EP2617053B1 - Appareil et procédé permettant de générer des motifs sur des pièces - Google Patents

Appareil et procédé permettant de générer des motifs sur des pièces Download PDF

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Publication number
EP2617053B1
EP2617053B1 EP11778668.1A EP11778668A EP2617053B1 EP 2617053 B1 EP2617053 B1 EP 2617053B1 EP 11778668 A EP11778668 A EP 11778668A EP 2617053 B1 EP2617053 B1 EP 2617053B1
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EP
European Patent Office
Prior art keywords
die
workpiece
pick
dies
place tool
Prior art date
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Active
Application number
EP11778668.1A
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German (de)
English (en)
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EP2617053A2 (fr
Inventor
Mikael Wahlsten
Per-Erik Gustafsson
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Mycronic AB
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Micronic MyData AB
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
    • Y10T29/53061—Responsive to work or work-related machine element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Definitions

  • the invention relates to methods and apparatuses for performing pattern alignment to die, and methods and apparatuses for generating patterns on workpieces.
  • One example of a process requiring relatively accurate matching of structures is the stacking of dies on top of each other where the second die must be aligned relatively accurately with the first die to create sufficient contact between the two dies.
  • a fan-out or embedded die process in which a first structure is composed of mounted dies, and a second structure is a conductor pattern or via hole pattern (e.g., a build up metal patterned with lithography or laser drilled via holes), which must be aligned accurately with the first structure (e.g., the pads on the dies).
  • a conductor pattern or via hole pattern e.g., a build up metal patterned with lithography or laser drilled via holes
  • Conventional pick-and-place machines are capable of determining the local alignment of dies on a workpiece, and then using the local alignment together with alignment fiducial(s) or other measurable features on the die to align the die in the correct position on the workpiece.
  • a first layer of one or more dies is accurately placed with a relatively slow pick-and-place machine and the second layer of one or more dies is also placed with a relatively slow pick-and-place machine.
  • each die must be placed relatively accurately on a workpiece because conventional patterning equipment (e.g., aligners, steppers, etc.) have somewhat limited capabilities to individually align to each die without sacrificing (e.g., significantly sacrificing) throughput (e.g., TAKT).
  • patterning equipment sacrifices speed to achieve the necessary accuracy of the pick-and-place machine.
  • Prior art US 2002/092595 describes a semiconductor device mounting apparatus comprising a mounting head for attaching a substrate on a semiconductor device using an adhesive and solder paste.
  • the mounting apparatus of US 2002/092595 is adapted for attaching a substrate above a semiconductor device located therebelow using an adhesive or solder paste.
  • the mounting head of US 2002/092595 may also comprise a recognizing camera for measuring the mounting position accurately. While the mounting head is being moved toward a transfer position, the tool of US 2002/092595 is rotated by rotating means in accordance with the rotational posture of the substrate. When the tool has reached the transfer position, the substrate is vacuumed by the tool and the mounting head is moved to a transfer means. Then, the substrate is pressed against a transfer plate so as to transfer adhesive or paste, e.g. silver paste, to the contact pads of the substrate.
  • adhesive or paste e.g. silver paste
  • Prior art US 2004/0061346 describes a mounting head and viewing mechanism for simultaneous high accuracy placement of multiple semiconductor components or dies on substrates.
  • the viewing mechanism is adapted for simultaneously or sequentially viewing fiducial marks or other repeatable patterns on semiconductor components and on substrates.
  • highly accurate die placement requires high powered magnification for a camera, causing the field of view of the camera to decrease.
  • An adjustment mechanism is provided for the viewing mechanism for adjusting the position of an optical probe relative to the camera(s) in the X, Y and Z-directions. In this manner, when one or more fiducial marks lies outside the field of view of the either camera, the position of the optical probe relative to the cameras can be adjusted during die placement to bring such fiducial marks into the view of each camera before placement of the dies.
  • Prior art US 5,894,657 describes an apparatus for mounting electronic components on circuit board comprising a recognition camera for detecting whether or not a component in wafer is acceptable and correcting the position of an acceptable component.
  • a transfer saucer containing a bonding paste is further used to fix the component onto the circuit board. Based on a position of the circuit board recognized by a recognition camera, the position of the component may be slightly adjusted by the carrier head carrying the component.
  • At least one example embodiment provides a mounting head for a pick-and-place tool configured to pick and place at least one die on a workpiece according to claim 1.
  • the mounting head includes: a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.
  • the invention equally is directed to a method for determining a position of a die placed on a workpiece according to claim 16.
  • the die position determining unit may be configured to one of measure and detect the actual position of the at least one die while the mounting head is still in a position for placing the at least one die on the workpiece.
  • the pick-and-place tool may be configured to measure the actual position of the at least one die on the workpiece relative to at least one measurement mark.
  • the at least one measurement mark may be a local alignment mark or another unique feature associated with or connected to a position on the workpiece.
  • the pick-and-place tool may be configured to output position information indicative of the actual position of the at least one die, and the position information may include a measurement of the position of the at least one die relative to the local alignment mark or some other reference point to which the local alignment mark have a clearly defined distance.
  • the pick-and-place tool may be further configured to output position information indicative of the measured actual position to an external unit, either directly or indirectly via a memory, and the position information may be usable in adjusting original pattern data associated with a pattern to be generated on the workpiece.
  • the at least one die or component may be placed on a first layer, and a pattern generator may use the position information to adjust original pattern data to be written on a second layer, which is different from the first layer.
