EP2495081B1 - Outil de coupe doté d'une lame en diamant cristallin fin - Google Patents

Outil de coupe doté d'une lame en diamant cristallin fin Download PDF

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Publication number
EP2495081B1
EP2495081B1 EP20110001694 EP11001694A EP2495081B1 EP 2495081 B1 EP2495081 B1 EP 2495081B1 EP 20110001694 EP20110001694 EP 20110001694 EP 11001694 A EP11001694 A EP 11001694A EP 2495081 B1 EP2495081 B1 EP 2495081B1
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Prior art keywords
layer
cutting tool
diamond layer
diamond
cutting
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EP20110001694
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German (de)
English (en)
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EP2495081A8 (fr
EP2495081A1 (fr
Inventor
André Dr. Flöter
Stefan Strobel
Peter Dr.-Ing. Gluche
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GFD Gesellschaft fuer Diamantprodukte mbH
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GFD Gesellschaft fuer Diamantprodukte mbH
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Priority to EP20110001694 priority Critical patent/EP2495081B1/fr
Priority to US13/408,093 priority patent/US8904650B2/en
Publication of EP2495081A1 publication Critical patent/EP2495081A1/fr
Publication of EP2495081A8 publication Critical patent/EP2495081A8/fr
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26B—HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B21/00—Razors of the open or knife type; Safety razors or other shaving implements of the planing type; Hair-trimming devices involving a razor-blade; Equipment therefor
    • B26B21/54—Razor-blades
    • B26B21/58—Razor-blades characterised by the material
    • B26B21/60—Razor-blades characterised by the material by the coating material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26B—HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR
    • B26B21/00—Razors of the open or knife type; Safety razors or other shaving implements of the planing type; Hair-trimming devices involving a razor-blade; Equipment therefor
    • B26B21/54—Razor-blades
    • B26B21/58—Razor-blades characterised by the material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support

