EP2397902A4 - POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURABLE FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE - Google Patents

POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURABLE FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE

Info

Publication number
EP2397902A4
EP2397902A4 EP10741104.3A EP10741104A EP2397902A4 EP 2397902 A4 EP2397902 A4 EP 2397902A4 EP 10741104 A EP10741104 A EP 10741104A EP 2397902 A4 EP2397902 A4 EP 2397902A4
Authority
EP
European Patent Office
Prior art keywords
film
resin composition
photosensitive resin
same
positive photosensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10741104.3A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2397902A1 (en
Inventor
Masatoshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Publication of EP2397902A1 publication Critical patent/EP2397902A1/en
Publication of EP2397902A4 publication Critical patent/EP2397902A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Polyamides (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
EP10741104.3A 2009-02-13 2010-02-12 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURABLE FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE Withdrawn EP2397902A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009031743 2009-02-13
PCT/JP2010/000873 WO2010092824A1 (ja) 2009-02-13 2010-02-12 ポジ型感光性樹脂組成物、及びそれを用いた硬化膜、保護膜、絶縁膜、半導体装置及び表示装置

Publications (2)

Publication Number Publication Date
EP2397902A1 EP2397902A1 (en) 2011-12-21
EP2397902A4 true EP2397902A4 (en) 2014-01-15

Family

ID=42561672

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10741104.3A Withdrawn EP2397902A4 (en) 2009-02-13 2010-02-12 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURABLE FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE

Country Status (8)

Country Link
US (1) US20110294066A1 (ko)
EP (1) EP2397902A4 (ko)
JP (1) JPWO2010092824A1 (ko)
KR (1) KR20110122135A (ko)
CN (1) CN102317861A (ko)
SG (1) SG173608A1 (ko)
TW (1) TW201035242A (ko)
WO (1) WO2010092824A1 (ko)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101023089B1 (ko) 2008-09-29 2011-03-24 제일모직주식회사 포지티브형 감광성 수지 조성물
JP5155989B2 (ja) * 2009-11-30 2013-03-06 旭化成エレクトロニクス株式会社 半導体装置及びその製造方法
KR101333704B1 (ko) 2009-12-29 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
KR101400192B1 (ko) 2010-12-31 2014-05-27 제일모직 주식회사 포지티브형 감광성 수지 조성물, 이를 사용하여 제조된 감광성 수지막 및 상기 감광성 수지막을 포함하는 반도체 소자
JP5834778B2 (ja) * 2011-11-02 2015-12-24 住友ベークライト株式会社 ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜、半導体装置、および表示装置
KR101609631B1 (ko) 2012-12-24 2016-04-06 제일모직 주식회사 포지티브형 감광성 수지 조성물, 및 이를 이용한 표시 소자용 유기 절연막 및 표시 소자
US9208301B2 (en) 2014-02-07 2015-12-08 Bank Of America Corporation Determining user authentication requirements based on the current location of the user in comparison to the users's normal boundary of location
US9286450B2 (en) 2014-02-07 2016-03-15 Bank Of America Corporation Self-selected user access based on specific authentication types
US9647999B2 (en) 2014-02-07 2017-05-09 Bank Of America Corporation Authentication level of function bucket based on circumstances
US9223951B2 (en) 2014-02-07 2015-12-29 Bank Of America Corporation User authentication based on other applications
US9721268B2 (en) 2014-03-04 2017-08-01 Bank Of America Corporation Providing offers associated with payment credentials authenticated in a specific digital wallet
JP6750499B2 (ja) 2015-01-27 2020-09-02 東レ株式会社 ５，５’−ジヒドロキシル−４，４’−ジアミノビフェニル誘導体およびその製造方法ならびに５，５’−ジブロモビフェニル誘導体の製造方法
US9729536B2 (en) 2015-10-30 2017-08-08 Bank Of America Corporation Tiered identification federated authentication network system
US10524165B2 (en) 2017-06-22 2019-12-31 Bank Of America Corporation Dynamic utilization of alternative resources based on token association
US10313480B2 (en) 2017-06-22 2019-06-04 Bank Of America Corporation Data transmission between networked resources
US10511692B2 (en) 2017-06-22 2019-12-17 Bank Of America Corporation Data transmission to a networked resource based on contextual information
CN111522201B (zh) * 2020-06-12 2023-03-10 江苏三月科技股份有限公司 一种正型感光性树脂组合物及其制备的固化膜与电子元件

