EP2273622A1 - Matériau métallique pour connecteur et procédé de production de matériau métallique pour connecteur - Google Patents

Matériau métallique pour connecteur et procédé de production de matériau métallique pour connecteur Download PDF

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Publication number
EP2273622A1
EP2273622A1 EP09723255A EP09723255A EP2273622A1 EP 2273622 A1 EP2273622 A1 EP 2273622A1 EP 09723255 A EP09723255 A EP 09723255A EP 09723255 A EP09723255 A EP 09723255A EP 2273622 A1 EP2273622 A1 EP 2273622A1
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EP
European Patent Office
Prior art keywords
tin
layer
copper
plating layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09723255A
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German (de)
English (en)
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EP2273622A4 (fr
Inventor
Shuichi Kitagawa
Kengo Mitose
Yoshiaki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008072546A external-priority patent/JP5415707B2/ja
Priority claimed from JP2008072545A external-priority patent/JP5089451B2/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2273622A1 publication Critical patent/EP2273622A1/fr
Publication of EP2273622A4 publication Critical patent/EP2273622A4/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Definitions

  • the present invention relates to a metallic material for a connector and a method of producing the same, and specifically relates to a metallic material for a connector, which material is favorable in both the property of low plugging-in force and the connection reliability, and a method of producing the same.
  • a plating layer of, for example, tin (Sn) or a tin alloy, on an electroconductive base material, such as copper (Cu) or a copper alloy (hereinafter, appropriately referred to as base material) is known as a high performance conductor material having the excellent electroconductivity and mechanical strength of the base material, as well as the excellent electrical connectivity, corrosion resistance, and solderability of the plating layer.
  • base material such as copper (Cu) or a copper alloy
  • the Sn plating layer on the surface of the connector terminal may be thinned to weaken contact pressure between the terminals.
  • the Sn plating layer is soft, a fretting phenomenon may occur between contact faces of the terminals, thereby causing inferior conduction between the terminals.
  • Patent Literature 1 describes a method of producing a fitting-type connection terminal, in which an underlying copper plating layer is formed on a base material of copper or a copper alloy, a tin plating layer is further formed on the surface thereof, then the face opposite to the sliding face in the fitting unit of the terminal is irradiated with a laser beam, so that the part corresponding to the beam spot of the laser in the sliding face is heated by heat transfer, and thereby a copper-tin alloy layer is formed at the interface between the tin plating layer and the underlying copper plating layer.
  • Patent Literature 1 it is believed that, under laser beam irradiation conditions that are capable of maintaining a thin tin plating layer, it is possible to decrease the plugging-in force of the terminal while maintaining the contact resistance stable; and further, since the tin plating layer is not directly irradiated with the laser beam, the tin plating layer does not undergo a change by fusion, and the contact resistance is not deteriorated.
  • Patent Literature 2 describes a fitting-type male terminal having a tin plated layer provided on the surface of a tab of the fitting-type male terminal where plugging marks are formed on the surface of the tabular tab of the fitting-type male terminal when brought into elastic contact with protruding parts formed so as to sandwich the tab within the fitting unit of a fitting-type female terminal, wherein the vicinity of the connection mark at the end of the plugging mark is surface-treated to have a plating thickness that is at least larger than that of the area where the plugging mark is formed.
  • the contact site where the connection mark is formed has a plating layer that is capable of securing connection reliability, and the plating layer of the area where the plugging mark is formed in the front part of the contact site, is thin.
  • the solder wettability is decreased by heating through the back surface which is used in soldering, and the friction coefficient is high at the area where sliding occurs at the time of plugging-in. Therefore, it is still unsatisfactory in achieving both of the property of low plugging-in force and the connection reliability.
