Classifications

• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02K—DYNAMO-ELECTRIC MACHINES
  • H02K55/00—Dynamo-electric machines having windings operating at cryogenic temperatures
  • H02K55/02—Dynamo-electric machines having windings operating at cryogenic temperatures of the synchronous type
  • H02K55/04—Dynamo-electric machines having windings operating at cryogenic temperatures of the synchronous type with rotating field windings
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
  • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
  • F28D15/0208—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes using moving tubes
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
  • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
  • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
  • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F1/00—Tubular elements; Assemblies of tubular elements
  • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
  • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
  • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
  • F28F1/16—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F28—HEAT EXCHANGE IN GENERAL
  • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
  • F28F1/00—Tubular elements; Assemblies of tubular elements
  • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
  • F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02K—DYNAMO-ELECTRIC MACHINES
  • H02K9/00—Arrangements for cooling or ventilating
  • H02K9/19—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
  • H02K9/20—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil wherein the cooling medium vaporises within the machine casing
• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02K—DYNAMO-ELECTRIC MACHINES
  • H02K9/00—Arrangements for cooling or ventilating
  • H02K9/22—Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
  • H02K9/225—Heat pipes
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
  • Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment

Definitions

• the invention relates to a device for cooling superconducting machines.
• This device has a closed thermosiphon system, which can be filled with a liquid coolant and which has an evaporator for the evaporation of the liquid coolant.
• DE 102 44 428 A1 discloses a machine with a rotor and a stator in a machine housing which contains a device for cooling parts within this housing.
• This cooling device has on at least one end face of the machine a closed line system with a condenser located outside the housing, with an evaporator located inside the housing and with connecting pipes extending between the condenser and the evaporator, in which system a circulation of a refrigerant according to a thermosiphon effect he follows.
• the invention has for its object to improve the cooling capacity of a device for cooling superconducting machines.
• thermosiphon system which can be filled with a liquid coolant and which has an evaporator for evaporating the liquid coolant, wherein means for increasing a wettable by the liquid coolant surface of the evaporator are.
• the invention is based on the finding that in order to achieve a required cooling capacity in a device for
• Cooling superconducting machines not the absolute amount of available liquid coolant is crucial, but the size of one through the liquid coolant wettable surface of the evaporator.
• the available cooling capacity of the device for cooling superconducting machines can thus be effectively increased.
• the evaporator is arranged inside a rotor of a superconducting machine.
• the excess heat energy can be dissipated directly from the rotor.
• the achieved by the invention enlargement of the wettable by the liquid coolant surface of the evaporator is particularly advantageous in this embodiment of the invention, since usually the volume and thus the surface of a located in an interior of a rotor evaporator are limited by the relatively small dimensions of a rotor ,
• An evaporator is usually designed as a cavity whose boundary is available as the surface of the evaporator. Depending on the degree of filling with the liquid coolant, a more or less large surface of the evaporator is thus available for the evaporation of the liquid coolant.
• the means for increasing the wettable by the liquid coolant surface of the evaporator at least one displacement body for displacement having the liquid coolant.
• Evaporator and the at least one displacement body cylindrical, in particular circular cylindrical, are formed. Such molding is easy to manufacture and yet effective in displacing the liquid coolant.
• the wettable by the liquid coolant surface of the evaporator has a surface structure which is designed such that the effective for the transfer of heat usable surface is increased.
• a surface structure which has one-dimensional, in particular groove or web-like, elements is particularly easy to realize.
• the surface structure according to a further advantageous embodiment of the invention, two-dimensional, in particular hole-like or sting-like, elements.
• the liquid coolant is neon.
• Neon allows a particularly favorable working point, z.
• the cooling of high-temperature superconductors but is relatively expensive, so that the reduction of coolant, which is achieved by the invention, comes particularly to fruition.
• the invention will be described and explained in more detail below with reference to the exemplary embodiments schematically illustrated in the figures.
• FIG. 1 shows a section through a superconducting machine and a device for cooling the superconducting machine in a schematic representation
• FIG. 2 shows a schematic diagram of an evaporator according to the prior art
• FIG 3 shows an embodiment of the device according to the invention with a displacement body for displacing the liquid coolant
• FIG. 4 shows a further embodiment of the device according to the invention, in which the surface of the evaporator which can be used effectively to transfer heat is increased, and
• FIG 5 shows an embodiment of the device according to the invention, in which various means for enlargement of the wettable by the liquid coolant
• FIG. 1 shows a superconducting machine 1 and a device for cooling the superconducting machine 1 in a schematic representation. Shown is a section along the
• the superconducting machine 1 shown in the exemplary embodiment according to FIG. 1 is a rotating electrical machine, in particular a synchronous machine, for example a motor or a generator. This has a stator 10 and a rotor 6. Furthermore, it has a housing 11 for receiving the stator 10 and for mounting the rotor 6.
• the superconducting machine 1 is closed by a Thermosiphon cooled, which includes an evaporator 4, a condenser 9 and the evaporator 4 and the condenser 9 connecting elements, for. B. pipe connections, has.
• the evaporator 4, the connecting elements and the condenser 9 define a closed volume, which is provided for receiving the liquid coolant 3.
• the evaporator 4 has a wettable by the liquid coolant 3 surface 5, via which the dissipated heat energy, which is obtained in the rotor, is transferred to the coolant 3.
• the coolant 3 is usually converted by the transferred heat energy from the liquid state to the gaseous state, ie, the coolant 3 evaporates or boils. Due to the lower density of the gaseous coolant, this rises through the connecting elements to the geodetically higher-lying condenser 9 and is there converted by withdrawal of the absorbed heat energy from the gaseous state to the liquid state.
• the thus re-liquefied coolant 3 flows due to gravity back to the evaporator 4 and in particular to the wettable by the coolant 3 surface 3 of the evaporator 4.
• Such a cooling system thus uses the so-called thermosiphon effect.
• the cooling circuit is maintained solely by the mentioned differences in density or gravity.
• FIG. 2 shows an axial section through the evaporator 4 of a superconducting machine during machine standstill. The other parts of the machine are not shown explicitly in FIG.
• the evaporator 4 according to FIG 2 has a circular cylindrical cross-section.
• the illustrated evaporator 4 is known from the prior art.
• the evaporator 4 is at least partially filled with a liquid coolant 3.
• the wettable by the liquid coolant 3 or wetted surface of the evaporator 4 is denoted by the reference numeral 5.
• the 3 shows an evaporator 4 of an embodiment of a device according to the invention.
• the evaporator 4 is at least partially filled with a liquid coolant 3.
• the device has as a means 7, 8 for increasing the wettable by the liquid coolant 3 surface 5 of the evaporator 4, a displacement body 7 for displacing the liquid coolant 3.
• the displacement body 7 By means of the displacement body 7, the volume available for the liquid coolant 3 within the evaporator 4 is limited in such a way that the surface 5 of the evaporator 4 actually wetted by the coolant 3 is increased.
• 4 shows an evaporator 4 of a further embodiment of a device according to the invention.
• the evaporator surface itself can be considerably enlarged by introducing a corresponding surface structure 8 in its effectively effective surface.
• Advantageous embodiments are one-dimensional, groove or web-like structures with which the surface can be considerably increased in a simple manner (factor 3-5).
• the means 7, 8 for increasing the wettable by the liquid coolant 3 surface 5 of the evaporator 4 is formed as a surface structure 8 of the surface of the evaporator, wherein the surface structure 8 is designed such that the effective for the transfer of heat usable surface 5 is increased.
• the surface structure 8 in the exemplary embodiment shown has one-dimensional, in this case groove or web-like elements.
• two-dimensional, somewhat more complicated variants for increasing the surface area such as, for example, the introduction of holes or sting-like structures), which permit an even greater enlargement of the effective surface area.
• FIG. 5 shows a further exemplary embodiment of an evaporator 4 of a device according to the invention which has a combination of the means 7, 8 for enlarging the surface 5 of the evaporator 4 which is wettable by the liquid coolant 3.
• Both the means according to FIG. 3, d. H. a displacement body 7, as well as the means according to FIG 4, d. H. a surface structure 8 for enlarging the wettable by the coolant 3 surface 5 of the evaporator 4 are combined according to the embodiment of FIG.
• the illustrated embodiments of the invention allow a reduction in the amount of liquid required to wet a given minimum surface area of the evaporator 4 as part of the thermosyphon refrigeration cycle.
• the advantages lie in the immediate reduction of the required The buffer volume (typically from several 100 liters to about one-tenth) and thus of smaller space requirements and lower costs.
• the costs for the actual filling of the thermosiphon system are thereby also reduced (less coolant 3).
• the invention relates to a device for cooling superconducting machines 1, with a closed thermosiphon system 2, which can be filled with a liquid coolant 3 and which has an evaporator 4 for the evaporation of the liquid coolant 3.
• means 7, 8 are provided for enlarging a surface 5 of the evaporator 4 which is wettable by the liquid coolant 3.