  • a pattern may be modified for several layers after the die or dies are placed on the workpiece.
  • Both the first layer and the second layer may be layers associated with the same group of placed dies or components.
  • a subsequent second layer e.g., a via hole layer
  • a subsequent third layer e.g., circuit pattern layer
  • the circuit pattern layer and the via hole layer are associated with the same group of dies.
  • a common transformation may be associated with a group (or subset) of dies on the workpiece. This may be useful, for example, in cases where several dies are to be connected to the same printed circuit board (PCB), or some other connector board.
  • PCB printed circuit board
  • the entire region in which the group of dies is placed is associated with the same transformation, which provides a relatively good fit for the whole region relative to, for example, the connector card or some other component that puts requirements on a common boundary condition.
  • the first layer may be a layer associated with a first group of placed dies or components and the second layer may be a layer associated with a second group of placed dies or components different from the first group of dies or components.
  • This example embodiment may be used, for example, when different routing layers are used for different parts of a pattern; for example, when a first layer is used as a routing layer for a first group of dies, and a third layer is used as a routing layer for a second group of dies, etc.
  • the die position determining unit may include a camera configured to obtain an image of the workpiece.
  • the camera may further be configured to obtain an image covering only a subarea of the workpiece surface, wherein the image of the subarea is used to measure the actual position of at least one die placed on the workpiece relative to at least one measurement mark associated with the at least one die placed on the workpiece, wherein the at least one measurement mark is a local alignment mark or another unique feature associated with or connected to a position on the workpiece.
  • the image obtained by the camera may cover only a subarea of the workpiece surface area and may further include actual position information for only a subset of the plurality of dies placed on the workpiece.
  • the subset of dies includes or equals the at least one die placed in the last pick-and-place action performed by the mounting head.
  • the camera may be a charge coupled device camera.
  • the die position determining unit may include a sensor configured to detect a position of the at least one die on the workpiece.
  • the sensor may be a laser sensor configured to use at least one of reflected light and triangulation to detect the position of the at least one die on the workpiece.
  • first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and similarly, a second element could be termed a first element, without departing from the scope of example embodiments.
  • the term "and/or,” includes any and all combinations of one or more of the associated listed items.
  • a process may be terminated when its operations are completed, but may also have additional steps not included in the figures.
  • a process may correspond to a method, function, procedure, subroutine, subprogram, etc.
  • a process corresponds to a function
  • its termination may correspond to a return of the function to the calling function or the main function.
  • Such existing hardware may include one or more central processing units (CPUs), digital signal processors (DSPs), application-specific-integrated-circuits (ASICs), field programmable gate arrays (FPGAs) computers or the like in addition to pattern generating equipment, such as laser direct imaging (LDI) writers and/or other pattern generating equipment.
  • CPUs central processing units
  • DSPs digital signal processors
  • ASICs application-specific-integrated-circuits
  • FPGAs field programmable gate arrays
  • a pattern generation system will be discussed in more detail below.
  • the term “storage medium” or “computer readable storage medium” may represent one or more devices for storing data, including read only memory (ROM), random access memory (RAM), magnetic RAM, core memory, magnetic disk storage mediums, optical storage mediums, flash memory devices and/or other tangible machine readable mediums for storing information.
  • ROM read only memory
  • RAM random access memory
  • magnetic RAM magnetic RAM
  • core memory magnetic disk storage mediums
  • optical storage mediums flash memory devices and/or other tangible machine readable mediums for storing information.
  • computer-readable medium may include, but is not limited to, portable or fixed storage devices, optical storage devices, and various other mediums capable of storing, containing or carrying instruction(s) and/or data.
  • one or more example embodiments may be implemented by hardware, software, firmware, middleware, microcode, hardware description languages, or any combination thereof.
  • the program code or code segments to perform the necessary tasks may be stored in a machine or computer readable medium such as a computer readable storage medium.
  • a processor or processors When implemented in software, a processor or processors will perform the necessary tasks.
  • a code segment may represent a procedure, function, subprogram, program, routine, subroutine, module, software package, class, or any combination of instructions, data structures or program statements.
  • a code segment may be coupled to another code segment or a hardware circuit by passing and/or receiving information, data, arguments, parameters or memory contents.
  • Information, arguments, parameters, data, etc. may be passed, forwarded, or transmitted via any suitable means including memory sharing, message passing, token passing, network transmission, etc.
  • Example embodiments relate to methods and apparatuses for performing pattern alignment to die, and methods and apparatuses for writing an image on a workpiece.
  • An image may be written on a workpiece using a laser direct imaging (LDI) device to pattern a surface of the workpiece.
  • Patterning by projecting, writing or printing a pattern on a surface of a workpiece may include exposing a photoresist or other photosensitive material, annealing by optical heating, ablating, creating any other change to the surface by an optical beam, etc.
  • At least one example embodiment relates to laser pattern imaging of workpieces during the manufacture of products, such as printed circuit boards (PCBs), substrates, flexible roll substrates, flexible displays, wafer level packages (WLP), flexible electronics, solar panels, displays, etc.
  • PCBs printed circuit boards
  • WLP wafer level packages
  • flexible electronics such as solar panels, displays, etc.
  • Wafer level packaging is a technology in which an integrated circuit is packaged at the wafer level.
  • WLP is essentially a true chip scale package (CSP) technology because the resulting package is practically of the same size as the die.
