EP2965358A2 - Module à del et dispositif d'éclairage équipé dudit module à del - Google Patents

Module à del et dispositif d'éclairage équipé dudit module à del

Info

Publication number
EP2965358A2
EP2965358A2 EP14708246.5A EP14708246A EP2965358A2 EP 2965358 A2 EP2965358 A2 EP 2965358A2 EP 14708246 A EP14708246 A EP 14708246A EP 2965358 A2 EP2965358 A2 EP 2965358A2
Authority
EP
European Patent Office
Prior art keywords
leds
led module
carrier
led
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14708246.5A
Other languages
German (de)
English (en)
Other versions
EP2965358B1 (fr
Inventor
Stephan Ebner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zumtobel Lighting GmbH Austria
Original Assignee
Zumtobel Lighting GmbH Austria
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zumtobel Lighting GmbH Austria filed Critical Zumtobel Lighting GmbH Austria
Publication of EP2965358A2 publication Critical patent/EP2965358A2/fr
Application granted granted Critical
Publication of EP2965358B1 publication Critical patent/EP2965358B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/10—Arrangement of heat-generating components to reduce thermal damage, e.g. by distancing heat-generating components from other components to be protected
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED module according to the preamble of
  • Claim 1 which consists of an arrangement of electronically interconnected LEDs and a support for the LEDs, and an arrangement for emitting light with such an LED module.
  • Basis for the present invention is the currently common interconnection of LEDs on boards to series and parallel circuits. Preferably, a parallel connection of an arbitrary number of LED series circuits is selected here.
  • carrier boards are considered in the present case, which are flat and on which the LEDs are arranged in a uniform grid.
  • Such an arrangement is currently used to operate LEDs with low power consumption efficiently on common high-voltage converters.
  • the same number of LEDs is interconnected within such interconnections in all parallel series circuits or strings.
  • LED modules which are provided for illumination purposes and designed in the manner described above, in operation, a considerable heat is generated by the LEDs, which should be dissipated efficiently to reduce the thermal load of the LEDs or in a planned
  • Equidistant arrangement of the LEDs on a board is usually far more effectively dissipated via the edge regions or end regions of a mainly elongate LED board heat than over the central or central area.
  • an LED module which has an arrangement of electronically interconnected LEDs in parallel circuits of series circuits of the LEDs and a carrier or a circuit board, which is provided as a support structure for the LEDs, wherein the parallel circuit is chosen such that that the thermal stress caused by the operation of the LEDs is distributed substantially uniformly over the carrier.
  • the design according to the invention of the LED interconnection which compensates for the imbalance in the thermal load present in LED modules of the prior art, can be realized in different ways.
  • a targeted asymmetric parallel connection of the LED series circuits or LED strands is provided, although the LEDs are arranged despite all preferably on a two-dimensional uniform grid, which is located on a circuit board.
  • This asymmetrical interconnection is characterized in that the number of LEDs in a strand located in the edge region of the carrier or the printed circuit board is reduced compared to the number of LEDs in one strand from the central region. This means that you will find more series connections in the edge area of the board than in the center or in the central area of the board, although the
  • the difference in the number of LEDs of the individual strands also means that the LEDs in the center or in the middle area are now subject to a lower current load and thus produce less heat. This takes into account the fact that the heat in the middle or central region of the module can be dissipated less effectively to the environment or cooling elements coupled to the module, so that ultimately seen a total of significantly more uniform thermal load across area.
  • all the LEDs on the board are substantially identical.
  • LEDs with different forward voltages are used.
  • Each series circuit or each string has in this case LEDs with in
  • each strand preferably has an identical number of LEDs, although it would be readily possible to use both embodiments in the sense of the problem solution according to the invention
  • the LED strands would not only differ in terms of the LEDs but also on the number of LEDs.
  • a further useful effect in both exemplary embodiments can lie in a targeted amplification of luminous fluxes at the edge region of the LED modules. This can in particular in a planar arrangement of a variety of
  • LED modules combined with diffuse optical systems according to the invention lead to a higher homogeneity of the luminance on a light exit surface.
  • FIG. 1 shows a sketch of an LED module according to the invention according to a first embodiment
  • FIG. 2 shows a perspective sketch of the LED module of FIG. 1 coupled to a heat sink
  • a cross-sectional diagram of an arrangement for light emission consisting of the LED module and an optical diffuser plate and
  • FIG. 1 shows a sketch of an LED module 1 according to the invention in accordance with the first exemplary embodiment, consisting of an elongate planar carrier or a circuit board 2 and LEDs 3 arranged thereon in a uniform grid, which are connected via electrically conductive connections 4 to a parallel circuit of eleven series circuits 6.
  • the uniform grid of five rows 5, each with nine LEDs 3 is formed.
  • all the LEDs 3 are preferably substantially identical in at least their forward voltage, more preferably identical in all their properties, with respect to the forward voltage being understood to mean that the deviations from each other should be as low as possible below 0.1V.
  • the interconnection of the LEDs 3 is carried out in such a way that the number of LEDs 3 per series circuit 6 in the central or middle row on the carrier 2 is greatest and that this number is smaller, the farther an observed row 5 from the center or center axis is removed.
  • This is particularly evident in this embodiment in that - counted from above - the first row 5 three series circuits 6, each with three LEDs 3, the second row 5 two series circuits 6 each with five or four LEDs 3 and the third row, the at the same time is the most central, a series circuit 6 with nine LEDs 3 has.
