheets, plastic films (polyester, polyethylene, polypropylene, etc.). ) ...
- the amounts of deposited compositions are generally of the order of 0.1 to 5 g per m 2 of surface to be treated, which corresponds to the deposition of layers of the order of 0.1 to 5 pm.
- the materials or supports thus coated may subsequently be brought into contact with any pressure sensitive rubber, acrylic or other adhesive materials.
- the adhesive material is then easily detachable from said support or material. All the viscosities referred to herein correspond to a dynamic viscosity quantity which is measured, in a manner known per se, at 25.degree.
- the polyorganosiloxane oils will be conventionally described using the usual notation in which the letters M, D, T and Q are used to designate various siloxyl units.
- the silicon atom of a siloxyl unit is engaged in one (M), two (D), three (T) or four (Q) covalent bonds with as many oxygen atoms.
- M silicon atom
- D two
- T three
- Q four
- an oxygen atom is shared between two silicon atoms, it is counted for 1 ⁇ 2 and it will not be mentioned in an abbreviated form.
- the oxygen atom belongs to an alkoxyl or hydroxyl group bonded to a silicon atom, this chemical function will be indicated in parentheses in the abbreviated formula.
- Silicon bonded hydrocarbon groups via a C-Si bond are not mentioned and most often correspond to an alkyl group, for example a methyl group.
- a hydrocarbon group has a particular function, it is indicated by exponent. For example, short forms:
- - M V represents a unit in which the silicon atom is bonded to an oxygen atom and one of the C-Si bond-forming hydrocarbon groups is a vinyl group, i.e. a dialkylvinylsiloxyl unit, and
- M ' represents a unit in which the silicon atom is bonded to a hydrogen atom, to an atom and to two methyl groups.
- the pKa values are those measured in aqueous solution and at 25 ° C.
- Oils polymethylhydrosiloxanes (B.2) mixture: 18% by weight of an oil having the average formula I4 i Mi D2iMo 4, 6- + 82% of an oil polymethylhydrogenosiloxanes MD structure '40 M.
- the inhibitor ECH (D1.I1) is previously added to the vinylated polydimethylsiloxane oil (A.1). After homogenization of the mixture, the polymethylhydrogen siloxane oil (B.1) is then introduced, then a fixed quantity of 500 ppm (relative to the total weight of the composition) of the acid to be tested and finally a variable amount of the catalyst (C ).
- the inhibitor ECH (D1.I1) is previously added to the vinylated polydimethylsiloxane oil (A.1). After homogenization of the mixture, the polymethylhydrogensiloxane oil (B.1) is then introduced, followed by the acid to be tested, and finally the amount of catalyst (C) is fixed at 10 ppm platinum relative to the total weight of the composition.
- the formulations are recorded in the following Table 3:
- a sample for each composition is taken and analyzed in DSC ("Differential Scanning Calorimetry", METLER type device). The analysis is carried out in aluminum capsule and using a temperature ramp of 25 to 250 ° C. with a gradient of 10 ° C./min. This technique makes it possible to measure for each composition, the temperature peak start (starting the crosslinking reaction) or "T ° C onset”, the peak peak temperature ("T ° C peak”) and the peak end temperature (“T ° C endset”).
- Thermal profiles, the characteristic data of the exothermic peaks are shown in the following Table 4.
- composition (I-3) with 500 ppm of methanesulfonic acid, the crosslinking reaction starts at 109.3 ° C] than for the comparative examples that are the compositions:
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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FR1101918 | 2011-06-21 | ||
PCT/FR2012/000249 WO2012175825A1 (fr) | 2011-06-21 | 2012-06-19 | Inhibiteurs de reaction d'hydrosilylation, et leur application pour la preparation de compositions silicones durcissables stables. |
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EP2723816A1 true EP2723816A1 (de) | 2014-04-30 |
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EP12735925.5A Withdrawn EP2723816A1 (de) | 2011-06-21 | 2012-06-19 | Hydrosilylierungsreaktionsinhibitoren und ihre verwendung zur herstellung von stabilen, härtbaren silikonzusammensetzungen |
Country Status (6)
Country | Link |
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US (1) | US9120935B2 (de) |
EP (1) | EP2723816A1 (de) |
JP (1) | JP5945593B2 (de) |
KR (1) | KR101564857B1 (de) |
CN (1) | CN103717678B (de) |
WO (1) | WO2012175825A1 (de) |
Families Citing this family (9)
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FR3015508B1 (fr) | 2013-12-20 | 2016-02-05 | Bluestar Silicones France | Nouveau systeme d'inhibition d'hydrosilylation photoactivable |
WO2017186586A1 (en) * | 2016-04-25 | 2017-11-02 | Dow Corning Corporation | Aqueous coating composition |
