EP2521875A1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage

Info

Publication number
EP2521875A1
EP2521875A1 EP11723344A EP11723344A EP2521875A1 EP 2521875 A1 EP2521875 A1 EP 2521875A1 EP 11723344 A EP11723344 A EP 11723344A EP 11723344 A EP11723344 A EP 11723344A EP 2521875 A1 EP2521875 A1 EP 2521875A1
Authority
EP
European Patent Office
Prior art keywords
lighting device
light source
carrier
lid
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11723344A
Other languages
German (de)
English (en)
Inventor
Thomas Preuschl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2521875A1 publication Critical patent/EP2521875A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Definitions

  • the invention relates to a lighting device, in particular light-emitting module, in particular LED module comprising a light ⁇ source substrate, on the front side at least a half ⁇ conductor light source, in particular light-emitting diode is mounted and its reverse side is attached to an electrically conductive support.
  • a lighting device in particular light-emitting module, in particular LED module comprising a light ⁇ source substrate, on the front side at least a half ⁇ conductor light source, in particular light-emitting diode is mounted and its reverse side is attached to an electrically conductive support.
  • a lighting device alswei- transmitting a light source substrate on the front side Minim ⁇ least, is mounted a semiconductor light source, in particular light-emitting diode and whose back is mounted on an electrically leit ⁇ enabled carrier, in addition to the light source substrate at least two electrically conductive contact pins are guided through the carrier and the contact sti are electrically connected to the at least one semiconductor light source and wherein the contact sti are each introduced into an electrically insulating sleeve and the respective sleeve is inserted into an associated recess of the carrier.
  • the lighting device can easily mechanically and electrically from a light source substrate remote (back) side to be contacted to bring a versor ⁇ supply voltage.
  • the contact pins may be arranged with great design variability.
  • the result for uniform, eg standardized, contacting of the lighting device is that the arrangement of the contact pins is decoupled to a large degree from an arrangement and configuration of the light source substrate. So many different light source substrates can be connected (with the corresponding ⁇ to semiconductor light sources) to the equal and arranged contact pins. This allowed ⁇ light a universal Einset zbarkeit also very different ⁇ Lich shaped lighting devices.
  • plug laterally or in a light-emitting region of the lighting device which saves space and in particular allows a low overall height.
  • a small space also supports standardizability.
  • the associated contact pin advantageously passes through the center of the sleeve.
  • the sleeve is preferably configured in a cylindrical shape or ring shape for a laterally equal ⁇ moderate material property and electrical property before ⁇ .
  • the contact pin is, inter alia, for inexpensive production, preferably a metallic contact piece, eg of stainless steel, which may be in particular copper-plated or tin-plated.
  • the electrically conductive carrier By the electrically conductive carrier a very good thermal conductivity is achieved, so that a waste heat generated by the at least one semiconductor light source effek ⁇ tively flow through the light source substrate on the support and can be removed from there.
  • the carrier can thus also serve as a heat sink.
  • the carrier in particular at its front side and / or at its lateral edge have at least one structuring, for example at least one cooling projection such as at least one cooling pin, at least one cooling rib, etc.
  • the electrically insulating sleeves serve to maintain creepage distances and to be able to contact the lighting device from the rear. The diameter of the sleeve can be selected as a function of the desired lighting device, eg the length of the required creepage distances.
  • the contact pins may have a semiconductor light source may be electrically connected in different ways with the min ⁇ least. It is advantageous for a particularly simple electrical Verbin ⁇ dung over variable distances, if this means of a wire connection or by means of a wire bonding ( 'wire- bonding') is implemented.
  • the contact pins are preferably connected indirectly to the at least one semiconductor light source, namely via the light source substrate.
  • a contact pin may be connected to a contact field of the light source substrate, which in turn is electrically connected to the Halbleiterlichtquel ⁇ le, possibly via a vitegeschal ⁇ tete logic (electronics), such as a driver.
  • the logic or electronics are then preferably arranged on the light source substrate.
  • the at least one semiconductor light source comprises at least one light-emitting diode. If several LEDs are present, they can be lit in the same color or in different colors. A color can be monochrome (eg red, green, blue etc.) or multichrome (eg white).
  • the light emitted by the at least one light-emitting diode can also be an infrared light (IR LED) or an ultraviolet light (UV LED).
  • IR LED infrared light