Definitions

  • the present invention relates to a cutting tool, in particular in the form of a razor blade, a scalpel, a knife, a machine knife, a pair of scissors, etc., which has a synthetic diamond layer with a cutting edge.
  • the diamond layer consists of fine crystalline diamond.
  • Cutting tools such as knives and scalpels having diamond layers have been known in the prior art for some time. These cutting tools can be completely formed from a diamond layer (full diamond blade), as well as the possibility can be given that a synthetic diamond layer is applied to a substrate suitable for this purpose. In most cases, the cutting edge of the cutting tool is formed in the diamond layer, since diamond is the hardest known Material is.
  • These blades are distinguished from, for example, steel blades by a higher cutting ability (sharpness) and a higher cutting durability (life, service life).
  • the diamond materials that are used for the blades known from the prior art are either polycrystalline diamond materials, on the other hand, the use of single-crystal diamond is possible.
  • single-crystal diamond is extremely difficult to produce and process, on the other hand it is very expensive, so that it is unsuitable for use in mass products such as razor blades.
  • Polycrystalline diamond layers are characterized by a clearly heterogeneous distribution of the size of the crystalline domains.
  • the sizes of the crystalline regions in polycrystalline diamond vary over several orders of magnitude.
  • at least 50% of the crystallites are present with an average size between 2 and 100 ⁇ m.
  • Such a polycrystalline diamond layer is thus very heterogeneous, but inexpensive to produce.
  • polycrystalline diamond layers on the growth side have high surface roughness roughness on. This is usually about rms> 1 ⁇ m.
  • polycrystalline diamond layers in the transverse fracture have a columnar structure, ie the grain boundaries are substantially perpendicular to the substrate surface. Since the grain boundary represents a macroscopic defect, it acts like a predetermined breaking point.
  • polycrystalline diamond layers contain a large number of these predetermined breaking points and are therefore very susceptible to breakage. For example, the bending fracture stress ⁇ 0 in the case of polycrystalline layers is approximately 1/10 that of monocrystalline diamond.
  • a cutting tool which comprises a cutting edge, synthetic diamond layer.
  • the cutting edge is characterized by a profile with decreasing layer thickness, wherein the diamond layer consists of fine crystalline diamond.
  • finely crystalline diamond is understood to mean a diamond layer, the crystalline domains having an average particle size d 50 of ⁇ 500 nm. By this is meant that at least 50% of the crystallites have each dimension of a single crystallite ⁇ 500 nm.
  • the fine-crystalline diamond layer is thus characterized by an extremely high homogeneity of the crystallites.
  • the bending fracture stress ⁇ 0 is determined by statistical evaluation of fracture tests, eg in the B3B load test according to the literature references above. It is defined as the breaking stress, with a probability of 63%.
  • the cutting tools according to the invention can be formed symmetrically or asymmetrically with respect to the cutting edge.
  • the cutting tool may have a chamfer, i. a second angle at the cutting edge.
  • a preferred embodiment provides that the mean grain size d ⁇ 0 of the fine-crystalline diamond is ⁇ 100 nm, more preferably between 5 and 100 nm, particularly preferably between 10 and 70 nm.
  • the proportion of sp and sp 2 bonds of the fine-crystalline diamond layer is between 0.5 and 10%, preferably between 2 and 9%, particularly preferably between 3 and 8%.
  • a higher sp 2 content causes the modulus of elasticity of the fine-grained diamond layer to be slightly lowered.
  • the hardness of this material also decreases.
  • the fine-crystalline diamond layers become more flexible and elastic overall and can better adapt to the material to be cut or the contour of the material to be cut.
  • the cutting edge is ideally round, preferably the rounding radius r of the diamond layer at the cutting edge is between 3 and 100 nm, preferably between 15 and 70 nm, especially preferably between 20 and 50 nm.
  • the cutting angle ⁇ is between 10 ° and 40 °, preferably between 10 ° and 30 °, particularly preferably between 15 ° and 25 °.
  • the rounding radius r is matched to the mean grain size d 50 of the fine-crystalline diamond.
  • the ratio between the radius of curvature r of the diamond layer at the cutting edge and the mean grain size d 50 of the fine-crystalline diamond r / d 50 is between 0.03 and 20, preferably between 0.05 and 15, particularly preferably between 0 , 5 and 10.
  • a first particularly preferred alternative of the present invention provides that the cutting tool is formed entirely from the diamond layer, wherein the diamond layer has a thickness of 10 to 1000 .mu.m, preferably 10 to 500 .mu.m, particularly preferably 20 to 250 microns.
  • the cutting tool is formed as a full diamond blade.
  • the diamond layer is arranged on a substrate material, the diamond layer having a thickness of up to 1 and 500 ⁇ m, preferably 5 to 200 ⁇ m.
  • the cutting edge is formed in the diamond layer.
  • This embodiment is advantageous in that the diamond layer is formed with a smaller layer thickness than a full diamond blade can be, resulting in savings on the relatively expensive and expensive to produce diamond material.
  • the function of reinforcing the blade can take over the substrate.
  • Preferred substrate materials are selected from the group consisting of metals such as titanium, nickel, chromium, niobium, tungsten, tantalum, molybdenum, vanadium, platinum, iron-containing materials such as steel and / or germanium; from carbon and / or nitrogen or boron-containing ceramics, such as silicon carbide, silicon nitride, boron nitride, tantalum carbide, tungsten carbide, molybdenum carbide, titanium nitrides, TiAlN, TiCN and / or TiB 2 , glass ceramics, such as Zerodur® or Pyrex®; Composites of ceramic materials in a metallic matrix (cermets); Hard metals; sintered carbide carbides such as cobalt or nickel bonded tungsten carbides or titanium carbides; Silicon, glass or sapphire; and monocrystalline or polycrystalline diamond and / or diamond-like carbon layers.
