EP2628562A1 - Dispositif de traitement au laser et procédé de traitement au laser - Google Patents

Dispositif de traitement au laser et procédé de traitement au laser Download PDF

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Publication number
EP2628562A1
EP2628562A1 EP11832533.1A EP11832533A EP2628562A1 EP 2628562 A1 EP2628562 A1 EP 2628562A1 EP 11832533 A EP11832533 A EP 11832533A EP 2628562 A1 EP2628562 A1 EP 2628562A1
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EP
European Patent Office
Prior art keywords
laser beam
laser
processed object
laser light
yag
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11832533.1A
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German (de)
English (en)
Inventor
Masao Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Publication of EP2628562A1 publication Critical patent/EP2628562A1/fr
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting

Definitions

  • the present invention relates to a laser processing apparatus and a laser processing method.
  • Fiber lasers have been becoming more widespread because the electrical energy required for generating laser light is small in comparison with gas lasers (for example, CO 2 lasers), the laser beam quality (the focusing characteristics and directivity of the laser beam) is high in comparison with rod-type solid state lasers, and it is possible to achieve high output power.
  • gas lasers for example, CO 2 lasers
  • the laser beam quality the focusing characteristics and directivity of the laser beam
  • some laser processing apparatuses perform cutting by heating the processed object to a high temperature using not only the power of the laser beam but also oxidation heat, produced when the metal is oxidized by oxygen gas (assist gas) that is blown while the processed object is irradiated with the laser beam.
  • oxygen gas assistant gas
  • the metal forming the processed object and oxidized metal produced in the process of generating the oxidation heat are melted, forming molten metal.
  • the molten metal is removed from the processed object by being blown away by the pressure of the above assist gas so as to flow away, and thereby the processed object is cut.
  • the cutting temperature when cutting with a laser beam, it is necessary to increase the temperature of the interior of the processed object, in other words, the cutting temperature, to a high temperature.
  • the cutting temperature in the case where the processed object to be cut is Fe (iron), the cutting temperature needs to be approximately 1200 °C to 1700 °C.
  • the absorptance of the laser light in the material (hereinafter referred to as "material absorptance") and the absorptance of the laser light in the plasma (hereinafter referred to as "plasma absorptance”) are different.
  • the material absorptance in iron is 0.08 for CO 2 laser light and 0.39 for YAG-based laser light, which has a shorter wavelength than CO 2 laser light.
  • the YAG-based laser light has higher material absorptance than the CO 2 laser light, more laser beam power is consumed for melting the processed object as compared with the CO 2 laser light. Hence, it is less likely that the laser beam power contributes to raising the temperature of the processed object. Furthermore, when cutting the processed object, some of the metal forming the processed object is vaporized, forming a plasma. Then, although the plasma temperature contributes to raising the temperature in the interior of the processed object to be cut, the plasma absorptance of the YAG-based laser light is about one-hundredth that of the CO 2 laser light. With the YAG-based laser light, therefore, it is difficult to increase the plasma temperature in the interior of the processed object to be cut.
  • the refractive index changes due to stresses occurring at the interface between the cladding and the core resulting from differences among individual laser oscillators, degradation of the fiber over time, the accumulation and localization of mechanical stress (stress) in the fiber, and so forth, and this causes a deterioration in the quality and a reduction in the output power of the laser beam, which reduces the cutting performance of the laser processing apparatus.
  • the present invention has been conceived in light of these circumstances, and an object thereof is to provide a laser processing apparatus and a laser processing method that can cut a thick processed object using short-wavelength laser light.
  • a laser processing apparatus includes a first irradiating unit for focusing a first laser beam and irradiating a processed object; and a second irradiating unit for focusing a second laser beam having a longer wavelength than the first laser beam and irradiating the processed object, wherein a region of the processed object being irradiated with the first laser beam focused by the first irradiating unit is irradiated with the second laser beam focused by the second irradiating unit.
  • the first laser beam is focused by the first irradiating unit and radiated onto the processed object
  • the second laser beam having a longer wavelength than the first laser beam is focused by the second irradiating unit and radiated onto the processed object.
