EP2463353A4 - Substance fluorescente, son procédé de production, et dispositif luminescent la contenant - Google Patents
Substance fluorescente, son procédé de production, et dispositif luminescent la contenantInfo
- Publication number
- EP2463353A4 EP2463353A4 EP10806485.8A EP10806485A EP2463353A4 EP 2463353 A4 EP2463353 A4 EP 2463353A4 EP 10806485 A EP10806485 A EP 10806485A EP 2463353 A4 EP2463353 A4 EP 2463353A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- same
- device including
- fluorescent substance
- luminescent device
- producing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000126 substance Substances 0.000 title 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/55—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing beryllium, magnesium, alkali metals or alkaline earth metals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/64—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing aluminium
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/7734—Aluminates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
- H01L2924/15747—Copper [Cu] as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009183313A JP5517037B2 (ja) | 2009-08-06 | 2009-08-06 | 蛍光体及びその製造方法、並びにそれを用いた発光装置 |
PCT/JP2010/063187 WO2011016486A1 (fr) | 2009-08-06 | 2010-08-04 | Substance fluorescente, son procédé de production, et dispositif luminescent la contenant |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2463353A1 EP2463353A1 (fr) | 2012-06-13 |
EP2463353A4 true EP2463353A4 (fr) | 2014-05-28 |
EP2463353B1 EP2463353B1 (fr) | 2017-11-01 |
Family
ID=43544381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10806485.8A Active EP2463353B1 (fr) | 2009-08-06 | 2010-08-04 | Phosphore, son procédé de production, et dispositif luminescent le contenant |
Country Status (6)
Country | Link |
---|---|
US (1) | US8674388B2 (fr) |
EP (1) | EP2463353B1 (fr) |
JP (1) | JP5517037B2 (fr) |
KR (1) | KR101382915B1 (fr) |
CN (1) | CN102575161B (fr) |
WO (1) | WO2011016486A1 (fr) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101172143B1 (ko) * | 2009-08-10 | 2012-08-07 | 엘지이노텍 주식회사 | 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 led 소자 |
WO2011028033A2 (fr) | 2009-09-02 | 2011-03-10 | 엘지이노텍주식회사 | Phosphore, procédé de préparation de phosphore, et dispositif émettant de la lumière blanche |
KR101163902B1 (ko) * | 2010-08-10 | 2012-07-09 | 엘지이노텍 주식회사 | 발광 소자 |
US9117981B2 (en) * | 2010-11-22 | 2015-08-25 | Ube Material Industries, Ltd. | Silicate phosphor exhibiting high light emission characteristics and moisture resistance, and light emitting device |
US20120188738A1 (en) * | 2011-01-25 | 2012-07-26 | Conexant Systems, Inc. | Integrated led in system-in-package module |
JP5690159B2 (ja) * | 2011-02-06 | 2015-03-25 | 独立行政法人物質・材料研究機構 | 蛍光体、その製造方法及び発光装置 |