  • the metallic material for a connector, of the present invention in which a layer of tin or tin alloy plating and a copper-tin alloy layer appears in the transverse direction of the bar material (including a sheet material) or the rectangular wire material (including a rectangular rod material), can reduce the coefficient of friction, as compared with the case in which only a layer of tin or tin alloy plating is exposed. Further, the metallic material for a connector, of the present invention, in which a thick layer and a thin layer of tin or tin alloy plating appears in the transverse direction of the bar material or rectangular wire material, can reduce the coefficient of friction, as compared with the case in which only a thick layer is present.
  • the resultant material has a low coefficient of friction and is excellent in fretting resistance, and the remaining part other than the above is excellent in solderability or environment resistance.
  • a connector can be formed, which is favorable in both of the low plugging-in force and the connection reliability.
  • the metallic material for a connector can be obtained, which has a very good productivity and is favorable in both of the low plugging-in force and the connection reliability.
  • the metallic material for a connector is one which has a bar material or a rectangular wire material formed of copper or a copper alloy as a base material, which has a striped copper-tin alloy layer formed in the longitudinal direction of the metallic material on a part of the surface of the metallic material, and which has a tin layer or a tin alloy layer formed on the remaining part of the surface of the metallic material.
  • the metallic material for a connector is one which has a bar material or a rectangular wire material formed of copper or a copper alloy as a base material, which has a tin layer or a tin alloy layer formed on the surface of the base material, in which the thickness of the tin layer or the tin alloy layer varies in a stripe form in the transverse direction (lateral direction) of the metallic material, and in which a copper-tin alloy layer is formed as an under layer at at least the area where the thickness of the tin layer or the tin alloy layer is thin.
  • the base material for the metallic material for a connector of the present invention, copper or a copper alloy is used, and use may be preferably made of copper and copper alloys, such as phosphor bronze, brass, nickel silver, beryllium copper, and Corson alloy, each of which has the electroconductivity, mechanical strength, and heat resistance required in connectors.
  • the shape of the base material is preferably a bar material (including a sheet material) or a rectangular wire material (including a rectangular rod material), and more preferably a rectangular wire material.
  • the cross-sectional shape may be any of square, rectangle, and regular hexagon, or may be an irregularly shaped wire.
  • a rectangular wire material having an approximately square cross-sectional shape can be used with preference in the present invention.
  • the present invention it is preferable to carry out Cu underlying plating on the rectangular wire material, and to provide a Cu plating layer, but a constitution, such as one capable of forming a copper-tin alloy by reflow that will be described later, may be used without any underlying.
  • a constitution such as one capable of forming a copper-tin alloy by reflow that will be described later, may be used without any underlying.
  • the thickness of the Cu plating layer is preferably 0.01 to 3.0 ⁇ m, and more preferably 0.05 to 1.0 ⁇ m.
  • a nickel plating layer may be formed, by providing a nickel (Ni) underlying plating having a barrier property that prevents the diffusion of metal from the lower layer, between the base material and the copper underlying.
  • the nickel underlying plating may be a Ni alloy plating, such as a Ni-P-based, a Ni-Sn-based, a Co-P-based, a Ni-Co-based, a Ni-Co-P-based, a Ni-Cu-based, a Ni-Cr-based, a Ni-Zn-based, or a Ni-Fe-based. Ni and Ni alloys are not deteriorated in the barrier function even in a high temperature environment.
  • the thickness of the nickel plating layer is preferably 0.02 to 3.0 ⁇ m.
  • the upper limit of the thickness of the nickel plating layer is preferably 1.5 ⁇ m, and more preferably 1.0 ⁇ m, taking the terminal processability into consideration.
  • the surface layer of the material is provided with tin plating or with tin alloy plating, and matt tin plating or tin alloy plating is preferable to glossy plating since the matt plating increases the absorptance of laser beam. Further, if the thickness of the tin plating or tin alloy plating is too small, the heat resistance and environment resistance of tin are hardly exhibited.
  • the thickness is preferably 0.3 ⁇ m or greater, more preferably 0.3 to 0.8 ⁇ m, and further preferably 0.3 to 0.6 ⁇ m.
