EP2510538A4 - Élimination d'une matière de masquage - Google Patents
Élimination d'une matière de masquageInfo
- Publication number
- EP2510538A4 EP2510538A4 EP10836729.3A EP10836729A EP2510538A4 EP 2510538 A4 EP2510538 A4 EP 2510538A4 EP 10836729 A EP10836729 A EP 10836729A EP 2510538 A4 EP2510538 A4 EP 2510538A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- removal
- masking material
- masking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000000873 masking effect Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31127—Etching organic layers
- H01L21/31133—Etching organic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3063—Electrolytic etching
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- ing And Chemical Polishing (AREA)
- Detergent Compositions (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/636,015 US8367555B2 (en) | 2009-12-11 | 2009-12-11 | Removal of masking material |
US35624210P | 2010-06-18 | 2010-06-18 | |
PCT/US2010/059800 WO2011072188A2 (fr) | 2009-12-11 | 2010-12-10 | Élimination d'une matière de masquage |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2510538A2 EP2510538A2 (fr) | 2012-10-17 |
EP2510538A4 true EP2510538A4 (fr) | 2014-03-26 |
Family
ID=44146190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10836729.3A Withdrawn EP2510538A4 (fr) | 2009-12-11 | 2010-12-10 | Élimination d'une matière de masquage |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2510538A4 (fr) |
JP (1) | JP2013513824A (fr) |
KR (1) | KR20120108984A (fr) |
CN (1) | CN103119694A (fr) |
SG (1) | SG181642A1 (fr) |
TW (1) | TW201140254A (fr) |
WO (1) | WO2011072188A2 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140318584A1 (en) | 2011-01-13 | 2014-10-30 | Advanced Technology Materials, Inc. | Formulations for the removal of particles generated by cerium-containing solutions |
US8367556B1 (en) * | 2011-12-01 | 2013-02-05 | International Business Machines Corporation | Use of an organic planarizing mask for cutting a plurality of gate lines |
CN104487900B (zh) * | 2012-05-18 | 2019-07-23 | 恩特格里斯公司 | 用于从包括氮化钛的表面剥离光致抗蚀剂的组合物和方法 |
CN103235491A (zh) * | 2013-04-07 | 2013-08-07 | 北京七星华创电子股份有限公司 | 一种抗蚀剂剥离液及其应用 |
TWI667708B (zh) * | 2013-11-11 | 2019-08-01 | 東京威力科創股份有限公司 | 蝕刻後聚合物及硬遮罩移除之加強型移除用方法及硬體 |
TWI595332B (zh) * | 2014-08-05 | 2017-08-11 | 頎邦科技股份有限公司 | 光阻剝離方法 |
CN106435616B (zh) * | 2016-10-10 | 2018-09-07 | 深圳大学 | 一种TiNC膜的退镀液及退镀工艺 |
KR101971459B1 (ko) * | 2017-06-05 | 2019-04-23 | 재원산업 주식회사 | 유기발광소자 제조용 도전 부재 세정용 조성물 및 이를 이용한 세정방법 |
JP6992095B2 (ja) * | 2018-02-05 | 2022-01-13 | 富士フイルム株式会社 | 基板の処理方法、半導体装置の製造方法、基板処理用キット |
CN115066104A (zh) * | 2022-07-09 | 2022-09-16 | 南通群安电子材料有限公司 | 针对厚光阻抗蚀剂的剥除液 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006113621A2 (fr) * | 2005-04-15 | 2006-10-26 | Advanced Technology Materials, Inc. | Formulations pour le nettoyage de couches de photoresine implantees d'ions a partir de dispositifs microelectroniques |
US20080283090A1 (en) * | 2007-05-18 | 2008-11-20 | Dekraker David | Process for treatment of substrates with water vapor or steam |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19639093A1 (de) * | 1996-09-24 | 1998-03-26 | Bosch Gmbh Robert | Verfahren zur drahtlosen Übertragung von Ortsinformationen und Nutzinformationen und Sende-/Empfangseinrichtung |
US6162565A (en) * | 1998-10-23 | 2000-12-19 | International Business Machines Corporation | Dilute acid rinse after develop for chrome etch |
JP2002064101A (ja) * | 2000-08-21 | 2002-02-28 | Casio Comput Co Ltd | クロム層を有する配線の形成方法 |
US6599370B2 (en) * | 2000-10-16 | 2003-07-29 | Mallinckrodt Inc. | Stabilized alkaline compositions for cleaning microelectronic substrates |
JP2003017465A (ja) * | 2001-06-29 | 2003-01-17 | Mitsubishi Electric Corp | 半導体装置の製造方法および半導体装置 |
