EP2237697B1 - Mit einem graphischen element auf einem träger versehenes objekt und verfahren zur herstellung des objekts - Google Patents

Mit einem graphischen element auf einem träger versehenes objekt und verfahren zur herstellung des objekts Download PDF

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Publication number
EP2237697B1
EP2237697B1 EP09704738.5A EP09704738A EP2237697B1 EP 2237697 B1 EP2237697 B1 EP 2237697B1 EP 09704738 A EP09704738 A EP 09704738A EP 2237697 B1 EP2237697 B1 EP 2237697B1
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EP
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Prior art keywords
layer
face
graphic element
substrate
adhesion
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EP09704738.5A
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English (en)
French (fr)
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EP2237697A2 (de
Inventor
Alain Rey
Chrystel Deguet
Laurent Vandroux
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/22—Removing surface-material, e.g. by engraving, by etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00—Processes for producing special ornamental bodies
    • B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
    • B44C5/0407—Ornamental plaques, e.g. decorative panels, decorative veneers containing glass elements
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C17/00—Gems or the like
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C27/00—Making jewellery or other personal adornments

Definitions

  • the invention relates to an object, such as a massive object, for example of jewel type, stone, watch (for example a watch glass, a dial or a case back), nomadic electronic equipment (for example a window or a window). screen) or any other solid support, including a graphic element, or graphics, such as a decoration, typographic characters, a drawing or a photo, for example of micrometric and / or nanometric dimensions.
  • a massive object for example of jewel type, stone, watch (for example a watch glass, a dial or a case back), nomadic electronic equipment (for example a window or a window). screen) or any other solid support, including a graphic element, or graphics, such as a decoration, typographic characters, a drawing or a photo, for example of micrometric and / or nanometric dimensions.
  • the invention also relates to a method for producing such an object.
  • the invention has applications in various industrial, cultural or artistic fields.
  • watch glasses or case backs can be manufactured according to this invention to produce semi-transparent graphics or decorations of very high visual quality and very robust.
  • the invention can also be applied in the field of jewelery, in particular for the production of stones comprising decorations or texts with micrometric and / or nanometric dimensions, for example used to make pendants, rings, or loops. hear.
  • the invention can also be used to carry out the storage of a large amount of information in small volumes (for example a few cm 2 of surface for less than 2 mm thick) with very good durability (several thousand or millions years).
  • a method of protecting a graphic made on an object is described in the document FR 2 851 496 .
  • the graphic is first made by photolithography on a transparent substrate.
  • the substrate is then returned and secured to the desired object by gluing or crimping.
  • the adhesives used to secure the substrate to the object comprise organic materials having a limited life.
  • the objects thus produced therefore have a limited life.
  • the optical properties of its glues deteriorate over time, which alters the readability of the graphics made on the substrate.
  • the crimping allows a solid mechanical assembly of the substrate to the object, but does not ensure a good integrity of the object and its graphics because the crimping can be dismantled without destroying the object, which poses a problem if the we want to make an object with an inviolable graphic.
  • EP-A-0627 763 describes an object provided with a graphic element and a method of producing it.
  • An object of the present invention is to provide an object comprising one or more graphic elements, as well as a method for producing such an object, not having the disadvantages of the prior art described above.
  • the present invention proposes an object provided with at least one graphic element, comprising at least one layer etched according to a pattern of the graphic element, a first face of said layer being arranged opposite a face of at least one at least partially transparent substrate, a second face, opposite to the first face, of said layer being covered by at least one passivation layer secured to at least one face of at least one support by molecular adhesion and forming, with the support, a monolithic structure.
