WO2012016891A1 - Dispositif d'exposition d'objets à des rayons uv - Google Patents
Dispositif d'exposition d'objets à des rayons uv Download PDFInfo
- Publication number
- WO2012016891A1 WO2012016891A1 PCT/EP2011/062877 EP2011062877W WO2012016891A1 WO 2012016891 A1 WO2012016891 A1 WO 2012016891A1 EP 2011062877 W EP2011062877 W EP 2011062877W WO 2012016891 A1 WO2012016891 A1 WO 2012016891A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- radiator
- flat cable
- cable connection
- carrier
- led
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F23/00—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing
- B41F23/04—Devices for treating the surfaces of sheets, webs, or other articles in connection with printing by heat drying, by cooling, by applying powders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2252/00—Sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
- B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
- B05D3/065—After-treatment
- B05D3/067—Curing or cross-linking the coating
Definitions
- the invention relates to a device for UV irradiation of objects, in particular for the curing of coatings, with a plurality of UV lamp modules, each comprising an area arranged on a carrier LED array.
- US 2006/0127594 A1 discloses a UV curing apparatus which comprises a plurality of UV LED arrangements which are arranged in a staggered manner on a common panel in order to achieve a uniform irradiation in the course of an object transport through the irradiation area.
- the radiator surface has gaps in the rows, so that object areas are exposed to UV radiation at different times.
- an extensive space is needed. Proceeding from this, the present invention seeks to further develop the devices known in the art and to ensure a high degree of flexibility, efficiency and quality in the irradiation, especially in a compact design especially for installation units. To solve this problem, the combination of features specified in claim 1 and 14 is proposed. Advantageous embodiments and modifications of the invention will become apparent from the dependent claims.
- each UV radiator module has a flat cable connection provided with a multiplicity of connection lines for the electrical connection of the LED arrangement, and that the flat cable connection is arranged on a connection side of the carrier that can be attached or attached to a further UV radiator module. Due to the lateral power supply, the LED arrays of the individual modules can be mounted on a limited area with high power density and effectively cooled, while the flat cable connection allows a virtually seamless assembly, without restricting the possible combinations.
- connection lines of the flat cable connection extend at least in the region of the carrier in a plane transverse to the surface of the LED arrangement laterally next to each other, so that only a narrow gap area must be kept free to an adjacent module and a convenient connection option for a planar LED arrangement is created.
- a further improvement can be achieved in that the flat cable connection has a flexible flat strip containing the connection lines in the form of strip conductors.
- the flat cable connection is stiffened by a rigid composite part, in particular a sandwich-type laminate structure, on an end section attached to the connection side of the support.
- the connection lines of the flat cable connection with a small line cross section can be connected to the LED arrangement at the front end via bonding wires.
- the thickness of the flat cable connection is less than 3 mm, preferably between 1 and 2 mm.
- the support for the LED arrangement is preferably arranged in the form of a metal plate on a cooler, so that efficient cooling is possible far away from temperature gradients.
- the radiator protrudes laterally on one side of the carrier.
- a further advantageous embodiment provides that the LED arrangement is formed by a matrix of LEDs, wherein each two adjacent LED rows are connected in series, so that there is a one-sided connection possibility.
- the LED arrangement In order to be able to provide the required electrical energy with small, relatively thin conductors, it is advantageous for the LED arrangement to be connected to a DC voltage supply of the UV radiator module via the flat cable connection, the DC voltage provided for a series connection of the LEDs being more than 100 V. , preferably 300 to 500 volts. To achieve a high power density, it is advantageous if the LED arrangement of each UV radiator module has more than 1000, preferably approximately 1500 LEDs formed by individual chips. For the hardening of coatings tions, the UV radiator modules can thus have an optical power density of more than 10 W / cm 2 .
- the invention also provides a device for UV irradiation of objects, in particular for curing coatings, comprising a plurality of UV radiator modules, each comprising an arrayed on a support LED array and to form a occupied in a regular grid with LEDs common Emitter surface are composable, so that in the region of the connecting sides between the carriers no radiation inhomogeneities arise.
- the irradiation device 10 shown in the drawing enables the UV irradiation of objects which are transported through the irradiation area, in particular in the form of substrates coated with printing inks, varnishes or adhesives, for example in a printing press for chemical crosslinking or curing of the coating.
- the irradiation device 10 is composed of a plurality of UV radiator modules 12, which each comprise a grid-shaped LED arrangement 16 applied to a carrier plate 14 and to a connection side 18 which can be attached seamlessly to an adjacent radiator module with a flat cable connection 20 for electrical connection the LED array 16 are provided.
- radiator modules 12 each are assembled in such a way that the total radiator surface 22 formed is occupied by LEDs 24 in a uniform grid.
- the individual radiator modules 12 can be seamlessly combined with other modules 12 on one, two or three sides (connecting sides 18) of their rectangular support plate 14, while one remaining side (radiator side 26) of the support plate 14 is kept free for a coolant supply.
- Each cooler block 28 can be connected via a feed 30 and return 32 with a continuous in the longitudinal direction of the radiator modules 12 two-channel coolant guide 34.
- the boards 36 of an electronic control system and power supply 38 are arranged, which are also cooled in this way.
- the web-shaped flat cable connection 20 along a connecting side 18 of the support plate 14 is arranged so that the LED assembly 16 can be connected to the power supply 38 without a disturbing supernatant seamless Combination with a further radiator module 12 prevents.
