EP2671425A1 - Verfahren zur herstellung einer elektrischen spule und elektrische spule - Google Patents
Verfahren zur herstellung einer elektrischen spule und elektrische spuleInfo
- Publication number
- EP2671425A1 EP2671425A1 EP12702030.3A EP12702030A EP2671425A1 EP 2671425 A1 EP2671425 A1 EP 2671425A1 EP 12702030 A EP12702030 A EP 12702030A EP 2671425 A1 EP2671425 A1 EP 2671425A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- thick
- nano
- film paste
- particles
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000002105 nanoparticle Substances 0.000 claims abstract description 51
- 230000006698 induction Effects 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 11
- 239000002923 metal particle Substances 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 239000011370 conductive nanoparticle Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 claims description 2
- 238000007254 oxidation reaction Methods 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000010411 cooking Methods 0.000 claims 1
- 230000001939 inductive effect Effects 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract 3
- 238000007639 printing Methods 0.000 description 8
- 239000004020 conductor Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 238000010304 firing Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 231100000206 health hazard Toxicity 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B6/00—Heating by electric, magnetic or electromagnetic fields
- H05B6/02—Induction heating
- H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
- H05B6/12—Cooking devices
- H05B6/1209—Cooking devices induction cooking plates or the like and devices to be used in combination with them
- H05B6/1245—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements
- H05B6/1281—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements with flat coils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
- H05B2214/04—Heating means manufactured by using nanotechnology
Definitions
- the invention relates to a method for producing an electrical coil and such an electrical coil.
- EP 2120508 A2 it is known to manufacture a coil or induction coil for an induction heating device by applying a thick-film paste with a high proportion of carbon nanotubes to a carrier, for example made of ceramic. This can be done for example by printing.
- the invention has for its object to provide an aforementioned method for producing an electrical coil and an electric coil produced therewith, with which disadvantages of the prior art can be avoided and in particular a practical and good quality control technology Bares method can be created for the production of such coils, preferably induction coils.
- a thick film paste is applied to a support with the geometry desired for the coil.
- a thick-film paste is admixed with nano-particles and the thick-layer paste thus enriched is applied to the support, dried and then baked.
- the somewhat more complex step of enriching the thick-film paste with the nano-particles can be carried out before application. Under certain circumstances, certain limits for the maximum possible admixture of nano-particles to the thick-film paste must be observed.
- a conventional thick-film paste as is known, for example, from the aforementioned EP 2120508 A2, is applied to the carrier in the desired geometry. Although it can also have nano-particles, but not yet advantageous. After application, in particular with only a very short time delay or directly thereafter, the surface of the applied thick-film paste is enriched with nano-particles. Due to the special nature and duration of the enrichment process or application process, the proportion of nano-particles can be influenced. Thereafter, the thick-film paste with the applied nano-particles is dried and baked. During firing, a homogeneously mixed layer results which contains a certain proportion of the nanoparticles.
- the nano-particles are applied in a fluidized bed process to the thick-film paste or its surface for enrichment.
- relatively high levels of nano-particles can be achieved on the finished conductor material.
- this also makes it possible to apply the nanoparticles in a certain predetermined thickness on the surface.
- a certain predetermined concentration of nano-particles in the conductor material can ultimately be achieved in the finished conductor material.
- this method is particularly preferably carried out with a still moist thick-film paste, ie in particular very short or even directly after the application of the thick-film paste itself.
- an additional covering layer or protective layer is applied to the surface enriched with nano-particles. This can be applied before baking the thick-film paste including nano-particles and then prevent loose nano-particles from entering the surrounding air and causing a health hazard. Likewise, this allows a kind of fixation of the nano-particles on the thick-film paste, until they are quasi integrated during firing and thus fixed. - -
- a covering layer can be applied to the finished conductor or the finished coil structure. This provides protection against external damage, electrical insulation and protection against oxidation. So harmful oxygen can be kept away from the conductor material or the nano-particles.