US10147853B2 (en) | 2011-03-18 | 2018-12-04 | Cree, Inc. | Encapsulant with index matched thixotropic agent |
US9290618B2 (en) | 2011-08-05 | 2016-03-22 | Sabic Global Technologies B.V. | Polycarbonate compositions having enhanced optical properties, methods of making and articles comprising the polycarbonate compositions |
CN103931005A (zh) * | 2011-09-14 | 2014-07-16 | 玛太克司马特股份有限公司 | Led制造方法、led制造设备和led |
KR101626229B1 (ko) * | 2011-11-07 | 2016-05-31 | 코쿠리츠켄큐카이하츠호징 붓시쯔 자이료 켄큐키코 | 형광체, 그 제조 방법, 발광 장치 및 화상 표시 장치 |
KR101356098B1 (ko) | 2012-02-03 | 2014-01-29 | 한국과학기술원 | 알루미늄 실리케이트계 형광체 및 이의 제조방법 |
EP2810309A1 (fr) * | 2012-02-03 | 2014-12-10 | SABIC Innovative Plastics IP B.V. | Dispositif à diodes électroluminescentes et son procédé de production comprenant de la chimie de matière de conversion |
JP2015083617A (ja) * | 2012-02-09 | 2015-04-30 | 電気化学工業株式会社 | 蛍光体及び発光装置 |
JP2015083618A (ja) * | 2012-02-09 | 2015-04-30 | 電気化学工業株式会社 | 蛍光体及び発光装置 |
CN104144902A (zh) | 2012-02-29 | 2014-11-12 | 沙特基础创新塑料Ip私人有限责任公司 | 用于生产低硫双酚a的方法、用于生产聚碳酸酯的方法以及由聚碳酸酯制作的制品 |
CN103827260B (zh) * | 2012-03-16 | 2015-11-25 | 株式会社东芝 | 荧光体、荧光体的制造方法及发光装置 |
JP5920773B2 (ja) * | 2012-03-16 | 2016-05-18 | 国立研究開発法人物質・材料研究機構 | 蛍光体、その製造方法、発光装置および画像表示装置 |
JP5682586B2 (ja) * | 2012-03-22 | 2015-03-11 | 豊田合成株式会社 | 発光装置 |
US9938460B2 (en) | 2012-04-02 | 2018-04-10 | National Taiwan University | Phosphor, light emitting apparatus and method of forming phosphor |
US9887327B2 (en) | 2012-06-11 | 2018-02-06 | Cree, Inc. | LED package with encapsulant having curved and planar surfaces |
US10468565B2 (en) | 2012-06-11 | 2019-11-05 | Cree, Inc. | LED package with multiple element light source and encapsulant having curved and/or planar surfaces |
US9818919B2 (en) | 2012-06-11 | 2017-11-14 | Cree, Inc. | LED package with multiple element light source and encapsulant having planar surfaces |
US10424702B2 (en) | 2012-06-11 | 2019-09-24 | Cree, Inc. | Compact LED package with reflectivity layer |
JP5910340B2 (ja) * | 2012-06-15 | 2016-04-27 | コニカミノルタ株式会社 | Led装置、及びその製造方法 |
DE102012212086A1 (de) * | 2012-07-11 | 2014-01-16 | Osram Opto Semiconductors Gmbh | Verfahren zum herstellen einer komponente eines optoelektronischen bauelements und verfahren zum herstellen eines optoelektronischen bauelements |
CN102779929B (zh) * | 2012-07-30 | 2015-07-29 | 香港应用科技研究院有限公司 | 荧光墨组合物 |
CN104488096B (zh) * | 2012-09-26 | 2017-09-22 | 日亚化学工业株式会社 | 发光装置 |
KR101961312B1 (ko) | 2012-10-25 | 2019-03-22 | 사빅 글로벌 테크놀러지스 비.브이. | 발광 다이오드 장치, 이의 제조 방법 및 용도 |
CN102899038A (zh) * | 2012-10-30 | 2013-01-30 | 江苏博睿光电有限公司 | 一种氮化物红色荧光粉及其制备方法 |
CN103937500B (zh) * | 2013-01-22 | 2016-02-10 | 蔡凯雄 | 发光装置及其耐温碳化物荧光材料 |
US9099391B2 (en) * | 2013-03-14 | 2015-08-04 | Infineon Technologies Austria Ag | Semiconductor package with top-side insulation layer |