- the term "seamless" in this context means that the mutual spacing of the LEDs 24 remains substantially constant over the flat cable connection 20, so that no radiation inhomogeneities arise.To achieve this, the thickness of the flat cable connection 20 is expediently between 1 and 2mm.
- the flat cable connection 20 has a plurality of connecting lines 40 in the form of parallel conductor tracks, of which only a few are illustrated by dashed lines in FIG. 2 for the sake of clarity. These run at least with their end portions in a plane transverse to the surface of the adjacent support plate 14.
- region 42 of the flat cable connection 20 is rigid as a rigid composite part, as will be explained in more detail below.
- the lower board-side region 44 of the flat cable connection is bendable as a flex line, in order to compensate, if necessary, building tolerances.
- each radiator module 12 can have more than 1000, expediently approximately 1500 LEDs 24 formed by individual chips. In this way, an optical power density of more than 10 W / cm 2 can be achieved at a wavelength of about 395 nm, so that effective crosslinking or hardening of the irradiated coatings is possible. In principle, a combination of different irradiation wavelengths is possible by using LEDs 24 mixed with the desired wavelengths.
- FIG. 4 likewise shows the wiring of the individual LEDs 24 in a radiator module 12 in a symbolically simplified manner.
- Two adjacent LED rows 46 are connected in a series connection as a string of approximately 100 LEDs to one another and via the connecting leads 40 of the flat cable connection 20 to a DC voltage can be acted upon by about 400 volts. Due to the high voltage, especially small cable cross sections can be realized.
- the electrical connection of the LED rows 46 is effected by a direct bonding wire connection 48 between the first and last LED 24 and the free end side of the connection line 40.
- the upper region 42 of the flat cable connection 20 as a miniaturized board stiffened by a sandwich-like laminate structure 50.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microbiology (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Supply, Installation And Extraction Of Printed Sheets Or Plates (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
L'invention concerne un dispositif d'exposition d'objets à des rayons ultraviolets (UV), en particulier pour durcir des revêtements, comprenant plusieurs modules émetteurs d'UV (12) qui comprennent respectivement un système de LED (16) disposé en nappe sur un support (14). Selon l'invention, chaque module émetteur d'UV (12) présente une connexion à câble plat (20) pourvue d'une pluralité de lignes de raccordement (40) pour le raccordement électrique du système de LED (16) et la connexion à câble plat (20) est disposée sur un côté de connexion (18) du support (14) ajouté ou pouvant être ajouté à un autre module émetteur d'UV (12).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11767175.0A EP2601052B1 (fr) | 2010-08-02 | 2011-07-27 | Dispositif d'exposition d'objets à des rayons uv |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010038802.5 | 2010-08-02 | ||
DE201010038802 DE102010038802A1 (de) | 2010-08-02 | 2010-08-02 | Vorrichtung zur UV-Bestrahlung von Objekten |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012016891A1 true WO2012016891A1 (fr) | 2012-02-09 |
Family
ID=44773030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2011/062877 WO2012016891A1 (fr) | 2010-08-02 | 2011-07-27 | Dispositif d'exposition d'objets à des rayons uv |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2601052B1 (fr) |
DE (1) | DE102010038802A1 (fr) |
WO (1) | WO2012016891A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105413991A (zh) * | 2015-12-08 | 2016-03-23 | 淮南纪兴源机电设备有限公司 | 一种往复式uv固化机 |
US9539824B2 (en) * | 2014-02-26 | 2017-01-10 | Seiko Epson Corporation | Irradiation device and image recording device |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10180248B2 (en) | 2015-09-02 | 2019-01-15 | ProPhotonix Limited | LED lamp with sensing capabilities |
DE102016112122B4 (de) * | 2015-12-23 | 2021-01-07 | Qingdao LED optoelectronic technology Co.,LTD | LED-Aushärtungseinrichtung für UV-Druckfarben |
ITUB20161205A1 (it) | 2016-03-01 | 2017-09-01 | Cefla S C | Apparato e metodo per l’essiccazione/polimerizzazione di prodotti chimici mediante modulo a led |
IT201800010863A1 (it) * | 2018-12-06 | 2020-06-06 | Ind Chimica Adriatica S P A In Sigla Ica S P A | Sistema meccanico di riflessione ed irraggiamento per la reticolazione di vernici polimerizzabili uv. |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060127594A1 (en) | 2003-01-09 | 2006-06-15 | Con-Trol-Cure, Inc. | Light emitting apparatus and method for curing inks, coatings and adhesives |
-
2010
- 2010-08-02 DE DE201010038802 patent/DE102010038802A1/de not_active Withdrawn
-
2011
- 2011-07-27 EP EP11767175.0A patent/EP2601052B1/fr not_active Not-in-force
- 2011-07-27 WO PCT/EP2011/062877 patent/WO2012016891A1/fr active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060127594A1 (en) | 2003-01-09 | 2006-06-15 | Con-Trol-Cure, Inc. | Light emitting apparatus and method for curing inks, coatings and adhesives |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9539824B2 (en) * | 2014-02-26 | 2017-01-10 | Seiko Epson Corporation | Irradiation device and image recording device |
CN105413991A (zh) * | 2015-12-08 | 2016-03-23 | 淮南纪兴源机电设备有限公司 | 一种往复式uv固化机 |
Also Published As
Publication number | Publication date |
---|---|
EP2601052B1 (fr) | 2016-08-31 |
EP2601052A1 (fr) | 2013-06-12 |
DE102010038802A1 (de) | 2012-02-02 |
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