- the nanoparticles can have or be carbon nanotubes, in particular also exclusively.
- the admixed nanoparticles have nano-metal powders, preferably copper, silver or gold. Both different material groups can be used in the second alternative of the manufacturing process. In the first alternative, the admixture of nano-metal particles is particularly suitable.
- the proportion of nanoparticles or nano-metal particles on the thick-film paste may be, for example, up to 60%, advantageously up to 40% or 50%.
- the percentages are based on volume percent.
- a Resinat- thick-film paste as a thick-film paste.
- the ratio of the highly conductive nano-particles to the other material of the coil, which consists mainly of the usual thick-film paste with conductor material, can be increased. This also contributes to the fact that the properties of the finished coil are mainly dominated by the nano-particles.
- the electrical coil can have any desired shape, as can be produced by a previously described application method, in particular a thick-film method.
- the shape is favorable for the purpose of use as induction coil, so for example spiral with round or approximately rectangular shape.
- 1 is a plan view of a finished electrical coil as an induction coil for an induction heater with a spiral shape on a support
- FIG 3 shows in several steps the production process according to the second basic alternative with subsequent application of the nano-particles to a printed structure of thick-film paste.
- a carrier 1 1 with an induction coil 12 is shown in plan view thereon. They form, for example, a heater for an induction hob. Since such an induction coil is known for example from the aforementioned EP 2120508 A2, it need not be discussed in detail.
- Fig. 2 for the above-described first basic method according to the invention is shown how the induction coil 12 is applied to the support 1 1 by means of a printing screen 14 with illustrated by corresponding hatching pressure areas 15.
- a thick-layer paste 18 which has been offset by nano-particles, is applied to the printing screen 14 and in particular to the printing areas 15.
- the shape shown in Fig. 2 in the middle corresponding to the course of the induction coil 12 of a thick-film paste structure 20. Due to the previous admixture of the nano-particles in the thick-film paste 18, they are already fairly homogeneously distributed therein.
- the thick-film paste 18 is baked in its usual shape in accordance with the thick-film paste course 20 so that it firmly adheres to the carrier 11 and on the other hand to the electrical - -
- the amount of nano-particles remains the same and these are just then present with a certain proportion of the material of the finished induction coil 12, for example as previously mentioned. Due to the limitations mentioned above in screen printing or in other application or printing process their share can only be increased up to a certain point. Thus, the maximum achievable concentration of nano-particles in the finished induction coil 12 is limited.
- FIG. 3 an alternative second basic embodiment of the invention according to the description is shown at the beginning.
- a support 1 1 ' is in turn by means of a printing screen 14' with pressure areas 15 'and an application device 17' a thick-film paste 18 'applied.
- a thick-film paste 18 'applied is a pure thick-film paste which contains at least none of the above-described nano-particles.
- a certain proportion of nano-particles may be provided, possibly even up to a maximum possible saturation, as is also possible for the previous embodiment in FIG.
- Fig. 3 in the middle can be seen on the one hand, as shown in FIG. 2, the thick-film paste structure 20 'on the support 1 1' is present.
- the pure thick-film paste structure 20 ' is shown at the far right in Fig. 3 middle.
- a further application device 22' To the left is located above the thick-film paste structure 20 ', a further application device 22', with the here also shown as thicker dots nano-particles 23 'are applied to the top of the thick-film paste structure 20'.
- An application method is - - For example, spreading, inflation or a previously mentioned fluidized bed process.
- the support 11 ' is again heated to burn in the thick-film paste 20' and to homogeneously mix with the nano-particles 23 '. These diffuse into the paste material and distribute themselves fairly evenly, preferably completely uniformly.
