EP2324284A1 - Dispositif d'éclairage comportant une diode électroluminescente - Google Patents

Dispositif d'éclairage comportant une diode électroluminescente

Info

Publication number
EP2324284A1
EP2324284A1 EP09782842A EP09782842A EP2324284A1 EP 2324284 A1 EP2324284 A1 EP 2324284A1 EP 09782842 A EP09782842 A EP 09782842A EP 09782842 A EP09782842 A EP 09782842A EP 2324284 A1 EP2324284 A1 EP 2324284A1
Authority
EP
European Patent Office
Prior art keywords
lighting device
layer
piston
carrier element
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09782842A
Other languages
German (de)
English (en)
Inventor
Jens Florian Hockel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2324284A1 publication Critical patent/EP2324284A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device having at least one carrier element and at least one light-emitting diode arranged on the carrier element.
  • Lighting devices with LEDs find due to the high efficiency and decreasing manufacturing costs increasingly used in general lighting.
  • the actual light-emitting diodes are usually arranged on a support element due to their small size, on which also other elements, such as other light-emitting diodes, leads or circuits, may be attached.
  • LED lamps which are preferably used to replace existing conventional lamps such as incandescent or fluorescent lamps, without having to make changes to the light or the socket.
  • the support element is mounted with one or more light emitting diodes on a conventional socket, wherein for the implementation of the mains voltage to the supply voltage of the LED usually still an electrical circuit is provided.
  • retrofit solutions should preferably be reminiscent of the known incandescent lamps in their appearance and therefore usually have a piston on, which surrounds the support element and the light emitting diodes and similar in shape to that known from conventional light bulbs designs.
  • a carrier element with high thermal conductivity is selected, for example made of copper or aluminum, to dissipate the heat directly from the LEDs, but in this case an insulating layer has to be arranged between the LED and the carrier element, which deteriorates the heat conduction and increases the manufacturing outlay ,
  • the object of the present invention is to provide an illumination device with at least one carrier element and at least one light-emitting diode arranged on the carrier element, in which the described disadvantages, in particular in the cooling of the LED, are avoided.
  • the layer with high thermal conductivity is, in particular, those layers which have a higher thermal conductivity than the underlying substrate, but in any case layers with a thermal conductivity which is greater than 20 W / mK under normal conditions, in particular greater than 200 W / mK, more preferably greater than 600 W / mK.
  • Electrically insulating materials are distinguished by a high specific resistance of typically more than 10 3 ⁇ m, in particular more than 10 5 ⁇ m, more preferably more than 10 8 ⁇ m.
  • the layer is at least partially formed of carbon, in particular of amorphous carbon, preferably tetrahedral amorphous carbon.
  • Carbon can occur in various modifications with different mechanical and electrical properties and can be well adapted to the requirements.
  • Amorphous carbon is characterized not only by a high level of wear resistance, but above all by a high specific resistance (> 10 3 ⁇ m) and a high thermal conductivity (about 1000 W / mK), so that it is particularly suitable for a coating according to the invention.
  • Amorphous carbon is also an integral part of diamond-like composites, which may include, for example, silicon as a further component to tailor the properties to the requirements.
  • Coatings can simply be applied to complicated geometries and the properties can be advantageously set, for example by selecting the layer thickness and the material.
  • the thermal conductivity in particular the electrical conductivity and the permeability to electromagnetic radiation of different wavelengths can be advantageously influenced.
  • a carrier element can be provided with a layer according to the invention, on which the light-emitting diodes can be arranged, so that a particularly good dissipation of heat from the light-emitting diodes is achieved by discharging them directly to the side as well as downwards.
  • the lateral removal of the heat is advantageous since it can be distributed over a large area.
  • the layer is additionally electrically insulating, the connection points of the LEDs are automatically isolated from one another, regardless of the material of the carrier element. It is thus also a particularly advantageous embodiment possible by a metallic and therefore good heat-conducting support element, such as a copper or aluminum support, can be used, with the heat removal from the LED can be accomplished particularly advantageous.
  • user-touchable parts such as housing or heat sink, they may be in contact with live parts, such as the socket, without any risk to the user when touched.
  • live parts such as the socket
  • Such layers can be applied in a simple way by means of various coating methods, for example by the PECVD method, to various substrates, in particular to metals and glass.
  • the layer is at least partially formed from a ceramic material, in particular aluminum nitride.
  • Ceramic materials are also dielectrics that meet the requirements for electrical resistivity and, especially when using aluminum nitride, thermal conductivity.
  • the layer has a preferably constant thickness of at least 1 ⁇ m and at most 3 ⁇ m, preferably of approximately 2 ⁇ m.
  • This layer thickness can be easily applied, but is also large enough to ensure that no unintentionally uncoated areas arise.
