EP2704191A4 - Refroidisseur pour module à semi-conducteur, et module à semi-conducteur - Google Patents

Refroidisseur pour module à semi-conducteur, et module à semi-conducteur

Info

Publication number
EP2704191A4
EP2704191A4 EP12776276.3A EP12776276A EP2704191A4 EP 2704191 A4 EP2704191 A4 EP 2704191A4 EP 12776276 A EP12776276 A EP 12776276A EP 2704191 A4 EP2704191 A4 EP 2704191A4
Authority
EP
European Patent Office
Prior art keywords
semiconductor module
cooler
semiconductor
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12776276.3A
Other languages
German (de)
English (en)
Other versions
EP2704191B1 (fr
EP2704191A1 (fr
Inventor
Hiromichi Gohara
Akira Morozumi
Takeshi Ichimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of EP2704191A1 publication Critical patent/EP2704191A1/fr
Publication of EP2704191A4 publication Critical patent/EP2704191A4/fr
Application granted granted Critical
Publication of EP2704191B1 publication Critical patent/EP2704191B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP12776276.3A 2011-04-26 2012-04-16 Refroidisseur pour module à semi-conducteur Active EP2704191B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011098700 2011-04-26
PCT/JP2012/060215 WO2012147544A1 (fr) 2011-04-26 2012-04-16 Refroidisseur pour module à semi-conducteur, et module à semi-conducteur

Publications (3)

Publication Number Publication Date
EP2704191A1 EP2704191A1 (fr) 2014-03-05
EP2704191A4 true EP2704191A4 (fr) 2015-08-19
EP2704191B1 EP2704191B1 (fr) 2019-03-13

Family

ID=47072066

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12776276.3A Active EP2704191B1 (fr) 2011-04-26 2012-04-16 Refroidisseur pour module à semi-conducteur

Country Status (5)

Country Link
US (1) US9237676B2 (fr)
EP (1) EP2704191B1 (fr)
JP (1) JP5692368B2 (fr)
CN (1) CN103503131B (fr)
WO (1) WO2012147544A1 (fr)