  • UV LED ultraviolet light
  • Several light emitting diodes can produce a mixed light; eg a white mixed light.
  • the at least one light-emitting diode may contain at least one wavelength-converting phosphor (conversion LED).
  • the at least one light emitting diode may be in the form min ⁇ least one individually packaged light emitting diode or in the form of at least one LED chip. Several LED chips can be mounted on a common substrate ("submount").
  • the light source carrier may be the submount.
  • the at least one light-emitting diode can be equipped with at least one own and / or common optics for beam guidance, for example at least one Fresnel lens, collimator, and so on.
  • inorganic light-emitting diodes for example based on InGaN or AlInGaP, it is generally also possible to use organic LEDs (OLEDs, for example polymer OLEDs).
  • the at least one semiconductor light source may, for example, comprise at least one diode laser.
  • the sleeves are made of glass. Glass has a very good electrical insulation, is easy to produce on a large scale and allows in a simple way a tight enclosure of the pins. Ins ⁇ particular, the enclosure may be gas-tight.
  • the glass tubes are preferably melted onto the contact pins before they are introduced into the electrically conductive carrier.
  • the glass tubes are made of a powdery raw material, these can be connected after melting on the contact pins with the carrier by a further sintering step. This achieves a particularly secure and gas-tight connection between the components.
  • other thermal processes for fixing the glass sleeve are also conceivable, for example, shrink-fitting or soldering.
  • other electrically insulating materials are used, such as plastic or ceramic.
  • the back of the light ⁇ swelling substrate is connected to the carrier via a thermal adhesive. This improves heat dissipation from the semiconductor light sources. It is yet another embodiment that the Kunststoffstif ⁇ te adjacent to a same side of the Lichtménsub ⁇ strats are guided by the carrier. It is also an embodiment that the lighting device comprises an at least partially electrically conductive cover on ⁇ , which is seated on the support and arched over the sleeves and the light source substrate, wherein the lid above the at least one light source comprises a light-permeable insert. The cover serves to protect against contact with the live parts of the connected lighting device, in particular a logic / electronics.
  • the light emitting device can be configured as light-tight, dustproof, waterproof and / or gas-tight and is therefore suitable for example for outdoor and special applications. There are no costly protective coatings on the substrate needed. In addition, there is a better EMC protection, as well as a better thermal behavior due to an increased heat radiation area.
  • the lid can also be present as a fully metallic lid body in which the translucent insert is inserted. The fully metallic lid body is easy to manufacture and allows a particularly good heat dissipation and a particularly effective EMC protection. It is still an embodiment that the translucent insert is held by means of a support step on the lid. This allows the translucent insert to be easily mounted and precisely positioned.
  • the translucent insert by means of an adhesive bond or an adhesive on the lid (permanently) is attached.
  • a defined and spatially precise limited introduction of an adhesive is made possible.
  • the adhesive may for example be a Kleberdispenstechnik.
  • the translucent insert is disc-shaped or plate-shaped, which supports a low height and ease of manufacture.
  • the translucent insert may e.g. be circular.
  • the translucent insert is an optical element or has an optical function.
  • the translucent insert may be e.g. be designed as a diffuser or as a beam-guiding element (such as a lens or the like).
  • the translucent insert is coated, e.g. with a scratch-resistant layer and / or an IR-reflecting layer on an outer side.
  • the translucent insert may for example consist of glass, plastic and / or a ceramic.
  • the lid has at least one lateral mounting recess and / or at least one lateral recess.
  • the mounting recess has the advantage that a sealing of the lid is beibehal ⁇ th.
  • this configuration has the advantage that the lid so particularly easy, especially auto ⁇ matically, assembled or positioned and / or advertising dismantled the can.
  • the cover has a substantially annular support element, which supports the cover on the light source substrate, wherein the support member surrounds the at least one semiconductor light source and extends laterally outside of the translucent insert.
  • the support element is used to increase a Lichtausbeu- te light-tight, in particular diffusely reflective or spat ⁇ gelnd reflective configured.
  • a thermal separation between the at least one semiconductor light source and a logic or electronics may also be achieved, so that in particular the logic or electric ⁇ technology does not overheat.
  • a pressing force can be exerted on the lid, for example, to hold the lid on the support (for example, if the lid is not firmly bonded to the carrier), without the lid unintentionally to the In ⁇ vaults.