  • the region of the processed object being irradiated with the first laser beam is irradiated with the second laser beam.
  • the region of the processed object being irradiated with the first laser beam is irradiated with the second laser beam having a longer wavelength than the first laser beam.
  • the first laser beam melts the metal forming the processed object
  • the second laser beam having a higher plasma absorptance than the first laser beam, raises the temperature of the molten metal.
  • the molten metal reaches a high temperature, and the viscosity of the molten metal can be sufficiently decreased for the molten metal to be blown away by the assist gas; therefore, with the first aspect of the present invention, it is possible to cut a thick processed object using short-wavelength laser light.
  • a laser processing apparatus employs the following solutions.
  • a laser processing apparatus includes a first emitting unit for emitting a first laser beam for processing a processed object; a second emitting unit for emitting a second laser beam for processing the processed object and having a longer wavelength than the first laser beam; and a focusing unit for focusing the first laser beam and the second laser beam so that the second laser beam emitted from the second emitting unit irradiates a region of the processed object being processed by the first laser beam emitted from the first emitting unit.
  • the first laser beam for processing the processed object is emitted by the first emitting unit, and the second laser beam for processing the processed object and having a longer wavelength than the first laser beam is emitted by the second emitting unit. Then, the first laser beam and the second laser beam are focused by the focusing unit so that the region of the processed object being processed by the first laser beam emitted from the first emitting unit is irradiated with the second laser beam emitted from the second emitting unit.
  • the region of the processed object being irradiated with the first laser beam is irradiated with the second laser beam having a longer wavelength than the first laser beam.
  • the first laser beam melts the metal forming the processed object
  • the second laser beam having a higher plasma absorptance than the first laser beam, raises the temperature of the molten metal.
  • the molten metal reaches a high temperature, and the viscosity of the molten metal can be sufficiently decreased for the molten metal to be blown away by the assist gas.
  • the second aspect of the present invention has the focusing unit that is shared by the first laser beam and the second laser beam, making it possible to irradiate the above-described region with the first laser beam and the second laser beam via the focusing unit, it is possible, with a simple construction, to cut a thick processed object by using short-wavelength laser light.
  • the focusing unit may be a focusing lens that focuses the first laser beam and the second laser beam onto the processed object, and the first laser beam and the second laser beam may be incident at positions equidistant from a center axis of the focusing lens.
  • the first laser beam may be YAG-based laser light
  • the second laser beam may be CO 2 laser light.
  • the first laser beam may be fiber laser light.
  • the fiber laser light is high-quality, high-output-power laser light, a thick processed object can be cut more reliably.
  • the first laser beam may be disk laser light.
  • the disk laser light is high-quality, high-output-power laser light, a thick processed object can be cut more reliably.
  • a laser processing method for a laser processing apparatus equipped with a first irradiating unit for focusing a first laser beam and irradiating a processed object, and a second irradiating unit for focusing a second laser beam having a longer wavelength than the first laser beam and irradiating the processed object, wherein a region of the processed object being irradiated with the first laser beam focused by the first irradiating unit is irradiated with the second laser beam focused by the second irradiating unit.
  • the region of the processed object being irradiated with the first laser beam is irradiated with the second laser beam having a longer wavelength than the first laser beam.
  • the first laser beam melts the metal forming the processed object
  • the second laser beam having a higher plasma absorptance than the first laser beam, raises the temperature of the molten metal.
  • the molten metal reaches a high temperature, and the viscosity of the molten metal can be sufficiently decreased for the molten metal to be blown away with the assist gas; therefore, the present invention can cut a thick processed object by using short-wavelength laser light.
  • the present invention provides the excellent advantage that it enables cutting of a thick processed object by using short-wavelength laser light.
  • FIG. 1 shows the configuration of a laser processing apparatus 10 according to the first embodiment of the present invention.
  • the laser processing apparatus 10 is a laser cutting apparatus for cutting a processed object 12.
