EP2248190A2 - Boitier miniature et ensemble support pourvu d'au moins un boitier miniature - Google Patents

Boitier miniature et ensemble support pourvu d'au moins un boitier miniature

Info

Publication number
EP2248190A2
EP2248190A2 EP09714225A EP09714225A EP2248190A2 EP 2248190 A2 EP2248190 A2 EP 2248190A2 EP 09714225 A EP09714225 A EP 09714225A EP 09714225 A EP09714225 A EP 09714225A EP 2248190 A2 EP2248190 A2 EP 2248190A2
Authority
EP
European Patent Office
Prior art keywords
carrier
housing
miniature
housing body
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09714225A
Other languages
German (de)
English (en)
Inventor
Charles Lee
Feng Sheng
Jenny Zhou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of EP2248190A2 publication Critical patent/EP2248190A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Definitions

  • the invention relates to a miniature housing with an electromagnetic radiation emitting or receiving element and a support assembly having at least one such miniature housing.
  • the object of the invention is to provide a miniature housing for an electromagnetic radiation-receiving or emitting element and a suitable carrier arrangement. This object is achieved by the measures indicated in the independent claims. Further advantageous embodiments are specified in the subordinate claims.
  • the miniature housing in the housing body is an electromagnetic radiation emitting or receiving element, has at least two laterally projecting beyond the housing body electrical connection devices.
  • the passage side of the miniature housing through which the element emits or is received is aligned transversely or substantially perpendicular or perpendicular to the mounting plane of the miniature housing.
  • the laterally projecting beyond the housing body electrical connection devices of the miniature housing are electrically connected to conductors that accomplish the direct contact with the emitting or receiving element.
  • the contacting surfaces of the connection devices are therefore arranged substantially perpendicular to the passage side of the miniature housing.
  • a carrier arrangement is specified which solves the described problem in a particularly good manner and also simplifies the production of the carrier arrangement.
  • a particularly simple production of the connection devices for example by means of bending, is made possible.
  • fewer items are to be considered and the number of manufacturing steps is reduced.
  • Platelets By connecting devices, which are formed essentially as flat plates, the space required perpendicular to the carrier is minimized. Also, this type of execution larger bearing surfaces on a support, and thus potentially larger contact surfaces, guaranteed. Platelets can also be made easily by means of punching, for example, with a great deal of freedom of form. Platelets may mean that a maximum lateral extent exceeds a thickness by at least a factor of 5, in particular by at least a factor of 10. For example, the tiles are under the
  • the platelets are preferably flat and flat.
  • L-shaped electrical connection devices can be easily produced, as a continuation of the lines from the radiating or receiving element, for example by bending, and are therefore a particularly cost-effective design.
  • connection devices are easy to install in production and later allow good access to the connection devices from above or below, for example when contacting the miniature housing.
  • connection devices may mean that a main surface of the connection devices is aligned parallel to the top side and / or bottom side within the manufacturing tolerances and that the top side and / or the bottom side are flush with the main side.
  • the lines from the element can be out of the housing body and out to the top or bottom of the housing body only inside or outside, in particular laterally out. Then these lines can be matched with less effort
  • Connection devices are contacted on the top or bottom of the housing body.
  • the miniature housing for illumination purposes as a radiation emitting or receiving element usually called LED light emitting diode.
  • Make housing body flat that is, the lateral extent is significantly greater in at least one direction as the height of the miniature housing.
  • a type conditional height of less than 0.8 mm, in particular less than 0.6 mm is particularly advantageous.
  • the carrier assembly comprises a carrier and at least one miniature housing.
  • the carrier is designed so that it has a substantially parallel to the passage side of the miniature housing carrier front side, and a transversely or substantially perpendicularly standing carrier top. As a result, and that the contacting surfaces of the connection devices of the miniature housing lie substantially flat on the carrier top side, the space required with respect to the height is minimized. "Essentially” here means in particular in the context of manufacturing tolerances.
  • the housing body of the miniature housing is located in front of the carrier front, processing steps are unnecessary, for example to create recesses on the carrier. Even a very compact arrangement of miniature housings along the carrier front side is made possible.
  • the miniature housing can be embedded in this recess to save space.
  • the extent of the carrier assembly in the direction perpendicular to the carrier front side and parallel to the carrier top can be kept low in this way.
  • the housing body is located completely in a recess or in such a way in front of the J-front-mounted-i-st -, that-he-n ⁇ -eht ⁇ -neeh-ebeneh or protrudes below the Shinober- or carrier base.
  • a particularly favorable variant is to attach the electrical leads in a suitable manner only on one side of the carrier, whereby a complex treatment or preparation of another carrier side can be omitted.
  • the passage side of the miniature housing is flush with the carrier front side, then a substantially uniform, largely smooth front side can be ensured. Since there are no protruding parts, the risk of damage is minimized. Also, a large-area contact over the front of the carrier to, for example, a line or surface light guide is thereby simplified.