  • An immediately resulting consequence therefore consists in that, in the case of an interconnection according to this first exemplary embodiment, basically more series circuits 6 or LED strands 6 are required than ultimately LED rows 5 are arranged on the carrier 2.
  • Fig. 1 is primarily the basic representation of the inventive concept, namely to use LED strands, each with different numbers of LEDs. In reality, the numbers of LEDs will be less different than shown in FIG. For example, a concrete embodiment would be conceivable in which three LED strands are provided, wherein the middle Stang consists of 21 LEDs and the two outer strands each have 18 LEDs.
  • an LED string it would also be conceivable for an LED string to extend over several rows of the LED board in order to achieve a uniform grid arrangement of LEDs.
  • the last LEDs of the middle strand e.g. the last LEDs of the middle strand (with 21 LEDs) are arranged in the outer rows, so that a uniform LED grid with 3 x 19 LEDs results.
  • heat is primarily generated in the side areas in order to achieve the desired goal of uniform thermal stress.
  • LED module 1 according to the invention, as shown in Fig. 1, is made possible.
  • the LED module 1 is fastened, for example, on its underside on a heat sink 12 or coupled thereto, wherein the means for attachment in Fig. 2 are not visible. It is assumed in the present case that the LED module 1 due to the inventive design in operation itself without
  • Cooling measures is thermally evenly utilized, which has the consequence that the heat sink 12 requires no further or more specific cooling mechanisms under the center of the LED module 1 in the assembly 11 than at the edge of the
  • Heat sink 12th d the equalization of the thermal load according to the invention is achieved solely by the design of the LED module 1, so that by the use of the heat sink 12, the thermal load can be further reduced overall without the heat sink would have to be formed in any special way.
  • FIG. 3 shows a cross-sectional sketch of an arrangement 15 for emitting light, consisting of LED module 1 according to the invention in operation and an optical diffuser plate 18.
  • the LED module 1 and the diffuser plate 18 are arranged substantially parallel to each other at a certain distance.
  • the LEDs 3 in the edge region of the carrier 2 emit more light than the LEDs 3 in the central region due to the higher current load, with the result that the radiation density 16 at the edge is greater than the radiation density 17 in the center ,
  • the diffuser plate can now be designed to homogenize or evenify the light of the LED module 1 in the emission direction, which is characterized by the uniform radiation density 19.
  • the LEDs 3 may even be advantageous for the LEDs 3 to emit more light in an edge region of the carrier 2 than the LEDs 3 in the central region.
  • a plurality of LED modules 1 are arranged next to one another on a preferably flat surface in combination with an optical diffuser plate 18, preferably according to FIG. 3.
  • the spacing between the LED modules 1 is also greater than the spacing between the LED rows on a module, which would mean that - assuming - equally strong
  • the optical diffuser plate 18 then additionally provides a better homogenization.
  • FIG. 4 shows a sketch of an LED module 22 according to the invention in accordance with a second exemplary embodiment, analogous to the LED module 1 according to variant one from FIG. 1.
  • One of the essential differences between the LED module 1 of FIG. 1 and the LED module 22 of FIG. 4 is that in the LED module 22 different LEDs are used, which differ in their forward voltage. LEDs with different forward voltages are identified by numbers 24, 26 and 28, with identical numbers for identical
  • each row of LEDs 25, 27 or 29 preferably each have only LEDs with identical forward voltages, that is, within a row, the variations in forward voltages we mentioned are below 0.1V.
  • the differences in the forward voltages between the various LED rows 25, 27, 29, however, should preferably be at least 0.1V.
  • each series circuit has the same number of LEDs.
  • the number of LED rows coincides with the number of series circuits.
  • the electrical connection is no longer asymmetrical, as was the case with the LED module 1 of FIG.
  • the complete arrangement of the LEDs and electrical connections on the carrier 23 is suitably axially symmetrical about the LED row 29 placed around none
  • the carrier 23 from FIG. 4 and the carrier 2 from FIG. 1 do not necessarily have to be different.
  • the forward voltages of the LEDs 24 in the outer row 25 are selected to be smaller than the forward voltages of the LEDs 26 in row 27.
  • the forward voltages of the LEDs 26 in row 27 are to be selected to be smaller than the forward voltages of the LEDs LEDs 28 in row 29. The same applies to the remaining unnumbered rows in the lower part of the LED module 22 through
  • LEDs of different forward voltage are made possible for example by taking LEDs of the identical type, which nevertheless have different forward voltages during production.
  • LEDs of the identical type which nevertheless have different forward voltages during production.
  • the use of completely different types of LEDs is possible.
  • the two ideas for a better distribution of the thermal load can also be combined with one another. In this case, then different LEDs are used on the module and the lengths of the LED series circuits varies.
  • the LED module shown in Figure 4 can be combined in an analogous manner as the module of Figure 1 with heat sinks or optical elements. In the illustrations of FIGS. 2 and 3, the LED module 1 can therefore be easily replaced by the LED module 22.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un module à del (1) qui comprend un ensemble de DEL (3) connectées électroniquement et un support (2) pour les DEL (3). Ledit ensemble de DEL est constitué par un montage parallèle de montages en série (6) de DEL (3). Le montage parallèle est choisi de telle manière que la charge thermique du support (2), causée par le fonctionnement des DEL (3), est répartie sensiblement de manière uniforme sur le support (2).
EP14708246.5A 2013-03-05 2014-03-05 Module del et dispositif d'éclairage équipé dudit module del Active EP2965358B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201310203728 DE102013203728A1 (de) 2013-03-05 2013-03-05 LED-Modul und Beleuchtungsanordnung mit entsprechendem Modul
PCT/EP2014/054240 WO2014135577A2 (fr) 2013-03-05 2014-03-05 Module à del et dispositif d'éclairage équipé dudit module à del

