EP2601052B1 - Dispositif d'exposition d'objets à des rayons uv - Google Patents
Dispositif d'exposition d'objets à des rayons uv Download PDFInfo
- Publication number
- EP2601052B1 EP2601052B1 EP11767175.0A EP11767175A EP2601052B1 EP 2601052 B1 EP2601052 B1 EP 2601052B1 EP 11767175 A EP11767175 A EP 11767175A EP 2601052 B1 EP2601052 B1 EP 2601052B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- flat cable
- radiator
- cable connection
- support
- led arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
- B41F23/04—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2252/00—Sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
Definitions
- the invention relates to a device for UV irradiation of objects, in particular for curing coatings, with a plurality of UV radiator modules, each comprising an area arranged on a carrier LED array.
- a UV curing apparatus which comprises a plurality of UV LED arrays which are arranged in a row on a common panel in order to achieve uniform irradiation in the course of an object transport through the irradiation area.
- the radiator surface has gaps in the rows, so that object areas are exposed to UV radiation at different times. In addition, an extensive space is needed.
- the present invention seeks to further develop the devices known in the art and to ensure a high degree of flexibility, efficiency and quality in the irradiation, especially in a compact design especially for installation units.
- each UV lamp module has a flat cable connection provided with a plurality of connection lines for the electrical connection of the LED arrangement, and that the flat cable connection is arranged on a connection side of the carrier which can be attached or attached to a further UV lamp module.
- the lateral power supply, the LED arrays of the individual modules can be applied to a limited area with high power density and effectively cooled, while through the flat cable connection, a virtually seamless assembly is possible without restricting the possible combinations.
- connection lines of the flat cable connection extend at least in the region of the carrier in a plane transverse to the surface of the LED array side by side, so that only a narrow gap area must be kept free to an adjacent module and a convenient connection option for a planar LED array is provided ,
- a further improvement can be achieved in that the flat cable connection has a flexible ribbon containing the connection lines in the form of strip conductors.
- connection lines of the flat cable connection with a small line cross-section can be connected to the LED arrangement at the ends via bonding wires.
- the thickness of the flat cable connection is less than 3 mm, preferably between 1 and 2 mm.
- the UV radiator modules have a rectangular carrier and can be seamlessly joined together on at least two connecting sides of the carrier with further UV radiator modules, so that the radiator surface formed together is uniformly occupied by LEDs.
- the support for the LED arrangement is preferably arranged in the form of a metal plate on a cooler, so that efficient cooling is possible far away from temperature gradients.
- radiator protrudes laterally on one side of the carrier.
- a further advantageous embodiment provides that the LED arrangement is formed by a matrix of LEDs, wherein each two adjacent LED rows are connected in series, so that there is a one-sided connection possibility.
- the LED array is connected via the flat cable connection with a DC voltage supply of the UV lamp module, wherein the DC voltage provided for a series connection of the LEDs more than 100 V, preferably 300 to 500 volts.
- each UV radiator module has more than 1000, preferably approximately 1500 LEDs formed by individual chips.
- the UV lamp modules can have an optical power density of more than 10 W / cm 2 .
- a further embodiment not according to the invention provides a device for UV irradiation of objects, in particular for curing coatings, with a plurality of UV radiator modules, each comprising an LED array arranged on a carrier and occupied by LEDs in a regular grid common radiator surface are composable, so that no radiation inhomogeneities arise in the region of the connecting sides between the carriers.
- the irradiation device 10 shown in the drawing enables the UV irradiation of objects which are transported through the irradiation area, in particular in the form of substrates coated with printing inks, varnishes or adhesives, for example in a printing machine for chemical crosslinking or curing of the coating.
- the irradiation device 10 is composed of a plurality of UV radiator modules 12, each comprising one mounted on a support plate 14 grid-shaped LED assembly 16 and a seamlessly attachable to an adjacent radiator module connecting side 18 with a flat cable connection 20 for electrical connection of the LED -Anowski 16 are provided.
- each radiator module 12 is assembled so that the total formed radiator surface 22 is occupied in a uniform grid with LEDs 24.
- the individual radiator modules 12 can be seamlessly combined with other modules 12 on one, two or three sides (connecting sides 18) of their rectangular support plate 14, while one remaining side (radiator side 26) of the support plate 14 is kept free for a coolant supply.