  • Said layer etched according to the pattern of the graphic element may be based on at least one metal.
  • said layer etched according to the pattern of the graphic element may comprise, at least at the level of the second face, at least one zone based on said metal and at least one semiconductor.
  • the graphic element which may be of micrometric and / or nanometric dimensions, is produced on the object in a robust, durable and integrated manner (uncoupling impossible without degrading the object) thanks to the molecular adhesion bonding achieved between the layer of passivation and the support of the object.
  • the graphics, or texts, formed by the graphic element are thus hermetically enclosed between two solid solid components, on one side the substrate and on the other side the support, thanks to the bonding by molecular adhesion achieved.
  • This hermetic seal forms in particular a barrier to the diffusion of moisture or any gaseous or liquid chemical product (except products possibly capable of destroying the substrate or the support).
  • molecular bonding allows the use of inorganic materials whose optical properties are stable over time.
  • the structure produced therefore does not undergo degradation of its optical qualities (in particular the visibility of the graphic element) due to time.
  • the graphic element is mechanically protected by the entire thickness of the substrate on one side and the support of the other. These must be abraded or fully worn before destroying the graphic element. This protection can therefore be maximized by choosing very hard materials, for example sapphire for the substrate which can only be scratched by silicon carbide or diamond.
  • This object can be realized independently of the density of the patterns of the graphic element.
  • the graphic element When the graphic element is made in a metal layer, the graphics or texts can be made with a valuable material and very stable, that is to say, not sensitive to corrosion or degradation in time.
  • the substrate may be based on at least one amorphous or crystalline material and / or the passivation layer may be based on at least one mineral material.
  • the object may further comprise an adhesion layer disposed between the first face of the layer, in which the graphic element is formed, and the face of the substrate.
  • the graphic element can also be etched in the adhesion layer.
  • the adhesion layer may be based on at least one metal and / or one metal nitride and / or one metal oxide.
  • the object may further comprise at least one adhesion layer disposed between the face of the support and the passivation layer, the molecular adhesion being able to be formed between the adhesion layer and the passivation layer.
  • the support can be of any kind or based on any material. This material may in particular be compatible with a possible annealing to consolidate the molecular adhesion.
  • the object may be for example a jewel, a watch, or an electronic device.
  • Said zone of the layer may be based on silicide.
  • the method may further comprise, before step a) of depositing the layer, a step of depositing an adhesion layer on the face of the substrate, said layer being then deposited, during step a), on the adhesion layer.
  • the graphic element can also be etched, during step b), in the adhesion layer.
  • the method may further comprise, between step d) of depositing the passivation layer and the step e) of joining, an annealing step, at a temperature between about 400 ° C and 1100 ° C, of the substrate having the passivation layer.
  • the method may further comprise, between step d) of depositing the passivation layer and the step e) of joining, a step of planarization of the passivation layer.
  • Step b) of etching the graphic element can be obtained by the implementation of masking, lithography and etching steps in said layer and / or in an adhesion layer disposed between the face of the substrate and said layer, or at least one laser ablation step directly in said layer and / or in an adhesion layer disposed between the face of the substrate and said layer.
  • the method may further comprise, before the step e) of joining, a step of deposition of at least one adhesion layer at least on the face of the support, the step e) of securing being obtained by the implementation bonding by molecular adhesion between said adhesion layer and the passivation layer.
  • the method may further comprise, between the step of depositing the adhesion layer and step e) solidarization, a step of planarization of the adhesion layer.
  • the method may furthermore comprise, between the step of depositing the adhesion layer and the step e) of joining, an annealing step, at a temperature of between about 400 ° C. and 1100 ° C., of the support comprising the adhesion layer.
  • the method may further comprise, after the step e) of joining, a heat treatment step by annealing the object consolidating the molecular adhesion.
