EP2279821A3 - Flüssigkeitsversorgungsvorrichtung, Flüssigkeitsauftragungsvorrichtung und Flüssigkeitsversorgungsverfahren - Google Patents
Flüssigkeitsversorgungsvorrichtung, Flüssigkeitsauftragungsvorrichtung und Flüssigkeitsversorgungsverfahren Download PDFInfo
- Publication number
- EP2279821A3 EP2279821A3 EP20100007162 EP10007162A EP2279821A3 EP 2279821 A3 EP2279821 A3 EP 2279821A3 EP 20100007162 EP20100007162 EP 20100007162 EP 10007162 A EP10007162 A EP 10007162A EP 2279821 A3 EP2279821 A3 EP 2279821A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- fluid
- fluid supply
- piston
- support portion
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 title abstract 7
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/40—Inking units
- B41F15/42—Inking units comprising squeegees or doctors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/85978—With pump
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009176216A JP5458727B2 (ja) | 2009-07-29 | 2009-07-29 | 流動体供給装置、流動体塗布装置及び流動体供給方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2279821A2 EP2279821A2 (de) | 2011-02-02 |
EP2279821A3 true EP2279821A3 (de) | 2011-04-27 |
EP2279821B1 EP2279821B1 (de) | 2018-05-16 |
Family
ID=43067251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP10007162.0A Active EP2279821B1 (de) | 2009-07-29 | 2010-07-12 | Flüssigkeitsversorgungsvorrichtung und Flüssigkeitsversorgungsverfahren |
Country Status (4)
Country | Link |
---|---|
US (1) | US20110023966A1 (de) |
EP (1) | EP2279821B1 (de) |
JP (1) | JP5458727B2 (de) |
CN (1) | CN101987389B (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103144419A (zh) * | 2011-12-06 | 2013-06-12 | 亚旭电子科技(江苏)有限公司 | 刮刀、具有该刮刀的锡膏涂布机及锡膏刮除方法 |
JP5884015B2 (ja) * | 2012-11-19 | 2016-03-15 | パナソニックIpマネジメント株式会社 | 電子部品装着システム |
US10132529B2 (en) | 2013-03-14 | 2018-11-20 | Rolls-Royce Corporation | Thermal management system controlling dynamic and steady state thermal loads |
JP6043964B2 (ja) * | 2013-07-04 | 2016-12-14 | パナソニックIpマネジメント株式会社 | ペースト供給装置及びスクリーン印刷機 |
JP6123076B2 (ja) * | 2013-11-12 | 2017-05-10 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置及び電子部品実装システム |
JP6194481B2 (ja) * | 2014-03-17 | 2017-09-13 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置及びスクリーン印刷方法 |
JP6101938B2 (ja) * | 2014-03-17 | 2017-03-29 | パナソニックIpマネジメント株式会社 | ペースト供給装置及びスクリーン印刷装置 |
JP6221063B2 (ja) * | 2014-03-17 | 2017-11-01 | パナソニックIpマネジメント株式会社 | スクリーン印刷装置及びスクリーン印刷方法 |
JP6101937B2 (ja) * | 2014-03-17 | 2017-03-29 | パナソニックIpマネジメント株式会社 | ペースト供給装置及びスクリーン印刷装置 |
JP6167336B2 (ja) * | 2014-03-19 | 2017-07-26 | パナソニックIpマネジメント株式会社 | ペースト供給装置、スクリーン印刷装置、ペースト供給方法及びスクリーン印刷方法 |
US10722964B2 (en) * | 2016-03-18 | 2020-07-28 | Fuji Corporation | Viscous fluid supply device |
CN107215084A (zh) * | 2017-06-13 | 2017-09-29 | 芜湖桑乐金电子科技有限公司 | 碳晶板用丝网印刷机 |
US10933483B2 (en) | 2017-12-05 | 2021-03-02 | Illinois Tool Works Inc. | IR non-contact temperature sensing in a dispenser |
US20190174633A1 (en) * | 2017-12-05 | 2019-06-06 | Illinois Tool Works Inc. | Material temperature sensor for stencil printer |