  • metals such as titanium, nickel, chromium, niobium, tungsten
  • the gradient of the average grain size of the fine-crystalline diamond measured in the direction of the thickness of the finely crystalline diamond layer is ⁇ 300%, preferably ⁇ 100%, particularly preferably ⁇ 50%.
  • This embodiment provides that the mean grain size diameter of the fine-grained domains of the diamond layer is distributed relatively evenly to evenly throughout the entire layer thickness, ie the grain sizes are approximately the same on one side of the diamond layer as on the other side of the diamond layer; Of course, it is particularly advantageous in this case for a virtually complete or complete complete homogeneity of the finely crystalline domains of the diamond layer.
  • the gradient is determined by determining the average grain size diameter d 50 on one side of the diamond layer and relating it to the average grain size diameter on the opposite side of the diamond layer.
  • a further preferred embodiment of the present invention provides that at least one first adhesion promoter layer, preferably of silicon carbide, silicon nitride, tungsten, titanium or silicon, is applied between the substrate and the fine-crystalline diamond layer.
  • This embodiment ensures a good hold of the diamond layer on the substrate.
  • the first primer layer increases the strength of the mechanical bond between the core and the fine-grained diamond layer and thus enables reliable further processing.
  • At least one second primer layer preferably of Cr, Pt, Ti or W, and thereon a sliding layer, in particular a polymer layer, preferably a PTFE layer (Teflon) on the fine crystalline diamond layer , Carbon layer, preferably a graphite layer and / or a DLC layer applied.
  • the second adhesion promoter layer also serves to better bond the sliding layer to the fine crystalline diamond layer.
  • the sliding layer serves to minimize friction.
  • carbon layers, graphite or DLC layers can also be dispensed with the second adhesion promoter layer, since a direct bonding of the carbon layers to the fine crystalline diamond layer is possible.
  • the sliding layer serves to minimize friction between cutting tool and cutting material. Likewise, a minimization of dirt adhesion, avoidance of cutting dust and a reduction of the cutting forces is achieved.
  • these additional coatings may for example be present locally in the region of the cutting edge, as well as the entire cutting tool may be provided with these coatings.
  • the additional coatings described above may also be used e.g. be applied in the region of the edges forming the cutting edge of the cutting tool. Likewise, however, a complete coating of the cutting tool or at least the surfaces of the diamond layer is possible.
  • the diamond layer has an average surface roughness of R A ⁇ 5 ⁇ m, preferably ⁇ 2 ⁇ m, particularly preferably ⁇ 1 ⁇ m. This makes an additional mechanical polishing of the grown diamond surface superfluous.
  • a further preferred variant provides that the cutting edge has notches or cuts at regular intervals, preferably at regular intervals of less than 10 mm. Preferred distances are for example between 5 and 9 mm. These indentations allow the blade to be guided relative to the material to be cut, thus stabilizing the cutting tool during the cutting process.
  • the cutting tool is a blade, knife blade, razor blade, scalpel, knife, machine knife, Scissors or machine shears trained or can be used as such. It is also possible that the cutting tool is designed as a shaving system, ie, as a head with a plurality of razor blades or can be used as such. All razor blades are designed as cutting tools according to the invention.
  • the bending fracture stress ⁇ 0 of the diamond layer is> 2 GPa, preferably> 4 GPa, particularly preferably> 5 GFa.
  • ⁇ 0 is defined as above.
  • the modulus of elasticity of the diamond layer is ⁇ 1.200 GPa, preferably ⁇ 900, particularly preferably ⁇ 750 GPa.
  • a further preferred embodiment provides that the crystallites of the fine-crystalline diamond layer are preferably grown in the ⁇ 100>, ⁇ 110> and / or ⁇ 111> direction, ie. a texture is present. This can result from the manufacturing process, in which the growth rate of certain crystal directions can be deliberately preferred. This anisotropic texture of the crystallites also positively affects the mechanical properties.
  • a separation of the diamond layer is performed at a given angle ⁇ .
  • This sharp edge forms later, i. after resharpening the cutting edge.
  • the relationship ⁇ + ⁇ 90 ° between angle ⁇ and cutting angle ⁇ .
  • the finely crystalline diamond layer is cut through by two flat sides at an angle ⁇ , wherein preferably the same angles ⁇ are selected for the cuts from both sides.
  • cutting tools with symmetrical cutting edges can thus be produced in this way, as they are eg in Fig. 2b are shown.
  • an asymmetrical or symmetrical solid diamond blade can be realized.
  • the synthetic, finely crystalline diamond layer provided in the first step can be produced on a planar substrate by standard methods known from the prior art. It is only important that the average grain size diameter d 50 of the crystalline domains in the fine-crystalline diamond layer is ⁇ 500 nm. By subsequently removing the substrate by suitable methods, the finely crystalline diamond layer is obtained in isolation.
  • the separation step can be used in all possible ways such as laser cutting, plasma or ion etching, water jet cutting or mechanical processing are performed.
  • the cutting angle ⁇ of the resulting cutting tool is already predetermined.
  • the cutting edge ideally two identical fragments are formed; if the separating cut is carried out appropriately, both acute-angled ends of the diamond layer are already suitable for being used as the cutting edge of the cutting tool.
  • the provision of the fine crystalline diamond layer is performed by applying the fine crystalline diamond layer to a substrate and then partially or completely removing the substrate.
  • planar substrate can be done before or after the execution of the separation step.
  • the substrate can also be maintained and contribute to mechanical stability (sandwich construction).
  • the synthetic fine-grained diamond layer is deposited on a substrate and subsequently steps b) and c) are carried out.
