EP2273622A4 - Matériau métallique pour connecteur et procédé de production de matériau métallique pour connecteur - Google Patents

Matériau métallique pour connecteur et procédé de production de matériau métallique pour connecteur

Info

Publication number
EP2273622A4
EP2273622A4 EP09723255A EP09723255A EP2273622A4 EP 2273622 A4 EP2273622 A4 EP 2273622A4 EP 09723255 A EP09723255 A EP 09723255A EP 09723255 A EP09723255 A EP 09723255A EP 2273622 A4 EP2273622 A4 EP 2273622A4
Authority
EP
European Patent Office
Prior art keywords
connector
metallic material
producing
metallic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09723255A
Other languages
German (de)
English (en)
Other versions
EP2273622A1 (fr
Inventor
Shuichi Kitagawa
Kengo Mitose
Yoshiaki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008072546A external-priority patent/JP5415707B2/ja
Priority claimed from JP2008072545A external-priority patent/JP5089451B2/ja
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2273622A1 publication Critical patent/EP2273622A1/fr
Publication of EP2273622A4 publication Critical patent/EP2273622A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
EP09723255A 2008-03-19 2009-03-18 Matériau métallique pour connecteur et procédé de production de matériau métallique pour connecteur Withdrawn EP2273622A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008072546A JP5415707B2 (ja) 2008-03-19 2008-03-19 コネクタ用金属材料およびその製造方法
JP2008072545A JP5089451B2 (ja) 2008-03-19 2008-03-19 コネクタ用金属材料およびその製造方法
PCT/JP2009/055358 WO2009116601A1 (fr) 2008-03-19 2009-03-18 Matériau métallique pour connecteur et procédé de production de matériau métallique pour connecteur

Publications (2)

Publication Number Publication Date
EP2273622A1 EP2273622A1 (fr) 2011-01-12
EP2273622A4 true EP2273622A4 (fr) 2011-07-06

Family

ID=41091000

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09723255A Withdrawn EP2273622A4 (fr) 2008-03-19 2009-03-18 Matériau métallique pour connecteur et procédé de production de matériau métallique pour connecteur

Country Status (3)

Country Link
EP (1) EP2273622A4 (fr)
CN (1) CN101978562B (fr)
WO (1) WO2009116601A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5692192B2 (ja) * 2012-09-21 2015-04-01 株式会社オートネットワーク技術研究所 コネクタ端子の製造方法およびコネクタ端子用材料の製造方法
CN104513994A (zh) * 2013-09-29 2015-04-15 泰科电子(上海)有限公司 在导电基材上形成锡镀层的方法以及利用该方法制成的电接触端子
DE102014017886A1 (de) * 2014-12-04 2016-06-09 Auto-Kabel Management Gmbh Verfahren zum Herstellen eines elektrischen Anschlussteils
DE102015003284A1 (de) * 2015-03-14 2016-09-15 Diehl Metal Applications Gmbh Verfahren zur Herstellung eines Werkstücks aus Metall
DE102015004651B4 (de) * 2015-04-15 2018-09-27 Diehl Metal Applications Gmbh Verfahren zum Beschichten eines Bauteils und Verwendung des Verfahrens
JP7211075B2 (ja) * 2018-12-27 2023-01-24 三菱マテリアル株式会社 防食端子材及び端子並びに電線端末部構造
JP7226210B2 (ja) * 2019-09-19 2023-02-21 株式会社オートネットワーク技術研究所 ピン端子、コネクタ、コネクタ付きワイヤーハーネス、及びコントロールユニット

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233228A (ja) * 1998-02-12 1999-08-27 Harness Syst Tech Res Ltd 嵌合型接続端子の製造方法
US20040229077A1 (en) * 2003-05-14 2004-11-18 Akihito Mori Plated material and method of manufacturing the same, terminal member for connector, and connector
US20050048308A1 (en) * 2001-09-19 2005-03-03 Frank Mucklich Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof
JP2006172877A (ja) * 2004-12-15 2006-06-29 Sumitomo Wiring Syst Ltd 端子金具
EP1788585A1 (fr) * 2004-09-10 2007-05-23 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Matériau conducteur pour pièce de connexion et procédé de fabrication du matériau conducteur

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5296649A (en) * 1991-03-26 1994-03-22 The Furukawa Electric Co., Ltd. Solder-coated printed circuit board and method of manufacturing the same
JPH10134869A (ja) * 1996-10-30 1998-05-22 Yazaki Corp 端子材料および端子
JP3411824B2 (ja) * 1998-06-30 2003-06-03 株式会社オートネットワーク技術研究所 嵌合型接続端子の製造方法
JP3411825B2 (ja) * 1998-06-30 2003-06-03 株式会社オートネットワーク技術研究所 嵌合型接続端子の製造方法
JP3523556B2 (ja) * 2000-02-28 2004-04-26 古河電気工業株式会社 メッキ方法
JP4514012B2 (ja) * 2001-01-19 2010-07-28 古河電気工業株式会社 めっき材料とその製造方法、それを用いた電気・電子部品
EP1352993B1 (fr) * 2001-01-19 2011-05-11 The Furukawa Electric Co., Ltd. Procede de preparation du materiau revetu d'un placage metallique
JP4646192B2 (ja) * 2004-06-02 2011-03-09 古河電気工業株式会社 電気電子機器用銅合金材料およびその製造方法
JP2005353352A (ja) 2004-06-09 2005-12-22 Auto Network Gijutsu Kenkyusho:Kk 嵌合型オス端子およびそのメッキ方法
JP2006161127A (ja) * 2004-12-09 2006-06-22 Takamatsu Mekki:Kk 嵌合型接続端子に適した電子材料とその製造方法
JP2006196323A (ja) * 2005-01-14 2006-07-27 Takamatsu Mekki:Kk 接続端子およびその製造方法
JP4771970B2 (ja) * 2006-02-27 2011-09-14 株式会社神戸製鋼所 接続部品用導電材料
JP4640840B2 (ja) 2006-09-15 2011-03-02 シャープ株式会社 リモコン信号受信装置、及び該装置を備えた映像表示装置
JP4747057B2 (ja) 2006-09-15 2011-08-10 株式会社オーディオテクニカ マイクロホンの出力コネクタ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233228A (ja) * 1998-02-12 1999-08-27 Harness Syst Tech Res Ltd 嵌合型接続端子の製造方法
US20050048308A1 (en) * 2001-09-19 2005-03-03 Frank Mucklich Metallic surface of a body, method for producing a structured metallic surface of a body and the use thereof
US20040229077A1 (en) * 2003-05-14 2004-11-18 Akihito Mori Plated material and method of manufacturing the same, terminal member for connector, and connector
EP1788585A1 (fr) * 2004-09-10 2007-05-23 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Matériau conducteur pour pièce de connexion et procédé de fabrication du matériau conducteur
JP2006172877A (ja) * 2004-12-15 2006-06-29 Sumitomo Wiring Syst Ltd 端子金具

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009116601A1 *

Also Published As

Publication number Publication date
EP2273622A1 (fr) 2011-01-12
CN101978562B (zh) 2013-04-03
WO2009116601A1 (fr) 2009-09-24
CN101978562A (zh) 2011-02-16

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