- Each cooler block 28 can be connected via a feed 30 and return 32 with a continuous in the longitudinal direction of the radiator modules 12 two-channel coolant guide 34.
- the boards 36 of an electronic control system and power supply 38 are arranged, which are also cooled in this way.
- the web-shaped flat cable connection 20 along a connecting side 18 of the support plate 14 is arranged so that the LED assembly 16 is connected to the power supply 38 without a disturbing supernatant prevents the seamless combination with another radiator module 12.
- the term "seamless" in this context means that the mutual distance of the LEDs 24 across the flat cable connection 20 remains substantially constant, so that no radiation inhomogeneities arise.
- the thickness of the flat cable connection 20 is expediently between 1 and 2 mm.
- the flat cable connection 20 has a plurality of connection lines 40 in the form of parallel conductor tracks, of which in Fig. 2 for the sake of clarity, only some are illustrated by dashed lines. These extend at least with their end portions in a plane transverse to the surface of the adjacent support plate 14.
- This carrier-side region 42 of the flat cable connection 20 is rigid as a rigid composite executed, as will be explained in more detail below.
- the lower board-side region 44 of the flat cable connection is bendable as a flex line, in order to compensate, if necessary, building tolerances.
- each radiator module 12 is formed on each radiator module 12 by a regular matrix of LEDs 24, which are arranged in rows 46 at a defined mutual distance, for example, of a few millimeters, this distance also over the flat cable connection 20 away an adjacent radiator module 12 is maintained.
- each emitter module 12 can have more than 1000, expediently about 1500 LEDs 24 formed by individual chips.
- an optical power density of more than 10 W / cm 2 can be achieved at a wavelength of about 395 nm, so that effective crosslinking or hardening of the irradiated coatings is possible.
- a combination of different irradiation wavelengths is possible by using LEDs 24 mixed with the desired wavelengths.
- Fig. 4 symbolically simplifies the wiring of the individual LEDs 24 in a radiator module 12.
- two adjacent LED rows 46 are connected in a series connection as a strand of about 100 LEDs and a total of about the connection lines 40 of the flat cable connection 20 with a DC voltage of about 400th Voltage can be applied.
- the electrical connection of the LED rows 46 is effected by a direct bonding wire connection 48 between the first and last LED 24 and the free end face of the connection line 40.
- the upper region 42 of the flat cable connection 20 is as it were as a miniaturized circuit board a sandwiched laminate structure 50 stiffened.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microbiology (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Claims (13)
- Dispositif d'irradiation aux UV d'objets, notamment pour le durcissement de revêtements, comprenant plusieurs modules sources de rayonnement UV (12) qui comprennent respectivement un arrangement de LED (16) disposé à plat sur un support (14), caractérisé en ce que chaque module source de rayonnement UV (12) possède une liaison par câble plat (20) pourvue d'une pluralité de lignes de raccordement (40) destinées au raccordement électrique de l'arrangement de LED (16), et en ce que la liaison par câble plat (20) est disposée sur un côté de liaison (18) du support (14) qui peut être adjoint ou qui est adjoint à un module source de rayonnement UV (12) supplémentaire.
- Dispositif selon la revendication 1, caractérisé en ce que les lignes de raccordement de la liaison par câble plat (20), au moins dans la zone du support (14), s'étendent latéralement les unes à côté des autres dans un plan transversal à la surface de l'arrangement de LED (16).
- Dispositif selon la revendication 1 ou 2, caractérisé en ce que la liaison par câble plat (20) possède une bande plate flexible qui contient les lignes de raccordement (40) sous la forme de pistes conductrices.
- Dispositif selon l'une des revendications 1 à 3, caractérisé en ce que la liaison par câble plat (20) est rigidifiée à une portion d'extrémité adjointe au côté de liaison (18) du support (14) par une pièce de liaison rigide (50), notamment une structure stratifiée de type sandwich.
- Dispositif selon l'une des revendications 1 à 4, caractérisé en ce que les lignes de raccordement de la liaison par câble plat (20) sont reliées du côté frontal à l'arrangement de LED (16) par le biais de fils de connexion (48).
- Dispositif selon l'une des revendications 1 à 5, caractérisé en ce que l'épaisseur de la liaison par câble plat (20) est inférieure à 3 mm, de préférence comprise entre 1 et 2 mm.