  • the farther above-described diamond blade having a fine crystalline diamond layer deposited on a substrate With regard to the individual steps, reference is made to the comments made above.
  • the fine crystalline diamond layer may be formed such that fine crystalline diamond seed crystals are deposited on the substrate for depositing the fine crystalline diamond layer, and the fine crystalline diamond layer is deposited on the diamond seed crystals, e.g. is deposited via CVD method.
  • the fine-crystalline diamond films are produced, for example, by means of a "hot-wire CVD process".
  • a gas phase consisting of, for example 1 to 5 vol .-% CH 4 and 95 to 99 vol .-% hydrogen activated.
  • the wire temperature is, for example, in a range of 1,800 ° C to 2,400 ° C.
  • a substrate temperature of 600 ° C to 900 ° C is set.
  • the pressure of the gas atmosphere is between 3 mbar and 30 mbar. In this case, the fine-grained diamond layer is deposited on the substrate.
  • the severing which is carried out in the abovementioned variants of the method in step b), can, for example by means of a laser, by means of Wire erosion, by water jet, by plasma or ion etching, or by mechanical ⁇ procedure.
  • FIG. 1 shows three different variants of blades, each made entirely of diamond.
  • FIG. 1a shows a blade consisting of single crystal diamond.
  • monocrystalline diamond in macroscopic form, such as blades, efficient and reproducible manufacture, so that such blades are available only in limited quantities and are also very expensive.
  • the rounding radius r of the cutting edge is indicated (detail D).
  • FIG. 1b shows by default known in the art Volldiamantklingen based on polycrystalline diamond material.
  • the polymorphism of the arranged crystallite domains of the polycrystalline material is shown schematically.
  • it can occur with the high cutting forces occurring here that individual crystallites break out of the blade, in particular in the region preferably along grain boundaries of the cutting edge (see detail A), so that the blade, for example, already during initial use has an increased pungency. This results in a very inhomogeneous cutting edge, which significantly affects the cutting ability and the cutting edge of such a blade.
  • FIG. 1c a blade according to the invention of nano or fine crystalline diamond material is shown.
  • the average size that is to say the diameter d 50 of the respective crystallite domains
  • the breaking of the blade in the cutting area in comparison to the form of the polycrystalline diamond according to FIG. 1b is significantly reduced, since the crystallites, which may possibly break out, much smaller pronounced are.
  • damage to the blade compared to FIG. 1b detectable only on a microscopic scale, so that the macroscopic structure of the cutting edge of the blade according to Figure 1c essentially unimpaired.
  • nanocrystalline crystallite domains of a blade according to Figure 1c lie below 500 nm, while polycrystalline diamond crystal domains have an average order of the crystallite domain d 50 between 2 and 100 microns.
  • FIG. 2 shows three alternative variants for the production of the cutting tool according to the invention by means of the method according to the invention, which are each shown in the figure sequence 2a) to 2c), 2d) to 2f) and 2g) to 2i).
  • the diamond layer 1 is in an in Fig. 2b
  • a two-time cutting process in each case at an angle ⁇ to the surface normal (shown as arrow in FIG Fig. 2b ) carried out.
  • ⁇ represents the angle to the surface normal the diamond layer under which the diamond layer is cut from both sides, and ⁇ the cutting angle.
  • step sequence according to FIGS. 2g) to 2i is based on a diamond layer 2, which is applied to a substrate 1. Between substrate 1 and diamond layer 2 further layers may be arranged, such as the adhesive layer shown in detail c 3.
  • This compound is in the step sequence in FIG. 2h ) is also severed at an angle ⁇ to the surface normal, so that two fragments A and B are formed. This results in fragment A also already - not sufficiently sharp - cutting edge in the diamond layer 2, which analogous to the step according to FIG. 2f ) in a subsequent sharpening process (step according to FIG. 2i )) can be resharpened by plasma or ion etching.
  • FIG. 2h the adhesive layer shown in detail c 3.
  • fragment B to be able to form a cutting edge in the diamond layer 2, the cutting projection of the substrate layer 1 still has to be removed (not shown). This can be done for example by a new cutting process, so that after appropriate processing, a further fragment is present, the fragment A, as in FIG. 2h ), corresponds.
  • FIG. 3 shows various embodiments of the cutting tool according to the invention, for example in the form of a machine knife a), a kitchen knife b) or differently designed blades c) or d). Also razor blades (see e)) are possible.
  • FIG. 4 shows a special embodiment in which the cutting tool is based on a fine crystalline diamond layer 2.
  • This cutting tool represents a solid diamond blade.
  • an adhesion promoter layer 3 and a lubricant layer 4 applied to the adhesion promoter layer 3 are formed on the diamond layer 2, an adhesion promoter layer 3 and a lubricant layer 4 applied to the adhesion promoter layer 3 are formed.
  • the bonding agent layer 3 may preferably consist of metals, such as chromium, platinum, titanium, silicon or tungsten. These metals may, for example, by CVD or PVD processes on the diamond layer 2, which forms the blade deposited or sputtered on.
  • the sliding layer 4 are in particular polymeric materials, such as PTFE, in question. But there are also carbon-based sliding layers, such as DLC or graphite possible.
  • FIG. 4 an embodiment of the cutting tool is shown, wherein the cutting edge is formed asymmetrically.
  • FIG. 5 shows essentially the same embodiment as FIG. 4 , only that here only the cutting tool is symmetrical with respect to the cutting edge.
  • FIG. 6 another embodiment of the diamond blade is shown having notches in the cutting edge.
  • the notches are formed throughout by the diamond blade and can, for example, as in FIG. 6a shown to be formed at regular intervals.
  • the regular spacing shown here may be, for example, less than 10 mm, for example 5 mm.
  • FIG. 6b shows a further variant of the blade, wherein the notch is formed wider, the width of such a notch may for example be between 0.01 and 1 mm and serve to guide the blade relative to the cutting material.

