AU2010252079A1 - Cooling for superconducting machines - Google Patents
Cooling for superconducting machines Download PDFInfo
- Publication number
- AU2010252079A1 AU2010252079A1 AU2010252079A AU2010252079A AU2010252079A1 AU 2010252079 A1 AU2010252079 A1 AU 2010252079A1 AU 2010252079 A AU2010252079 A AU 2010252079A AU 2010252079 A AU2010252079 A AU 2010252079A AU 2010252079 A1 AU2010252079 A1 AU 2010252079A1
- Authority
- AU
- Australia
- Prior art keywords
- evaporator
- liquid coolant
- wetted
- coolant
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 26
- 239000002826 coolant Substances 0.000 claims abstract description 65
- 239000007788 liquid Substances 0.000 claims abstract description 50
- 238000001704 evaporation Methods 0.000 claims abstract description 7
- 229910052754 neon Inorganic materials 0.000 claims description 4
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 239000012464 large buffer Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K55/00—Dynamo-electric machines having windings operating at cryogenic temperatures
- H02K55/02—Dynamo-electric machines having windings operating at cryogenic temperatures of the synchronous type
- H02K55/04—Dynamo-electric machines having windings operating at cryogenic temperatures of the synchronous type with rotating field windings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0208—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes using moving tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
- F28F1/16—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
- H02K9/19—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil
- H02K9/20—Arrangements for cooling or ventilating for machines with closed casing and closed-circuit cooling using a liquid cooling medium, e.g. oil wherein the cooling medium vaporises within the machine casing
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K9/00—Arrangements for cooling or ventilating
- H02K9/22—Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
- H02K9/225—Heat pipes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Abstract
The invention relates to a device for cooling superconducting machines (1), comprising a closed thermal siphon system (2) which can be filled with a liquid coolant (3) and has an evaporator (4) for evaporating the liquid coolant (3). In order to improve the cooling performance of the device, the invention provides means (7, 8) for expanding a surface (5) of the evaporator (4) which can be wetted with the liquid coolant (3).
Description
L'gJ. / "~L J.L ( V') I SJ'U / (LV./ASL .JVII-Id v.LIjV Cooling for superconducting machines The invention relates to a device for cooling superconducting machines. This device has a closed thermal siphon system which can be filled with a liquid coolant and which has an evaporator for evaporating the liquid coolant. DE 102 44 428 Al discloses a machine with a rotor and a stator in a machine housing which contains an installation for cooling parts within this housing. This cooling installation has on at least one face of the machine a closed system of piping with a condenser located outside the housing, with an evaporator located inside the housing and with connecting tubes running between the condenser and the evaporator, wherein the circulation of a coolant in this system is effected in accordance with a thermal siphon effect. The object underlying the invention is to improve the cooling performance of a device for cooling superconducting machines. This object is achieved by a device for cooling superconducting machines which has a closed thermal siphon system, which can be filled with a liquid coolant and which has an evaporator for evaporating the liquid coolant, wherein means are provided for enlarging an area of the evaporator which can be wetted by the liquid coolant. The invention is based on the recognition that for the purpose of achieving a required cooling performance in a device for cooling superconducting machines, it is not the absolute quantity of the liquid coolant available which is decisive but the size of a surface of the evaporator which can be wetted by the liquid coolant. The larger the surface of the evaporator 2 which can be wetted by the liquid coolant, the more coolant can evaporate, i.e. the more thermal energy can be transferred to the evaporating coolant via this available wettable surface. Thus the available cooling performance of the device for cooling superconducting machines can be effectively raised by an enlargement of the wettable surface of the evaporator. Advantageous embodiments of the device in accordance with the invention emerge from the dependent claims. In accordance with one advantageous embodiment of the invention, the evaporator is arranged in the interior of a rotor of a superconducting machine. The surplus thermal energy can thereby be dissipated directly from the rotor. The enlargement of the surface of the evaporator which can be wetted by the liquid coolant, achieved by the invention, is especially advantageous with this embodiment of the invention because the volume, and with it also the surface, of an evaporator located in the interior of a rotor is normally limited by the relatively small dimensions of a rotor. An evaporator is usually designed as a hollow space, the bounds of which are available as the surface of the evaporator. Depending on the level of filling with