  • WLP has the ability to enable true integration of wafer fabrication, packaging, test, and burn-in at wafer level in order to streamline the manufacturing process for a device from silicon start to customer shipment.
  • Wafer-level packaging basically includes extending the wafer fabrication processes to include device interconnection and device protection processes. In most other types of packaging, wafer dicing is performed first, and then the individual dies are put in a plastic package and solder bumps are attached. Wafer-level packaging involves performing wafer dicing after attaching the top and bottom outer layers of packaging as well as the solder bumps to the integrated circuit while still in the wafer.
  • the pick-and-place tool used in solar panel manufacturing may be configured to first place components, such as e.g. optical elements, on a first layer and place other components, such as e.g. solar cells, on a second layer different from the first layer.
  • the method includes patterning or ablating a layer surface, e.g. a layer surface associated with the placed dies/components, with modified pattern or write data after receiving placement position information from a camera or sensor arranged on the mounting head of the pick-and-place tool performing the placement of components.
  • a workpiece is used to denote any carrier of a surface layer upon which a pattern may be printed with a laser direct (or other) imaging (or pattern generation) system.
  • a workpiece may be a silicon substrate or a silicon wafer for a printed circuit board, an organic substrate, etc.
  • Workpieces may have any shape (e.g., circular, rectangular, polygonal, etc.) and may have any size for example in a piece or in a roll.
  • a die is used to denote a passive component, an active component, or any other component associated with electronics.
  • a die may be a small block of semiconducting material, on which a given functional circuit may be fabricated.
  • the term local alignment is used to denote alignment in relation to alignment features on an individual die or on a group of dies.
  • An alignment feature may be a measurement mark, such as a local alignment mark, edge, corner, bump, pad, contact, text or other measurable feature of the die that provides a registration measure with relatively significant accuracy.
  • an alignment feature may be a measurement mark, such as a global alignment mark, edge, corner, bump, pad, contact, text or other measurable feature of the workpiece that provides a registration measure with relatively significant accuracy.
  • reading and writing are to be understood in a broad sense.
  • Reading operations may include, for example, microscopy, inspection, metrology, spectroscopy, interferometry, scatterometry, etc. of relatively small or relatively large workpieces.
  • writing may include exposing a photoresist or other photosensitive material, annealing by optical heating, ablating, creating any other change to the surface by an optical beam, etc.
  • the mounting head in a pick-and-place unit measures the actual positions of the dies by obtaining an image (e.g., taking a picture), or detecting, immediately after each placement action performed by one or a plurality of pick-and-place nozzles of the mounting head.
  • the mounting head of the pick-and-place unit may include a measuring head of a camera and/or a detection unit (e.g., a sensor), which does not use images to detect positions.
  • the camera may be a charge coupled device (CCD) camera or other imaging device suitable for obtaining an image of the workpiece.
  • the sensor may be a laser sensor using reflected light and/or triangulation to detect the positions of the dies on the workpiece.
  • the measuring head and the detection unit may be referred to collectively as a die position determining unit.
  • the measurement (or detection) head is always in the correct position for measuring placement of the one or more dies.
  • the measured actual position data of a first layer of dies on the workpiece, or pattern adjustment data based at least partially on the measured actual positions of the dies is transmitted from the pick-and-place unit (e.g., via a memory) to a pattern generator (e.g., a LDI tool).
  • the pattern generator uses the transmitted data as an input adjustment.
  • the pattern generator may re-sample pattern data to be used by the pattern generator for patterning a subsequent layer on the workpiece.
  • an actual position of a die placed on a workpiece is measured by a pick-and-place unit, and measured position data indicative of the measured actual position is output from the pick-and-place unit to a memory.
  • a pattern generator obtains the measured position data from the memory to prepare for a subsequent patterning step in which a pattern is written on a surface of the workpiece based on the data received from the pick-and-place unit.
  • the measured position data may also be referred to herein as measured position information, actual position data, actual position information, measured actual position data, etc.
  • the pattern generator generates pattern adjustment data based on the measured position data obtained from a memory, and then modifies and/or adjusts the pattern data based on the pattern adjustment data.
  • the pattern adjustment data may be a recalculated or transformed position of the die on the workpiece.
  • the re-calculated or transformed position of the die is the actual measured position of the die in the global coordinate system of the laser pattern generator, rather than the local coordinate system.
  • the pattern generator uses the pattern adjustment data to relax position accuracy of the pick-and-place machine, such as a surface mount technology (SMT) machine.
  • SMT surface mount technology
  • SMT is a method for constructing electronic circuits in which the components (e.g., surface mounted components (SMC)) are mounted directly onto the surface of printed circuit boards (PCBs).
  • PCBs printed circuit boards
  • SMD surface mount device
  • One principal example of a conventional prior art SMT machine comprises a pick-and-place unit with a mounting head, a machine frame, a component feeding device, including a plurality of component feeders, and arranged at a component feeder area of the machine frame, e.g. a gantry system having a first beam, or X beam, and a second perpendicular beam, or Y beam, attached to the machine frame, where the mounting head may be movably attached to the X beam, and a board transportation system, attached to the machine frame.
  • the component feeding device is configured to present electronic components to the mounting head.
  • a gantry system may be used to move the mounting head between the component feeding device and the workpiece.
  • the board transportation system transports workpieces between a conveyor line and a working area of the SMT machine.
  • the SMT machine may be a component mounting machine as described in PCT Publication No. WO2011/079956 (A1 ).