  • the lid can, and to distribute a contact force evenly, also be sufficiently mechanically rigid, for example, by a correspondingly large wall ⁇ strength or reinforcing ribs.
  • the lid can be pressed or pressed on the carrier, for example via at least one spring element and / or a clamping element.
  • the light source substrate may have one or more areas which are freed from a component assembly and / or a conductor track guide and in which the support element mechanically contacts the light source substrate.
  • the support element can in particular to the wiring substrate having an under ⁇ brochene contact line, so that conductor tracks without damage to the at least one semiconductor light source can be guided.
  • the support element can have at least one recess on the attachment side.
  • the lid is welded or glued to the carrier.
  • the De ⁇ ckel imbalance and the support consists of metal, preferably the moving ⁇ chen metal
  • these two elements can be welded with one another, especially welded continuously, in particular laser-welded. This allows a very high density with a very high mechanical Resistance to separation of the two elements can be achieved.
  • the lighting device in a precise and easy to handle manner particularly robust and tight ⁇ are out.
  • the lid can be pressed onto the carrier.
  • the lid and / or the carrier may have at least one sealing element.
  • the contact pressure or pressure can be performed, for example via at least one spring and / or a clip, which can be dispensed with screws for easy handling, so that, for example, no small parts and no screwdriver are necessary.
  • the carrier need not be nachbear ⁇ processed so, for example, for the introduction of screw holes. This in turn results in cast supports a simpler tool and less wear, while strand ⁇ press cooling bodies no drilling, tapping and deburring is necessary.
  • the lid can alternatively be bolted to the carrier, for example manually or by means of a compressed air ⁇ or electric screwdriver.
  • the light source substrate is a ceramic substrate.
  • a (elekt ⁇ driven insulating) ceramic has the advantage that it meets the norms as reinforced insulation.
  • voltage ranges of up to 250 volts can be easily implemented. This offers the advantage of the light sources and / or any associated logic, for example, with a low voltage (eg 12 volts to 26 volts, eg from 24 volts) up to a high voltage (eg between 110 volts to 300 volts, eg with 230 volts to 250 V).
  • a flexible printed circuit board has the advantage that it can also be placed flat on a carrier that is not flat locally.
  • the circuit board may be single-layer or multi-layer, but is preferably equipped for application to the surface only one-sided on the carrier.
  • the substrate may have integrated components, in particular resistors. These are preferably arranged on the underside of the substrate as well as in multilayer substrates in the inner layers. This achieves a compact design and simplifies production. If the resistors are arranged on the underside, laser alignment, i. by changing the geometry of the resistor by means of a laser beam, the resistance value can be set to very precise tolerances, for example 0.1%.
  • other electronic components can be implemented as integrated components, such as capacitors, coils and integrated circuits.
  • the substrate may be provided with so-called multi-chip modules, which may be formed as separate components, but also as integrated structures.
  • the substrate may be provided on the upper side (ie the side on which the semiconductor light sources are arranged) with optical means, in particular with reflectors.
  • optical means in particular with reflectors.
  • the opti ⁇ rule means to do so on a reflectivity of more than 90%.
  • the reflectors can be used as paint layer, silver layer ⁇ or with particles of high reflectivity, such as titanium di ⁇ oxide-filled layer may be formed.
  • the integrated components can preferably be applied by paste printing methods, since these have a particularly simple However, other methods are known to those skilled in the art.
  • carbon pastes can be applied to the substrate as pastes.
  • Carbon pastes have the advantage of high thermal conductivity, so they can also be used for cooling purposes.
  • sleeves are surrounded at a rear side of the carrier by a respective seal. This ensures electrical and mechanical external protection in the connection area.
  • sleeves are preferably peripherally surrounded by the respective gasket, e.g. from an O-ring seal.
  • the carrier is in the form of a plate.
  • the plate is preferably a metallic plate, which allows good heat dissipation and high stability.
  • the plate shape also has the advantage that the carrier, and thus the lighting device, can be easily clamped or clamped to the component, e.g. a terminal socket, can be fixed, in which he or she is plugged in via the contact pins or is attached via a plug / turn connection.
  • the contact pin on a rear portion of the carrier may have a head, in particular a mushroom-shaped head, so that the lighting device can be inserted and held in a keyhole of the component.
  • This component may e.g. be a heat sink or a connection socket.
  • the base can have, for example, at least one keyhole for fastening the lighting device by means of a plug-in / turn connection.