the liquid coolant, a larger or smaller surface of the evaporator is then available for evaporating the liquid coolant. In order to enlarge this surface which can be wetted by the liquid coolant, without the need to increase the quantity of the liquid coolant, it is proposed in accordance with another advantageous embodiment of the invention, that the means for enlarging the surface of the evaporator which can be wetted by the liquid coolant have at least one displacer for displacing the liquid coolant. By this means, there is a saving on 3 coolant combined with an enlargement of the surface of the evaporator which can be wetted by the liquid coolant. Constructional advantages are achieved in that, in accordance with another advantageous embodiment of the invention, the evaporator and the at least one displacer are cylindrical, in particular circularly cylindrical, in shape. Such shaping is simple to manufacture, and nevertheless is efficient in displacing the liquid coolant. In accordance with another advantageous embodiment of the invention, it is proposed that the surface of the evaporator which can be wetted by the liquid coolant has a surface structure which is formed in such a way that the surface which can be effectively used for the transfer of heat is enlarged. By this means it is possible to achieve a particularly significant enlargement of the surface of the evaporator which can be wetted by the liquid coolant, combined with low construction costs. Here, in accordance with another advantageous embodiment of the invention one surface structure which is particularly simple to realize, in terms of manufacturing technology, has elements which are one-dimensional, in particular groove- or fin-like. In order to further raise the cooling performance, the surface structure has, in accordance with another advantageous embodiment of the invention, elements which are two dimensional, in particular hole-like or spiky. In accordance with another embodiment of the invention, the liquid coolant is neon. Neon permits a particularly favorable working point, e.g. in the cooling of high temperature super- LCI/ LLLVJiULV/ VJ.j IV2u / ZVVJLV ULJV'JUV 4 conductors, but is however relatively expensive so that the reduction in coolant which is achieved by the invention is particularly useful. The invention is described and explained below by reference to the exemplary embodiments illustrated schematically in the figures. These show: FIG 1 a schematic diagram of a section through a superconducting machine together with a device for cooling the superconducting machine, FIG 2 a schematic diagram of an evaporator in accordance with the prior art, FIG 3 an exemplary embodiment of the inventive device, with a displacer for displacing the liquid coolant, FIG 4 another exemplary embodiment of the inventive device, in which the surface of the evaporator which is effectively usable for the transfer of heat is enlarged, and FIG 5 an exemplary embodiment of the inventive device, in which use is made of various means for enlarging the surface which can be wetted by the liquid coolant. Figure 1 shows a schematic diagram of a superconducting machine 1 together with a device for cooling the superconducting machine 1. This shows a section along the longitudinal axis of the superconducting machine 1. The superconducting machine 1 in the case of the exemplary embodiment shown in FIG 1 is a rotating electrical machine, in 5 particular a synchronous machine, for example a motor or a generator. This has a stator 10 together with a rotor 6. In addition, it has a housing 11 for accommodating the stator 10 and for the bearing mountings of the rotor 6. The superconducting machine 1 is cooled by a closed thermal siphon system, which has an evaporator 4, a condenser 9 together with elements which connect the evaporator 4 and the condenser 9, e.g. connecting pipes. The evaporator 4, the connecting elements and the condenser 9 form the bounds of an enclosed space, which is provided to accommodate the liquid coolant 3. The evaporator 4 has a surface 5, which can be wetted by the liquid coolant 3, via which the thermal energy arising in the rotor and which is to be dissipated is transferred to the coolant 3. In this process, the coolant 3 is normally converted from the liquid state into the gaseous state by the thermal energy transferred, i.e. the coolant 3 is evaporated or boils. Due to the lower density of the gaseous form of the coolant, it rises through the connecting elements to the condenser 9, which is at a higher geodetic level, and there it is converted back from the gaseous to the liquid state by extraction of the thermal energy which it had taken up. Due to gravity, the coolant 3 which has in this way been re-liquefied flows back to the evaporator 4, and in particular to the surface 3 of the evaporator 4 which can be wetted by the coolant 3. A cooling system of this type utilizes the so called thermal siphon effect. The cooling circulation is maintained solely by the density differences mentioned, or gravity, as applicable. FIG 2 shows an axial section through the evaporator 4 of a superconducting machine with the machine stationary. The other parts of the machine are not explicitly illustrated in FIG 2. The evaporator 4 shown in FIG 2 has a circularly cylindrical cross-section. The evaporator 4 illustrated is known from the - 6 prior