  • the mounting head may be movable in the vertical direction, and may also be configured to rotate around a vertical axis.
  • the mounting head may also contain a suction device in form of at least one nozzle.
  • the suction device, or at least one nozzle makes it possible to pick up, by activating the suction device, electronic components (or dies) from the component feeding device, transport them to the substrate, and release them at a precise location on the workpiece.
  • the mounting head may be a mounting head as described in PCT Publication No. WO2011/079956 (A1 ) but further adapted to have at least one camera, or sensor, arranged on the mounting head, and which is configured to measure, or detect, the actual position of at least one die placed on a workpiece.
  • the pick-and-place action of one or a plurality of dies is performed by one or more of the plurality of nozzles of the mounting head, i.e. the placement of at least one die is performed by one or more of the plurality of nozzles.
  • the measuring or detection of the actual position of at least one die may be performed immediately after the at least one die is placed by the at least one nozzles on the workpiece, and before initiating a subsequent pick-and-place action by the mounting head.
  • the measured actual position of the die or pattern adjustment data generated based on the actual position of the die may be sent from the pick-and-place machine to the pattern generator, either directly or indirectly via a memory, for use in adjusting the original pattern data associated with the pattern to be generated on the workpiece.
  • FIG. 3A is a plan view illustrating a pattern generation system according to an example embodiment.
  • the pattern generation system PGS1 includes a die placement system 14 and a pattern generator 10.
  • the die placement system 14 may also be referred to as a pick-and-place tool.
  • the die placement system 14 includes a pick-and-place unit 2 for picking and placing one or more dies on a surface of a workpiece W.
  • FIG. 3A shows only a single pick-and-place unit 2
  • example embodiments may include any suitable number of pick-and-place units 2 arranged side-by-side in the direction P1.
  • some example embodiments may be discussed with regard to placement of a single die on a workpiece, it will be understood that any number of dies may be placed on any number of workpieces in the same or a similar manner.
  • the workpiece W to be provided with the dies is transported through the die placement system 14 in the direction P1 by a transport system 3. Because transport systems such as the transport system 3 are generally known, a detailed discussion is omitted.
  • the pick-and-place unit 2 includes a camera 5.
  • the camera 5 is configured to obtain images of the workpiece W on which the die or dies are placed by the pick-and-place unit 2.
  • the camera 5 may be a charge coupled device (CCD) camera or other imaging device capable of obtaining images of the die, or dies, on the workpiece W.
  • CCD charge coupled device
  • the measurement or detection is performed within the pick-and-place unit 2.
  • a measurement or detection system e.g., camera 5 or sensor
  • the measuring (or detection) of the actual positions of each die is fully integrated in the pick-and-placement of the die, and may be performed immediately after the die is placed on the workpiece, rather than after all dies have been placed.
  • the mounting head may include image processing and/or detection hardware (e.g., a position measurement controller 4).
  • image processing and/or detection hardware e.g., a position measurement controller 4
  • the position measurement controller 4 will be discussed in more detail below.
  • an actual position of at least one die on the workpiece may be determined during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.
  • the actual position of the at least one die may be determined while the mounting head is still in a position for placing the at least one die on the workpiece.
  • the mounting head may include one or more nozzles for placing one or more dies on the workpiece, but only a single camera or detection unit for measuring the actual positions of the one or more dies placed on the workpiece (e.g., a first layer of the workpiece).
  • the measured position data is sent to a pattern generator that adjusts pattern data for a subsequent second layer based on the measured actual positions of the dies through re-sampling.
  • the re-sampled pattern data is then used to write a pattern on a subsequent layer of the workpiece.
  • the die placement system 14 includes a position measurement controller 4 configured to communicate with the camera 5.
  • the position measurement controller 4 may be a computer or other suitable processing system or controller.
  • the position measurement controller 4 may also include image recognition software configured to recognize objects such as dies or features such as alignment marks on the dies (e.g., local alignment marks) and/or the workpiece W (e.g., global alignment marks).
  • the position measurement controller 4 is coupled to a memory 20 and the pattern generator 10.
  • the memory 20 may be any non-volatile memory capable of storing image data and/or position information associated with the die placed on the workpiece W by the pick-and-place machine 2.
  • the pattern generator 10 is also coupled to the memory 20 and the position measurement controller 4.
  • the pattern generator 10 is configured to receive measured position data indicative of the actual position of the die, or plurality of dies, on the workpiece W from the position measurement controller 4 either directly or indirectly via the memory 20.
  • the pattern generator 10 includes an image writer 22 and an image write controller 24.
  • the image writer 22 and the image write controller 24 are configured to exchange data with one another, and the image write controller 24 is configured to control the image writer 22.
  • the image writer 22 may be any conventional pattern generator or other writing tool capable of generating a pattern on a workpiece.
  • the image writer 22 may be a photoplotter.
  • a photoplotter is an electro-mechanical-optical machine that exposes a latent image on a media, such as high-contrast monochromatic (black-and-white) photographic film, using a light source under computer control. Once the exposing step is complete, the media is processed in a film processor using a developer solution, along with fixing, washing, and drying.
  • a photoplotter may be used to form nearly any conceivable image, but photoplotters are generally used for the production of printed circuit boards (PCBs) and integrated circuit (IC) packages. Other application areas include chemical milling and specialized graphic arts.