JP2018053229A (ja) * | 2016-09-21 | 2018-04-05 | 住友化学株式会社 | シリコーン樹脂組成物、シリコーン樹脂組成物の製造方法および硬化物 |
TW201829672A (zh) * | 2017-02-10 | 2018-08-16 | 美商道康寧公司 | 可固化組成物及經塗佈基材 |
TW201835260A (zh) * | 2017-03-16 | 2018-10-01 | 美商陶氏有機矽公司 | 聚矽氧離型塗層組成物 |
WO2018178321A1 (fr) * | 2017-03-30 | 2018-10-04 | Elkem Silicones France Sas | Procede de realisation d'un revetement hydrofuge et anti-adherent sur un support |
KR102159562B1 (ko) * | 2017-10-19 | 2020-09-24 | 다우 실리콘즈 코포레이션 | 하이드로 실릴화 반응 억제제로 유용한 2-실질-1-알카인-1-사이클로헥산올을 포함하는 폴리오르가노실록산 조성물 |
MX2022005934A (es) * | 2019-11-19 | 2022-06-22 | Henkel Ag & Co Kgaa | Materiales de interfaz termica y metodos de aplicacion. |
WO2023032781A1 (ja) | 2021-08-30 | 2023-03-09 | 日産化学株式会社 | 熱硬化性組成物 |
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US3159601A (en) | 1962-07-02 | 1964-12-01 | Gen Electric | Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes |
US3220972A (en) | 1962-07-02 | 1965-11-30 | Gen Electric | Organosilicon process using a chloroplatinic acid reaction product as the catalyst |
NL131800C (de) | 1965-05-17 | |||
NL129346C (de) | 1966-06-23 | |||
FR1528464A (fr) | 1966-06-23 | 1968-06-07 | Dow Corning | Compositions d'organopolysiloxanes durcissables à une partie composante |
US3814730A (en) | 1970-08-06 | 1974-06-04 | Gen Electric | Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes |
US3715334A (en) | 1970-11-27 | 1973-02-06 | Gen Electric | Platinum-vinylsiloxanes |
DE2654893A1 (de) | 1976-12-03 | 1978-06-15 | Wacker Chemie Gmbh | Verfahren zum herstellen von klebrige stoffe abweisenden ueberzuegen |
US4394317A (en) | 1981-02-02 | 1983-07-19 | Sws Silicones Corporation | Platinum-styrene complexes which promote hydrosilation reactions |
FR2575085B1 (fr) | 1984-12-20 | 1987-02-20 | Rhone Poulenc Spec Chim | Complexe platine-triene comme catalyseur de reaction d'hydrosilylation et son procede de preparation |
FR2575086B1 (fr) | 1984-12-20 | 1987-02-20 | Rhone Poulenc Spec Chim | Complexe platine-alcenylcyclohexene comme catalyseur de reaction d'hydrosilylation et son procede de preparation |
DE3927359A1 (de) * | 1989-08-18 | 1991-02-21 | Wacker Chemie Gmbh | Verfahren zur herstellung von organo(poly)siloxanen mit si-gebundenen konjugierten dienylgruppen |
JPH0657144A (ja) * | 1992-07-14 | 1994-03-01 | Shin Etsu Chem Co Ltd | 剥離性シリコーンエマルジョン組成物 |
US5496906A (en) * | 1994-08-31 | 1996-03-05 | General Electric Company | Production of nitrosamine-free silicone articles |
JP4646363B2 (ja) * | 2000-06-29 | 2011-03-09 | 東レ・ダウコーニング株式会社 | シリコーンゴム組成物 |
GB0316162D0 (en) * | 2003-07-10 | 2003-08-13 | Dow Corning | Silicone release coating compositions |
CN1921847B (zh) * | 2004-02-24 | 2010-06-16 | 三共株式会社 | 氨基醇化合物 |
US7611998B2 (en) * | 2004-06-16 | 2009-11-03 | Bluestar Silicones France Sas | Enhanced elastomer coated, protective barrier fabric and process for producing same |
DE102004035860A1 (de) * | 2004-07-23 | 2006-02-16 | Basf Ag | Verfahren zur Herstellung von 2-Alkin-1 acetalen |
DE102004050128A1 (de) * | 2004-10-14 | 2006-04-20 | Wacker Chemie Ag | Siliconkautschuk Zusammensetzung mit verbesserter Haltbarkeit |
PT1848705E (pt) * | 2005-01-14 | 2010-05-10 | Schering Corp | Sínteses exo- e diastereo-selectivas de análogos da himbacina |
JP2007131750A (ja) * | 2005-11-11 | 2007-05-31 | Shin Etsu Chem Co Ltd | 付加硬化型オルガノポリシロキサン組成物及びその硬化促進方法 |
FR2894590B1 (fr) * | 2005-12-09 | 2008-03-14 | Rhodia Recherches & Tech | Procede de lutte contre l'apparition de brouillard lors de l'enduction de supports flexibles avec une composition silicone liquide reticulable, dans un dispositif a cylindres |
FR2901800B1 (fr) * | 2006-05-31 | 2008-08-29 | Rhodia Recherches & Tech | Composition silicone reticulable pour la realisation de revetements anti-adherents pour films polymeres |
JP2009091403A (ja) * | 2007-10-04 | 2009-04-30 | Shin Etsu Chem Co Ltd | 付加硬化型シリコーンゴム組成物及びその硬化方法 |
KR100987951B1 (ko) * | 2008-11-24 | 2010-10-18 | 에스에스씨피 주식회사 | 실리콘 블랭킷 제조용 실리콘 고무 조성물 |
-
2012
- 2012-06-19 EP EP12735925.5A patent/EP2723816A1/de not_active Withdrawn
- 2012-06-19 KR KR1020147001510A patent/KR101564857B1/ko not_active IP Right Cessation
- 2012-06-19 CN CN201280036691.XA patent/CN103717678B/zh not_active Expired - Fee Related
- 2012-06-19 WO PCT/FR2012/000249 patent/WO2012175825A1/fr active Application Filing
- 2012-06-19 JP JP2014516409A patent/JP5945593B2/ja not_active Expired - Fee Related
- 2012-06-19 US US14/128,414 patent/US9120935B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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KR20140039056A (ko) | 2014-03-31 |
WO2012175825A1 (fr) | 2012-12-27 |
CN103717678B (zh) | 2015-11-25 |
US9120935B2 (en) | 2015-09-01 |
CN103717678A (zh) | 2014-04-09 |
JP2014523938A (ja) | 2014-09-18 |
US20140329099A1 (en) | 2014-11-06 |
JP5945593B2 (ja) | 2016-07-05 |
KR101564857B1 (ko) | 2015-10-30 |
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