art. The evaporator 4 is at least partially filled with a liquid coolant 3. Here, the surface of the evaporator 4 which can be or is wetted by the liquid coolant 3 is identified with the reference mark 5. When superconducting machines 1 are cooled using a thermal siphon system, a certain minimum area of the evaporator 4 must be wetted by the liquid coolant 3 in order to achieve the required cooling performance. Depending on the precise geometry of the evaporator 4 combined with the heat transfer, which during the cooling-down phase is frequently limited by film boiling, a comparatively large amount of liquid coolant (e.g. neon, nitrogen or similar) is required in the case of superconducting machines as presently designed. Currently, this problem is normally solved by simply filling up with an appropriate quantity of coolant 3 to be able to wet a sufficiently large surface in a (normally horizontally arranged) cylindrical-shaped evaporator 4. In order at the same time to adhere to the concept of a closed thermal siphon system with a one-time filling, this method requires a comparatively large buffer container at room temperatures (pressurized container), in which liquid coolant 3, which gradually evaporates when the cooling system is switched off or fails, can be collected with a tolerable pressure rise. Alternatively of course, it is also possible to make allowance for the fact that a lower level of filling with coolant causes cooling-down to last longer than is really necessary. FIG 3 shows an evaporator 4 in an exemplary embodiment of a device in accordance with the invention. The evaporator 4 is at least partially filled with a liquid coolant 3. By using an additional (advantageously cylindrical) displacer 7, the quantity of liquid required for wetting the same evaporator 7 surface area can be substantially reduced. The device has, as the means 7, 8 for enlarging the surface 5 of the evaporator 4 which can be wetted by the liquid coolant 3, a displacer 7 for displacing the liquid coolant 3. The displacer 7 restricts the volume available within the evaporator 4 for the liquid coolant 3, in such a way as to enlarge the surface 5 of the evaporator 4 which is actually wetted by the coolant 3. FIG 4 shows an evaporator 4 in another exemplary embodiment of a device in accordance with the invention. Alternatively or additionally to the embodiment shown in FIG 3, the functionally effective surface of the evaporator surface can itself also be substantially enlarged by the introduction of an appropriate surface structure 8. Advantageous embodiments are one-dimensional groove- or fin-like structures, with which the surfaces can in a simple way be substantially enlarged (factor 3-5). As shown in the exemplary embodiment illustrated, the means 7, 8 for enlarging the surface 5 of the evaporator 4 which can be wetted by the liquid coolant 3 are in the form of a surface structure 8 on the surface of the evaporator, wherein the surface structure 8 is arranged so as to enlarge the surface 5 which is effectively usable for the transfer of heat. The surface structure 8 in the exemplary embodiment shown has one-dimensional elements, in this case groove- or fin-like elements. Two-dimensional variants, rather more complicated to manufacture, are also advantageous for the purpose of enlarging the surfaces (such as for example the introduction of holes or spiky structures), and permit an even greater enlargement of the effective surface. As another exemplary embodiment, FIG 5 shows an evaporator 4, in a device in accordance with the invention, which has a combination of the means 7, 8 for enlarging the surface 5 of the evaporator 4 which can be wetted by the liquid coolant 3.
8 In the exemplary embodiment shown in FIG 5, the means shown in FIG 3, i.e. a displacer 7, is combined with the means shown in FIG 4, i.e. a surface structure 8 for enlarging the surface 5 of the evaporator 4 which can be wetted by the coolant 3. The embodiments of the invention shown enable a reduction in the quantity of fluid required for wetting a particular minimum surface of the evaporator 4 as part of the thermal siphon cooling circuit. The advantages lie in the directly associated reduction in the required buffer volume (typically from several 100 liters to about one tenth of that) and thus from a smaller space requirement and lower costs. The costs of the actual filling of the thermal siphon system are also reduced thereby (less coolant 3). In summary, the invention relates to a device for cooling superconducting machines 1, with a closed thermal siphon system 2 which can be filled with a liquid coolant 3 and which has an evaporator 4 for evaporating the liquid coolant 3. In order to improve the cooling performance of the device, inventive means 7, 8 are provided for enlarging a surface 5 of the evaporator 4 which can be wetted by the coolant 3.
Claims (8)
1. A device for cooling superconducting machines (1), with a closed thermal siphon system (2) which can be filled with a liquid coolant (3) and which has an evaporator (4) for evaporating the liquid coolant (3), wherein means (7,8) are provided for enlarging a surface (5) of the evaporator (4) which can be wetted by the liquid coolant (3).
2. The device as claimed in claim 1, characterized in that the evaporator (4) is arranged in the interior of a rotor (6) of a superconducting machine (1).