Publications (2)

Publication Number Publication Date
EP2965358A2 true EP2965358A2 (fr) 2016-01-13
EP2965358B1 EP2965358B1 (fr) 2018-05-09

Family

ID=50236169

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14708246.5A Active EP2965358B1 (fr) 2013-03-05 2014-03-05 Module del et dispositif d'éclairage équipé dudit module del

Country Status (5)

Country Link
US (1) US10001267B2 (fr)
EP (1) EP2965358B1 (fr)
CN (1) CN105190884B (fr)
DE (1) DE102013203728A1 (fr)
WO (1) WO2014135577A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3061625B1 (fr) 2016-12-30 2020-07-24 Commissariat Energie Atomique Structure electronique comprenant une matrice de dispositifs electroniques presentant des performances thermiques ameliorees
FR3078442B1 (fr) * 2018-02-26 2023-02-10 Valeo Vision Source lumineuse electroluminescente destinee a etre alimentee par une source de tension
JP2023077024A (ja) * 2021-11-24 2023-06-05 日亜化学工業株式会社 面状光源

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8632215B2 (en) * 2003-11-04 2014-01-21 Terralux, Inc. Light emitting diode replacement lamp
GB2417824A (en) * 2004-09-02 2006-03-08 Custom Interconnect Ltd LED light source
JP5025913B2 (ja) 2005-05-13 2012-09-12 シャープ株式会社 Ｌｅｄ駆動回路、ｌｅｄ照明装置およびバックライト
JP2007311561A (ja) 2006-05-18 2007-11-29 Showa Denko Kk 表示装置、発光装置、および固体発光素子基板
JP4877552B2 (ja) * 2007-07-13 2012-02-15 Ｎｅｃディスプレイソリューションズ株式会社 照明装置
EP2141965A4 (fr) * 2007-07-27 2011-03-23 Sharp Kk Dispositif d'éclairement et dispositif d'affichage à cristaux liquides
DE202008007862U1 (de) * 2008-06-12 2008-08-21 Lin, Hsiang-Chou LED-Leuchte mit freistehenden Kühlrippen
US8081271B2 (en) * 2008-07-28 2011-12-20 Panasonic Corporation Backlight apparatus and liquid crystal display apparatus
US9019445B2 (en) * 2009-12-25 2015-04-28 Sharp Kabushiki Kaisha Lighting device, display device, and television receiver
JP5545848B2 (ja) * 2010-06-24 2014-07-09 シチズン電子株式会社 半導体発光装置
JP5873625B2 (ja) * 2010-08-20 2016-03-01 セイコーエプソン株式会社 光源装置及びプロジェクター
CN103221741A (zh) * 2011-11-21 2013-07-24 松下电器产业株式会社 发光装置以及照明装置
CN202402975U (zh) * 2011-11-25 2012-08-29 佑图物理应用科技发展(武汉)有限公司 Led环形模组
CN103890488B (zh) * 2012-07-25 2018-02-16 松下知识产权经营株式会社 发光模块
US8970131B2 (en) * 2013-02-15 2015-03-03 Cree, Inc. Solid state lighting apparatuses and related methods

Also Published As

Publication number Publication date
CN105190884A (zh) 2015-12-23
WO2014135577A2 (fr) 2014-09-12
DE102013203728A1 (de) 2014-09-25
US10001267B2 (en) 2018-06-19
EP2965358B1 (fr) 2018-05-09
US20160178177A1 (en) 2016-06-23
CN105190884B (zh) 2018-05-08
WO2014135577A3 (fr) 2015-01-22

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