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006126809A (ja) * 2004-09-28 2006-05-18 Asahi Kasei Electronics Co Ltd ポジ型感光性樹脂組成物
JP2006227063A (ja) * 2005-02-15 2006-08-31 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
JP2008280497A (ja) * 2007-04-13 2008-11-20 Sony Chemical & Information Device Corp ポリイミド組成物及びフレキシブル配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3422704B2 (ja) 1997-12-16 2003-06-30 住友ベークライト株式会社 ポジ型感光性樹脂組成物
JP4661245B2 (ja) * 2004-02-03 2011-03-30 住友ベークライト株式会社 ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
JP2005250160A (ja) * 2004-03-04 2005-09-15 Kyocera Chemical Corp ポジ型感光性樹脂組成物及びその硬化物
JP2009025725A (ja) * 2007-07-23 2009-02-05 Sumitomo Electric Ind Ltd ポジ型感光性樹脂組成物及び前記ポジ型感光性樹脂組成物より得られる樹脂フィルム、並びに、ｆｐｃの製造方法及びｆｐｃ
KR101431166B1 (ko) 2007-07-25 2014-08-19 삼성전자주식회사 현상제 카트리지 및 이를 구비하는 화상형성장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006126809A (ja) * 2004-09-28 2006-05-18 Asahi Kasei Electronics Co Ltd ポジ型感光性樹脂組成物
JP2006227063A (ja) * 2005-02-15 2006-08-31 Hitachi Chemical Dupont Microsystems Ltd ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
JP2008280497A (ja) * 2007-04-13 2008-11-20 Sony Chemical & Information Device Corp ポリイミド組成物及びフレキシブル配線板

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010092824A1 *

Also Published As

Publication number Publication date
SG173608A1 (en) 2011-09-29
JPWO2010092824A1 (ja) 2012-08-16
CN102317861A (zh) 2012-01-11
WO2010092824A1 (ja) 2010-08-19
KR20110122135A (ko) 2011-11-09
EP2397902A1 (en) 2011-12-21
TW201035242A (en) 2010-10-01
US20110294066A1 (en) 2011-12-01

Similar Documents

Publication Publication Date Title
EP2397902A4 (en) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, CURABLE FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE
EP2485091A4 (en) POSITIVE LIGHT-SENSITIVE RESIN COMPOSITION, THEREOF HARDENED FILM AND OPTICAL DEVICE THEREFOR
EP2196850A4 (en) POSITIVE LIGHT-SENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATION FILM AND SEMICONDUCTOR ARRANGEMENT
EP2113810A4 (en) Photosensitive resin composition, hardened film, protective film, insulating film and semi-conductor arrangement therefor and display arrangement
EP2533100A4 (en) POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND WATER-REPELLENT AND OIL FILM
EP2154205A4 (en) RESIN COMPOSITION, SPACER RESIN FILM, AND SEMICONDUCTOR DEVICE
TWI562365B (en) Oxide semiconductor film and semiconductor device
EP2280309A4 (en) POSITIVE LIGHT-SENSITIVE RESIN COMPOSITION, HARDENED FILM, PROTECTIVE FILM, INSULATING FILM AND SEMICONDUCTOR ELEMENT AND DISPLAY DEVICE WITH THE HARDENED FILM
HK1205795A1 (en) Image display device, resin composition, resin cured layer and method for manufacturing image display device
EP2436725A4 (en) RESIN COMPOSITION, LAMINATE FILM THEREFOR AND IMAGING DEVICE WITH THE LAMINATE FILM AS PART OF IT
HK1185369A1 (en) Ultraviolet-curable silicone resin composition and image display device using same
EP2592126A4 (en) Photosensitive adhesive composition, photosensitive adhesive film, and semiconductor device using each
EP2308909A4 (en) RESIN COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR COMPONENT THEREWITH
EP2426557A4 (en) Light-sensitive modified polyimide resin composition and use
EP2154203A4 (en) POLYAMIDE POLYPHENYLENETHER RESIN COMPOSITION AND FILM
EP2357674A4 (en) FLUORINATED RESIN FILM AND USE THEREOF
EP2637229A4 (en) Adhesive film and method for encapsulating an organic electrical device therefor
SG10201402583TA (en) Resin composition for encapsulating semiconductor and semiconductor device
EP2392613A4 (en) CELLULOSE RESIN COMPOSITION AND CELLULOSE RESIN FILM
TWM386520U (en) Waterproof mechanism, electronic device with such a waterproof mechanism, and combination of external electronic apparatus with such an electronic device
SG11201405096WA (en) Photosensitive black resin composition and resin black matrix substrate
TWI368822B (en) Photosensitive resin composition for forming organic insulating film and device using the same
EP2937731A4 (en) PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM USING THE SAME
TWI560232B (en) Resin composition and heat-shrinkable film thereof
SG11201502291VA (en) Resin composition, cured film, laminated film, and method for manufacturing semiconductor device

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20110802

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20131213

RIC1 Information provided on ipc code assigned before grant

Ipc: G03F 7/023 20060101AFI20131209BHEP

Ipc: G03F 7/075 20060101ALI20131209BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20140722