  • Step c) of forming the zone based on said metal and a semiconductor is obtained by carrying out a step of siliciding said layer.
  • An exemplary method of producing an object 100 comprising a graphic element carried on a support 20, for example a solid object such as a jewel, a watch, or an electronic equipment, will be described in connection with the Figures 1A to 1H .
  • a deposit is made on a flat face of a substrate 2, for example transparent or at least partially transparent, and based on an amorphous material, such as glass, or crystalline, such as sapphire or diamond, an adhesion layer 4 on which is deposited a layer 6.
  • the thickness of the substrate 2 is for example equal to a few hundred micrometers, or between about 100 microns and 1 mm.
  • the thickness of the support 20 (shown on the Figures 1F to 1H ) may in particular be greater than or equal to the thickness of the substrate 2.
  • the layers 4 and 6 are for example obtained by PVD type deposits (evaporation or sputtering).
  • the layer 6 is metal-based, for example example of gold, platinum, tungsten, titanium, metal oxide, etc.
  • the material of the layer 6 may in particular be opaque to light.
  • the thickness of this layer 6 is for example between about 50 nm and 100 nm.
  • the thickness of the layer 6 can in particular be chosen according to the nature of the material forming the layer 6, the thickness chosen being sufficient to obtain a certain opacity of the layer 6.
  • the adhesion layer 4 is for example based on titanium, titanium nitride, titanium oxide or any other material to obtain a good adhesion between the layer 6 and the substrate 2.
  • the nature of the adhesion layer 4 may in particular be chosen depending on the nature of the substrate 2 and the layer 6.
  • the thickness of this adhesion layer 4 may for example be between about 1 nm and 10 nm.
  • the layer 6 can be deposited directly on the substrate 2 without using an intermediate adhesion layer 4 between the substrate 2 and the layer 6.
  • a layer of photoresist is for example deposited on the layer 6.
  • One or more steps of lithography and etching are then implemented to form the mask 8.
  • the mask 8 is formed by remaining portions of the photosensitive resin layer deposited on the layer 6.
  • the resin layer Thus, in the example described here, the photosensitive resin is positive, the pattern of the graphic element being formed by the portions of the mask 8. However, it is also possible to use a negative photoresist.
  • the layer 6, as well as the adhesion layer 4 are then etched by an isotropic or anisotropic or dry chemical route (plasma mode, reactive ion etching or ionic machining).
  • the etching mask 8 is then eliminated.
  • the pattern of the graphic element is therefore transferred to the layer 6 and formed by remaining portions 6 'and 6 "of the layer 6, as well as remaining portions 4' and 4" of the adhesion layer 4.
  • the mask 8 is formed in a layer, for example of mineral type (for example based on silicon dioxide), deposited on the layer 6, and on which the layer to be deposited is then deposited. photosensitive resin base.
  • the pattern of the graphic element is then formed by lithography and etching in the resin layer. This pattern is then transferred into the mineral layer by etching. Finally, the remaining portions of the resin layer are then removed by engraving.
  • the mask 8 is in this case formed by the remaining portions of the mineral layer.
  • This variant may in particular be used to produce an etching mask resistant to certain etching agents used to etch the layer 6 and / or the adhesion layer 4, which may damage a resin-based mask (for example water regia).
  • the choice of one or the other embodiment of the mask can be made according to the material to be etched (material of the layers 6 and 4).
  • the pattern of the graphic element is produced directly in the layer 6, and possibly in the adhesion layer 4 if it is present between the layer 6 and the substrate 2, for example by laser ablation which can in particular be performed by a femtosecond laser.
  • the remaining portions of the etched layer 6 are then formed (portions 6 'and 6 "on the figure 1C ), a zone 10 based on the metal of the layer 6 and a semiconductor.
  • siliciding of the etched portions 6 ', 6 " is carried out for example,
  • This silicidation is for example obtained by a silane decomposition (SiH 4 , or more generally any type of gas Si n H 2n + 2 ) under a controlled atmosphere. at a temperature for example between about 200 ° C and 450 ° C and preferably about 300 ° C.
  • the gas thus decomposed reacts with the metal of the layer 6 to form the zone 10.