  • the lighting device is a lighting module.
  • a light emitting module may be distinguished in ⁇ play characterized in that it comprises connection not have its own power, but is fixed for operating typically at a lighting system or light and electrically contacted. The lighting system or the light are in turn intended to be connected to a mains supply.
  • the lighting module has the advantage that many differently designed lighting modules can be plugged onto the same connection of the lighting system or the luminaire and thus a modular and subsequently standardized and yet photometrically flexible lighting solution is made possible.
  • the lighting device is not limited to ⁇ and can also be designed as a lamp or a lamp.
  • Fig.l shows a sectional view in side view a
  • Lighting device according to a first embodiment
  • FIG. 2 shows the lighting device according to the first embodiment in plan view
  • FIG. 3 shows a sectional view in side view of a
  • Lighting device according to a second embodiment
  • FIG. 5 shows a plan view of a base for receiving a
  • FIG. 6 shows the base of Figure 5 in side view.
  • 7 shows a sectional side view of a
  • Fig.l shows a lighting device in the form of an LED module 1.
  • the LED module 1 has a light source substrate 2, wel ⁇ ches is formed as a ceramic substrate and which ⁇ at least on its (here upwardly facing) front 2a with a Conductor structure (traces, contact feider, etc.) is equipped (o.Fig.).
  • the light source substrate 2 also has a plurality of light-emitting diodes 3, which emit rays in an upper or front half-space.
  • the light source substrate 2 is further equipped on its front side 2a with a plurality of electronic components 4 (for example logic modules, capacitors and resistors, eg in surface mount technology (SMD)).
  • SMD surface mount technology
  • the light source substrate 2 With its (here downwardly directed) back 2b, the light source substrate 2 is attached over a dressingleitkleber 5 surface on a serving as a support metal plate 6.
  • the metal plate 6 makes it possible, in a cost-effective manner, for the LED module 1 to be mechanically stable (for example by avoiding twisting or other bending) and thermally advantageously constructed, since the metal plate 6 effectively dissipates waste heat generated by the light-emitting diodes 3 and can dissipate.
  • the metal plate 6 here two circular recesses 7, in each of which an electrically insulating sleeve 8 is inserted.
  • an electrically conductive contact pin 9 is guided in each case vertically.
  • the two Kon ⁇ clock pins 9 (however, a different number of contact has pins 9 possible, for example, a contact pin 9, or more than two contact pins 9) may be the LED module 1 me ⁇ mechanically attached to its rear side and electrically contacted, and though by a simple plug movement.
  • the contact pin 9 at its rear end have a (dashed lines) head 9a, by means of which the contact pin in a keyhole, for example, a socket insertable and rotatable therein.
  • the contact pins 9 On its light source substrate 2 adjacent region of the contact pins 9 by means of a respective electrically conduct ⁇ the wire 10 ( "bonding wire"), for example of copper or a gold-copper alloy (with a respectively associated contact pad 11 see Fig.2 ) connected.
  • the two contact pins 9 can be connected, for example, to different poles of a clamping voltage source ⁇ .
  • the contact pieces 9 are preferably made of metal for ease of manufacture and good electrical conductivity.
  • the sleeves 8 have the advantage that they are easy to produce and very good sealing.
  • the LED module 1 has the advantage that the light source substrate 2 with the elements 3, 4 fastened thereto can be variably designed without the metal plate having the sleeves 8 and the contact pins 9 needing to be structurally adapted thereto. This makes it possible to combine a high degree of design diversity of LED modules 1 with a standardized contact surface and electrical and mechanical contacting.
  • the light source ⁇ substrate 2 is in this case formed substantially square, but may alternatively have other shapes, such as rectangular or round.
  • the metal plate 6, however, is circular or round, but can also arbitrary have other shapes, for example, a n (n> 4) -eckige form or a freeform.
  • the contact pins 9 and associated sleeves 8 are here arranged on a common straight side of the light source substrate 2 in the vicinity of a side edge 12 of the metal plate 6, so that a large surface area is available for placing the light source substrate 2.
  • FIG. 3 shows a sectional side view of an LED module 13 according to a second embodiment, which uses the LED module 1 and provides additional elements.
  • the LED module 13 now additionally has a lid 14, which has a metallic main body 15 and a translucent insert in the form of a glass plate 16.
  • the lid 14 is mounted circumferentially on the metal plate 6 and vaulted both the sleeves 8 and Needlesstif ⁇ te 9 and the light source substrate 2.
  • the cover 14 he ⁇ thus allows protection of the live parts on the front of the LED module 13 and allows the Attribution of an IP protection class.
  • the lid 14 may be pressed onto the metal plate 6 or pressed against it, for example by means of at least egg ⁇ nes (not shown) spring element.