  • a substantially shaped in the form of a circle segment recess of the support can be created particularly easily by a milling or drilling process and offers, depending on the opening angle of the circle segment, a simple, flexible design possibility of the recess.
  • the recess By configuring the recess as a fit with respect to the housing body, it is possible with little effort to fix the embedded miniature housing spatially. This is especially true when the miniature housing rests at least partially on the boundary surfaces of the recess.
  • the miniature housing can be better fixed within the recess and also be positioned more accurately. Also, at least temporary mechanical support of the miniature housing is made possible with a suitable embodiment of the recess.
  • the entire carrier assembly can be designed as a mechanically flexible arrangement. This allows use, for example, in flexible displays.
  • the support assembly has a thickness of at most 1 mm, in particular of at most 0.6 mm.
  • notches or notches, recesses, bulges or nubs on the support of the support assembly positioning marks or holding devices can be formed, which allow easy detection, for example, the correct position of the support assembly in a mounting process or the locking or attachment of the support assembly such as a light guide or can simplify a housing.
  • Carrier arrangement specified The method makes it possible to produce a carrier assembly as specified in connection with one or more of the described embodiments.
  • the method for producing a carrier arrangement with a carrier and with at least one miniature housing comprises the steps:
  • Connecting device with at least one electrical supply By providing the carrier, placing the miniature housings and contacting the electrical connection means in the method for producing a carrier arrangement, the at least one carrier possibly located on the carrier may be provided
  • Recesses by means of a common and inexpensive method such as drilling, milling or punching created to, or the recess in the carrier already be provided in the course of a casting process, which reduces the cost of manufacture.
  • Miniature housing by suitably configured recesses or connection devices are at least temporarily mechanically supported on the support before, for example, in a next manufacturing step about the electrical contacts by soldering or gluing the miniature housing are finally fixed and an intermediate holders can thus be omitted.
  • Contacting the terminals with the feeds on the carrier is done before-the-time-and-economically by a method such as soldering, gluing, or pressing, especially advantageous and efficient by bending, folding or buckling suitably designed connection devices and leads.
  • the carrier arrangement for illumination purposes, it is practicable to couple the carrier arrangement to an optical waveguide by means of an adhesive, welding or casting method. In this way, reflection losses at interfaces and coupling losses due to divergent radiation can be reduced.
  • Figure 1 is a schematic representation of various components
  • Figure 2 is a schematic representation of a
  • FIG. 3 shows a front view a) and a top view b) of a miniature housing
  • Figure 4 is a schematic representation of another
  • Figure 5 is a schematic representation of another
  • Figure 6 is a schematic representations of various designs a) and b) of the recess on
  • FIG. 7 is a schematic representation of another
  • Figure 8 is a schematic representation of a
  • Embodiment of a carrier assembly in conjunction with a light guide Embodiment of a carrier assembly in conjunction with a light guide
  • Figure 9 is a schematic representation of another
  • Embodiment of a carrier assembly in conjunction with a light guide Embodiment of a carrier assembly in conjunction with a light guide.
  • Figure Ia shows an embodiment of a miniature housing 1, in the laterally projecting beyond a housing body 3 connecting devices 6 are designed L-shaped.
  • the connection devices 6 are attached laterally to the housing body 3 or go by bending from the side of the
  • connection devices 6 are mounted on opposite sides of the housing body 3.
  • the L-legs can also point away from each other or in the same direction.
  • the laterally projecting legs of the L-shaped connection means 6 are mounted in extension of a top 4 of the housing body 3.
  • the legs in question protrude more at the center of the housing body 3, as shown in FIG. 1b, or protrude outwards above the housing body 3, as shown in FIG. 1c.
  • the increased in terms of the height of the components space requirement may be justified, for example, by more favorable mechanical properties or by better handling of the miniature housing 1.
  • connection devices are designed parallel to the upper side 4 or underside of the housing body 3.
  • a not completely rectangular configuration of the connection means 6 is suitable.
  • the contacting surfaces 7 are still substantially parallel to the top 4 of the Looking housing body 3 aligned.
  • the case that the angle between the legs of the L 'is slightly greater than 90 ° may be useful, for example, when the terminal devices 6 are attached to one side of the housing body 3 and the miniature housing 1 is pushed laterally against a support 9 becomes. Due to the resulting, slightly V-shaped alignment of the connection devices 6, a kind of funnel is formed, which increases the positioning tolerance with respect to the height on the support 9 when mounting the miniature housing 1.
  • FIG. 2 shows a further exemplary embodiment, wherein for the time being only the miniature housing 1 itself is considered.
  • the electrical connection devices 6 are formed as platelets and are located at the top 4 or underside of the housing body 3.
  • the connection devices 6 are made here in several pieces and electrically connected to the Unter%êt top 4 of the housing body 3 out, not shown lines 5.
