EP2965358B1 - Module del et dispositif d'éclairage équipé dudit module del - Google Patents

Module del et dispositif d'éclairage équipé dudit module del Download PDF

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Publication number
EP2965358B1
EP2965358B1 EP14708246.5A EP14708246A EP2965358B1 EP 2965358 B1 EP2965358 B1 EP 2965358B1 EP 14708246 A EP14708246 A EP 14708246A EP 2965358 B1 EP2965358 B1 EP 2965358B1
Authority
EP
European Patent Office
Prior art keywords
leds
led
carrier
led module
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP14708246.5A
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German (de)
English (en)
Other versions
EP2965358A2 (fr
Inventor
Stephan Ebner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zumtobel Lighting GmbH Austria
Original Assignee
Zumtobel Lighting GmbH Austria
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zumtobel Lighting GmbH Austria filed Critical Zumtobel Lighting GmbH Austria
Publication of EP2965358A2 publication Critical patent/EP2965358A2/fr
Application granted granted Critical
Publication of EP2965358B1 publication Critical patent/EP2965358B1/fr
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/10—Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED module according to the preamble of claim 1, which consists of an arrangement of electronically interconnected LEDs and a support for the LEDs, and an arrangement for emitting light with such an LED module.
  • Basis for the present invention is the currently common interconnection of LEDs on boards to series and parallel circuits.
  • a parallel connection of an arbitrary number of LED series circuits is selected here.
  • carrier boards are considered in the present case, which are flat and on which the LEDs are arranged in a uniform grid.
  • Such an arrangement is currently used to operate LEDs with low power consumption efficiently on common high-voltage converters.
  • the same number of LEDs is interconnected within such interconnections in all parallel series circuits or strings.
  • LED modules which are provided for illumination purposes and configured in the manner described above, in operation a considerable heat is generated by the LEDs, which should be dissipated efficiently to reduce the thermal load of the LEDs or in a designated temperature range to keep and thus extend their life.
  • metal core boards are used, which are optionally coupled with corresponding heat sinks, through which then the heat can be dissipated.
  • the thermal load of the carrier and in particular the LEDs arranged thereon vary in size.
  • the heat is dissipated over the edge regions or end regions of a mainly elongate LED board much more effective than over the central or central region. Due to this imbalance, the LEDs from the central area must be cooled better or the cooling measures must be designed more effective, which entails a higher cost.
  • each LED beach is here separately connected to a corresponding output of a driver and is individually supplied with a corresponding power.
  • the present invention has the object to distribute the thermal load for LEDs on a board evenly without disturbing the uniform arrangement of the LEDs or to make the cooling in the center more efficient.
  • an LED module which has an arrangement of electronically interconnected LEDs in parallel circuits of series circuits of the LEDs and a carrier or a circuit board, which is provided as a support structure for the LEDs, wherein the parallel circuit is chosen such that in that the arrangement of the LEDs has a uniform grid, wherein the number of LEDs of a series circuit from the outer region of the carrier is smaller than the number of LEDs of one Series connection from the inner region and wherein in operation, the LEDs of the series circuit from an outer region of the carrier each subject to a stronger current load than the LEDs of the series circuit from an inner region ,.
  • the design of the LED interconnection according to the invention which compensates for the imbalance in the thermal load present in LED modules of the prior art, can be realized in different ways.
  • the asymmetrical interconnection is characterized in that the number of LEDs in a strand located in the edge region of the carrier or the printed circuit board is reduced compared to the number of LEDs in one strand from the central region. This means that more series circuits are found in the edge area of the board than in the center or in the central area of the board, although the arrangement of the LEDs as a whole is uniform or homogeneous. The difference in the number of LEDs of the individual strands has the consequence that The LEDs in the center or in the middle area are now subject to a lower current load and thus produce less heat.