US7247567B2 (en) * | 2004-06-16 | 2007-07-24 | Cabot Microelectronics Corporation | Method of polishing a tungsten-containing substrate |
-
2010
- 2010-12-10 EP EP10836729.3A patent/EP2510538A4/fr not_active Withdrawn
- 2010-12-10 SG SG2012042941A patent/SG181642A1/en unknown
- 2010-12-10 WO PCT/US2010/059800 patent/WO2011072188A2/fr active Application Filing
- 2010-12-10 KR KR1020127017769A patent/KR20120108984A/ko not_active Application Discontinuation
- 2010-12-10 CN CN2010800629333A patent/CN103119694A/zh active Pending
- 2010-12-10 JP JP2012543300A patent/JP2013513824A/ja not_active Withdrawn
- 2010-12-10 TW TW099143206A patent/TW201140254A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006113621A2 (fr) * | 2005-04-15 | 2006-10-26 | Advanced Technology Materials, Inc. | Formulations pour le nettoyage de couches de photoresine implantees d'ions a partir de dispositifs microelectroniques |
US20080283090A1 (en) * | 2007-05-18 | 2008-11-20 | Dekraker David | Process for treatment of substrates with water vapor or steam |
Also Published As
Publication number | Publication date |
---|---|
KR20120108984A (ko) | 2012-10-05 |
SG181642A1 (en) | 2012-07-30 |
WO2011072188A2 (fr) | 2011-06-16 |
TW201140254A (en) | 2011-11-16 |
CN103119694A (zh) | 2013-05-22 |
JP2013513824A (ja) | 2013-04-22 |
WO2011072188A3 (fr) | 2011-09-15 |
EP2510538A2 (fr) | 2012-10-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2510538A4 (fr) | Élimination d'une matière de masquage | |
EP2490770A4 (fr) | Production rapide de masques personnalisés | |
EP2455097A4 (fr) | Matière à teneur en protéoglycane | |
GB0909460D0 (en) | Mesoporus material | |
GB2473099B (en) | Inspection of holes | |
HK1167373A1 (en) | Wheel of polymeric material | |
ZA201107861B (en) | Absorbent material | |
EP2441477A4 (fr) | Matériau de recouvrement d une plaie | |
GB0915515D0 (en) | Treatment of vasculoproliferative conditions | |
GB0911616D0 (en) | Ceramic material | |
HK1171624A1 (en) | Inhibitors of cognitive decline | |
HK1167323A1 (en) | Inhibitors of cognitive decline | |
IL208839A0 (en) | Structure of touch-fastening anti-skidding material | |
PL2493496T3 (pl) | Zastosowanie GSTP1 | |
GB0912177D0 (en) | Contained transfer of material | |
GB0916510D0 (en) | Deposition of materials | |
GB2473232B (en) | Method of depositing material | |
GB0907249D0 (en) | New process and new compounds | |
SI2504309T1 (sl) | Sinteza acetokslacetaldehida | |
GB201007014D0 (en) | Masking | |
GB0904378D0 (en) | Delayed-tack material | |
TWM372743U (en) | Improved structure of Kendama | |
TWM365675U (en) | Improved structure of teapoy | |
GB0901178D0 (en) | Proximity of particles | |
GB0920907D0 (en) | Method of handling material |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20120704 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: CYWAR, DOUGLAS Inventor name: BOGGS, KARL E. Inventor name: KERN, MATTHEW Inventor name: BAUM, THOMAS H. Inventor name: TOTIR, GEORGE GABRIEL Inventor name: AFZALI-ARDAKANI, ALI Inventor name: NUNES, RONALD W. Inventor name: COOPER, EMANUEL I. Inventor name: KHOJASTEH, MAHMOUD |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: NUNES, RONALD W. Inventor name: AFZALI-ARDAKANI, ALI Inventor name: TOTIR, GEORGE GABRIEL Inventor name: KHOJASTEH, MAHMOUD Inventor name: COOPER, EMANUEL I. Inventor name: BOGGS, KARL E. Inventor name: BAUM, THOMAS H. Inventor name: CYWAR, DOUGLAS Inventor name: KERN, MATTHEW |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20140225 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/311 20060101AFI20140219BHEP Ipc: G03F 7/42 20060101ALI20140219BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20140701 |