  • the platelets used as connection devices 6, which can be formed from metal, a conductive polymer or even a transparent glass coated with indium tin oxide, can be made suitable prior to attachment to a housing body 3 .
  • Possible is a range of, as in Figure 2, rectangular, completely planar platelets on slightly dish-shaped bent round shapes to pondereartigen forms.
  • a projection of a single connection device 6 over two sides of the housing body 3 is a suitable embodiment, for example, to optimize the attachment of the connection means on the housing body 3. Not excluded is a one-piece Execution of lines 5 and connection devices 6, as described above with reference to FIG.
  • connection devices 6 are attached to the housing body 3, over how many and which sides and in what exact direction they survive, to vary. This is true not only for the just described, but also for all subsequent embodiments.
  • FIG. 3 shows another embodiment of the invention
  • Miniature housing 1 illustrated. Between the conductors 5 from the electromagnetic radiation emitting or receiving element and the electrical connection means 6 at least one intermediate piece 14 is attached, so that an electrically conductive connection from the element to the
  • Connection devices 6 results. This simplifies an adaptation of existing housing designs. Suitable, in particular metallic intermediate pieces may also be advantageous in order to dissipate the thermal power or waste heat which arises during operation of the element.
  • FIG. 7 shows a housing body 3 which has a rectangular ground plan and an ellipsoid passage side 2.
  • Minimum requirement is that the housing body 3 of the miniature housing 1 has at least one top 3, which is pronounced flat in the broadest sense.
  • the geometry of the housing body are set only very wide limits.
  • designs of the housing body 3 with a semicircular, round, polygonal or triangular layout can be provided with suitable connection devices 6, which can be attached either laterally or on the top 4 or underside of the housing body 3.
  • FIG. 2 shows an embodiment of a carrier arrangement 8 whose miniature housing 1 has already been described above.
  • This carrier assembly 8 includes a carrier 9, which has no recesses 12, but has electrical leads 13 on the carrier top 11 and bottom, which can be contacted with a miniature housing 1.
  • About the two-sided oversight of the carrier 8 with leads 13 is a particularly simple guidance of the leads 13 realize and a dedicated access from outside the carrier assembly 8 on the leads 13, such as on the side of the carrier 9, is particularly simple.
  • the leads 13 are guided for reasons of clarity of the individual miniature housings 1 to the rear.
  • a course of the leads 13 on the carrier top side 11 and the carrier underside along the carrier front side 10 can also be realized.
  • connection devices 6 of the miniature housing 1 are guided to the rear, the lateral space requirement of these is very low and a high packing density of the miniature housing 1 along the carrier front side 10 can be realized. Due to a high packing density, good thermal contact with a thermally conductive carrier 9 has a particularly advantageous effect.
  • Carrier back is mounted, the carrier assembly 1 so can emit and receive forward and back, is feasible. This applies analogously to all other embodiments.
  • connection devices 6 have only a small extent along the carrier front side 10, then during bending of the carrier arrangement 8, only low shear stresses occur over the contacting surfaces 7 and small bending radii become possible. The same applies to all embodiments below.
  • FIG. 4 shows a further exemplary embodiment of a carrier arrangement 1. Again, it comprises a plurality of miniature housings 1, whose connecting devices 6 project beyond the housing body 3 on opposite sides and are attached to the upper side 4 thereof. In addition, the passageway of the miniature housing 1 terminates flush with the carrier front side 10, so that a compact arrangement without sensitive, far protruding parts arises. The space requirement towards the rear is also very low. Electrical leads 13 are arranged on the carrier top 11.
  • FIG. 5 shows a carrier arrangement 8 which comprises two miniature housings 1.
  • recesses 12 are located at the corners of a carrier 9.
  • the electrical connection devices 6 of the miniature housing 1 are guided as a possible variant on two sides beyond the housing body 3. This is a favorable design in this case, since the miniature housings 1 are embedded in the recesses 12 at the corners of the support 9, with passage sides 2 and side walls of the housing bodies 3 of the miniature housings 1 being flush with the support 9.
  • Embodiments of the miniature housings 1 described above and other arrangements thereof on the support 9 are also applicable.
  • FIG. 7 shows a particularly narrow embodiment of the carrier arrangement 1, which contains only a single miniature housing 1. Expansions along the carrier front side 10 of a few millimeters can be realized in this way. This embodiment can again be combined with the previously described embodiments of the miniature housing 1 and carrier 9.
  • FIG. 6 a shows a recess 13, which has a constriction parallel to
  • Carrier front 10 has. Intention to make a constriction is better to position the miniature housing 1 in the recess 12 and / or to lock.
  • the constriction can, as in FIG. 6 a, be located in the middle region of the recess 12, or also approximately in the vicinity of Carrier front side 10.
  • the constriction may be configured not only as shown by two isosceles prismatic projections 18, but also by other shaped projections 18 such as polygons or round formations.
  • the projections 18 on both sides of the constriction need not be opposite, but may also be offset from each other.