  • the thickness is preferably 0.3 ⁇ m or greater, more preferably 0.8 to 1.2 ⁇ m, and further preferably 0.8 to 1.0 ⁇ m.
  • the tin plating may be formed by performing electroless plating, but it is preferable to form the tin plating by electroplating.
  • plating of a Sn-based alloy such as Sn-Cu, Sn-Bi, Sn-Ag, Sn-Zn, Sn-In, Sn-Pb, or Sn-Ag-Cu, can be used with preference.
  • the Sn electroplating of the surface layer may be performed by, for example, using a tin sulfate bath, at a plating temperature of 30°C or lower, with a current density of 5 A/dm 2 .
  • the conditions are not limited thereto and can be appropriately set up.
  • the ratio (Sn thickness/Cu thickness) of the thickness of the surface layer tin plating or tin alloy plating layer (Sn thickness) to the thickness of the underlying copper plating layer (Cu thickness) is preferably less than 2, and more preferably equal to or greater than 1.0 and less than 2.0.
  • the ratio (Sn thickness/Cu thickness) of the thickness of the surface layer tin plating or tin alloy plating layer (Sn thickness) to the thickness of the underlying copper plating layer (Cu thickness) is preferably 2 or greater, and more preferably 2.0 to 3.0.
  • the metallic material of the present invention for connectors is subjected to a reflow treatment in a stripe form in the longitudinal direction of the bar material or rectangular wire material having a tin plating or tin alloy plating layer formed as the outermost layer by the plating described above.
  • the stripe form means a continuous region having a narrower width than the width of one face of the bar material or rectangular wire material.
  • the reflow treatment is not limited as long as the treatment is a method capable of performing reflow in a limited manner, to have a narrower width than one face of the bar material or rectangular wire material, and for example, a treatment by laser beam irradiation can be preferably used.
  • This treatment can be carried out by, for example, heating in a stripe form, using a YAG laser irradiating apparatus or a semiconductor laser irradiating apparatus, which are used in material processing.
  • this treatment results in the formation of reflow stripes, and the copper-tin alloy is exposed at a part of the surface of the bar material or rectangular wire material.
  • the proportion of the area occupied by the exposed copper-tin alloy at the surface of the material is preferably 20 to 80% when the material is a rectangular wire material.
  • this treatment results in the formation of reflow stripes, and the thickness of the tin layer or tin alloy layer varies in a stripe form in the transverse direction (lateral direction) of the metallic material, so that a copper-tin alloy layer is formed as an under layer at at least the area where the thickness of the tin layer or tin alloy layer is small.
  • the reflow treatment as described above may be carried out on at least one face, but when the rectangular wire has been processed to the shape of a connector, it is preferable to take the reflow-treated face as a sliding face (a face for contact with the connector of the object to be connected).
  • the number of reflow stripes is 1 or more, and preferably 4 to 8. Further, the number of reflow stripes per face of the bar material or rectangular wire material to be used is preferably 1 to 2. However, the end area of the rectangular material is generally not provided with reflow stripes.
  • the reflow treatment carried out using laser beam irradiation will be explained.
  • the reflow treatment is carried out under such conditions that the Cu-Sn alloy would be exposed even at the surface.
  • the reflow treatment is carried out under such conditions for laser beam irradiation that a thin Sn plating or Sn alloy plating layer would remain on the surface, and the thickness of the site with the thinnest Sn plating or Sn alloy plating layer at the surface is preferably 0.1 to 0.3 ⁇ m.
  • the laser output power is preferably 1 W to 60 W.
  • the beam diameter (spot diameter) of the laser beam is preferably smaller than the width of the bar material to be used or the diameter or one side of the wire material, and larger than 1/5 of the width of the bar material or the diameter or one side of the wire material.
  • the beam diameter of the laser beam is more preferably 1/5 to 4/5 in total of the width of the bar material or the diameter or one side of the wire material.
