NL2003027C - Werkwijze voor het vervaardigen van een aan een led toe te voegen lens, alsmede met de werkwijze verkregen lens. - Google Patents

Werkwijze voor het vervaardigen van een aan een led toe te voegen lens, alsmede met de werkwijze verkregen lens.

Info

Publication number
NL2003027C
NL2003027C NL2003027A NL2003027A NL2003027C NL 2003027 C NL2003027 C NL 2003027C NL 2003027 A NL2003027 A NL 2003027A NL 2003027 A NL2003027 A NL 2003027A NL 2003027 C NL2003027 C NL 2003027C
Authority
NL
Netherlands
Prior art keywords
lens
led
manufacturing
added
lens obtained
Prior art date
Application number
NL2003027A
Other languages
English (en)
Other versions
NL2003027A1 (nl
Inventor
Marinus Johannes Og
Original Assignee
Stichting Administratiekantoor Vomgroup
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stichting Administratiekantoor Vomgroup filed Critical Stichting Administratiekantoor Vomgroup
Priority to NL2003027A priority Critical patent/NL2003027C/nl
Publication of NL2003027A1 publication Critical patent/NL2003027A1/nl
Application granted granted Critical
Publication of NL2003027C publication Critical patent/NL2003027C/nl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C2033/0005—Moulds or cores; Details thereof or accessories therefor with transparent parts, e.g. permitting visual inspection of the interior of the cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
    • B29C2045/0075—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping curing or polymerising by irradiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0888—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using transparant moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
NL2003027A 2008-06-15 2009-06-15 Werkwijze voor het vervaardigen van een aan een led toe te voegen lens, alsmede met de werkwijze verkregen lens. NL2003027C (nl)

Priority Applications (1)

Application Number Priority Date Filing Date Title
NL2003027A NL2003027C (nl) 2008-06-15 2009-06-15 Werkwijze voor het vervaardigen van een aan een led toe te voegen lens, alsmede met de werkwijze verkregen lens.

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2001689 2008-06-15
NL2003027A NL2003027C (nl) 2008-06-15 2009-06-15 Werkwijze voor het vervaardigen van een aan een led toe te voegen lens, alsmede met de werkwijze verkregen lens.

Publications (2)

Publication Number Publication Date
NL2003027A1 NL2003027A1 (nl) 2009-12-17
NL2003027C true NL2003027C (nl) 2010-04-12

Family

ID=41078279

Family Applications (1)

Application Number Title Priority Date Filing Date
NL2003027A NL2003027C (nl) 2008-06-15 2009-06-15 Werkwijze voor het vervaardigen van een aan een led toe te voegen lens, alsmede met de werkwijze verkregen lens.

Country Status (4)

Country Link
EP (1) EP2310175A1 (nl)
EA (1) EA019225B1 (nl)
NL (1) NL2003027C (nl)
WO (1) WO2010005294A1 (nl)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US20130228276A1 (en) * 2010-11-10 2013-09-05 Kuo-Kuang Chang Method for manufacturing cover plate and method for manufacturing encapsulated light-emitting diode using the cover plate
US8564004B2 (en) * 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
US10041646B2 (en) * 2015-05-01 2018-08-07 Cooper Technologies Company Optic and apparatus for making an optic
RU177885U1 (ru) * 2016-08-29 2018-03-15 Общество с ограниченной ответственностью "Футура Химия" Установка для формирования линз из расплава оптических материалов

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227131A (ja) * 1983-06-08 1984-12-20 Matsushita Electronics Corp 樹脂封止形半導体装置の製造方法およびこれに用いる封止装置
US4822536A (en) * 1985-12-20 1989-04-18 U.S. Philips Corporation Method of encapsulating an electronic component with a synthetic resin
JPH1140858A (ja) * 1997-07-17 1999-02-12 Nichia Chem Ind Ltd 発光ダイオード及びその形成方法
JP2001148512A (ja) * 1999-11-18 2001-05-29 Matsushita Electric Works Ltd 照明光源
US20040138326A1 (en) * 2003-01-14 2004-07-15 Arnold John R. Acrylic resin formulations curable to clear, heat-resistant bodies
US20080084009A1 (en) * 2005-05-02 2008-04-10 Derose Anthony Method of Making Shaped LED Light Bulb
EP2030752A1 (en) * 2007-08-31 2009-03-04 Isotech Products Incorporated Method of forming a resin cover lens of LED assembly

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59227131A (ja) * 1983-06-08 1984-12-20 Matsushita Electronics Corp 樹脂封止形半導体装置の製造方法およびこれに用いる封止装置
US4822536A (en) * 1985-12-20 1989-04-18 U.S. Philips Corporation Method of encapsulating an electronic component with a synthetic resin
JPH1140858A (ja) * 1997-07-17 1999-02-12 Nichia Chem Ind Ltd 発光ダイオード及びその形成方法
JP2001148512A (ja) * 1999-11-18 2001-05-29 Matsushita Electric Works Ltd 照明光源
US20040138326A1 (en) * 2003-01-14 2004-07-15 Arnold John R. Acrylic resin formulations curable to clear, heat-resistant bodies
US20080084009A1 (en) * 2005-05-02 2008-04-10 Derose Anthony Method of Making Shaped LED Light Bulb
EP2030752A1 (en) * 2007-08-31 2009-03-04 Isotech Products Incorporated Method of forming a resin cover lens of LED assembly

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 199917, Derwent World Patents Index; AN 1999-196719, XP002547297 *
DATABASE WPI Week 200225, Derwent World Patents Index; AN 2002-190250, XP002547296 *

Also Published As

Publication number Publication date
EP2310175A1 (en) 2011-04-20
WO2010005294A1 (en) 2010-01-14
EA201100047A1 (ru) 2011-08-30
NL2003027A1 (nl) 2009-12-17
EA019225B1 (ru) 2014-02-28

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AD1B A search report has been drawn up
SD Assignments of patents

Effective date: 20101012

TD Modifications of names of proprietors of patents

Effective date: 20121005

MM Lapsed because of non-payment of the annual fee

Effective date: 20150701