EP2471083B1 - Thermosicherung - Google Patents
Thermosicherung Download PDFInfo
- Publication number
- EP2471083B1 EP2471083B1 EP11749108.4A EP11749108A EP2471083B1 EP 2471083 B1 EP2471083 B1 EP 2471083B1 EP 11749108 A EP11749108 A EP 11749108A EP 2471083 B1 EP2471083 B1 EP 2471083B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- safety device
- thermal safety
- fuse
- terminals
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004020 conductor Substances 0.000 claims description 66
- 239000011248 coating agent Substances 0.000 claims description 35
- 238000000576 coating method Methods 0.000 claims description 35
- 238000005538 encapsulation Methods 0.000 claims description 31
- 238000002844 melting Methods 0.000 claims description 27
- 230000008018 melting Effects 0.000 claims description 25
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 21
- 229910045601 alloy Inorganic materials 0.000 claims description 15
- 239000000956 alloy Substances 0.000 claims description 15
- 230000004907 flux Effects 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 229910052718 tin Inorganic materials 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 9
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 8
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 7
- 239000004922 lacquer Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 6
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 239000011368 organic material Substances 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229910001152 Bi alloy Inorganic materials 0.000 claims 1
- 229910000846 In alloy Inorganic materials 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 24
- 239000000203 mixture Substances 0.000 description 8
- 239000000155 melt Substances 0.000 description 7
- 238000000926 separation method Methods 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
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- 230000008569 process Effects 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229910000743 fusible alloy Inorganic materials 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012778 molding material Substances 0.000 description 2
- 229910000480 nickel oxide Inorganic materials 0.000 description 2
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
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- 229910001092 metal group alloy Inorganic materials 0.000 description 1
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- 238000007747 plating Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- 238000005382 thermal cycling Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/02—Details
- H01H37/32—Thermally-sensitive members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D41/00—Casting melt-holding vessels, e.g. ladles, tundishes, cups or the like
- B22D41/005—Casting melt-holding vessels, e.g. ladles, tundishes, cups or the like with heating or cooling means
- B22D41/01—Heating means
- B22D41/015—Heating means with external heating, i.e. the heat source not being a part of the ladle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H37/761—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material with a fusible element forming part of the switched circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/06—Fusible members characterised by the fusible material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/12—Two or more separate fusible members in parallel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H37/00—Thermally-actuated switches
- H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
- H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
- H01H2037/768—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material characterised by the composition of the fusible material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
- H01H2085/0412—Miniature fuses specially adapted for being mounted on a printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
- H01H2085/0414—Surface mounted fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
Definitions
- the invention relates to a method for the separation of a circuit.
- the invention further relates to a thermal fuse for disconnecting a circuit during melting of a fusible conductor.
- Thermal fuses of the specified type for example, in the automotive industry in vehicles due to the increasing use of semiconductor devices (MOSFETs, IGBTs) for switching high currents in electrical consumers increasingly important.
- MOSFETs semiconductor devices
- IGBTs semiconductor devices
- failure of the semiconductor switching element e.g. due to a short-circuit or because of alloying or another malfunction, it may be due to a faulty current flow to an impermissible and possibly fatal temperature increase.
- Such a fuse works as overtemperature protection by interrupting the power supply upon reaching a switching temperature caused by a malfunction, in particular short circuit of an electrical component and prevents another, possibly fatal temperature increase.
- thermal fuse can generally be the over-temperature and fire protection of high current loads, for example, to secure solar cells or high-energy battery cells, as well as additional heaters.
- Thermal fuses based on spring or melt wax technology are already used in household appliances, e.g. Coffee machines, state of the art. Such fuses can not be used for high current power applications due to their low current carrying capacity.
- thermal fuses from the US 7,068,141 B2 known that trigger without mechanical forces (eg springs).
- the DE 244 375 A1 describes a thermal fuse in the form of a melt resistor for use in power supplies and power circuits.
- the DE 10 2007 014 338 A1 describes a thermal fuse in the form of a line structure, in particular in a stamped grid or a printed circuit board, which has a fusible element and causes the separation of the electrical connection due to the surface tension.