  • a constant is considered to be a layer in which the maximum deviation from the average layer thickness does not exceed 5%. If translucent components, such as a light-guiding optics or the bulb of an LED lamp, are to be coated, the visible light transmittance at these layer thicknesses is not reduced too much.
  • the invention comes into play when the lighting device has at least one base and / or at least one enveloping the light emitting diode and the support member piston and thus formed as an LED lamp.
  • These lamps are the carrier element and the LEDs surrounded by base and piston, whereby the delivery of heat is difficult.
  • the additional or alternative use of an externally visible heat sink and the provision of the piston with vents to dissipate the heat, is disadvantageous because these measures affect the appearance of the lamp undesirably and favor the deposition of dust and dirt.
  • the piston is at least partially provided with the layer of high thermal conductivity.
  • heat introduced into the piston can be distributed over the entire surface of the piston, where it can be released particularly well to the environment.
  • the piston is thermally in operative connection with the LED and / or the carrier element, since thus the heat of the LED can be dissipated via the piston.
  • the layer is arranged on the outside of the piston, since it is exposed to the ambient air and can deliver the heat to them.
  • the piston is at least partially coated with a conversion layer for at least partially converting at least one wavelength of the radiation emitted by the LED to another wavelength.
  • a conversion layer for at least partially converting at least one wavelength of the radiation emitted by the LED to another wavelength.
  • the light color of the LED lamp can be adjusted.
  • a conversion layer arranged on the piston is subjected to lower loads, in particular of a thermal type.
  • the conversion layer is arranged on the inside of the piston, since it is protected there from environmental influences.
  • the layer with high thermal conductivity is formed as a layer substantially impermeable to UV radiation, emanating from the LED for the User reliably shielded harmful UV light.
  • the UV radiation can continue to be directed back to the conversion layer further inside, thereby increasing the efficiency of the LED lamp.
  • a glass bulb can be provided with a heat-conducting layer particularly well, since this is largely insensitive to the heat generated during the production of the layer as well as during operation of the LED lamp.
  • the wavelength of the radiation emitted by at least one light-emitting diode lies in a range between 410 nm and 540 nm, preferably between 440 nm and 510 nm, in particular at approximately 470 nm.
  • Such wavelength ranges are particularly advantageous in conjunction with a conversion layer, since this makes it particularly easy to generate white light.
  • the support member is thermally in operative connection with the base of the LED lamp. As a result, the heat can be released from the carrier element to the base and distributed further from there, for example to a suitable socket or to the piston.
  • the carrier element is in operative connection with the base of the lighting device via at least one, preferably designed as a heat pipe, connecting element, a particularly good heat transfer is achieved and at the same time the carrier element freely positionable within the piston.
  • the carrier element can be designed to be particularly simple as a three-dimensional body, which can also be equipped on all sides with light-emitting diodes and thus an all-round light output can be realized with simple means.
  • the carrier element and / or at least one connecting element between the carrier element and the base of the lighting device is provided with the layer with high thermal conductivity.
  • the heat is distributed particularly well on the carrier element or removed from it.
  • electronic components for controlling the at least one light-emitting diode in the region of the base of the lighting device are arranged. In this position, the components are located as far away from the LED as possible and thus subjected to a lower thermal load. In addition, especially when using a metal base, the components can be easily shielded, whereby a good EMC compatibility is ensured.
  • FIG. 1 As an example of a lighting device 1 according to the invention, the figure shows an LED lamp 1 with a base 2, a piston 3 and a carrier element 4, on which light-emitting diodes (LED) 5 are arranged.
  • LED light-emitting diodes
  • the support element 4 is formed of aluminum and coated with a non-conductive layer 6 of tetrahedral amorphous carbon (so-called diamond-like carbon, DLC) of approximately 2 microns thickness.
  • This layer is both electrically insulating and excellent heat-conducting (more than 600 W / mK, typically about 1000 W / mK).
  • the LEDs 5 are thermally excellently connected to the carrier element 4 as well as electrically isolated from this.
  • the high thermal conductivity of the DLC layer 6 causes the heat emanating from the LEDs 5 to be distributed along the surface of the carrier element 4 and thus good heat emission to the environment as well as into the interior of the carrier element 4 is made possible.
  • the carrier element 4 is connected via a so-called heat pipe 7 (heat pipe) to the base 2, so that the heat of the LEDs 5 can be dissipated via the carrier element 4 and the heat pipe 7 to the base 2.
  • the heat pipe 7 serves for at least one polarity at the same time as a power supply to the carrier element 4, wherein by suitable design via the inner tube 8, a polarity and the outer tube 9, the second polarity are transmitted.