- the application of the nano-particles 23 'with the application device 22' on the thick-film paste structure 20 ' is advantageously carried out as soon as possible after printing. Then the thick-film paste structure 20 'is still moist and a maximum of many nano-particles 23' can adhere to the top and thus subsequently also be incorporated into the finished conductor material of the induction coil 12 '.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102011003463A DE102011003463A1 (de) | 2011-02-01 | 2011-02-01 | Verfahren zur Herstellung einer elektrischen Spule und elektrische Spule |
| PCT/EP2012/051617 WO2012104327A1 (de) | 2011-02-01 | 2012-02-01 | Verfahren zur herstellung einer elektrischen spule und elektrische spule |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2671425A1 true EP2671425A1 (de) | 2013-12-11 |
| EP2671425B1 EP2671425B1 (de) | 2015-07-01 |
Family
ID=45560910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP12702030.3A Not-in-force EP2671425B1 (de) | 2011-02-01 | 2012-02-01 | Verfahren zur herstellung einer elektrischen spule und elektrische spule |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP2671425B1 (de) |
| DE (1) | DE102011003463A1 (de) |
| WO (1) | WO2012104327A1 (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10605464B2 (en) | 2012-10-15 | 2020-03-31 | Whirlpool Corporation | Induction cooktop |
| ITTO20120896A1 (it) | 2012-10-15 | 2014-04-16 | Indesit Co Spa | Piano cottura a induzione |
| DE102012220022B4 (de) * | 2012-11-02 | 2014-09-25 | Festo Ag & Co. Kg | Verfahren zur Herstellung einer Spule und elektronisches Gerät |
| EP3432682B1 (de) | 2017-07-18 | 2026-04-08 | Whirlpool Corporation | Verfahren zum betreiben eines induktionskochfelds und kochfeld mit diesem verfahren |
| US10993292B2 (en) | 2017-10-23 | 2021-04-27 | Whirlpool Corporation | System and method for tuning an induction circuit |
| CN109757001A (zh) * | 2017-11-08 | 2019-05-14 | 佛山市顺德区美的电热电器制造有限公司 | 线圈盘组件及烹饪器具 |
| US12302478B2 (en) | 2018-04-23 | 2025-05-13 | Whirlpool Corporation | Control circuits and methods for distributed induction heating devices |
| US11140751B2 (en) | 2018-04-23 | 2021-10-05 | Whirlpool Corporation | System and method for controlling quasi-resonant induction heating devices |
| US12588112B2 (en) | 2018-04-23 | 2026-03-24 | Whirlpool Corporation | System and method for controlling induction heating devices with series connected switching devices |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1141250C (zh) * | 2001-05-25 | 2004-03-10 | 清华大学 | 一种流化床连续化制备碳纳米管的方法及其反应装置 |
| JP2003109732A (ja) * | 2001-09-27 | 2003-04-11 | Seiji Motojima | コイル状炭素繊維を備える発熱体及びそれに用いるコイル状炭素繊維並びにそれらの用途 |
| CN1898051B (zh) * | 2003-10-20 | 2010-04-28 | 播磨化成株式会社 | 干粉形式的细金属粒子和细金属氧化物粒子及它们的应用 |
| WO2007044959A1 (en) * | 2005-10-13 | 2007-04-19 | Inframat Corporation | Patterned magnetic inductors |
| US20080174397A1 (en) * | 2007-01-19 | 2008-07-24 | General Electric Company | High quality factor, low volume, air-core inductor |
| DE102008024888A1 (de) | 2008-05-16 | 2009-11-26 | E.G.O. Elektro-Gerätebau GmbH | Induktionsheizeinrichtung und Verfahren zur Herstellung einer Induktionsheizeinrichtung |
-
2011
- 2011-02-01 DE DE102011003463A patent/DE102011003463A1/de not_active Withdrawn
-
2012
- 2012-02-01 WO PCT/EP2012/051617 patent/WO2012104327A1/de not_active Ceased
- 2012-02-01 EP EP12702030.3A patent/EP2671425B1/de not_active Not-in-force
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2012104327A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012104327A1 (de) | 2012-08-09 |
| EP2671425B1 (de) | 2015-07-01 |
| DE102011003463A1 (de) | 2012-08-02 |
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