  • the laser processing apparatus 10 includes a first irradiation unit 14 that focuses a first laser beam and irradiates the processed object 12 and a second irradiation unit 16 that irradiates the processed object 12 with a second laser beam having a longer wavelength than the first laser beam.
  • YAG-based laser light is used as an example of the first laser beam
  • CO 2 laser light having a longer wavelength than the YAG-based laser light is used as an example of the second laser beam.
  • the first irradiation unit 14 according to this first embodiment employs a fiber laser in which an optical fiber is used as a medium.
  • the laser processing apparatus 10 cuts the processed object 12 by continuously irradiating the processed object 12, which is placed on a table 18, with the YAG-based laser light and the CO 2 laser light.
  • the processed object 12 is metal, and in this first embodiment, the processed object 12 is assumed to be iron (Fe), as an example.
  • the thickness of the processed object 12 is, for example, ten to several tens of mm (for example, 50 mm).
  • the laser processing apparatus 10 according to this first embodiment performs cutting while blowing the cut portion with oxygen gas, which is the assist gas.
  • the first irradiation unit 14 and the second irradiation unit 16 are supported by a three-axis arm (not illustrated) that can move in three axial directions (xyz axes), and the direction in which cutting of the processed object 12 advances is changed by driving the three-axis arm.
  • the thickness of the processed object 12 is large (for example, ten to several tens of mm (for example, 50 mm)), it may not be possible to cut such a processed object 12.
  • YAG-based laser light shows higher material absorptance compared with CO 2 laser light and lower plasma absorptance.
  • YAG-based laser light shows higher material absorptance compared with CO 2 laser light, more laser beam power is consumed for melting the processed object 12, and it is less likely that the laser beam power contributes to raising the temperature of the processed object 12.
  • some of the metal forming the processed object 12 is vaporized, creating a plasma.
  • the plasma temperature contributes to raising the temperature of the interior of the processed object 12 being cut
  • the plasma absorptance of the YAG-based laser light is lower than that of the CO 2 laser light, and it is difficult for the YAG-based laser light to raise the plasma temperature in the interior of the processed object 12 being cut.
  • the metal forming the processed object 12 and the oxidized metal melt, forming molten metal, and even though a molten pool is formed in the interior of the processed object 12, because the laser beam cannot sufficiently raise the temperature of the molten pool, the viscosity of the molten metal does not decrease, and the assist gas cannot make the molten metal flow out from the interior of the processed object 12. Accordingly, with the conventional laser processing apparatus, in some cases it is not possible to cut a thick processed object 12 in which a molten pool is created in the interior.
  • the laser processing apparatus 10 radiates CO 2 laser light focused by the second irradiation unit 16 onto a region A of the processed object 12, which is being irradiated with YAG-based laser light focused by the first irradiation unit 14, as shown in the longitudinal sectional view in Fig. 2 .
  • the YAG-based laser light showing high material absorptance, melts the metal forming the processed object 12, and the CO 2 laser light, showing higher plasma absorptance than the YAG-based laser light, raises the temperature of the molten metal.
  • the CO 2 laser light is used as plasma-induction laser light, raising the plasma temperature.
  • the output power of the CO 2 laser light used in this first embodiment is, for example, several W to several tens of W.
  • the viscosity of the molten metal is decreased, and the assist gas can blow away the molten metal from the processed object 12 with the pressure thereof; therefore, the laser processing apparatus 10 can cut the thick processed object 12.
  • the CO 2 laser light is made incident at an angle with respect to the processed object 12, as shown in the longitudinal sectional view in Fig. 2 , thereby irradiating the region A. Therefore, as shown in the top view in Fig. 2 , the diameter of the CO 2 laser light is preferably the same as or shorter than the diameter of the YAG-based laser light, so that the width of the YAG-based laser light diameter corresponds to the kerf width (cutting width).
  • the CO 2 laser light may be scanned in the depth direction by, for example, oscillating the second irradiation unit 16 itself, or the scanning CO 2 laser light may be scanned in the depth direction by providing the second irradiation unit 16 with a polygon mirror lens and rotating this polygon mirror lens.
  • the laser processing apparatus 10 irradiates the processed object 12 with YAG-based laser light focused by the first irradiation unit 14 and irradiates the region A of the processed object 12, which is being irradiated with the YAG-based laser light, with CO 2 laser light having a longer wavelength than the YAG-based laser light, focused by the second irradiation unit 16; therefore, it is possible to cut the thick processed object 12 by using short-wavelength laser light.
