EP2310175A1 - Procédé de fabrication d'une lentille à monter sur une diode électroluminescente, et lentille obtenue à l'aide de ce procédé - Google Patents

Procédé de fabrication d'une lentille à monter sur une diode électroluminescente, et lentille obtenue à l'aide de ce procédé

Info

Publication number
EP2310175A1
EP2310175A1 EP09794684A EP09794684A EP2310175A1 EP 2310175 A1 EP2310175 A1 EP 2310175A1 EP 09794684 A EP09794684 A EP 09794684A EP 09794684 A EP09794684 A EP 09794684A EP 2310175 A1 EP2310175 A1 EP 2310175A1
Authority
EP
European Patent Office
Prior art keywords
mould
lens
led
radiation
acrylate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09794684A
Other languages
German (de)
English (en)
Inventor
Marinus Johannes Van Og
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
REVENU Ltd
Original Assignee
RENEVU Ltd
RENEVU Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RENEVU Ltd, RENEVU Ltd filed Critical RENEVU Ltd
Publication of EP2310175A1 publication Critical patent/EP2310175A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C2033/0005—Moulds or cores; Details thereof or accessories therefor with transparent parts, e.g. permitting visual inspection of the interior of the cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C2045/0075—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping curing or polymerising by irradiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Led Device Packages (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention porte sur une lentille à monter sur une diode électroluminescente, qui est fabriquée par introduction d'un matériau de base en acrylate liquide dans un moule comprenant une cavité de moule formée de façon appropriée. Le moule est fait d'un matériau transparent au rayonnement ultraviolet, tel qu'un caoutchouc de silicone. Après l'injection du matériau de base en acrylate dans le moule, une irradiation du moule est effectuée avec un rayonnement ultraviolet, de telle sorte que le matériau de base en acrylate durcit de façon à former une lentille ayant la forme désirée. Après durcissement du matériau, le moule est ouvert, et la lentille obtenue est enlevée.
EP09794684A 2008-06-15 2009-06-15 Procédé de fabrication d'une lentille à monter sur une diode électroluminescente, et lentille obtenue à l'aide de ce procédé Withdrawn EP2310175A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2001689 2008-06-15
PCT/NL2009/050344 WO2010005294A1 (fr) 2008-06-15 2009-06-15 Procédé de fabrication d'une lentille à monter sur une diode électroluminescente, et lentille obtenue à l'aide de ce procédé

Publications (1)

Publication Number Publication Date
EP2310175A1 true EP2310175A1 (fr) 2011-04-20

Family

ID=41078279

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09794684A Withdrawn EP2310175A1 (fr) 2008-06-15 2009-06-15 Procédé de fabrication d'une lentille à monter sur une diode électroluminescente, et lentille obtenue à l'aide de ce procédé

Country Status (4)

Country Link
EP (1) EP2310175A1 (fr)
EA (1) EA019225B1 (fr)
NL (1) NL2003027C (fr)
WO (1) WO2010005294A1 (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US20130228276A1 (en) * 2010-11-10 2013-09-05 Kuo-Kuang Chang Method for manufacturing cover plate and method for manufacturing encapsulated light-emitting diode using the cover plate
US8564004B2 (en) * 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
US10041646B2 (en) * 2015-05-01 2018-08-07 Cooper Technologies Company Optic and apparatus for making an optic
RU177885U1 (ru) * 2016-08-29 2018-03-15 Общество с ограниченной ответственностью "Футура Химия" Установка для формирования линз из расплава оптических материалов

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227131A (ja) * 1983-06-08 1984-12-20 Matsushita Electronics Corp 樹脂封止形半導体装置の製造方法およびこれに用いる封止装置
FR2592221B1 (fr) 1985-12-20 1988-02-12 Radiotechnique Compelec Procede d'encapsulation d'un composant electronique au moyen d'une resine synthetique
JP3617587B2 (ja) * 1997-07-17 2005-02-09 日亜化学工業株式会社 発光ダイオード及びその形成方法
JP3640153B2 (ja) * 1999-11-18 2005-04-20 松下電工株式会社 照明光源
US20080084009A1 (en) 2005-05-02 2008-04-10 Derose Anthony Method of Making Shaped LED Light Bulb
US7001930B2 (en) 2003-01-14 2006-02-21 Dymax Corporation Acrylic resin formulations curable to clear, heat-resistant bodies
TW200910648A (en) 2007-08-31 2009-03-01 Isotech Products Inc Forming process of resin lens of an LED component

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2010005294A1 *

Also Published As

Publication number Publication date
WO2010005294A1 (fr) 2010-01-14
EA201100047A1 (ru) 2011-08-30
NL2003027A1 (nl) 2009-12-17
EA019225B1 (ru) 2014-02-28
NL2003027C (nl) 2010-04-12

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