  • differently shaped projections 18 can be combined, also a use of, for example, two closely spaced projections 18, which only one projection 18 on the other side of the recess 12 opposite, is possible. Nor is it necessary that the constriction from top to bottom over the height of the carrier 9 has the same width. If the miniature housing 1 is brought into the recess 12 from above, then V-shaped constrictions which run narrower at the bottom, ie with respect to the height wedge-like projections 18, are well suited. When produced in injection and pressure casting results in the shaping of the
  • FIG. 6b shows an exemplary embodiment of the recesses 12 as a fit.
  • the recess 12 is made stepwise. This allows the electrical
  • Connection devices 12 are also embedded in the recess, since the leads 13 are placed suitably, and no components beyond the carrier top 11 protrude out. If the housing body 3 is located at least partially on at least one step, then the housing body can also be defined with respect to the height on the support 9. Especially with tightly dimensioned leads 13 can such an accurate positioning of the miniature housing 1 in three spatial directions can be achieved by means of the recess 12.
  • the housing body 3 may also have step-like side surfaces, so that the bearing surface of the housing body 3 is enlarged at the recess 12, thereby resulting in a better positioning or locking.
  • the housing body 3 can then exploit the entire volume of the recess 12. However, there is no limitation to stepped recesses 12. Likewise possible are conical, pyramidal shapes or those which have a good geometric correspondence to the housing body 3 and / or connection devices 12. A combination of fit and constrictions can also be a useful addition.
  • the electrical supply lines 13 are mounted in a simplified manner laterally or alongside the recess 12. However, this does not limit the execution of the leads 13.
  • FIG. 8 shows by way of example, in addition to the carrier arrangement 1, the possibility of, for example, a light guide 15 by means of suitable means
  • Notches 16 on the carrier 9 to position or fix.
  • the miniature housings 1 do not terminate flush with the carrier front side 10 in order to ensure better contact with the light guide 15. This arrangement of the miniature housing 1 on the carrier 9 is another option.
  • a notch 16 is created laterally on the carrier 9 in order to laterally place the light guide 15 and thus to obtain no additional height expansion.
  • a single notch 16 can also be several, too attach differently shaped 16 or also notches, which, unlike in Figure 8, can also be mounted asymmetrically.
  • An attachment of, for example, indentations 16 is not limited to the lateral areas of the carrier 9, as on the Victoriafront- 10 or carrier back offer such designs advantages to ensure easy, accurate positioning, for example, on a device housing 8 comprehensive device housing.
  • the positioning or locking can also be an adhesive process, in which a carrier assembly 8 with a
  • Fiber optic or device housing is connected to serve as a temporary support or production aid to the hardening of an adhesive or a solder.
  • FIG. 9 shows a carrier arrangement 8 with circular recesses 17 in the carrier 9, which, as well as in combination with recesses 16 or notches et cetera, can be used for fixing approximately a light guide 15.
  • Recesses 17, for example in the context of a spray or die casting process, are particularly suitable for stably connecting the carrier arrangement 8 with, for example, a light guide, since the material to be cast can form fixed bridges through the recesses 17.
  • protuberances or nubs on the carrier top 11 or carrier base are suitable for this purpose.
  • the specific execution of the recesses 17 or knobs are set no narrow limits. With suitable, for example, encapsulation of the carrier assembly 8, the space required, in particular the height, increased only slightly.
  • the miniature housings 1 are recessed deeper with respect to the carrier front side 10, so that the carrier front side 10 clearly protrudes beyond the carrier front side 10
  • Miniature housing 1 protrudes. This may provide that sensitive passage sides 2 of the miniature housing 1 additional protection against, for example, scratching and amplified, in the case of a casting process, the connection between a light guide 15 or a device housing via a kind of teeth.
  • the toothing can be reinforced if at least one outer surface of the carrier 9 is additionally artificially roughened in the relevant areas.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un boîtier miniature, dans le corps duquel se trouve un élément émettant ou recevant un rayonnement électromagnétique. Le boîtier miniature présente au moins deux dispositifs de raccordement électrique faisant latéralement saillie du corps du boîtier. Le côté transmission du boîtier miniature, par lequel l'élément émet ou reçoit, est orienté de manière sensiblement perpendiculaire au plan de montage du boîtier miniature. Les dispositifs de raccordement électrique du boîtier miniature, faisant latéralement saillie du corps du boîtier, sont reliés de manière électroconductrice à des conducteurs qui assurent la mise en contact direct avec l'élément émetteur ou récepteur. Les surfaces de contact des dispositifs de raccordement sont placées de manière sensiblement perpendiculaire au côté transmission du boîtier miniature. Grâce à cet agencement, le boîtier miniature peut être inséré au moins en partie dans un support, de sorte que ledit boîtier miniature n'est plus significatif de l'épaisseur d'un appareil d'éclairage.
EP09714225A 2008-02-29 2009-02-18 Boitier miniature et ensemble support pourvu d'au moins un boitier miniature Withdrawn EP2248190A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008011862A DE102008011862A1 (de) 2008-02-29 2008-02-29 Miniaturgehäuse, Trägeranordnung mit mindestens einem Miniaturgehäuse, sowie ein Verfahren zur Herstellung einer Trägeranordnung
PCT/DE2009/000248 WO2009106051A2 (fr) 2008-02-29 2009-02-18 Boîtier miniature et ensemble support pourvu d'au moins un boîtier miniature