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  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Chemical Vapour Deposition (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Claims (15)

  1. Outil de coupe comportant une couche diamantée synthétique présentant une arête de coupe, l'arête de coupe présentant un profil ayant une épaisseur de couche décroissante, caractérisé en ce que la couche diamantée est constituée de diamants finement cristallins ayant une taille moyenne de grain d50 ≤ 500 nm, étant entendu que la proportion des liaisons sp et sp2 est comprise entre 0,5 et 10 %.
  2. Outil de coupe selon la revendication 1, caractérisé en ce que le rayon d'arrondi r de la couche diamantée est, au niveau de l'arête de coupe, compris entre 3 et 100 nm, de préférence entre 15 et 70 nm, d'une manière particulièrement préférée entre 20 et 50 nm.
  3. Outil de coupe selon l'une des revendications précédentes, caractérisé en ce que l'angle de coupe β est compris entre 10 et 40°, de préférence entre 10 et 30°, d'une manière particulièrement préférée entre 15 et 25°.
  4. Outil de coupe selon l'une des revendications précédentes, caractérisé en ce que le rapport entre le rayon d'arrondi r de la couche diamantée au niveau de l'arête de coupe et la taille moyenne de grain d50 du diamant finement cristallin r/d50 est compris entre 0,03 et 20, de préférence entre 0,05 et 15, d'une manière particulièrement préférée entre 0,5 et 10.
  5. Outil de coupe selon l'une des revendications précédentes, caractérisé en ce que l'outil de coupe est formé en totalité par la couche diamantée, la couche diamantée présentant une épaisseur allant de jusqu'à 10 à 1000 µm, de préférence de 10 à 500 µm, d'une manière particulièrement préférée de 20 à 250 µm.
  6. Outil de coupe selon l'une des revendications 1 à 4, caractérisé en ce que la couche diamantée est disposée sur un matériau formant substrat, la couche diamantée présentant une épaisseur de jusqu'à 1 à 500 µm, de préférence de 5 à 200 µm.
  7. Outil de coupe selon la revendication précédente, caractérisé en ce que le matériau formant substrat est choisi dans le groupe consistant en les métaux tels que le titane, le nickel, le chrome, le niobium, le tungstène, le tantale, le molybdène, le vanadium, le platine, les matériaux ferreux tels que l'acier et/ou le germanium ; les céramiques contenant du carbone et/ou de l'azote et/ou du bore, tels que le carbure de silicium, le nitrure de silicium, le nitrure de bore, le carbure de tantale, le carbure de tungstène, le carbure de molybdène, les nitrures de titane, le TiAIN, le TicN et/ou le TiB2, les vitrocéramiques ; les matériaux composites constitués de matériaux céramiques dans une matrice métallique (Cermets) ; les métaux durs ; les métaux durs du type carbure fritté, tels que par exemple les carbures de tungstène ou les carbures de titane liés au cobalt ou au nickel ; le silicium, le verre ou le saphir ; ainsi que le diamant mono- ou polycristallin et/ou les couches de carbone de type diamant.
  8. Outil de coupe selon l'une des revendications précédentes, caractérisé en ce que le gradient de la taille moyenne de grain du diamant finement cristallin, mesuré dans la direction de l'épaisseur de la couche diamantée finement cristalline, est < 300 %, de préférence < 100 %, d'une manière particulièrement préférée < 50 %.
  9. Outil de coupe selon l'une des deux revendications précédentes, caractérisé en ce qu'entre le substrat et la couche diamantée finement cristalline est appliquée au moins une première couche promotrice d'adhérence, de préférence en carbure de silicium, en nitrure de silicium, en tungstène, en titane ou en silicium.
  10. Outil de coupe selon l'une des revendications précédentes, caractérisé en ce que sur la couche diamantée finement cristalline sont appliquées au moins une deuxième couche promotrice d'adhérence, de préférence en Cr, Pt, Ti ou W, ainsi que, par-dessus, une couche de glissement, en particulier une couche polymère, de préférence une couche de PTFE, une couche de carbone, de préférence une couche de graphite et/ou une couche de DLC.
  11. Outil de coupe selon l'une des revendications précédentes, caractérisé en ce que la couche diamantée présente une rugosité superficielle moyenne Ra < 5 µm, de préférence < 2 µm, d'une manière particulièrement préférée < 1 µm.
  12. Outil de coupe selon l'une des revendications précédentes, caractérisé en ce que l'arête de coupe présente, à des distances régulières, de préférence à des distances régulières inférieures à 10 mm, des rainures ou des découpures.
  13. Outil de coupe selon l'une des revendications précédentes, caractérisé en ce que les cristallites de la couche diamantée finement cristalline présentent une texturation essentiellement <100>, <110> ou <111>.
  14. Procédé de fabrication d'un outil de coupe selon l'une des revendications 1 à 13, comportant les étapes suivantes :
    a) la fourniture d'une couche diamantée finement cristalline, synthétique, ayant une granulométrie moyenne d50 ≤ 500 nm, du moment que la proportion des liaisons sp et sp2 est comprise dans la plage de 0,5 à 10 %,
    b) le découpage, sur un ou sur deux côtés, de la couche diamantée finement cristalline sous un angle a qui par rapport à la normale à la surface de la couche diamantée finement cristalline est compris entre 50 et 85°, de préférence entre 60 et 80°, d'une manière particulièrement préférée entre 65 et 75°, avec formation d'au moins un fragment comportant une arête de coupe, ainsi que
    c) le réaffutage de l'arête de coupe, par un procédé de gravure par plasma ou de gravure ionique.
  15. Utilisation d'un outil de coupe selon l'une des revendications 1 à 13 en tant que lame, lame de couteau, lame de rasoir, système de rasage, scalpel, couteau, lame de massicot, ciseau ou ciseau mécanique.
EP20110001694 2011-03-01 2011-03-01 Outil de coupe doté d'une lame en diamant cristallin fin Active EP2495081B1 (fr)