  • the depth of reflow achieved by the laser beam irradiation as described above is, if an underlying plating layer has been provided, adjusted to be shallower than the total thickness of plating provided on the material, and to be deeper than the thickness of the tin plating. Further, in order to prevent the reflow treatment from being achieved in excess, laser beam irradiation may be carried out while the material is cooled from the side opposite to the side irradiated with laser beam. The laser beam treatment may be carried out in the air, but may also be carried out under a reducing atmosphere.
  • the material for connectors, of the present invention can be processed in a usual manner, into various electrical/electronic connectors including, for example, fitting-type connectors and contacts for automobiles.
  • various electrical/electronic connectors including, for example, fitting-type connectors and contacts for automobiles.
  • a 7/3 brass rectangular wire with width 0.64 mm (manufactured by Furukawa Electric Co., Ltd., material according to JIS Standard C2600: hereinafter, the same) was provided with an underlying plating of copper with thickness 0.3 ⁇ m, and then tin plating was conducted with thickness 0.3 ⁇ m. Then, the resultant material was irradiated at the center in the transverse direction on each face, with a YAG laser with beam diameter 0.2 mm (output power 30 W, wavelength 1,064 nm) in the longitudinal direction of the material to conduct reflow, to obtain a rectangular wire material, as shown in the enlarged schematic cross-sectional view of Fig. 1 .
  • the reference numeral 1 denotes a base material (brass rectangular wire) and a copper plating layer
  • the reference numeral 2 denotes a tin plating layer
  • the reference numeral 3 denotes a copper-tin alloy layer.
  • Fig. 2 is an enlarged schematic cross-sectional view which schematically shows a further enlarged view of the surface area including the copper-tin alloy layer of the rectangular wire material shown in Fig. 1 .
  • the reference numeral 1 a denotes the base material
  • the reference numeral 1b denotes a copper plating layer
  • the reference numeral 2 denotes a tin plating layer
  • the reference numeral 3 denotes the copper-tin alloy layer.
  • a rectangular wire of Corson alloy (trade name: EFTEC-97, manufactured by Furukawa Electric Co., Ltd.: hereinafter, the same) with width 0.64 mm was provided with an underlying plating of copper with thickness 0.5 ⁇ m, and then tin plating was conducted with thickness 0.6 ⁇ m. Then, the resultant material was irradiated at the center in the transverse direction on each face, with a YAG laser with beam diameter 0.2 mm (output power 30 W, wavelength 1,064 nm) in the longitudinal direction of the material to conduct reflow, to obtain a rectangular wire material. At the surface of the area irradiated with the laser beam, the copper-tin alloy layer was exposed.
  • a 7/3 brass rectangular wire with width 0.64 mm was provided with an underlying plating of nickel with thickness 0.5 ⁇ m and an underlying plating of copper with thickness 0.3 ⁇ m, and then tin plating was conducted with thickness 0.3 ⁇ m. Then, the resultant material was irradiated at the center in the transverse direction on each face, with a YAG laser with beam diameter 0.2 mm (output power 30 W, wavelength 1,064 nm) in the longitudinal direction of the material to conduct reflow, to obtain a rectangular wire material, as shown in the enlarged schematic cross-sectional view of Fig. 3 .
  • Fig. 3 In Fig.
  • the reference numeral 1 denotes a base material (brass rectangular wire) and a copper plating layer
  • the reference numeral 2 denotes a tin plating layer
  • the reference numeral 3 denotes a copper-tin alloy layer.
  • Fig. 4 is an enlarged schematic cross-sectional view which schematically shows a further enlarged view of the surface area including the copper-tin alloy layer of the rectangular wire material shown in Fig. 3 . Descriptions are omitted in Fig. 3 , but as shown in Fig. 4 , a nickel plating layer 4 is present between the base material 1 a and the copper plating layer 1 b.