  • Photoplotting is a first step of making photolithography masks for PCBs. In the PCB industry, these masks are called photo plots and are generally limited to features of about 20 ⁇ m or more. ICs are made in a similar fashion utilizing photomasks with sub-micrometer feature sizes; photomasks are traditionally made by photoreducing photo plotter output.
  • More modem photoplotters are generally raster-scan devices that use a laser beam focused to one or more spots, and modulated at multi-megahertz rates, to form the image.
  • green argon-ion lasers and blue helium-cadmium lasers were used.
  • More recent models utilize a red helium-neon laser, red laser diodes or even red light emitting diodes (LEDs).
  • Photo plotters are closely related to image setters, but differ in the type of controller used to produce the image, and in the resolution and absolute accuracy of the image. Generally, photo plotters meet more stringent specifications than image setters.
  • LDI laser direct imaging
  • direct writing no mask
  • patterning of a workpiece utilizes a high-power laser to directly expose photoresist on a coated substrate instead of exposing photographic film, which eliminates the handling of photographic film.
  • An example of a LDI machine or laser direct writer is described in U.S. Patent Application Publication No. 2003/0086600 .
  • a laser direct writer a laser beam is scanned over a photosensitive surface layer of a workpiece to expose-the layer with a pattern in accordance with pattern image data.
  • the pattern image data may be provided from an external source, such as a computer or other image pattern generating device.
  • the image writer 22 may be an LDI machine or laser direct writer as described in U.S. Patent Application Publication No. 2003/0086600 .
  • the image writer 22 may include patterning equipment for patterning by projecting, writing or printing a pattern on a surface that may include exposing a photoresist or other photosensitive material, annealing by optical heating, ablating, creating any other change to the surface by an optical beam, etc.
  • the image write controller 24 may be a computer or other processing device configured to control patterning (e.g., laser beam scanning) by the image writer 22 based on pattern image data and the actual position information for the one or more dies in the memory 20.
  • patterning e.g., laser beam scanning
  • the image write controller 24 generates adjusted pattern image data by adjusting original pattern image data associated with a pattern to be written on the workpiece W based on the actual position information stored in the memory 20.
  • the image writer 22 then writes the pattern on the workpiece W according to the adjusted pattern image data.
  • FIG. 3B illustrates a pattern generation system according to another example embodiment.
  • the example embodiment shown in FIG. 3B is similar to the example embodiment shown in FIG. 3A , except that the memory 20 is included within the pattern generator 10.
  • Other components of the system shown in FIG. 3B are the same as those in FIG. 3A .
  • FIG. 3C illustrates a pattern generation system according to still another example embodiment.
  • the example embodiment shown in FIG. 3C is similar to the example embodiment shown in FIG. 3A , except that the memory 20 is included within the die placement system 14.
  • Other components of the system shown in FIG. 3C are the same as those in FIG. 3A .
  • dies are placed on the workpiece W by the pick-and-place unit 2, the workpiece W is passed to the image writer 22 by the transport system 3, and the image writer 22 generates a pattern on the workpiece W.
  • Example operation of the pattern generation system shown in FIG. 3A is discussed in more detail below with regard to FIGS. 1A through 2 , 4 and 5 .
  • each of the systems shown in FIGS. 3B and 3C will be understood to operate in the same or substantially the same manner.
  • FIGS. 1A through 1C are flow charts illustrating example embodiments of methods for generating patterns on workpieces.
  • FIG. 1A is a flow chart illustrating method for generating a pattern on a workpiece according to an example embodiment.
  • FIG. 2 is a partial process flow diagram for explaining the example embodiment illustrated by the flow chart shown in FIG. 1A .
  • the die placement system 14 measures the actual local alignment position of the die D on the workpiece W.
  • the die placement system 14 measures the actual position of the die D on the workpiece W relative to at least one measurement mark.
  • the at least one measurement mark may be a local alignment mark or another unique feature associated with, or connected to, a position on the workpiece W.
  • the at least one measurement mark may be, for example, a correlation of, or reference to, graining, particles or other reference.
  • the at least one measurement mark may be one or more local alignment marks, edges, corners, bumps, pads, contacts, text or other measurable feature that provides a registration measure with relatively significant accuracy.
  • the die placement system 14 determines the actual position of the at least one die while the mounting head is still in a position for placing the at least one die D on the workpiece W.
  • FIG. 4 is a flow chart illustrating an example embodiment of a method for measuring the actual position of the die D on the workpiece W at S100 in FIG. 1A .
  • the camera 5 obtains an image of the die D directly or immediately after the die D is placed on the workpiece W.
  • the camera 5 outputs the obtained image to the position measurement controller 4.
  • the position measurement controller 4 performs image processing to determine the actual position of the die D on the workpiece W in real time.
  • the actual position determined by the position measurement controller 4 is a local alignment position of the die D on the workpiece W relative to the carrier.
  • the image processing performed by the position management controller 4 is generally based upon finding edges of the die, and then calculating a position for the die based on the position of the edges and knowledge about the shape of the die.
  • Other techniques use a correlation and search for templates in the image using a correlation to find the position, rotation, etc.
  • Still other techniques use model based shape matching, which searches for certain features in the image. Combinations of the above-described techniques may also be used. For example, a correlation may be first used to roughly find the object, and then a thresholding technique may be used to generate edges on a limited area in the image. Other well-known image processing techniques may also be used.
  • the camera 5 exports the image to an external computer system (not shown).
  • the external computer system then performs the above-described image processing to determine the actual position of the die D on the workpiece W at S406.