JP2014177601A (ja) * | 2013-03-15 | 2014-09-25 | Toshiba Corp | 黄色発光蛍光体およびそれを用いた発光装置 |
JP2014224182A (ja) * | 2013-05-15 | 2014-12-04 | 株式会社東芝 | 蛍光体、発光装置、および蛍光体の製造方法 |
US9772086B2 (en) | 2013-05-29 | 2017-09-26 | Sabic Innovative Plastics Ip B.V. | Illuminating devices with color stable thermoplastic light transmitting articles |
JP6237174B2 (ja) * | 2013-12-05 | 2017-11-29 | 日亜化学工業株式会社 | 発光装置 |
CN104232087A (zh) * | 2014-08-11 | 2014-12-24 | 北京大学工学院包头研究院 | 一种荧光材料及其制备方法和应用 |
US10431568B2 (en) | 2014-12-18 | 2019-10-01 | Cree, Inc. | Light emitting diodes, components and related methods |
KR101983426B1 (ko) * | 2015-01-23 | 2019-09-11 | 삼성디스플레이 주식회사 | 감광성 수지 조성물 및 표시장치 |
JP6590579B2 (ja) * | 2015-08-03 | 2019-10-16 | シチズン電子株式会社 | Led発光素子 |
CN105702833B (zh) * | 2016-03-30 | 2019-03-05 | 开发晶照明(厦门)有限公司 | Led封装结构和led发光装置 |
CN105838367B (zh) * | 2016-04-13 | 2018-07-03 | 厦门大学 | 一种窄发射带红色荧光粉及其制备方法 |
JP6536622B2 (ja) * | 2016-05-30 | 2019-07-03 | 日亜化学工業株式会社 | βサイアロン蛍光体の製造方法 |
EP3300128B1 (fr) | 2016-09-21 | 2021-03-03 | Vestel Elektronik Sanayi ve Ticaret A.S. | Systeme et procede au phosphore |
DE102016124366A1 (de) * | 2016-12-14 | 2018-06-14 | Osram Gmbh | Optoelektronisches Bauelement |
WO2018153484A1 (fr) | 2017-02-24 | 2018-08-30 | Vestel Elektronik Sanayi Ve Ticaret A.S. | Transducteur acousto-optique, réseau et procédé |
JP7248379B2 (ja) * | 2017-07-24 | 2023-03-29 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
CN109423285B (zh) * | 2017-08-31 | 2023-09-26 | 日亚化学工业株式会社 | 铝酸盐荧光体及发光装置 |
CN107903897B (zh) * | 2017-11-21 | 2019-02-05 | 佛山市丰源包装材料有限公司 | 一种La2Hf2O7体系无机发光材料及其制备方法 |
JP6932679B2 (ja) * | 2017-11-30 | 2021-09-08 | デクセリアルズ株式会社 | 被覆蛍光体、その製造方法、並びに、蛍光体シート、及び発光装置 |
WO2019107080A1 (fr) | 2017-11-30 | 2019-06-06 | デクセリアルズ株式会社 | Phosphore revêtu, procédé pour le produire, feuille de phosphore, et dispositif électroluminescent |
KR102652590B1 (ko) * | 2018-11-07 | 2024-04-01 | 엘지전자 주식회사 | 레이저 광원용 형광체 및 그 제조 방법 |
JP6684412B1 (ja) * | 2019-06-27 | 2020-04-22 | 国立研究開発法人物質・材料研究機構 | 蛍光体、その製造方法および発光装置 |
JP2021187960A (ja) * | 2020-05-29 | 2021-12-13 | 日亜化学工業株式会社 | ケイ酸塩蛍光体の製造方法、ケイ酸塩蛍光体及び発光装置 |
CN115432924A (zh) * | 2022-08-30 | 2022-12-06 | 浙江嘉利(丽水)工业股份有限公司 | 一种车用新型led橙红荧光玻璃陶瓷及其制备方法 |
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Publication number | Publication date |
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CN102575161A (zh) | 2012-07-11 |
KR101382915B1 (ko) | 2014-04-08 |
US20120119234A1 (en) | 2012-05-17 |
KR20120037034A (ko) | 2012-04-18 |
CN102575161B (zh) | 2015-05-27 |
US8674388B2 (en) | 2014-03-18 |
JP2011037913A (ja) | 2011-02-24 |
JP5517037B2 (ja) | 2014-06-11 |
WO2011016486A1 (fr) | 2011-02-10 |
EP2463353A1 (fr) | 2012-06-13 |
EP2463353B1 (fr) | 2017-11-01 |
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