  • a further useful effect can lie in a targeted amplification of luminous flux at the edge region of the LED modules. This can lead to a higher homogeneity of the luminances on a light exit surface, in particular in the case of a planar arrangement of a multiplicity of LED modules according to the invention combined with diffuse optical systems.
  • a sketch of an LED module 1 according to the invention is shown according to the first embodiment, consisting of an elongate planar support or a circuit board 2 and arranged thereon in a uniform grid LEDs 3, which are connected via electrically conductive connections 4 to a parallel circuit of eleven series circuits 6.
  • the uniform grid of five rows 5, each with nine LEDs 3 is formed.
  • all the LEDs 3 are preferably substantially identical in at least their forward voltage, more preferably identical in all their properties, with respect to the forward voltage being understood to mean that the deviations from each other should be as low as possible below 0.1V.
  • the interconnection of the LEDs 3 is carried out in such a way that the number of LEDs 3 per series circuit 6 in the central or middle row on the carrier 2 is greatest and that this number is smaller, the farther an observed row 5 from the center or center axis is removed.
  • This is particularly evident in this embodiment in that - counted from above - the first row 5 three series circuits 6, each with three LEDs 3, the second row 5 two series circuits 6 each with five or four LEDs 3 and the third row, the at the same time is the most central, a series circuit 6 with nine LEDs 3 has.
  • An immediately resulting consequence therefore consists in that, in the case of an interconnection according to this first exemplary embodiment, basically more series circuits 6 or LED strands 6 are required than ultimately LED rows 5 are arranged on the carrier 2.
  • a voltage provided by an operating device (not shown) is applied between the common end points 7 and 8 of all the electrically conductive connections 4. Since all series circuits 6 are supplied with the same voltage during operation, the LEDs 3 are in the series circuits 6 in the edge region of the carrier 2 due to their smaller number per series circuit 6 individually under increased voltage load and thus increased power load. Thus, the focal points of the current load of all LEDs 3 are outsourced to the outer regions of the carrier 2. This has the desired effect that now also the focus of heat generation outsourced to the outer regions of the carrier 2 and so the central regions of the carrier 2 are thermally relieved.
  • Fig. 1 serves primarily to the basic representation of the inventive concept, namely to use LED strands, each with different numbers of LEDs. In reality, the numbers of LEDs will differ less than this Fig. 1 is shown. For example, a concrete embodiment would be conceivable in which three LED strands are provided, wherein the middle Stang consists of 21 LEDs and the two outer strands each have 18 LEDs.
  • an LED string it would also be conceivable for an LED string to extend over several rows of the LED board in order to achieve a uniform grid arrangement of LEDs.
  • the last LEDs of the middle strand e.g. the last LEDs of the middle strand (with 21 LEDs) are arranged in the outer rows, so that a uniform LED grid with 3 x 19 LEDs results.
  • heat is primarily generated in the side areas in order to achieve the desired goal of uniform thermal stress.
  • Fig.2 is shown as an arrangement 11 for cooling such an LED module 1 according to the invention, as shown in FIG Fig. 1 is shown is possible.
  • the LED module 1 is fastened, for example, on its underside on a heat sink 12 or coupled thereto, wherein the means for fastening in Fig. 2 are not visible.
  • the LED module 1 is thermally evenly utilized during operation even without cooling measures due to the inventive design, with the result that the heat sink 12 no further or more specific cooling mechanisms below the center of the LED module. 1 in the arrangement 11 as required at the edge of the heat sink 12. That is, the equalization of the thermal load according to the invention is achieved solely by the design of the LED module 1, so that the use of the heat sink 12, the thermal load can be further reduced overall without the heat sink would have to be formed in any particular way.
  • Fig. 3 is a cross-sectional diagram of an arrangement 15 for light emission, consisting of inventive LED module 1 in operation and an optical diffuser plate 18 shown.