- the DE 10 2008 003 659 A1 relates to a fuse with a conductor bar, which serves as an electrically conductive connection in normal operation and melts in the event of thermal failure when reaching a certain temperature.
- a thermal fuse which has a connecting element and a separately formed actuator.
- the actuator mechanically disconnects the electrical connection upon reaching a particular trip temperature.
- thermal fuses which usually have a soldered leaf spring, which separates the electrical connection upon reaching a certain temperature.
- thermal fuse which performs the separation of a circuit during melting of a fusible conductor, wherein the thermal fuse has two connection parts and the fusible conductor is arranged between these connection parts. Furthermore, the fuse on a protective sheath, which is arranged around the fusible conductor such that a cavity between the protective sheath and the fusible conductor consists.
- the thermal fuse comprises a fusible element of a meltable at a triggering temperature material and a carrier layer on a surface in a contacting region of the fusible alloy, wherein the melting temperature of the material of the carrier layer is higher than the triggering temperature and wherein the material of the carrier layer is selected so that it is solid Condition in the molten material of the fusible element goes into solution.
- a method of making an electrical connection between two pads using a wire to form a fuse is described.
- a housing cover is provided, which at least partially encloses the fuse wire and the two connecting parts of the fuse.
- the invention has for its object to provide a thermal fuse for the separation of a circuit available, the fuse is very low and is suitable for high currents, in particular very high short-circuit currents, and a high reliability, especially under difficult conditions such. longer lasting thermal and mechanical stress has.
- the thermal fuse according to the invention is constructed as a fuse, which performs the separation of a circuit in the event of tripping by melting a fuse conductor.
- the thermal fuse has at least two electrically conductive connection parts and a fusible link, which melts when reaching a certain temperature.
- the thermal fuse on an encapsulation or enclosure.
- the fusible conductor is so surrounded by a shell without a free space between the fuse element and shell or components of the thermal fuse is provided.
- a material for the encapsulation or wrapping could be used, for example, a molding material based on epoxy resin. In principle, it is also possible to use other materials and painting.
- the thermal fuse furthermore has a layer structure, wherein at least one additional coating or material layer is provided between the connection parts and the encapsulation or encapsulation.
- the material of this coating is tin, indium, bismuth, preferably silver or an alloy consisting of tin, indium, bismuth or, preferably, silver. Such a coating promotes absorption of the fusible conductor upon reaching the melting temperature.
- the thermal fuse represents an electrical conductor with very high conductivity.
- two electrically conductive connection parts of the thermal fuse are electrically connected to one another by means of a fusible conductor.
- the material of the fusible conductor is designed such that the melting temperature of the fusible conductor material is in the range of the desired release temperature of the fuse.
- the melting temperature of the fusible conductor begins to melt.
- the volume of the fusible conductor increases. Due to encapsulation of the fusible conductor in the thermal fuse, a pressure increase takes place.
- the thermal fuse is designed such that is provided by the encapsulation of the fusible conductor no free space between the fuse element and sheath for receiving the liquid melt conductor material.
- the fusible conductor is completely surrounded within the fuse by directly adjacent components, e.g. the sheath, the connecting parts or a coating applied to the connecting parts or other components of the thermal fuse.
- the fusible conductor is thus surrounded at any point by a free space.
- the fusible conductor is not in contact with a free space, the space having air or other gaseous substance.
- the pressure increase causes the fusible conductor to be displaced in such a way that the electrical connection between the connection parts is disconnected.
- the volume increase in the phase transition of the melt conductor material from the solid to the liquid state takes place as quickly as possible and in the form of a volume jump.
- a sudden increase in volume a rapid increase in pressure and thus a safe release of the thermal fuse are possible.
- the liquid melt conductor material flows due to the volume increase and the associated increase in pressure and due to the capillary action.
- the capillary is formed by a coating on the connecting parts, which at a temperature in the range of the melting temperature of the melt conductor material liquefied.
- fusible link and coating mix and flow through the capillary volume due to pressure increase and capillary action.
- the effluent material of the fusible conductor and the coating thus accumulate at least partially in the outer region of the thermal fuse on the connection parts.
- the outdoor area is the area of the thermal fuse, which is not enclosed by an enclosure.