3. The device as claimed in claim 1 or 2, characterized in that the means (7,8) for enlarging the surface of the evaporator which can be wetted by the coolant are in the form of at least one displacer (7) for displacing the liquid coolant (3).
4. The device as claimed in claim 3, characterized in that the evaporator (4) and the at least one displacer (7) are cylindrical, in particular circularly cylindrical, in shape.
5. The device as claimed in one of the preceding claims, characterized in that the means (7,8) for enlarging the surface of the evaporator which can be wetted by the liquid coolant are in the form of a surface structure (8) on the surface (5) of the evaporator (4) which can be wetted by the liquid coolant (3), this surface structure (8) being formed in such a way that the surface which can be effectively used for the transfer of heat is enlarged. 10
6. The device as claimed in claim 5, characterized in that the surface structure (8) has one-dimensional, in particular groove- or fin-like, elements.
7. The device as claimed in claim 5 or 6, characterized in that the surface structure (8) has two-dimensional, in particular hole-like or spiky, elements.
8. The device as claimed in one of the preceding claims, characterized in that the liquid coolant (3) is neon.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009022960.4 | 2009-05-28 | ||
| DE102009022960A DE102009022960A1 (en) | 2009-05-28 | 2009-05-28 | Cooling superconducting machines |
| PCT/EP2010/057098 WO2010136419A2 (en) | 2009-05-28 | 2010-05-25 | Cooling for superconducting machines |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AU2010252079A1 true AU2010252079A1 (en) | 2012-01-12 |
| AU2010252079B2 AU2010252079B2 (en) | 2014-08-28 |
Family
ID=43014275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2010252079A Ceased AU2010252079B2 (en) | 2009-05-28 | 2010-05-25 | Cooling for superconducting machines |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20120073787A1 (en) |
| EP (1) | EP2436108A2 (en) |
| JP (1) | JP2012528291A (en) |
| KR (1) | KR20120028888A (en) |
| CN (1) | CN102449889A (en) |
| AU (1) | AU2010252079B2 (en) |
| CA (1) | CA2763596A1 (en) |
| DE (1) | DE102009022960A1 (en) |
| RU (1) | RU2550089C2 (en) |
| WO (1) | WO2010136419A2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101482570B1 (en) | 2011-12-30 | 2015-01-16 | 두산중공업 주식회사 | High temperatur superconducting rotor having wich structure |
| CN109120105B (en) * | 2018-09-29 | 2024-02-20 | 东方电气自动控制工程有限公司 | Anti-siphon device of generator stator cooling water system |
| CN114221491B (en) * | 2021-12-02 | 2023-07-14 | 国网江苏省电力有限公司经济技术研究院 | Superconductive motor rotor heat exchanger structure |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU805901A1 (en) * | 1979-03-12 | 1996-05-27 | Э.В. Барбашев | Rotor of electrical machine with superconducting excitation winding |
| JPS5658751A (en) * | 1979-10-19 | 1981-05-21 | Toshiba Corp | Extreme low temperature container for superconducting rotary machine |
| JPS5972958A (en) * | 1982-10-19 | 1984-04-25 | Toshiba Corp | Superconductive rotary electric machine |
| JP2000180083A (en) * | 1998-12-15 | 2000-06-30 | Matsushita Refrig Co Ltd | Heat transfer tube |
| DE10039964A1 (en) * | 2000-08-16 | 2002-03-07 | Siemens Ag | Superconducting device with a cooling unit for cooling a rotating, superconducting winding |
| DE10231434A1 (en) * | 2002-05-15 | 2003-12-04 | Siemens Ag | Superconductive device has rotor winding incorporated in refrigerated winding support coupled to refrigeration head |
| DE10244428A1 (en) | 2002-09-24 | 2004-06-17 | Siemens Ag | Electrical machine with a cooling device |
| US6840311B2 (en) * | 2003-02-25 | 2005-01-11 | Delphi Technologies, Inc. | Compact thermosiphon for dissipating heat generated by electronic components |
| DE10336277A1 (en) * | 2003-08-07 | 2005-03-24 | Siemens Ag | Machine has superconducting winding and a thermo siphon cooling system with coolant passing through Archimedean screw through central hollow space |