  • the position measurement controller 4 estimates the actual position of the die D on the workpiece W based on a measurement of the die D, the at least one measurement mark before being placed on the workpiece W, and an estimate of a known offset.
  • the deterministic offset may be added to the measured position.
  • the offset may also be tracked over the area. For example, if an SMT machine places one die, and then measures the offset, then the SMT machine may use the same or substantially the same offset for the next die. This offset may be based on an average of a plurality of measurements. Thus, if the SMT machine is rather deterministic, then only a few dies need be measured after placement to obtain a sufficiently accurate estimated position of all dies using the known offsets.
  • the position measurement controller 4 outputs the position data associated with the die D to the memory 20 at which the position data is stored.
  • the position information output from the die placement machine 14 includes a measurement of the position of the die relative to the local alignment mark(s) or some other reference point to which the local alignment mark(s) have a clearly defined distance.
  • the position measurement controller 4 may output the position information directly to the image write controller 24.
  • the image write controller 24 obtains (reads) the actual position data from the memory 20, and generates pattern adjustment data based on the obtained actual position data.
  • the image write controller 24 converts/transforms the actual position of the die D to the coordinate system of the pattern generator 10.
  • the coordinate system of the pattern generator 10 is the global coordinate system
  • the transformed position of the die D is a global alignment position relative to global alignment marks of the workpiece W, rather than a local alignment position relative to the local alignment marks.
  • a few global alignment marks are measured on the workpiece in a pattern generator such as a LDI machine.
  • the position of the workpiece may be determined in the global coordinate system of the pattern generator.
  • the local measured positions/orientations of dies may then be transformed to positions in the global coordinate system of the pattern generator by using the well defined relationship between the positions of the global alignment marks relative the local alignment marks on the workpiece.
  • the image write controller 24 generates modified pattern data based on the pattern adjustment data.
  • the image write controller 24 may generate the modified pattern data by re-sampling the pattern data for the pattern to be written based on the pattern adjustment data to fit the measured position of the die D on the workpiece W. More detailed examples of methods for re-sampling pattern image data are described, for example, in one or more of U.S. Patent Application Nos. 12/929,973 , 12/929,975 , 12/929,976 , 12/929,977 , and 12/929,981 , all of which were filed on February 28, 2011.
  • the image writer 22 then writes/generates a pattern on the workpiece W according to the modified pattern data. Examples of methods for generating a pattern on the workpiece W are described, for example, in one or more of U.S. Patent Application Nos. 12/929,973 , 12/929,975 , 12/929,976 , 12/929,977 , and 12/929,981 .
  • features provided in a subsequent patterning step may be more accurately aligned with the one or more dies placed on the workpiece W by the pick-and-place unit 2.
  • FIG. 1B is a flow chart illustrating a method for generating a pattern on a workpiece according to another example embodiment.
  • the example embodiment shown in FIG. 1B is similar to the example embodiment shown in FIG. 1A , except that the die placement system 14 also measures positions of global alignment marks on the workpiece, and then the image write controller 24 generates the modified pattern data based on the pattern adjustment data and the measured positions of the global alignment marks.
  • each of S100, S102 and S104 are the same as discussed above with regard to FIG. 1A .
  • the die placement system 14 measures the global alignment of the workpiece W. In one example, the die placement system 14 measures actual positions of at least two global alignment marks on the workpiece W. The die placement system 14 may measure the actual positions of the global alignment marks in the same or substantially the same manner as the actual position of the die is measured at S100.
  • the image write controller 24 generates modified pattern data based on the pattern adjustment data (generated at S104) and the measured positions of the global alignment marks on the workpiece W.
  • the image write controller 24 may generate the modified pattern data by re-sampling the pattern data based on the pattern adjustment data and the measured positions of the global alignment marks on the workpiece W to fit the measured position of the die D on the workpiece W.
  • the re-sampling performed at S106B is the same or substantially the same as the re-sampling discussed above with regard to S106 in FIG. 1A .
  • the image writer 22 writes/generates a pattern on the workpiece W according to the modified pattern data in the same manner as discussed above with regard to S108 in FIG. 1A .
  • the example embodiment shown in FIG. 1B enables features provided in a subsequent patterning step to be more accurately aligned with the one or more dies placed on the workpiece W by the pick-and-place unit 2.
  • FIG. 1C is a flow chart illustrating method for generating a pattern on a workpiece according to still another example embodiment.
  • FIG. 1C The example embodiment shown in FIG. 1C is described with regard to a situation in which a plurality of dies D are placed on the workpiece W by the pick-and-place unit 2.
  • the die placement system 14 measures the actual local alignment position of a subset (e.g., a cluster, such as 2x2 or 4x4) of the plurality of dies D on the workpiece W.
  • a subset e.g., a cluster, such as 2x2 or 4x4
  • the die placement system 14 measures the actual local alignment position of only a portion of the dies D on the workpiece W.
  • the die placement system 14 estimates positions of all of the plurality of dies D on the workpiece W based on the measured actual local alignment positions of the subset of the plurality of dies D on the workpiece W.
  • the positions of the dies D on the workpiece W are estimated using a last (or most recent) measured offset.
  • the last measured offset is combined with (e.g., summed with) a trend value dependent on the time and/or distance to the last measured offset.
  • the offset for all dies D on a carrier W is measured, and the measured information is used to build a model/map of how the placement error varies as function of time and/or placement on the carrier W.