- the fusible conductor is in the thermal fuse such that it is in direct contact with the connection parts or in direct contact with a coating applied to the connection parts.
- the encapsulation or encapsulation may preferably have an additional varnish layer on the inside towards the fusible conductor.
- the thermal fuse comprises a flux similar to e.g. may be used for soldering.
- a suitable flux promotes during activation of the fuse activation of the surface and on reaching the melting temperature, the mixing of fusible link and coating and the flow of material through the capillary.
- it is important to use a long-term stable flux which ensures activation even after prolonged elevated temperature influence under operating conditions of typically 100-200 ° C. Even with the use of a flux, no free spaces are provided adjacent to the fusible conductor and / or flux.
- the fusible conductor is located between the two electrically conductive connection parts.
- the Schmelzeiter is arranged in a gap between the connecting parts.
- the fusible conductor can be in direct contact with the connection parts or in direct contact with a coating provided on the connection parts. This has the advantage that during the tripping process when reaching a certain temperature, the separation of the circuit is performed by interrupting the electrical connection between the two connection parts.
- the coating forming the capillary is formed by a galvanization of the two connecting parts
- the material layer between the connecting parts and the encapsulation should preferably have a thickness between 1 ⁇ m and 50 ⁇ m, particularly preferably between 5 ⁇ m and 20 ⁇ m.
- the coating of the connecting parts is preferably designed such that between the connecting parts and the encapsulation the coating, e.g. the tin layer has an under nickelation, wherein the nickel plating may consist of a pure nickel layer or of a nickel-containing alloy.
- This sub-nickel is thus an additional layer between the terminal parts and the coating, e.g. the tin layer.
- the nickel oxide is in direct contact with the connector and the coating, e.g. the interest rate layer.
- the nickel oxide serves as a barrier layer and forms a diffusion barrier between the e.g. made of copper connecting parts and the coating. Such a diffusion barrier prevents the formation of intermetallic phases.
- the nickel layer or nickel-containing alloy may preferably have a thickness between 1 .mu.m and 50 .mu.m, particularly preferably between 5 .mu.m and 15 .mu.m.
- the fusible conductor consists of a conductive, low-melting metal, or a low-melting metal alloy whose composition is determined by the desired release temperature.
- solder alloys such as tin-silver solders, SnAgCu solders, lead solders or other solder alloys may be used.
- alloy compositions listed in the table are only examples of solder alloys. Other alloy compositions could also be used.
- connection parts have the form of caps. It is preferred that the caps have a circular or circular-like cross-section and inside at least partially have a cavity.
- the connecting parts have the shape of a cuboid or a cuboid-like shape.
- the connecting parts form the basic body of the thermal fuse. This has the advantage that the thermal fuse can be designed as a surface-mountable component (SMD component) in the form of a flat fuse.
- SMD component surface-mountable component
- each of the two connection parts could each accommodate one or more non-conductive bodies.
- the one or more non-conductive body for example, the shape of the caps, so they after joining the inner, free Fill in the space of the caps.
- the one or more non-conductive body hold the electrically conductive connection parts, such as caps in position.
- the fusible conductor can be positioned and held by the insulating body in a suitable position between the electrically conductive connection parts.
- the one or more non-conductive bodies could have the shape of a cuboid or a cuboid-like shape, with the non-conductive body or bodies serving to support or hold the electrically conductive connection parts.
- the one or more non-conductive body regardless of the geometric configuration of ceramic, z. B. Al 2 O 3 exist.
- the non-conductive bodies could also consist of another insulating material, eg glass, plastic or another organic material.
- the fusible conductor has the shape of a ring.
- the diameter of such a ring could, but need not necessarily, be selected according to the diameter of the caps.
- the use of an annular fusible conductor has the advantage that it can be easily interposed between the two electrically conductive caps by the non-conductive bodies, e.g. Ceramic body, can be kept.
- the ring could run around the non-conductive body from the outside.
- the fusible conductor could be designed in the form of one or more longitudinal strips with a certain projection between two parallelepiped connection parts. The fusible conductor is thus arranged at least partially between the cuboid or cap-shaped electrical connection parts.