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KR101496493B1 (ko) * 2007-11-26 2015-02-26 가부시키가이샤 도요다 지도숏키 액냉식 냉각 장치
JP5563383B2 (ja) * 2010-06-21 2014-07-30 日立オートモティブシステムズ株式会社 電力変換装置
US8982558B2 (en) * 2011-06-24 2015-03-17 General Electric Company Cooling device for a power module, and a related method thereof
CN104145333B (zh) * 2012-04-16 2018-02-02 富士电机株式会社 半导体装置以及半导体装置用冷却器
US8847384B2 (en) * 2012-10-15 2014-09-30 Toyota Motor Engineering & Manufacturing North America, Inc. Power modules and power module arrays having a modular design
WO2014069174A1 (fr) * 2012-10-29 2014-05-08 富士電機株式会社 Dispositif à semi-conducteurs
JP5523542B1 (ja) * 2012-12-07 2014-06-18 三菱電機株式会社 冷却装置
JP6093186B2 (ja) * 2013-01-11 2017-03-08 本田技研工業株式会社 半導体モジュール用冷却器
CN104423503A (zh) * 2013-08-28 2015-03-18 英业达科技有限公司 服务器
JP6168152B2 (ja) * 2013-09-05 2017-07-26 富士電機株式会社 電力用半導体モジュール
JP6164304B2 (ja) * 2013-11-28 2017-07-19 富士電機株式会社 半導体モジュール用冷却器の製造方法、半導体モジュール用冷却器、半導体モジュール及び電気駆動車両
CN105940491B (zh) * 2014-08-06 2019-06-25 富士电机株式会社 半导体装置
CN106298688B (zh) * 2015-05-28 2018-11-06 台达电子工业股份有限公司 封装型功率电路模块
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CN204967631U (zh) * 2015-08-04 2016-01-13 中山大洋电机股份有限公司 可扩展逆变器的冷却系统及其机械总成
US9443786B1 (en) * 2015-08-19 2016-09-13 Ac Propulsion, Inc. Packaging and cooling method and apparatus for power semiconductor devices
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CN108617148A (zh) * 2018-06-06 2018-10-02 张家港首驱动力科技有限公司 一种变宽度水道的散热板
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JP2020047559A (ja) * 2018-09-21 2020-03-26 株式会社デンソー 冷却器
DE102018126802B4 (de) * 2018-10-26 2020-08-20 Rogers Germany Gmbh Kühlvorrichtung für ein erstes Elektronikmodul und mindestens ein zweites Elektronikmodul, Versorgungsvorrichtung für eine solche Kühlvorrichtung und Verfahren zum Kühlen eines ersten Elektronikmoduls und mindestens eines zweiten Elektronikmoduls
JP7187992B2 (ja) * 2018-11-06 2022-12-13 富士電機株式会社 半導体モジュールおよび車両
JP7333690B2 (ja) * 2018-11-21 2023-08-25 三井化学株式会社 冷却装置および構造体
US11129310B2 (en) * 2018-11-22 2021-09-21 Fuji Electric Co., Ltd. Semiconductor module, vehicle and manufacturing method
US10966335B2 (en) 2019-04-29 2021-03-30 Semiconductor Components Industries, Llc Fin frame assemblies
JP7118262B2 (ja) * 2019-05-30 2022-08-15 三菱電機株式会社 半導体装置
JP7367418B2 (ja) * 2019-09-13 2023-10-24 富士電機株式会社 半導体モジュールおよび車両
US11758697B2 (en) 2019-09-26 2023-09-12 Ohio State Innovation Foundation Low inductance power module with vertical power loop structure and insulated baseplates
CN114667429A (zh) * 2019-11-12 2022-06-24 丰田自动车株式会社 冷却器及其制造方法
WO2021186891A1 (fr) * 2020-03-18 2021-09-23 富士電機株式会社 Module semi-conducteur
JP7342811B2 (ja) * 2020-07-10 2023-09-12 株式会社豊田自動織機 冷却器
DE102020132689B4 (de) * 2020-12-08 2022-06-30 Semikron Elektronik Gmbh & Co. Kg Leistungselektronisches System mit einer Schalteinrichtung und mit einer Flüssigkeitskühleinrichtung
US11698233B2 (en) 2020-12-26 2023-07-11 International Business Machines Corporation Reduced pressure drop cold plate transition
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CN112928082A (zh) * 2021-02-07 2021-06-08 阳光电源股份有限公司 液冷板及功率模组
CN113365485B (zh) * 2021-08-11 2021-12-07 深圳比特微电子科技有限公司 液冷板散热器
US11818871B2 (en) * 2021-09-20 2023-11-14 GM Global Technology Operations LLC Heat sink for an electronic device of a motor vehicle and method of manufacturing same
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JP7074270B1 (ja) 2022-01-19 2022-05-24 富士電機株式会社 半導体装置
WO2023248989A1 (fr) * 2022-06-20 2023-12-28 ニデック株式会社 Dispositif de refroidissement, et dispositif à semi-conducteur

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EP2234153A1 (fr) * 2007-11-26 2010-09-29 Kabushiki Kaisha Toyota Jidoshokki Dispositif de refroidissement refroidi par liquide
WO2009078289A2 (fr) * 2007-12-14 2009-06-25 Toyota Jidosha Kabushiki Kaisha Ailette de refroidissement et procédé de fabrication correspondant
US20100172091A1 (en) * 2008-11-28 2010-07-08 Fuji Electric Systems Co., Ltd. Cooling apparatus for semiconductor chips
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Title
See also references of WO2012147544A1 *

Also Published As

Publication number Publication date
EP2704191B1 (fr) 2019-03-13
JPWO2012147544A1 (ja) 2014-07-28
CN103503131A (zh) 2014-01-08
EP2704191A1 (fr) 2014-03-05
WO2012147544A1 (fr) 2012-11-01
US9237676B2 (en) 2016-01-12
CN103503131B (zh) 2016-07-06
US20140043765A1 (en) 2014-02-13
JP5692368B2 (ja) 2015-04-01

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