  • a rectangular wire of Corson alloy with width 0.64 mm was provided with an underlying plating of nickel with thickness 0.5 ⁇ m and an underlying plating of copper with thickness 0.5 ⁇ m, and then tin plating was conducted with thickness 0.6 ⁇ m. Then, the resultant material was irradiated at the center in the transverse direction on each face, with a YAG laser with beam diameter 0.2 mm (output power 30 W, wavelength 1,064 nm) in the longitudinal direction of the material to conduct reflow, to obtain a rectangular wire material. At the surface of the area irradiated with the laser beam, the copper-tin alloy layer was exposed.
  • a 7/3 brass rectangular wire with width 0.64 mm was provided with an underlying plating of nickel with thickness 0.3 ⁇ m and an underlying plating of copper with thickness 0.3 ⁇ m, and then tin plating was conducted with thickness 0.3 ⁇ m. Then, the material was irradiated at the center in the transverse direction on each face, with a semiconductor laser (output power 5 W, wavelength 915 nm) having a beam diameter adjusted to 1/3 of the wire diameter, along the longitudinal direction of the material, to obtain a rectangular wire material. At the surface of the area irradiated with laser beam, the copper-tin alloy layer was exposed.
  • a rectangular wire of Corson alloy with width 0.64 mm was provided with an underlying plating of nickel with thickness 0.3 ⁇ m and an underlying plating of copper with thickness 0.5 ⁇ m, and then tin plating was conducted with thickness 0.6 ⁇ m. Then, the material was irradiated at the center in the transverse direction on each face, with a semiconductor laser (output power 5 W, wavelength 915 nm) having a beam diameter adjusted to 1/3 of the wire diameter, along the longitudinal direction of the material, to obtain a rectangular wire material. At the surface of the area irradiated with laser beam, the copper-tin alloy layer was exposed.
  • a 7/3 brass rectangular wire with width 0.64 mm was provided with an underlying plating of nickel with thickness 0.5 ⁇ m and an underlying plating of copper with thickness 0.3 ⁇ m, and then tin plating was conducted with thickness 0.3 ⁇ m. Then, the material was irradiated at the center in the transverse direction on each surface, with a semiconductor laser (output power 5 W, wavelength 915 nm) with beam diameter 0.10 mm, along the longitudinal direction of the material to conduct reflow, to obtain a rectangular wire material. At the surface of the area irradiated with laser beam, the copper-tin alloy layer was exposed.
  • FIG. 5 A 7/3 brass rectangular wire with width 0.64 mm was provided with an underlying plating of nickel with thickness 0.5 ⁇ m and an underlying plating of copper with thickness 0.3 ⁇ m, and then tin plating was conducted with thickness 0.3 ⁇ m, to obtain a rectangular wire material, as shown in an enlarged schematic cross-sectional view of Fig. 5 .
  • the reference numeral 11 denotes a base material (brass rectangular wire) and an underlying layer
  • the reference numeral 12 denotes a tin plating layer.
  • Fig. 6 is an enlarged schematic cross-sectional view which schematically shows a further enlarged view of the surface area of the rectangular wire material shown in Fig. 5 .
  • the reference numeral 11 a denotes the base material
  • the reference numeral 11b denotes a copper plating layer
  • the reference numeral 11c denotes a nickel plating layer
  • the reference numeral 12 denotes the tin plating layer.
  • a 7/3 brass rectangular wire with width 0.64 mm was provided with an underlying plating of nickel with thickness 0.5 ⁇ m and an underlying plating of copper with thickness 0.3 ⁇ m, and then tin plating was conducted with thickness 0.3 ⁇ m. Then, the resultant material was heated to the melting point or higher of Sn with a burner, to conduct reflow, thereby to obtain a rectangular wire material, as shown in the enlarged schematic cross-sectional view of Fig. 7 .