- Dispositif selon l'une des revendications 1 à 6, caractérisé en ce que les modules sources de rayonnement UV (12) possèdent un support (14) de forme parallélépipédique et peuvent être assemblés sans soudure avec des modules sources de rayonnement UV (12) supplémentaires en au moins deux côtés de liaison (18) du support (14), de sorte que la surface de source de rayonnement formée en commun est occupée de manière uniforme par des LED (24).
- Dispositif selon l'une des revendications 1 à 7, caractérisé en ce que le support (14) pour l'arrangement de LED (16) est disposé sur un radiateur (28).
- Dispositif selon la revendication 8, caractérisé en ce que le radiateur (28) dépasse latéralement sur un côté du support (14).
- Dispositif selon l'une des revendications 1 à 9, caractérisé en ce que l'arrangement de LED (16) est formé par une matrice de LED (24), deux rangées de LED (46) respectivement voisines étant branchées en série.
- Dispositif selon l'une des revendications 1 à 10, caractérisé en ce que l'arrangement de LED (16) est relié par le biais de la liaison par câble plat (20) avec une alimentation en courant continu du module source de rayonnement UV (12), la tension continue délivrée pour un circuit série des LED (24) étant supérieure à 100 V, de préférence égale à 300 à 500 volts.
- Dispositif selon l'une des revendications 1 à 11, caractérisé en ce que l'arrangement de LED (16) de chaque module source de rayonnement UV (12) possède plus de 1000, de préférence environ 1500 LED (24) formées par des puces individuelles.
- Dispositif selon l'une des revendications 1 à 12, caractérisé en ce que les modules sources de rayonnement UV (12) possèdent une densité de puissance optique supérieure à 10 W/cm2.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201010038802 DE102010038802A1 (de) | 2010-08-02 | 2010-08-02 | Vorrichtung zur UV-Bestrahlung von Objekten |
PCT/EP2011/062877 WO2012016891A1 (fr) | 2010-08-02 | 2011-07-27 | Dispositif d'exposition d'objets à des rayons uv |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2601052A1 EP2601052A1 (fr) | 2013-06-12 |
EP2601052B1 true EP2601052B1 (fr) | 2016-08-31 |
Family
ID=44773030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11767175.0A Not-in-force EP2601052B1 (fr) | 2010-08-02 | 2011-07-27 | Dispositif d'exposition d'objets à des rayons uv |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2601052B1 (fr) |
DE (1) | DE102010038802A1 (fr) |
WO (1) | WO2012016891A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10180248B2 (en) | 2015-09-02 | 2019-01-15 | ProPhotonix Limited | LED lamp with sensing capabilities |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015160320A (ja) * | 2014-02-26 | 2015-09-07 | セイコーエプソン株式会社 | 照射装置および画像記録装置 |
CN105413991A (zh) * | 2015-12-08 | 2016-03-23 | 淮南纪兴源机电设备有限公司 | 一种往复式uv固化机 |
DE102016112122B4 (de) * | 2015-12-23 | 2021-01-07 | Qingdao LED optoelectronic technology Co.,LTD | LED-Aushärtungseinrichtung für UV-Druckfarben |
ITUB20161205A1 (it) | 2016-03-01 | 2017-09-01 | Cefla S C | Apparato e metodo per l’essiccazione/polimerizzazione di prodotti chimici mediante modulo a led |
IT201800010863A1 (it) * | 2018-12-06 | 2020-06-06 | Ind Chimica Adriatica S P A In Sigla Ica S P A | Sistema meccanico di riflessione ed irraggiamento per la reticolazione di vernici polimerizzabili uv. |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7671346B2 (en) | 2003-01-09 | 2010-03-02 | Con-Trol-Cure, Inc. | Light emitting apparatus and method for curing inks, coatings and adhesives |
-
2010
- 2010-08-02 DE DE201010038802 patent/DE102010038802A1/de not_active Withdrawn
-
2011
- 2011-07-27 WO PCT/EP2011/062877 patent/WO2012016891A1/fr active Application Filing
- 2011-07-27 EP EP11767175.0A patent/EP2601052B1/fr not_active Not-in-force
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10180248B2 (en) | 2015-09-02 | 2019-01-15 | ProPhotonix Limited | LED lamp with sensing capabilities |
Also Published As
Publication number | Publication date |
---|---|
WO2012016891A1 (fr) | 2012-02-09 |
DE102010038802A1 (de) | 2012-02-02 |
EP2601052A1 (fr) | 2013-06-12 |
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