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Mechanical Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Life Sciences & Earth Sciences (AREA)
• Sustainable Development (AREA)
• Geometry (AREA)
• Motor Or Generator Cooling System (AREA)
• Superconductive Dynamoelectric Machines (AREA)

Applications Claiming Priority (2)

Publications (1)

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ID=43014275

Family Applications (1)

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• 2009
  • 2009-05-28 DE DE102009022960A patent/DE102009022960A1/de not_active Withdrawn
• 2010
  • 2010-05-25 CA CA2763596A patent/CA2763596A1/en not_active Abandoned
  • 2010-05-25 US US13/322,856 patent/US20120073787A1/en not_active Abandoned
  • 2010-05-25 WO PCT/EP2010/057098 patent/WO2010136419A2/de active Application Filing
  • 2010-05-25 CN CN2010800228893A patent/CN102449889A/zh active Pending
  • 2010-05-25 AU AU2010252079A patent/AU2010252079B2/en not_active Ceased
  • 2010-05-25 KR KR1020117028118A patent/KR20120028888A/ko not_active Application Discontinuation
  • 2010-05-25 EP EP10721491A patent/EP2436108A2/de not_active Withdrawn
  • 2010-05-25 RU RU2011153676/07A patent/RU2550089C2/ru active
  • 2010-05-25 JP JP2012512326A patent/JP2012528291A/ja not_active Ceased

Non-Patent Citations (1)

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