  • the zone 10 obtained after the silicidation is then based on PtSi. It is also possible that the zone 10 is based on a semiconductor other than silicon. This zone 10 is for example made to a thickness between about 1 nm and 50 nm, or, if the metal layer 6 has a thickness greater than 50 nm, to a thickness of between about 1 nm and the entire thickness of the layer. 6.
  • a passivation layer 12 is then deposited, for example by CVD (chemical vapor deposition) or PVD.
  • This passivation layer 12 is for example based on a mineral material, such as silicon dioxide or silicon nitride.
  • the material of this passivation layer 12 is chosen in particular to be able to subsequently produce a molecular bonding with the support 20.
  • This passivation layer 12 is also intended to provide protection for the pattern formed by the remaining portions 6 ', 6 "of the layer 6.
  • the formation of the zone 10, for example obtained by a silicidation step can be implemented in situ, that is to say carried out in the equipment used to deposit the passivation layer 12, without implementing other steps between the step of producing the zone 10 and the deposition of the passivation layer 12, which makes it possible not to expose the zone 10 to the external environment and thus to retain better adhesion properties of the zone 10 vis-à- screw of the passivation layer 12.
  • the passivation layer 12 is then planarized, for example by a chemical-mechanical polishing step, thus making it possible to eliminate the relief formed by the remaining portions 6 ', 6''of the layer 6 and the remaining portions of the coating layer.
  • adhesion 4 ', 4 "relative to the surface of the substrate 2 on which are formed the remaining portions 6', 6" of the layer 6 and the remaining portions 4 ', 4''of the adhesion layer 4. thus forms a passivation thin film 12 ', having a flat surface, above the remaining portions 6', 6 "( figure 1E ).
  • the passivation thin film 12 ' may for example have a thickness between about 100 nm and 1 micron.
  • An assembly 14 is thus obtained, formed here by the substrate 2, the remaining portions 6 ', 6 "of the layer 6, the remaining portions 4', 4" of the adhesion layer 4 and the thin passivation film 12 ' , comprising the pattern of the graphic element that is to be transferred to the support 20 of the object 100.
  • the assembly 14 stabilization annealing for example to a temperature of between about 400 ° C. and 1100 ° C., in order to avoid any degassing by the oxides present in the assembly 14 during the molecular bonding carried out subsequently during the production method described here, and therefore to consolidate the adhesion molecular.
  • the support 20 can be prepared to receive the report of the assembly 14.
  • an adhesion layer 22 is deposited, for example by a CVD or PVD type deposit, on one side of the support 20 intended to receive the assembly 14.
  • This adhesion layer 22 may be based on a mineral material such as silicon dioxide or silicon nitride, and / or of a similar nature to that of the passivation layer 12.
  • the material of the adhesion layer 22 is chosen in particular so that a molecular bonding with the assembly 14 and more particularly with the passivation layer 12 '. It is also possible to cover the other faces of the support 20 with the material of the adhesion layer 22 so as to provide mechanical protection for the support 20 during the subsequent steps of the process.
  • the support 20 and the adhesion layer 22 are subjected to a stabilizing anneal, for example at a temperature of between about 400 ° C. and 1100 ° C., in order to avoid any degassing, for example when the adhesion layer 22 is based on silicon dioxide, during the molecular bonding carried out subsequently during the production method described here, and therefore to consolidate the molecular adhesion.
  • a stabilizing anneal for example at a temperature of between about 400 ° C. and 1100 ° C.
  • a surface treatment of the adhesion layer 22 is then carried out, for example a chemical-mechanical polishing of the surface 22 'of the adhesion layer 22, making it possible to eliminate the possible roughness of the support 20 which may end up at the face 22 'of the adhesion layer 22 ( figure 1G ). This gives a flat face 22 '.
  • the assembly 14, or part of the assembly 14 comprising the graphic element is transferred to the support 20 by molecular bonding, without addition of material.
  • the molecular bonding is performed between the adhesion layer 22 and the passivation thin film 12 'which are here based on the same material.
  • the adhesion layer 22 may be omitted.
  • the roughness of the molecular bonded surfaces may be less than about 1 nm or 0.5 nm.
  • This heat treatment may in particular be an annealing carried out at a temperature of between about 250 ° C. and 1200 ° C.
  • this annealing can be carried out at a temperature greater than about 850 ° C. in order to obtain the best possible strength between the layers 12 and 22 (at least equivalent to that of a solid material).