| DE102004040493A1 (en) * | 2004-08-20 | 2006-03-09 | Siemens Ag | Mechanical equipment, has pressure coils provided for pumping action of fluid cooling medium, and raising unit raising temperature in pipeline system to preset temperature level above normal operating temperature after action |
| US7994664B2 (en) * | 2004-12-10 | 2011-08-09 | General Electric Company | System and method for cooling a superconducting rotary machine |
| DE102005005283A1 (en) * | 2005-02-04 | 2006-08-17 | Siemens Ag | Machine system with thermosyphon cooling of its superconducting rotor winding |
| JP2008241180A (en) * | 2007-03-28 | 2008-10-09 | Kobelco & Materials Copper Tube Inc | Heat transfer tube for heat pipe and heat pipe |
| JP2008269353A (en) * | 2007-04-20 | 2008-11-06 | Toshiba Corp | Electronic equipment |
| DE102007038909B4 (en) * | 2007-08-17 | 2021-07-15 | Osram Gmbh | Heat pipe and arrangement with heat pipe |
-
2009
- 2009-05-28 DE DE102009022960A patent/DE102009022960A1/en not_active Withdrawn
-
2010
- 2010-05-25 AU AU2010252079A patent/AU2010252079B2/en not_active Ceased
- 2010-05-25 RU RU2011153676/07A patent/RU2550089C2/en active
- 2010-05-25 WO PCT/EP2010/057098 patent/WO2010136419A2/en active Application Filing
- 2010-05-25 KR KR1020117028118A patent/KR20120028888A/en not_active Application Discontinuation
- 2010-05-25 EP EP10721491A patent/EP2436108A2/en not_active Withdrawn
- 2010-05-25 US US13/322,856 patent/US20120073787A1/en not_active Abandoned
- 2010-05-25 CA CA2763596A patent/CA2763596A1/en not_active Abandoned
- 2010-05-25 JP JP2012512326A patent/JP2012528291A/en not_active Ceased
- 2010-05-25 CN CN2010800228893A patent/CN102449889A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| RU2011153676A (en) | 2013-07-10 |
| WO2010136419A3 (en) | 2011-05-12 |
| JP2012528291A (en) | 2012-11-12 |
| KR20120028888A (en) | 2012-03-23 |
| WO2010136419A2 (en) | 2010-12-02 |
| RU2550089C2 (en) | 2015-05-10 |
| US20120073787A1 (en) | 2012-03-29 |
| CN102449889A (en) | 2012-05-09 |
| CA2763596A1 (en) | 2010-12-02 |
| DE102009022960A1 (en) | 2010-12-02 |
| AU2010252079B2 (en) | 2014-08-28 |
| EP2436108A2 (en) | 2012-04-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7816826B2 (en) | Thermosyphon cooled superconductor | |
| CN100555823C (en) | The superconducting motor device that has superconduction winding and cooling by thermal siphon | |
| US8948828B2 (en) | Apparatus and method for cooling a super conducting machine | |
| CN105403085B (en) | Variable element liquid-sucking core ultrathin heat pipe | |
| US7207178B2 (en) | Superconducting device with a cooling-unit cold head thermally coupled to a rotating superconductive winding | |
| KR100914344B1 (en) | Motor device with thermosiphon cooling of its superconductive rotor winding | |
| JP4937563B2 (en) | System for cooling a superconducting rotating machine | |
| US7049717B2 (en) | Machine device having superconducting winding and thermosiphon cooling of winding | |
| AU2010252079B2 (en) | Cooling for superconducting machines | |
| US7272938B2 (en) | Superconducting device with a cold head of a refrigeration unit with a thermosyphon effect thermally coupled to a rotating superconducting winding | |
| Chen et al. | Study of heat pipe in motor cooling: A review | |
| EP3361203B1 (en) | Heat pipe anchor tubes for high side heat exchangers | |
| CN101720525A (en) | Electric machine comprising a superconducting rotor winding | |
| CN103280926A (en) | Clamping stator evaporative cooling device | |
| CN212519805U (en) | Data center submergence formula heat abstractor | |
| KR101344197B1 (en) | Super conducting electric power generation system | |
| CN102611284A (en) | Method and device for cooling a super-conductive machine | |
| KR101513816B1 (en) | Super conducting electric power generation system | |
| CN116913607A (en) | Cryogenically cooled device for superconducting magnet | |
| RO119744B1 (en) | Heat pipe cooler for power transformers |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FGA | Letters patent sealed or granted (standard patent) | ||
| PC | Assignment registered |
Owner name: SIEMENS ENERGY GLOBAL GMBH & CO. KG Free format text: FORMER OWNER(S): SIEMENS AKTIENGESELLSCHAFT |
|
| MK14 | Patent ceased section 143(a) (annual fees not paid) or expired |