  • the lid 14 can with the metal plate 6 welded to, and in particular when the metal base body 15 is composed of the same metal as the metal plate 6 or these two elemene ⁇ te 6, 14 have a suitable welding material combination.
  • the lid 14 may also be glued, screwed or locked with the metal plate 6.
  • the cover 14 or the metallic main body 15 has a recess 17, by means of which the lid 14 can be gripped securely for mounting and / or disassembly.
  • the recess 17 can also be referred to as a groove.
  • the LED module 13 further includes an annular lichtun take- permeable support member 19, which is seated on the light sources ⁇ substrate 2 and serves as a support against the De ⁇ ckel fourteenth
  • the support element 19 (“opaque ring") is dimensioned such that its diameter is greater than the diameter of the glass plate 16, so that the support element 19 does not lift off the glass plate 16.
  • the support element 19 he ⁇ increases the light output, since it prevents light from entering the space formed by the metallic body 15.
  • a luminous efficacy can be further enhanced by the ⁇ that the light emitting diodes 3 facing the inside of the support is reflective 19th
  • the support member 19 is further prevents the De ⁇ ckel 14 bends in a task of pressure on its top or possibly even by the influence of gravity to the inside (ie, in the direction of the metal plate 6 and the light-emitting diodes 3). This may be particularly useful if the De ⁇ ckel 14 is pressed by at least one pressing element (spring and / or clamp, etc.) on the metal plate 6.
  • the Ab ⁇ support member 19 further prevents free heat exchange of the heated by the light emitting diodes 3, so that the electronic components 4 are thermally better protected against a waste heat generated by the LEDs 3.
  • FIG. 3 shows a section A indicated in FIG. 3 in an enlarged view.
  • the detail A shows the LED module 13 in the region of the cover 14 in transition from the metallic base body 15 to the glass plate 16.
  • the metallic base body 15 has at its central recess, in which the glass plate 16 is inserted at the edge of a Aufla ⁇ stage 20th on, on which the glass plate 16 can be placed.
  • the support step 20 is formed in the direction of the printed circuit board substrate 2, so that the glass plate 16 is substantially flush with respect to its upper side with respect to the metal substrate.
  • Lische body 15 can be mounted.
  • an adhesive 21 is used for permanent attachment of the glass plate 16 to the metallic base body 15.
  • the supporting stage 20 serves as a lateral stop or as a positioning tion ists bamboo for the support element 19.
  • the inner ⁇ diameter of the support element 19 is therefore preferably slightly larger (with a small clearance) is constructed as a diameter of the support shoulder 20 here also ring-shaped .
  • the basic shape of the glass plate 16 is not limited, and so, the glass plate 16 may be other than the circular-disc-shaped basic shape ⁇ also have another basic shape, eg a square basic shape.
  • Fig. 5 shows in plan view a socket 22 for receiving a lighting device, e.g. 1 or 13, by resting on a support surface 23.
  • Fig.6 shows the base 22 in side view.
  • the lighting device 1 can be placed with the back of the metal plate 6 on the support surface 23, wherein the contact pins 9 are first inserted into a hole portion 25 of a keyhole 24 and then moved by a rotary movement of the lighting device 1 in a beard region 26 of the keyhole 24.
  • the widened head 9a holds the lighting device 1 on the base 22.
  • the keyhole 24 is rearwardly of the support surface 23 (or support plate) electrically and mechanically connected in each case with a contact socket 27 having lateral contacting holes for contacting with electrical leads 28.
  • the socket 22 may e.g.
  • a housing 30 which projects further to the rear than the contact bushes 27 and the base, e.g. upgraded for wall or ceiling mounting.
  • the keyhole connection shown in Fig. 5 and Fig. 6 may also be referred to as a GU connection or be made as such.
  • the light source substrate 2 is multi-layered, and integrated components 31 are disposed both on the lower surface 2b of the light source substrate 2 and between the individual layers 2c, 2d.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un dispositif d'éclairage (1; 13) qui comprend un substrat de source lumineuse (2) sur le côté avant (2a) duquel au moins une source lumineuse à semi-conducteurs (3), en particulier une diode électroluminescente (3), est appliquée et dont le côté arrière (2b) est appliqué sur un support électroconducteur, au moins deux broches de contact électroconductrices (9) étant guidées à travers le support à côté du substrat de source lumineuse (2) et les broches de contact (9) étant électriquement connectées à cette source lumineuse à semi-conducteurs (2) et les broches de contact (9) étant respectivement introduites dans une douille (8) électriquement isolante et chaque douille (8) étant insérée dans un évidement (7) associé du support.
EP11723344A 2010-05-21 2011-05-13 Dispositif d'éclairage Withdrawn EP2521875A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010029227A DE102010029227A1 (de) 2010-05-21 2010-05-21 Leuchtvorrichtung
PCT/EP2011/057737 WO2011144522A1 (fr) 2010-05-21 2011-05-13 Dispositif d'éclairage