  • the LED module 1 and the diffuser plate 18 are arranged substantially parallel to each other at a certain distance.
  • the LEDs 3 in the edge region of the carrier 2 emit more light than the LEDs 3 in the central region due to the higher current load, with the result that the radiation density 16 at the edge is greater than the radiation density 17 in the center ,
  • the diffuser plate can now be designed to homogenize or evenify the light of the LED module 1 in the emission direction, which is characterized by the uniform radiation density 19.
  • the LEDs 3 may even be advantageous for the LEDs 3 to emit more light in an edge region of the carrier 2 than the LEDs 3 in the central region.
  • a plurality of LED modules 1 are arranged next to one another on a preferably planar surface in combination with an optical diffuser plate 18, preferably according to FIG Fig.
  • the distance of the LED modules 1 with each other is greater than the distance between the LED rows with each other on a module, which would mean that - provided - same light emission of all LEDs 3, the areas between the LED modules 1 appeared less bright
  • This effect is now automatically compensated by means of the LED modules 1 according to the invention in that the LEDs 3 in the edge regions of the respective LED modules 1 shine brighter due to the higher current load, resulting in a total of significantly more homogeneous appearance of the brightness distribution leads.
  • the optical diffuser plate 18 then additionally provides for a better homogenization.
  • Fig. 4 is a sketch of a non-inventive LED module 22 according to a second embodiment, analogous to the LED module 1 according to variant one off Fig. 1 , shown.
  • One of the major differences between the LED module 1 of Fig. 1 and the LED module 22 of Fig. 4 consists in the fact that in the LED module 22 different LEDs are used, which differ in their forward voltage. LEDs with different forward voltages are identified by numbers 24, 26 and 28, with identical numbers representing identical forward voltages. However, each LED row 25, 27 or 29 preferably only has LEDs with identical forward voltages, ie, within a row, the deviations in the forward voltages are already below 0.1V as we mentioned earlier. The differences in the forward voltages between the various LED rows 25, 27, 29, however, should preferably be at least 0.1V.
  • the second major difference is that in the module of Fig. 4 Each series circuit has the same number of LEDs. As a result, the number of LED rows coincides with the number of series circuits. Furthermore, the electrical connection is no longer asymmetrical, as in the LED module 1 of Fig. 1 the case was.
  • the complete arrangement of the LEDs and electrical connections on the carrier 23 is conveniently placed axially symmetrically about the LED array 29 so as not to cause asymmetry in the thermal loading of the carrier 23 during operation, even if the total thermal load of the carrier were not uniform.
  • the carrier 23 from Fig. 4 and the carrier 2 off Fig. 1 do not necessarily have to be different.
  • the forward voltages of the LEDs 24 in the outer row 25 are selected to be smaller than the forward voltages of the LEDs 26 in row 27.
  • the forward voltages of the LEDs 26 in row 27 are to be selected to be smaller than the forward voltages of the LEDs
  • AchsenLiteung all properties on the series 29 are selected to be smaller than the forward voltages of the LEDs
  • LEDs of different forward voltage are made possible for example by taking LEDs of the identical type, which nevertheless have different forward voltages during production.
  • LEDs of the identical type which nevertheless have different forward voltages during production.
  • the use of completely different types of LEDs is possible.
  • the two ideas for a better distribution of the thermal load can also be combined with one another. In this case, then different LEDs are used on the module and the lengths of the LED series circuits varies.
  • FIG. 4 illustrated LED module in an analogous manner as the module according to FIG. 1 be combined with heat sinks or optical elements.
  • the LED module 1 can be easily replaced by the LED module 22.
  • an LED module according to the invention it is possible to save costs that arise through the use of cooling measures. Further, by optimizing the distribution of the thermal stress, the life of LEDs can be extended and more homogeneous appearances can be obtained with respect to the light output inside and / or outside of lighting devices containing an LED module according to the invention.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Led Device Packages (AREA)