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Application Number Priority Date Filing Date Title
EP20110001694 EP2495081B1 (fr) 2011-03-01 2011-03-01 Outil de coupe doté d'une lame en diamant cristallin fin
US13/408,093 US8904650B2 (en) 2011-03-01 2012-02-29 Cutting tool with blade made of fine-crystalline diamond

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EP20110001694 EP2495081B1 (fr) 2011-03-01 2011-03-01 Outil de coupe doté d'une lame en diamant cristallin fin

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EP2495081A1 EP2495081A1 (fr) 2012-09-05
EP2495081A8 EP2495081A8 (fr) 2012-10-24
EP2495081B1 true EP2495081B1 (fr) 2014-05-07

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WO2024056307A1 (fr) 2022-09-16 2024-03-21 Wmf Gmbh Lame de coupe et son procédé de production
WO2024125857A1 (fr) 2022-12-14 2024-06-20 Wmf Gmbh Lame de coupe et son procédé de fabrication

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BR112017010922B1 (pt) * 2014-12-22 2021-07-06 Bic-Violex Sa Lâmina para barbeamento e depilação
WO2016109481A2 (fr) 2014-12-30 2016-07-07 DePuy Synthes Products, Inc. Revêtements pour instruments chirurgicaux
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US8904650B2 (en) 2014-12-09
EP2495081A1 (fr) 2012-09-05
US20120276826A1 (en) 2012-11-01

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