  • the reference numeral 11 denotes the base material (brass rectangular wire) and the underlying plating layer
  • the reference numeral 13 denotes the copper-tin alloy layer.
  • FIG. 8 is an enlarged schematic cross-sectional view which schematically shows a further enlarged view of the surface area of the rectangular wire material shown in Fig. 7 .
  • the reference numeral 11a denotes the base material
  • the reference numeral 11c denotes a nickel plating layer
  • the reference numeral 13 denotes the copper-tin alloy layer.
  • a 7/3 brass rectangular wire with width 0.64 mm was provided with an underlying plating of copper with 0.3 ⁇ m, and then tin plating was conducted with 0.8 ⁇ m. Then, the resultant material was irradiated at the center in the transverse direction on each face, with a YAG laser with beam diameter 0.2 mm (output power 30 W, wavelength 1,064 nm) in the longitudinal direction of the material to conduct reflow, to obtain a rectangular wire material, as shown in the enlarged schematic cross-sectional view of Fig. 9 .
  • Fig. 9 In Fig.
  • the reference numeral 1 denotes a base material (brass rectangular wire) and a copper plating layer
  • the reference numeral 2 denotes a tin plating layer
  • the reference numeral 3 denotes a copper-tin alloy layer.
  • the tin plating layer 2 at the area irradiated with the laser beam remained at the surface in the state of having a reduced thickness as compared with areas other than the above, and the copper-tin alloy layer 3 was formed beneath the tin plating layer.
  • Fig. 10 is an enlarged schematic cross-sectional view which schematically shows a further enlarged view of the surface area including the copper-tin alloy layer of the rectangular wire material shown in Fig. 9 .
  • Fig. 10 is an enlarged schematic cross-sectional view which schematically shows a further enlarged view of the surface area including the copper-tin alloy layer of the rectangular wire material shown in Fig. 9 .
  • the reference numeral 1 a denotes the base material
  • the reference numeral 1 b denotes a copper plating layer
  • the reference numeral 2 denotes a tin plating layer
  • the reference numeral 3 denotes the copper-tin alloy layer.
  • a rectangular wire of Corson alloy with width 0.64 mm was provided with an underlying plating of copper with 0.5 ⁇ m, and then tin plating was conducted with 1.2 ⁇ m. Then, the resultant material was irradiated at the center in the transverse direction on each face, with a YAG laser with beam diameter 0.2 mm (output power 30 W, wavelength 1,064 nm) in the longitudinal direction of the material to conduct reflow, to obtain a rectangular wire material. At the surface of the area irradiated with the laser beam, the tin plating layer remained with a reduced thickness.
  • a 7/3 brass rectangular wire with width 0.64 mm was provided with an underlying plating of nickel with 0.5 ⁇ m and an underlying plating of copper with 0.3 ⁇ m, and then tin plating was conducted with 0.8 ⁇ m. Then, the resultant material was irradiated at the center in the transverse direction on each face, with a YAG laser with beam diameter 0.2 mm (output power 30 W, wavelength 1,064 nm) in the longitudinal direction of the material to conduct reflow, to obtain a rectangular wire material, as shown in the enlarged schematic cross-sectional view of Fig. 11 .
  • Fig. 11 In Fig.
  • the reference numeral 1 denotes a base material (brass rectangular wire) and a copper plating layer
  • the reference numeral 2 denotes a tin plating layer
  • the reference numeral 3 denotes a copper-tin alloy layer.
  • the tin plating layer 2 at the area irradiated with the laser beam remained at the surface in the state of having a reduced thickness as compared with areas other than the above, and the copper-tin alloy layer 3 was formed beneath the tin plating layer.
  • Fig. 12 is an enlarged schematic cross-sectional view which schematically shows a further enlarged view of the surface area including the copper-tin alloy layer of the rectangular wire material shown in Fig. 11 . Descriptions are omitted in Fig. 11 , but as shown in Fig. 12 , a nickel plating layer 4 is present between the base material 1 a and the copper plating layer 1 b.