  • some points may be sampled in time and space, and then calculated and estimated measurement values for components in-between may be added using interpolation.
  • each of the operations S104, S105, S106 and S108 are performed in the same or substantially the same as discussed above with regard to FIG. 1A , except that the image write controller 24 generates the pattern adjustment data at S104 based on the estimated die positions, rather than actual measured positions of the dies on the workpiece W.
  • the example embodiment shown in FIG. 1C enables features provided in a subsequent patterning step to be more accurately aligned with dies placed on the workpiece W by the pick-and-place unit 2.
  • the recalculated position of the die D on the workpiece W may be used by the die placement system 14 to match subsequent layers of dies to dies of the first layer. By using the re-calculated positions of the die on the workpiece W, subsequent layers of dies may be placed more accurately matched with the previous layer of dies.
  • At least some example embodiments do not require external measurement of the workpiece in a separate machine or in a LDI machine.
  • the expected position of the die on the workpiece may be calculated based on input from the local alignment position of the die (e.g., translation, rotation, etc.) and the position of the local or global alignment mark(s).
  • the actual position of the die on the workpiece may then be measured either immediately after the die is placed on the workpiece, after all dies are placed on the workpiece, or during placement of dies on the workpiece.
  • the measurement may also be performed in a separate module in connection with the pick-and-place machine (e.g., in a machine having a unit arranged in-between, which also may be used for hardening of glue).
  • the position data may then be used to match a second layer to the first layer (e.g., by feeding the data into a LDI tool, another pick-and-place tool or via a creation tool having local alignment capability).
  • FIG. 5 is a flow chart illustrating an example embodiment of a fan-out or embedded die process.
  • a multi-layer structure is formed on a workpiece.
  • a second (or subsequent) structure e.g., a conductor pattern or via hole pattern
  • a first (or previous) structure e.g., a layer of dies placed by the pick-and-place unit.
  • the example embodiment shown in FIG. 5 may enable more accurate alignment of the second structure with the first structure on the workpiece.
  • the die placement system 14 measures the actual positions of the one or more dies D on the workpiece W at S500.
  • the one or more dies D placed on the workpiece W constitute a first layer of the multi-layer structure to be formed on the workpiece W.
  • the position measurement controller 4 outputs the position data associated with the one or more dies D to the memory 20 in the same or substantially the same manner as discussed above with regard to S102 in FIG. 1A .
  • the image write controller 24 obtains (reads) the actual position data from the memory 20 and generates pattern adjustment data based on the actual position data obtained from the memory 20 as discussed above with regard to S104 in FIG. 1A .
  • the image write controller 24 generates modified pattern data based on the pattern adjustment data.
  • the image write controller 24 generates modified pattern data for a second or subsequent layer of the multi-layer structure (e.g., a conductor pattern or via hole pattern) to be formed on the workpiece W.
  • the first layer of the multi-layer structure is different from the second layer of the multi-layer structure.
  • the modified pattern data is generated in the same or substantially the same manner as discussed above with regard to S106 in FIG. 1A .
  • the image writer 22 forms the second layer of the multi-layer structure by writing/generating/patterning a pattern on the workpiece W according to the modified pattern data.
  • the pattern is written in the same or substantially the same manner as discussed above with regard to S108 in FIG. 1A .
  • Example embodiments may be utilized in a process where two or more dies are stacked on top of each other and where the top side of the first die is connected to the bottom side of the second die with relatively high alignment accuracy. If more dies are stacked in such a process, the top of the (n-1)-th die is connected to the bottom of the n-th die, where n is an integer larger the 2.
  • the position of each die may be measured in the first die level and the measured information may then be fed to the pick-and-place machine that is performing the second die level placement, thereby relaxing the requirements for accuracy on the first pick-and-place machine, which in turn allows the first pick-and-place machine to operate at significantly higher speeds.
  • example embodiments described herein need not include an external measurement tool.
  • the expected position of the die on the workpiece may be calculated based on input from the local alignment position of the die (e.g., translation, rotation, etc.) and the position of the local or global alignment mark(s).
  • the actual position of the die on the workpiece may then be measured either directly after the die is placed on the workpiece, after all dies are placed on the workpiece, or during placement of dies on the workpiece.
  • the measurement may also be performed in a separate module in connection with the pick-and-place machine (e.g., in a machine having a unit arranged in-between, which also may be used for hardening of glue).

Claims (18)

  1. Bras-transfert (14) comprenant une tête de montage (2), configuré pour prendre et placer des puces sur une pièce, la tête de montage comprenant :
    une unité de détermination de la position de la puce (5), l'unité de détermination de la position de la puce (5) est caractérisée en ce qu'elle est configurée pour effectuer une mesure ou une détection de la position réelle d'au moins une puce qui a déjà été placée sur la pièce par la tête de montage (2) et pendant une période comprise entre le placement de l'au moins une puce sur la pièce et la prise d'une puce suivante pour un placement sur la pièce, dans laquelle le bras-transfert (14) est configuré pour générer vers une unité externe des informations de position indiquant la position réelle mesurée, soit directement, soit indirectement par l'intermédiaire d'une mémoire (20), et dans laquelle les informations de position sont utilisées pour ajuster des données de motifs d'origine associées à un motif à générer sur la pièce.
  2. Bras-transfert (14) selon la revendication 1, dans lequel l'unité de détermination de la position de la puce (5) est configurée pour effectuer une mesure ou une détection de la position réelle de l'au moins une puce placée sur la pièce tandis que la tête de montage (2) est encore dans une position permettant de placer l'au moins une puce sur la pièce.