- the fusible conductor can additionally be arranged at least in regions on the cuboid or cap-shaped connection parts.
- an advantageous embodiment of the invention to provide the thermal fuse with suitable electrical connections by a wire or an electrical conductor in a wire-like shape, preferably in the middle, is connected to the two connection parts.
- the thermal fuse in conventional devices or savings without having to make structural changes to the electrical load or the device.
- the electrical connections be designed in the form of an SMD (Surface Mounted Device) construction.
- SMD Surface Mounted Device
- Such an SMD component is used in electronics as a surface-mountable component or component for surface mounting.
- connection types for other types of installation eg through-hole mounting (through hole technology), conceivable.
- the thermal fuse In order to ensure high mechanical protection, high mechanical stability and protection against oxidation of the thermal fuse, it is preferable to protect the thermal fuse by encapsulation or wrapping.
- the encapsulation or coating can be additionally combined with another protective coating to improve these properties.
- FIG. 1 shows a schematic representation of a thermal fuse 100 according to the invention.
- the thermal fuse 100 according to the invention consists of two caps 11 and 12 with centrally connected wire 14 and 15, a ceramic body 13 and a fusible conductor 10.
- the two caps 11, 12 made of copper.
- the caps 11, 12 may be made of another material of low resistivity.
- the caps 11, 12 and the wires 14, 15 are coated with a coating (23), preferably an Sn layer.
- the coating could also comprise another material, for example indium, bismuth, silver, or an alloy consisting of tin, indium, bismuth or silver.
- a fusible conductor 10 is arranged, which is held by a ceramic body 13.
- the fusible conductor 10 has the shape of a ring and consists of a tin-silver alloy (eg Sn97 Ag3 with a melting point of 217 ° C). The alloy could also have a different composition with a lower or higher melting point, depending on the required fuse release temperature.
- a long-term stable flux 16 which serves during the triggering operation of the fuse to activate the surface and to reduce the surface tension.
- the encapsulation or wrapping of the fuse consisting here of a UV-curable lacquer 17 and an epoxy resin-based molding material 18, serves to increase the mechanical stability of the fuse.
- the encapsulation or sheath 17, 18 provides mechanical and oxidation protection.
- the envelope 18 surrounds the thermal fuse only partially. In particular, the sheath 18 surrounds the thermal fuse in the region in which the fusible conductor 10 is arranged. The ends of the caps 11, 12, in particular in the region of the connection points, for example for the wires 14, 15 are not enclosed by the sheath 18.
- FIG. 2 shows a schematic representation of a thermal fuse 200 according to the invention.
- the thermal fuse 200 consists essentially of the components of in FIG. 1 described thermal fuse 100. An essential difference to the in FIG. 1 described structure is shown in that the thermal fuse 200 in FIG. 2 has no flux application on the fuse element 10.
- FIGS. 3 to 5 show schematic representations of the switching principle of the thermal fuse 100, 200, 300 according to the invention before reaching the melting temperature, upon reaching the melting temperature and after reaching the melting temperature.
- FIG. 3 shows the state before triggering the thermal fuse 100, 200, 300 or before reaching the melting temperature.
- the fusible conductor 10 Before reaching the melting temperature, the fusible conductor 10 is in a fixed state in the gap 24 between the connection parts 11, 12 with the coating 23 and the encapsulation or enclosure 18.
- the pressure gradient by one hand Volume increase and volume jump in the transition from the solid to the liquid phase and the capillary action of importance.
- FIG. 4 shows the state of the thermal fuse 100, 200, 300 when reaching the melting temperature.
- the fusible conductor 10 begins to melt.
- the coating 23 ' also melts in the region of the encapsulation or encapsulation, as a result of which the fusible conductor 10 and the coating 23' at least partially mix.
- the displacement into and through the capillary is significantly caused by the increase in pressure at the phase transition of the fuse element 10 from solid to liquid and the associated volume jump.
- the FIGS. 4 to 5 show the melting of the fusible conductor 10 during melting and after release. For better illustration, see FIG. 4 the flow direction 22 of the fusible conductor during emigration is shown. It can be seen that the fusible conductor 10 completely emanates from the gap 24.