Landscapes

  • Micromachines (AREA)
  • Adornments (AREA)
  • Physical Vapour Deposition (AREA)
  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)

Claims (19)

  1. Objekt (100), das mit wenigstens einem Grafikelement ausgestattet ist, umfassend wenigstens eine Schicht (6, 6', 6") auf Basis wenigstens eines Metalls, die gemäß einem Grafikelementmotiv graviert ist, wobei eine erste Seite der Schicht (6, 6', 6") gegenüber einer Seite wenigstens eines Substrats (2) angeordnet ist, das wenigstens teilweise transparent ist, wobei eine zweite Seite der Schicht (6, 6', 6"), die der ersten Seite entgegengesetzt ist, mit wenigstens einer Passivierungsschicht (12, 12') bedeckt ist, die mit wenigstens einer Seite wenigstens eines Trägers (20) durch molekulare Adhäsion verbunden ist und mit dem Träger (20) eine monolithische Struktur bildet, und wobei die Schicht (6, 6', 6") wenigstens im Bereich der zweiten Seite wenigstens eine Zone (10) auf Basis des Metalls und wenigstens eines Halbleiters umfasst.
  2. Objekt (100) nach Anspruch 1, bei dem das Substrat (2) auf Basis wenigstens eines amorphen oder kristallinen Materials hergestellt ist, und/oder die Passivierungsschicht (12, 12') auf Basis wenigstens eines mineralischen Materials hergestellt ist.
  3. Objekt (100) nach einem der vorhergehenden Ansprüche, ferner umfassend eine Anhaftschicht (4, 4', 4"), die zwischen der ersten Seite der Schicht (6, 6', 6"), in der das Grafikelement gebildet ist, und der Seite des Substrats (2) angeordnet ist.
  4. Objekt (100) nach Anspruch 3, bei dem das Grafikelement ebenfalls in die Anhaftschicht (4, 4', 4") graviert ist.
  5. Objekt (100) nach einem der Ansprüche 3 oder 4, bei dem die Anhaftschicht (4, 4', 4") auf Basis wenigstens eines Metalls und/oder eines Metallnitrids und/oder Metalloxids hergestellt ist.
  6. Objekt (100) nach einem der vorhergehenden Ansprüche, ferner umfassend wenigstens eine Adhäsionsschicht (22), die zwischen der Seite des Trägers (20) und der Passivierungsschicht (12, 12') angeordnet ist, wobei die molekulare Adhäsion zwischen der Adhäsionsschicht (22) und der Passivierungsschicht (12, 12') ausgebildet ist.
  7. Objekt (100) nach einem der vorhergehenden Ansprüche, wobei das Objekt (100) ein Schmuckstück, eine Uhr oder eine elektronische Vorrichtung ist.
  8. Objekt (100) nach einem der vorhergehenden Ansprüche, bei dem die Zone (10) der Schicht (6, 6', 6") auf Basis von Silicid hergestellt ist.
  9. Verfahren zur Realisierung eines Objekts (100), das mit wenigstens einem Grafikelement ausgestattet ist, umfassend wenigstens die folgenden Schritte:
    a) Aufbringen wenigstens einer Schicht (6, 6', 6") auf Basis wenigstens eines Metalls auf eine Seite wenigstens eines Substrats (2), das wenigstens teilweise transparent ist,
    b) Gravieren der Schicht (6, 6', 6") gemäß einem Grafikelementmotiv,
    c) Bilden wenigstens einer Zone (10) in der Schicht (6, 6', 6") wenigstens im Bereich einer zweiten Seite der Schicht (6, 6', 6") entgegengesetzt zu einer ersten Seite der Schicht (6, 6', 6"), die sich an der Seite des Substrats (2) befindet, auf Basis des Metalls und wenigstens eines Halbleiters,
    d) Aufbringen wenigstens einer Passivierungsschicht (12, 12') wenigstens auf die Schicht (6, 6', 6"), die das gravierte Grafikelement umfasst, und auf Bereiche der Seite des Substrats (2), die nicht durch die Schicht (6, 6', 6") bedeckt sind, die das gravierte Grafikelement umfasst,
    e) Verbinden der Passivierungsschicht (12, 12') mit wenigstens einer Seite wenigstens eines Trägers (20) durch molekulare Adhäsion, wodurch eine monolithische Struktur gebildet wird.
  10. Verfahren nach Anspruch 9, ferner umfassend, vor dem Schritt a) des Aufbringens der Schicht (6, 6', 6"), einen Schritt des Aufbringens einer Anhaftschicht (4, 4', 4") auf die Seite des Subtrats (2), wobei die Schicht (6, 6', 6") anschließend im Verlauf des Schritts a) auf der Anhaftschicht (4, 4', 4") aufgebracht wird.
  11. Verfahren nach Anspruch 10, bei dem das Grafikelement im Verlauf des Schritts b) ebenfalls in die Anhaftschicht (4, 4', 4") graviert wird.