  • a rectangular wire of Corson alloy with width 0.64 mm was provided with an underlying plating of nickel with 0.5 ⁇ m and an underlying plating of copper with 0.5 ⁇ m, and then tin plating was conducted with 1.2 ⁇ m. Then, the resultant material was irradiated at the center in the transverse direction on each face, with a YAG laser with beam diameter 0.2 mm (output power 30 W, wavelength 1,064 nm) in the longitudinal direction of the material to conduct reflow, to obtain a rectangular wire material. At the surface of the area irradiated with the laser beam, the tin plating layer remained with a reduced thickness.
  • a 7/3 brass rectangular wire with width 0.64 mm was provided with an underlying plating of nickel with 0.3 ⁇ m and an underlying plating of copper with 0.3 ⁇ m, and then tin plating was conducted with 0.8 ⁇ m. Then, the material was irradiated at the center in the transverse direction on each surface, with a semiconductor laser (output power 5 W, wavelength 915 nm) having a beam diameter adjusted to 1/3 of the wire diameter, along the longitudinal direction of the material, to obtain a rectangular wire material. At the surface of the area irradiated with the laser beam, the tin plating layer remained with a reduced thickness.
  • a rectangular wire of Corson alloy with width 0.64 mm was provided with an underlying plating of nickel with 0.3 ⁇ m and an underlying plating of copper with 0.5 ⁇ m, and then tin plating was conducted with 1.2 ⁇ m. Then, the resultant material was irradiated at the center in the transverse direction on each face, with a semiconductor laser (output power 5 W, wavelength 915 nm) having a beam diameter adjusted to 1/3 of the wire diameter, in the longitudinal direction of the material, to obtain a rectangular wire material. At the surface of the area irradiated with the laser beam, the tin plating layer remained with a reduces thickness.
  • a 7/3 brass rectangular wire with width 0.64 mm was provided with an underlying plating of nickel with 0.5 ⁇ m and an underlying plating of copper with 0.3 ⁇ m, and then tin plating was conducted with 0.8 ⁇ m. Then, the material was irradiated at the center in the transverse direction on each surface, with a semiconductor laser (output power 5 W, wavelength 915 nm) with beam diameter 0.10 mm, along the longitudinal direction of the material to conduct reflow, to obtain a rectangular wire material. At the surface of the area irradiated with the laser beam, the tin plating layer remained with a reduced thickness.
  • FIG. 13 A 7/3 brass rectangular wire with width 0.64 mm was provided with an underlying plating of nickel with 0.5 ⁇ m and an underlying plating of copper with 0.3 ⁇ m, and then tin plating was conducted with 0.8 ⁇ m, to obtain a rectangular wire material, which thus-obtained rectangular wire material is shown in an enlarged schematic cross-sectional view of Fig. 13 .
  • the reference numeral 11 denotes a base material (brass rectangular wire) and an underlying plating layer
  • the reference numeral 12 denotes a tin plating layer.
  • Fig. 14 is an enlarged schematic cross-sectional view which schematically shows a further enlarged view of the surface area of the rectangular wire material shown in Fig. 13 .
  • the reference numeral 11 a denotes the base material
  • the reference numeral 11 b denotes a copper plating layer
  • the reference numeral 11c denotes a nickel plating layer
  • the reference numeral 13 denotes the tin plating layer.
  • a 7/3 brass rectangular wire with width 0.64 mm was provided with an underlying plating of nickel with 0.5 ⁇ m and an underlying plating of copper with 0.3 ⁇ m, and then tin plating was conducted with 0.8 ⁇ m. Then, the resultant material was heated to the melting point or higher of Sn with a burner, to conduct reflow, thereby to obtain a rectangular wire material, as shown in the enlarged schematic cross-sectional view of Fig. 15 .