  • the power supply to the carrier element 4 for a polarity takes place by means of the heat pipe 7, which is likewise coated on its outside with tetrahedral amorphous carbon, and the second polarity via a conductor track on the DLC layer the support element 4 is guided.
  • the heat pipe 7 in turn is thermally in operative connection with the piston 3, in the exemplary embodiment via a cylindrical aluminum plate 10, on which the piston 3 rests.
  • the piston 3 is made of glass and also coated on the outside with a layer 11 of tetrahedral amorphous carbon.
  • the heat is transferred from the aluminum plate 10 to the layer 11 and so distributed due to the excellent thermal conductivity of the layer 11 on the surface of the piston 3 and discharged to the environment.
  • the thickness of the layer 11 is chosen to be about 2 microns so that a good heat dissipation is ensured and yet the light transmission of the piston 3 is not significantly affected for the relevant wavelengths.
  • the LEDs 5 emit light having a wavelength of approximately 470 nm.
  • the piston 3 is coated with a conversion layer 12, which partially converts the radiation emitted by the LED 5 into a different wavelength range and thus serves to produce white light.
  • the selection of a suitable conversion substance is within the skill of the artisan. Possibilities for this are also described in the use of blue LEDs 5, for example in EP1206802.
  • the base 2 comprises in the present embodiment, a standard E27 Edison threaded portion 13 and a cylindrical portion 14, which contains the electronic components not shown here for supplying power and driving the LED 5.
  • the size of the cylindrical part 14 depends on the space required for the electronic components.
  • the outer wall 15 of the cylindrical part 14 is made of a polymer material, in particular to meet safety requirements and to allow easy production of the base 2.
  • a metal is used for this purpose, for example to dissipate heat to the threaded part 13 and thus to the socket.
  • LED lamp 1 instead of an LED lamp 1, another lighting device 1 based on LEDs 5 may be provided, for example, a single LED module, which consists practically only of LED 1 and support member 4 and possibly a heat sink and / or electrical components.
  • a complete LED luminaire it is also possible for a complete LED luminaire to be designed according to the invention, for example by coating parts of the housing, a diffuser or other optical element.
  • the high wear resistance of both DLC layers and ceramic layers as well as their insensitivity to corrosion are also advantageous, since the illumination device can also be used under unfavorable ambient conditions.
  • the piston 3 can be made of plastic, for example, which allows a simple and cost-effective production.
  • the shape of the piston 3 may differ from the shape shown here and an incandescent incandescent lamp and, for example, similar to a reflector lamp.
  • a coating of piston 3 and carrier element 4 instead of a coating of piston 3 and carrier element 4, of course, embodiments are possible in which only one of the components is coated.
  • the person skilled in the art knows a large number of embodiments, and in particular those with other prevailing wavelengths can be used instead of the blue LEDs 5 shown.
  • the use of UV LEDs to mention, in which when using the LED lamp 1 for lighting purposes, the use of a conversion layer 12 and a piston material or a coating that prevents the escape of UV radiation in harmful dose is imperative ,
  • the piston 3 can also be used as a diffusion element to mix the colors of the individual LEDs 5 and thus to produce a white light color.
  • DLC coating 6 instead of the DLC coating 6, 11, other coating materials are also conceivable, in particular aluminum nitride and carbon-based diamond-like nanocoatings, which in addition to carbon contain further constituents in appreciable amount.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention porte sur un dispositif d'éclairage (1), comportant au moins un élément support (4) et au moins une diode électroluminescente (5) disposée sur l'élément support (4). Au moins l'un des composants (2, 3, 4, 7, 10) du dispositif d'éclairage (1) prévus pour l'évacuation de la chaleur à partir de la diode électroluminescente (5), en particulier l'élément support (4), est au moins partiellement pourvu d'une couche électriquement isolante (6, 11) ayant une conductivité thermique élevée.
EP09782842A 2008-09-19 2009-09-10 Dispositif d'éclairage comportant une diode électroluminescente Withdrawn EP2324284A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008047933A DE102008047933A1 (de) 2008-09-19 2008-09-19 Beleuchtungsvorrichtung mit einer Leuchtdiode
PCT/EP2009/061721 WO2010031723A1 (fr) 2008-09-19 2009-09-10 Dispositif d'éclairage comportant une diode électroluminescente

Publications (1)

Publication Number Publication Date
EP2324284A1 true EP2324284A1 (fr) 2011-05-25

Family

ID=41318909

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09782842A Withdrawn EP2324284A1 (fr) 2008-09-19 2009-09-10 Dispositif d'éclairage comportant une diode électroluminescente

Country Status (8)

Country Link
US (1) US8686557B2 (fr)
EP (1) EP2324284A1 (fr)
JP (1) JP2012503284A (fr)
KR (1) KR20110054068A (fr)
CN (1) CN102159886B (fr)
CA (1) CA2737660A1 (fr)
DE (1) DE102008047933A1 (fr)
WO (1) WO2010031723A1 (fr)

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Also Published As

Publication number Publication date
US8686557B2 (en) 2014-04-01
WO2010031723A1 (fr) 2010-03-25
CN102159886A (zh) 2011-08-17
CA2737660A1 (fr) 2010-03-25
CN102159886B (zh) 2014-11-12
JP2012503284A (ja) 2012-02-02
US20110170297A1 (en) 2011-07-14
KR20110054068A (ko) 2011-05-24
DE102008047933A1 (de) 2010-04-15

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