- FIG. 5 shows the switching state of the thermal fuse 100, 200, 300 after the tripping operation and the complete emigration of the fusible conductor 10 from the gap 24.
- solidified with the fusible conductor coating 23 "solidifies and sits on the connecting parts, ie at the original
- the current flow through the thermal fuse 100, 200, 300 is interrupted by the gap between the two conductive connection parts 11, 12 or main bodies 19 interrupted.
- the FIGS. 6 and 7 show schematic representations of a thermal fuse 300 according to the invention.
- the thermal fuse 300 according to the invention is designed as a flat fuse for surface mounting (SMD construction).
- the thermal fuse 300 according to the invention consists of two spaced-apart basic bodies 19 (connection parts), which are applied to a non-conductive body 13, for example a ceramic body.
- the two main body 19 (connecting parts) made of copper or other material with low resistivity.
- the two base bodies 19 (connection parts) are coated with a coating 23, preferably as a tin layer.
- the coating could also comprise another material, eg indium, bismuth, silver or an alloy consisting of tin, indium, bismuth or silver.
- the thermal fuse 300 has a fusible conductor 10 between the two base bodies 19 (connection parts) and in the area around the intermediate space (gap (24)) between the two base bodies 19 (connection parts). As in FIG. 6 shown, the thermal fuse 300 has two fuse elements 10. The fuse could also have one or more than two fuse element 10.
- On the fusible conductor 10 is a long-term stable flux 16, which serves during the triggering operation of the fuse to activate the surface and to reduce the surface tension.
- an additional resist layer 17 Between encapsulation or wrapping 18 of the fuse and the flux is an additional resist layer 17. The encapsulation or sheath 18 may also be applied only on the top of the thermal fuse.
- the encapsulation or coating 18 and the additional paint layer 17 serve to increase the stability of the fuse and the oxidation protection.
- the lacquer layer 17 is in direct contact with the flux 16 without the release of a gap.
- the thermal fuse 300 could also be configured such that it has no flux 16 on the fusible conductor 10. In this case, the lacquer layer 17, or in the absence of an additional lacquer layer 17, the encapsulation 18 would be in direct contact with the fusible conductor 10 without the release of a gap.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Fuses (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010038401A DE102010038401B4 (de) | 2010-07-26 | 2010-07-26 | Thermosicherung sowie Verwendung einer solchen |
PCT/EP2011/062793 WO2012016882A1 (de) | 2010-07-26 | 2011-07-26 | Thermosicherung |
Publications (2)
Publication Number | Publication Date |
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EP2471083A1 EP2471083A1 (de) | 2012-07-04 |
EP2471083B1 true EP2471083B1 (de) | 2016-04-27 |
Family
ID=45443619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11749108.4A Active EP2471083B1 (de) | 2010-07-26 | 2011-07-26 | Thermosicherung |
Country Status (10)
Country | Link |
---|---|
US (1) | US9899171B2 (ja) |
EP (1) | EP2471083B1 (ja) |
JP (1) | JP5723451B2 (ja) |
KR (1) | KR101539641B1 (ja) |
CN (1) | CN103038849B (ja) |
BR (1) | BR112013001814B1 (ja) |
DE (1) | DE102010038401B4 (ja) |
ES (1) | ES2579004T3 (ja) |
HU (1) | HUE029705T2 (ja) |
WO (1) | WO2012016882A1 (ja) |