Publications (1)

Publication Number Publication Date
EP2521875A1 true EP2521875A1 (fr) 2012-11-14

Family

ID=44279761

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11723344A Withdrawn EP2521875A1 (fr) 2010-05-21 2011-05-13 Dispositif d'éclairage

Country Status (5)

Country Link
US (1) US20130063946A1 (fr)
EP (1) EP2521875A1 (fr)
CN (1) CN102906486A (fr)
DE (1) DE102010029227A1 (fr)
WO (1) WO2011144522A1 (fr)

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JP6226130B2 (ja) * 2014-02-18 2017-11-08 東芝ライテック株式会社 ランプ装置および照明装置
US10629513B2 (en) * 2015-06-04 2020-04-21 Eaton Intelligent Power Limited Ceramic plated materials for electrical isolation and thermal transfer
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CN107968059B (zh) * 2017-10-19 2021-06-18 惠州市骏亚数字技术有限公司 一种全自动二极管组装装置
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CN111628067A (zh) * 2020-05-27 2020-09-04 深圳桑椹电子商务有限公司 一种led基板的制造方法及结构
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Also Published As

Publication number Publication date
WO2011144522A1 (fr) 2011-11-24
US20130063946A1 (en) 2013-03-14
CN102906486A (zh) 2013-01-30
DE102010029227A1 (de) 2011-11-24

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