Claims (4)

  1. Module de LED (1), présentant un agencement de LED (3) branchées électroniquement et d'un support (2) pour les LED (3), en présence d'un montage en parallèle de montages en série (6) de LED (3),
    le montage en parallèle étant choisi de telle sorte que la contrainte thermique sur le support (2) causée par le fonctionnement des LED (3) est répartie de façon essentiellement régulière sur le support (2),
    l'agencement des LED (3) présentant une trame régulière,
    et, pendant le fonctionnement, les LED (3) du montage en série (6) en provenance d'une zone extérieure du support (2) étant exposées respectivement à une charge de courant plus forte que les LED (3) du montage en série (6) en provenance d'une zone intérieure,
    caractérisé en ce que
    le nombre de LED (3) d'un montage en série (6) en provenance de la zone extérieure du support (2) est plus faible que le nombre de LED (3) d'un montage en série (6) en provenance de la zone intérieure.
  2. Module de LED selon la revendication 1,
    caractérisé en ce que
    toutes les LED (3) sur le support (2) sont essentiellement identiques.
  3. Agencement destiné à l'émission de lumière (15), composé du module de LED (1, 22) selon l'une des revendications précédentes et d'un dispositif optique (18),
    caractérisé en ce que
    le dispositif optique (18) est conçu pour homogénéiser ou respectivement uniformiser essentiellement la lumière (16, 17) émise par le module de LED (1, 22) pendant le fonctionnement.
  4. Agencement selon la revendication 3,
    caractérisé en ce
    qu'il présente plusieurs modules de LED (1, 22) disposés de façon juxtaposée.
EP14708246.5A 2013-03-05 2014-03-05 Module del et dispositif d'éclairage équipé dudit module del Active EP2965358B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201310203728 DE102013203728A1 (de) 2013-03-05 2013-03-05 LED-Modul und Beleuchtungsanordnung mit entsprechendem Modul
PCT/EP2014/054240 WO2014135577A2 (fr) 2013-03-05 2014-03-05 Module à del et dispositif d'éclairage équipé dudit module à del

Publications (2)

Publication Number Publication Date
EP2965358A2 EP2965358A2 (fr) 2016-01-13
EP2965358B1 true EP2965358B1 (fr) 2018-05-09

Family

ID=50236169

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Application Number Title Priority Date Filing Date
EP14708246.5A Active EP2965358B1 (fr) 2013-03-05 2014-03-05 Module del et dispositif d'éclairage équipé dudit module del

Country Status (5)

Country Link
US (1) US10001267B2 (fr)
EP (1) EP2965358B1 (fr)
CN (1) CN105190884B (fr)
DE (1) DE102013203728A1 (fr)
WO (1) WO2014135577A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3061625B1 (fr) * 2016-12-30 2020-07-24 Commissariat Energie Atomique Structure electronique comprenant une matrice de dispositifs electroniques presentant des performances thermiques ameliorees
FR3078442B1 (fr) * 2018-02-26 2023-02-10 Valeo Vision Source lumineuse electroluminescente destinee a etre alimentee par une source de tension

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2878883A1 (fr) * 2012-07-25 2015-06-03 Panasonic Intellectual Property Management Co., Ltd. Module électroluminescent

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US8632215B2 (en) * 2003-11-04 2014-01-21 Terralux, Inc. Light emitting diode replacement lamp
GB2417824A (en) * 2004-09-02 2006-03-08 Custom Interconnect Ltd LED light source
JP5025913B2 (ja) * 2005-05-13 2012-09-12 シャープ株式会社 Ｌｅｄ駆動回路、ｌｅｄ照明装置およびバックライト
JP2007311561A (ja) 2006-05-18 2007-11-29 Showa Denko Kk 表示装置、発光装置、および固体発光素子基板
JP4877552B2 (ja) * 2007-07-13 2012-02-15 Ｎｅｃディスプレイソリューションズ株式会社 照明装置
RU2420930C1 (ru) * 2007-07-27 2011-06-10 Шарп Кабусики Кайся Осветительное устройство и устройство жидкокристаллического дисплея
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WO2011077863A1 (fr) * 2009-12-25 2011-06-30 シャープ株式会社 Dispositif d'éclairage, dispositif d'affichage et dispositif de réception de télévision
JP5545848B2 (ja) 2010-06-24 2014-07-09 シチズン電子株式会社 半導体発光装置
JP5873625B2 (ja) * 2010-08-20 2016-03-01 セイコーエプソン株式会社 光源装置及びプロジェクター
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Publication number Priority date Publication date Assignee Title
EP2878883A1 (fr) * 2012-07-25 2015-06-03 Panasonic Intellectual Property Management Co., Ltd. Module électroluminescent

Also Published As

Publication number Publication date
CN105190884B (zh) 2018-05-08
US20160178177A1 (en) 2016-06-23
CN105190884A (zh) 2015-12-23
WO2014135577A2 (fr) 2014-09-12
DE102013203728A1 (de) 2014-09-25
WO2014135577A3 (fr) 2015-01-22
EP2965358A2 (fr) 2016-01-13
US10001267B2 (en) 2018-06-19

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