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KR101310735B1 (ko) * | 2011-09-16 | 2013-09-24 | 주식회사 엘지화학 | 이차전지용 부품 및 그 제조 방법, 및 상기 부품을 사용하여 제조된 이차전지와 조립 이차전지 장치 |
US9780721B2 (en) * | 2014-06-25 | 2017-10-03 | Firestone Building Products Company, Llc | Solar panel charging inhibitor |
JP6307762B2 (ja) * | 2014-09-26 | 2018-04-11 | デクセリアルズ株式会社 | 電線 |
KR102002448B1 (ko) * | 2015-09-02 | 2019-07-23 | 주식회사 엘지화학 | 배터리 팩 |
US10141149B2 (en) * | 2017-01-30 | 2018-11-27 | Continental Automotive Systems, Inc. | Thin film fuse |
CN106816766A (zh) * | 2017-03-31 | 2017-06-09 | 北京态金科技有限公司 | 电力连接器 |
US10566164B2 (en) * | 2017-04-27 | 2020-02-18 | Manufacturing Networks Incorporated (MNI) | Temperature-triggered fuse device and method of production thereof |
CN111133548B (zh) * | 2017-09-29 | 2022-06-28 | 株式会社村田制作所 | 片式熔断器 |
WO2019123829A1 (ja) * | 2017-12-22 | 2019-06-27 | アルプスアルパイン株式会社 | スイッチ装置 |
CN108364838B (zh) * | 2018-01-16 | 2019-08-09 | 云南靖创液态金属热控技术研发有限公司 | 一种可重复使用的保险丝 |
CN208093449U (zh) * | 2018-04-08 | 2018-11-13 | 厦门赛尔特电子有限公司 | 一种带热保护的温度控制器 |
JP7433783B2 (ja) * | 2019-06-19 | 2024-02-20 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子及び保護素子 |
US10861665B1 (en) * | 2019-10-04 | 2020-12-08 | Rosemount Aerospace Inc. | Inert environment fusible links |
US11532452B2 (en) * | 2021-03-25 | 2022-12-20 | Littelfuse, Inc. | Protection device with laser trimmed fusible element |
US11923162B2 (en) * | 2022-06-22 | 2024-03-05 | Littelfuse, Inc. | Step-terminated SMD fuse |
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JP2624439B2 (ja) * | 1993-04-30 | 1997-06-25 | コーア株式会社 | 回路保護用素子 |
JP3506733B2 (ja) * | 1993-07-09 | 2004-03-15 | ローム株式会社 | 安全ヒューズ付き面実装型電子部品の構造 |
JP3812865B2 (ja) * | 1998-09-21 | 2006-08-23 | 矢崎総業株式会社 | 電気回路の安全装置 |
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DE10226357B4 (de) * | 2002-06-13 | 2004-06-24 | INTER CONTROL Hermann Köhler Elektrik GmbH & Co KG | Thermische Sicherung |
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- 2010-07-26 DE DE102010038401A patent/DE102010038401B4/de active Active
-
2011
- 2011-07-26 CN CN201180037010.7A patent/CN103038849B/zh active Active
- 2011-07-26 KR KR1020137004794A patent/KR101539641B1/ko active IP Right Grant
- 2011-07-26 HU HUE11749108A patent/HUE029705T2/en unknown
- 2011-07-26 BR BR112013001814-3A patent/BR112013001814B1/pt active IP Right Grant
- 2011-07-26 WO PCT/EP2011/062793 patent/WO2012016882A1/de active Application Filing
- 2011-07-26 JP JP2013521104A patent/JP5723451B2/ja active Active
- 2011-07-26 EP EP11749108.4A patent/EP2471083B1/de active Active
- 2011-07-26 US US13/811,700 patent/US9899171B2/en active Active
- 2011-07-26 ES ES11749108.4T patent/ES2579004T3/es active Active
Non-Patent Citations (1)
Title |
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None * |
Also Published As
Publication number | Publication date |
---|---|
US9899171B2 (en) | 2018-02-20 |
BR112013001814B1 (pt) | 2020-10-06 |
WO2012016882A1 (de) | 2012-02-09 |
ES2579004T3 (es) | 2016-08-03 |
US20130234822A1 (en) | 2013-09-12 |
DE102010038401A1 (de) | 2012-01-26 |
JP2013535781A (ja) | 2013-09-12 |
KR101539641B1 (ko) | 2015-07-28 |
BR112013001814A2 (pt) | 2016-05-31 |
DE102010038401B4 (de) | 2013-11-14 |
HUE029705T2 (en) | 2017-03-28 |
CN103038849B (zh) | 2015-08-12 |
CN103038849A (zh) | 2013-04-10 |
JP5723451B2 (ja) | 2015-05-27 |
KR20130037726A (ko) | 2013-04-16 |
EP2471083A1 (de) | 2012-07-04 |
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