  • FIG. 3 shows the configuration of a laser processing apparatus 50 according to this second embodiment.
  • constituent parts that are the same as those in Fig. 1 are assigned the same reference signs as in Fig. 1 , and a description thereof will be omitted.
  • the laser processing apparatus 50 includes, at the top of the housing 52, a first laser-light emitting unit 54 that emits YAG-based laser light serving as a first laser beam and a second laser-light emitting unit 56 that emits CO 2 laser light serving as a second laser beam.
  • a housing 52 includes a first collimating optical system 58, a second collimating optical system 60, and a focusing optical system 62.
  • the housing 52 is supported by a three-axis arm (not illustrated) that can move in three axial directions (xyz directions), and the direction in which cutting of the processed object 12 advances is changed by driving the three-axis arm.
  • YAG-based laser light coming from the first laser-light emitting unit 54 which is generated by a laser oscillator (not illustrated), is emitted as fiber laser light, which is conveyed to the first laser-light emitting portion 54 by an optical fiber 64.
  • the focusing optical system 62 which includes a focusing lens 70, focuses the YAG-based laser light converted to a collimated beam by the first collimating optical system 58 and the CO 2 laser light converted to a collimated beam by the second collimating optical system 60 and irradiates the region A on the processed object 12 with the YAG-based laser light and the CO 2 laser light. More specifically, the YAG-based laser light and the CO 2 laser light are incident at positions equidistant from a center axis 72 of the focusing lens 70 (in this second embodiment, left and right symmetric positions centered on the center axis 72).
  • the focal points of the YAG-based laser light and the CO 2 laser light focused by the focusing lens 70 meet at the same position.
  • the region A on the processed object 12 can be irradiated with the YAG-based laser light and the CO 2 laser light simultaneously via the focusing lens 70.
  • the laser processing apparatus 50 has the focusing lens 70 which is shared by the YAG-based laser light and the CO 2 laser light, making it possible to irradiate the region A with the YAG-based laser light and the CO 2 laser light via the focusing lens 70, it is possible, with a simple construction, to cut the thick processed object 12 with short-wavelength laser light.
  • the first collimating optical system 58, the second collimating optical system 60, and the focusing optical system 62 are formed, for example, of fused quartz glass. Also, the first collimating optical system 58, the second collimating optical system 60, and the focusing optical system 62 may each be formed of single lenses, or they may be formed of a plurality of lenses.
  • the present invention is not limited thereto; forms in which the laser processing apparatuses 10 and 50 are used as laser welding apparatuses that weld a plurality of processed objects are also permissible.
  • the present invention is not limited thereto; forms in which another gas is used as the assist gas, such as nitrogen gas, argon gas, or the like, are also permissible.
  • the present invention is not limited thereto; a form in which disk laser light (wavelength 1.05 to 1.09 ⁇ m) is used is also permissible.
  • the present invention is not limited thereto; a form supported by a two-axis arm that moves longitudinally (x) and laterally (y) is also permissible.
  • a form in which the advancing direction of cutting of the processed object 12 is changed by making the table 18 on which the processed object 12 is mounted movable in three axial directions and then moving the table 18 is also permissible.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
EP11832533.1A 2010-10-15 2011-10-12 Dispositif de traitement au laser et procédé de traitement au laser Withdrawn EP2628562A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010232674A JP5642493B2 (ja) 2010-10-15 2010-10-15 レーザ切断装置及びレーザ切断方法
PCT/JP2011/073361 WO2012050098A1 (fr) 2010-10-15 2011-10-12 Dispositif de traitement au laser et procédé de traitement au laser

Publications (1)

Publication Number Publication Date
EP2628562A1 true EP2628562A1 (fr) 2013-08-21

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EP11832533.1A Withdrawn EP2628562A1 (fr) 2010-10-15 2011-10-12 Dispositif de traitement au laser et procédé de traitement au laser

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US (1) US20130170515A1 (fr)
EP (1) EP2628562A1 (fr)
JP (1) JP5642493B2 (fr)
CN (1) CN103221175A (fr)
WO (1) WO2012050098A1 (fr)

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WO2015029466A1 (fr) * 2013-08-28 2015-03-05 三菱重工業株式会社 Dispositif d'usinage au laser
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US11148319B2 (en) 2016-01-29 2021-10-19 Seurat Technologies, Inc. Additive manufacturing, bond modifying system and method
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Publication number Publication date
JP5642493B2 (ja) 2014-12-17
CN103221175A (zh) 2013-07-24
JP2012086228A (ja) 2012-05-10
WO2012050098A1 (fr) 2012-04-19
US20130170515A1 (en) 2013-07-04

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