Publications (1)

Publication Number Publication Date
EP2248190A2 true EP2248190A2 (fr) 2010-11-10

Family

ID=40874967

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09714225A Withdrawn EP2248190A2 (fr) 2008-02-29 2009-02-18 Boitier miniature et ensemble support pourvu d'au moins un boitier miniature

Country Status (7)

Country Link
US (1) US8633408B2 (fr)
EP (1) EP2248190A2 (fr)
JP (1) JP2011513956A (fr)
KR (1) KR20100127758A (fr)
CN (1) CN101960620B (fr)
DE (1) DE102008011862A1 (fr)
WO (1) WO2009106051A2 (fr)

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US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
US8486761B2 (en) 2010-03-25 2013-07-16 Koninklijke Philips Electronics N.V. Hybrid combination of substrate and carrier mounted light emitting devices
DE102011004508A1 (de) * 2011-02-22 2012-08-23 Siemens Aktiengesellschaft Vorrichtung und Verfahren zum Kontaktieren eines LED-Chips
DE102011079708B4 (de) * 2011-07-25 2022-08-11 Osram Gmbh Trägervorrichtung, elektrische vorrichtung mit einer trägervorrichtung und verfahren zur herstellung dieser
DE102013101260A1 (de) 2013-02-08 2014-08-14 Osram Opto Semiconductors Gmbh Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement
JP6358132B2 (ja) * 2015-03-03 2018-07-18 オムロン株式会社 立体回路構造体
EP3239665A1 (fr) * 2016-04-25 2017-11-01 Weickmann & Weickmann PartmbB Boitier de capteur

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CN101960620B (zh) 2013-06-12
KR20100127758A (ko) 2010-12-06
DE102008011862A1 (de) 2009-09-03
US8633408B2 (en) 2014-01-21
WO2009106051A2 (fr) 2009-09-03
US20110100707A1 (en) 2011-05-05
WO2009106051A3 (fr) 2009-12-30
JP2011513956A (ja) 2011-04-28

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