CN111390318B (zh) * | 2020-04-14 | 2022-11-22 | 江西省晶能半导体有限公司 | Smd器件焊接控制系统及焊接控制方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5348585A (en) * | 1993-01-07 | 1994-09-20 | Weston Colin K | Liquid dispensing apparatus |
US6454154B1 (en) * | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
JP2004306102A (ja) * | 2003-04-08 | 2004-11-04 | Sony Corp | はんだ供給装置及びはんだ印刷機 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5210146U (de) * | 1975-07-07 | 1977-01-24 | ||
US4618077A (en) * | 1984-03-07 | 1986-10-21 | Corsette Douglas Frank | Liquid dispensing pump |
JPS63123462A (ja) * | 1986-11-13 | 1988-05-27 | Hitachi Condenser Co Ltd | 注入装置 |
NZ228003A (en) * | 1988-02-29 | 1992-04-28 | Colgate Palmolive Co | Dispensing device with pump and removable container: nozzle has open and closed positions |
US5022556A (en) * | 1989-10-25 | 1991-06-11 | Raytheon Company | Programmable volume dispensing apparatus |
JP2513953Y2 (ja) * | 1991-10-23 | 1996-10-09 | 東レエンジニアリング株式会社 | 二液定量吐出装置 |
JPH09201558A (ja) * | 1996-01-29 | 1997-08-05 | Techno Kapura:Kk | 塗布装置 |
JP3306468B2 (ja) * | 1997-10-30 | 2002-07-24 | セレスティカ・ジャパン・イーエムエス株式会社 | 自動ハンダ付け機構及びその機構を用いる装置並びにそのハンダ付け方法 |
JPH11151574A (ja) * | 1997-11-18 | 1999-06-08 | Sony Corp | 半田付け装置 |
JPH11227156A (ja) * | 1998-02-17 | 1999-08-24 | Fuji Mach Mfg Co Ltd | クリーム半田切断具 |
JP3342841B2 (ja) * | 1998-10-23 | 2002-11-11 | 武蔵エンジニアリング株式会社 | 液体定量吐出方法および装置 |
US6158338A (en) * | 1998-12-22 | 2000-12-12 | Dek Printing Machines Limited | Cassette for holding and dispensing a viscous material for use in an apparatus for depositing the viscous material on a substrate |
JP2000312851A (ja) * | 1999-04-30 | 2000-11-14 | Sony Corp | 接着剤吐出装置 |
KR100598198B1 (ko) * | 1999-06-18 | 2006-07-07 | 시부야 코교 가부시키가이샤 | 피가공물과 헤드의 위치결정장치 및 위치결정방법 |
JP4744689B2 (ja) * | 2000-12-11 | 2011-08-10 | パナソニック株式会社 | 粘性流体転写装置及び電子部品実装装置 |
DE20112891U1 (de) * | 2001-08-03 | 2001-10-18 | Nordson Corp Westlake | Vorrichtung zum Abgeben von fließfähigem Material auf ein relativ zur Vorrichtung bewegbares Substrat |
JP2003188517A (ja) * | 2001-12-18 | 2003-07-04 | Senju Metal Ind Co Ltd | プリント基板の部分はんだ付け方法およびその装置 |
JP2009176216A (ja) | 2008-01-28 | 2009-08-06 | Aisin Aw Co Ltd | 運転支援装置、運転支援方法および運転支援プログラム |
-
2009
- 2009-07-29 JP JP2009176216A patent/JP5458727B2/ja active Active
-
2010
- 2010-07-12 EP EP10007162.0A patent/EP2279821B1/de active Active
- 2010-07-22 US US12/841,710 patent/US20110023966A1/en not_active Abandoned
- 2010-07-22 CN CN201010233863.5A patent/CN101987389B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5348585A (en) * | 1993-01-07 | 1994-09-20 | Weston Colin K | Liquid dispensing apparatus |
US6454154B1 (en) * | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
JP2004306102A (ja) * | 2003-04-08 | 2004-11-04 | Sony Corp | はんだ供給装置及びはんだ印刷機 |
Also Published As
Publication number | Publication date |
---|---|
US20110023966A1 (en) | 2011-02-03 |
JP2011025300A (ja) | 2011-02-10 |
EP2279821A2 (de) | 2011-02-02 |
CN101987389A (zh) | 2011-03-23 |
JP5458727B2 (ja) | 2014-04-02 |
CN101987389B (zh) | 2014-10-29 |
EP2279821B1 (de) | 2018-05-16 |
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