  3. Bras-transfert (14) selon la revendication 1, dans lequel l'unité de détermination de la position de la puce (5) est configurée pour mesurer la position réelle de l'au moins une puce placée sur la pièce par rapport à au moins une marque de mesure.
  4. Bras-transfert (14) selon la revendication 3, dans lequel l'au moins une marque de mesure est une marque locale de repérage ou une autre caractéristique unique associée ou connectée à une position sur la pièce.
  5. Bras-transfert (14) selon la revendication 1, dans lequel le bras-transfert est configuré pour générer des informations de position qui indiquent la position réelle de l'au moins une puce en incluant la mesure de la position de l'au moins une puce par rapport à au moins une marque locale de repérage ou à un autre point de référence d'où l'au moins une marque locale de repérage est située à une distance clairement définie.
  6. Bras-transfert (14) selon la revendication 5, dans lequel l'au moins une puce, ou un composant, est placé (e) sur une première couche, et dans lequel les informations de position sont adaptées pour être utilisées par un générateur de motifs (10) afin d'ajuster les données de motifs d'origine pour leur placement sur une seconde couche différente de la première couche.
  7. Bras-transfert (14) selon la revendication 6, dans lequel à la fois la première couche et la seconde couche sont des couches associées au même groupe de puces, ou de composants, placé (e) s.
  8. Bras-transfert (14) selon la revendication 6, dans lequel la première couche est une couche associée à un premier groupe de puces, ou de composants, placé (e) s et la seconde couche est une couche associée à un second groupe de puces, ou de composants, placé (e) s, différent du premier groupe de puces ou de composants.
  9. Bras-transfert (14) selon la revendication 1, dans lequel l'unité de détermination de la position de la puce (5) comprend une caméra configurée pour obtenir une image de la pièce.
  10. Bras-transfert (14) selon la revendication 9, dans lequel la caméra (5) est une caméra à transfert de charge.
  11. Bras-transfert (14) selon la revendication 1, dans lequel l'unité de détermination de la position de la puce (5) comprend un capteur configuré pour détecter la position de l'au moins une puce sur la pièce.
  12. Bras-transfert (14) selon la revendication 11, dans lequel le capteur (5) est un capteur laser configuré pour utiliser une lumière réfléchie ou une triangulation, ou les deux, pour détecter la position de l'au moins une puce sur la pièce.
  13. Bras-transfert (14) selon la revendication 9, dans lequel la caméra (5) est configurée pour obtenir une image couvrant seulement une sous-zone de la surface de la pièce, afin de mesurer la position réelle de l'au moins une puce, placée sur la pièce par rapport à au moins une marque de mesure.
  14. Bras-transfert (14) selon la revendication 13, dans lequel l'image obtenue par la caméra (5) comprend des informations de position réelle pour seulement un sous-ensemble de la pluralité des puces placées sur la pièce.
  15. Bras-transfert (14) selon la revendication 14, dans lequel le sous-ensemble de puces est égal à l'au moins une puce placée pendant la dernière action de prendre et placer réalisée par la tête de montage (2).
  16. Procédé permettant de déterminer la position de la puce placée sur une pièce, comprenant les étapes consistant à :
    prendre et placer la puce sur la pièce ;
    prendre une puce suivante pour un placement sur la pièce,
    le procédé est caractérisé en ce qu'il comprend des étapes supplémentaires consistant à :
    déterminer la position réelle de la puce placée sur la pièce en effectuant une mesure ou une détection de la position réelle de la puce, dans lequel la détermination de la position réelle de la puce placée sur la pièce est effectuée en mesurant la position réelle de la puce placée sur la pièce par rapport à au moins une marque de mesure, et dans lequel la détermination de la position réelle de la puce placée sur la pièce est effectuée pendant une période comprise entre le placement de la puce et la prise de la puce suivante pour un placement sur la pièce, et
    générer des informations de position indiquant la position réelle de la puce placée sur la pièce, dans lequel les informations de position comprennent des informations concernant la position réelle déterminée de la puce placée sur la pièce, et dans lequel les informations de position sont utilisées pour ajuster les données de motifs d'origine associées à un motif à générer sur la pièce.
  17. Procédé selon la revendication 16, dans lequel la détermination de la position réelle de la puce placée sur la pièce est effectuée tandis que la tête de montage (2) plaçant la puce sur la pièce est encore dans une position permettant de placer la puce.
  18. Procédé selon la revendication 16, dans lequel l'au moins une marque de mesure est une marque locale de repérage ou une autre caractéristique unique associée ou connectée à une position sur la pièce.
EP11778668.1A 2010-09-15 2011-09-15 Appareil et procédé permettant de générer des motifs sur des pièces Active EP2617053B1 (fr)

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EP2617053A2 (fr) 2013-07-24
KR20130127976A (ko) 2013-11-25
US20150082620A1 (en) 2015-03-26
WO2012035416A2 (fr) 2012-03-22
CN103210483B (zh) 2016-06-29
KR101819043B1 (ko) 2018-01-16
WO2012035416A3 (fr) 2012-05-10
US9032611B2 (en) 2015-05-19
CN103210483A (zh) 2013-07-17
US9648795B2 (en) 2017-05-09
JP6174487B2 (ja) 2017-08-02
JP2013545259A (ja) 2013-12-19

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