  • the reference numeral 11 denotes a base material (brass rectangular wire) and an underlying plating layer
  • the reference numeral 12 denotes a tin plating layer
  • the reference numeral 13 denotes the copper-tin alloy layer.
  • FIG. 16 is an enlarged schematic cross-sectional view which schematically shows a further enlarged view of the surface area of the rectangular wire material shown in Fig. 15 .
  • the reference numeral 11a denotes the base material
  • the reference numeral 11c denotes a nickel plating layer
  • the reference numeral 12 denotes a tin plating layer
  • the reference numeral 13 denotes the copper-tin alloy layer.
  • the rectangular wire materials of Examples 1 to 14 and Comparative examples 1 to 4 were subjected to evaluation tests on contact resistance, solder wettability, and coefficient of kinetic friction.
  • the contact resistance was measured according to a four-terminal method. An Ag probe was used for a contact, and the measurement was made under a load of 1 N.
  • a contact resistance of 2 m ⁇ or less was designated to as good ⁇
  • a contact resistance of 5 m ⁇ or less was designated to as acceptable (passed the test) ⁇
  • a higher contact resistance was designated to as unacceptable ⁇ .
  • solder wettability was measured according to a meniscograph method. Solder Checker SAT-51 00, manufactured by Rhesca Corp., was used for the apparatus. Lead-free solder of Sn-3.0Ag-0.5Cu was used as the solder, and a 25% rosin flux was used. The determination criteria were as follows: good ⁇ when 95% or more of the immersed area was wet, acceptable ⁇ when 90% or more of the immersed area was wet, and unacceptable ⁇ when the wet area was less than that.
  • a Bowden tester was used for the measurement of the coefficient of kinetic friction. The measurement was made with a sliding contact provided with dimples as a model of a group of female terminals. The determination criteria were as follows: good ⁇ when ⁇ k ⁇ 0.25, acceptable ⁇ when ⁇ k ⁇ 0.3, and unacceptable ⁇ when ⁇ k was 0.3 or more.
  • the Comparative examples 1 to 4 were unacceptable in at least one item among the contact resistance, the solder wettability, and the coefficient of kinetic friction. Contrary to the above, the Examples 1 to 14 each satisfied the acceptability criteria for all of the items of the contact resistance, the solder wettability, and the coefficient of kinetic friction. Thus, the Examples 1 to 14 were favorable as metallic materials for connectors.

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  • Chemical & Material Sciences (AREA)
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  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
EP09723255A 2008-03-19 2009-03-18 Matériau métallique pour connecteur et procédé de production de matériau métallique pour connecteur Withdrawn EP2273622A4 (fr)

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JP2008072546A JP5415707B2 (ja) 2008-03-19 2008-03-19 コネクタ用金属材料およびその製造方法
JP2008072545A JP5089451B2 (ja) 2008-03-19 2008-03-19 コネクタ用金属材料およびその製造方法
PCT/JP2009/055358 WO2009116601A1 (fr) 2008-03-19 2009-03-18 Matériau métallique pour connecteur et procédé de production de matériau métallique pour connecteur

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WO2016165809A1 (fr) * 2015-04-15 2016-10-20 Diehl Metal Applications Gmbh Procédé de revêtement d'un composant et utilisation du procédé

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CN104513994A (zh) * 2013-09-29 2015-04-15 泰科电子(上海)有限公司 在导电基材上形成锡镀层的方法以及利用该方法制成的电接触端子
DE102014017886A1 (de) * 2014-12-04 2016-06-09 Auto-Kabel Management Gmbh Verfahren zum Herstellen eines elektrischen Anschlussteils
JP7211075B2 (ja) * 2018-12-27 2023-01-24 三菱マテリアル株式会社 防食端子材及び端子並びに電線端末部構造
JP7226210B2 (ja) * 2019-09-19 2023-02-21 株式会社オートネットワーク技術研究所 ピン端子、コネクタ、コネクタ付きワイヤーハーネス、及びコントロールユニット

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