  12. Verfahren nach einem der Ansprüche 9 bis 11, ferner umfassend, zwischen dem Schritt d) des Aufbringens der Passivierungsschicht (12, 12') und dem Schritt e) des Verbindens, einen Schritt des Temperns des Substrats (2), das die Passivierungsschicht (12, 12') umfasst, bei einer Temperatur, die zwischen ungefähr 400°C und 1100°C enthalten ist.
  13. Verfahren nach einem der Ansprüche 9 bis 12, ferner umfassend zwischen dem Schritt d) des Aufbringens der Passivierungsschicht (12, 12') und dem Schritt e) des Verbindens, einen Schritt des Planarisierens der Passivierungsschicht (12, 12')
  14. Verfahren nach einem der Ansprüche 9 bis 13, bei dem der Schritt b) des Gravierens des Grafikelements erzielt wird durch Durchführung von Schritten zur Maskierung, zur Lithografie und zur Gravierung in der Schicht (6, 6', 6") und/oder in einer Anhaftschicht (4, 4', 4"), die zwischen der Seite des Subtrats (2) und der Schicht (6, 6', 6") angeordnet ist, oder wenigstens eines Laserabtragschritts direkt in der Schicht (6, 6', 6") und/oder in einer Anhaftschicht (4, 4', 4"), die zwischen der Seite des Subtrats (2) und der Schicht (6, 6', 6") angeordnet ist.
  15. Verfahren nach einem der Ansprüche 9 bis 14, ferner umfassend, vor dem Schritt e) des Verbindens, einen Schritt des Aufbringens wenigstens einer Adhäsionsschicht (22) wenigstens auf der Seite des Trägers (20), wobei der Schritt e) des Verbindens erzielt wird durch die Durchführung einer Verklebung durch molekulare Adhäsion zwischen der Adhäsionsschicht (22) und der Passivierungsschicht (12, 12').
  16. Verfahren nach Anspruch 15, ferner umfassend zwischen dem Schritt des Aufbringens der Adhäsionsschicht (22) und dem Schritt e) des Verbindens, einen Schritt des Planarisierens der Adhäsionsschicht (22).
  17. Verfahren nach einem der Ansprüche 15 oder 16, ferner umfassend zwischen dem Schritt des Aufbringens der Adhäsionsschicht (22) und dem Schritt e) des Verbindens, einen Schritt des Temperns des Trägers (20), der die Adhäsionsschicht (22) umfasst, bei einer Temperatur, die zwischen ungefähr 400°C und 1100°C enthalten ist.
  18. Verfahren nach einem der Ansprüche 9 bis 17, ferner umfassend nach dem Schritt e) des Verbindens einen Schritt der thermischen Behandlung durch Tempern des Objekts (100) zur Verfestigung der molekularen Adhäsion.
  19. Verfahren nach einem der Ansprüche 9 bis 18, bei dem der Schritt c) des Bildens der Zone (10) auf Basis des Metalls und eines Halbleiters erzielt wird durch die Durchführung eines Schritts zur Silicidbildung der Schicht (6, 6', 6").
EP09704738.5A 2008-01-25 2009-01-23 Mit einem graphischen element auf einem träger versehenes objekt und verfahren zur herstellung des objekts Active EP2237697B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0850472A FR2926747B1 (fr) 2008-01-25 2008-01-25 Objet comportant un element graphique reporte sur un support et procede de realisation d'un tel objet.
PCT/EP2009/050785 WO2009092799A2 (fr) 2008-01-25 2009-01-23 Objet comportant un element graphique reporte sur un support et procede de realisation d'un tel objet

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EP2237697A2 EP2237697A2 (de) 2010-10-13
EP2237697B1 true EP2237697B1 (de) 2014-11-12

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Country Link
US (1) US8274151B2 (de)
EP (1) EP2237697B1 (de)
JP (1) JP5302337B2 (de)
CN (1) CN101951802B (de)
AU (1) AU2009207638B2 (de)
FR (1) FR2926747B1 (de)
IL (1) IL207073A (de)
WO (1) WO2009092799A2 (de)

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EP4338639A1 (de) * 2022-09-16 2024-03-20 Comadur SA Verfahren zur herstellung einer verkleidungskomponente mit einem beugungsgitter

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FR2880189B1 (fr) * 2004-12-24 2007-03-30 Tracit Technologies Sa Procede de report d'un circuit sur un plan de masse
FR2946435B1 (fr) 2009-06-04 2017-09-29 Commissariat A L'energie Atomique Procede de fabrication d'images colorees avec une resolution micronique enfouies dans un support tres robuste et tres perenne
FR2967016B1 (fr) 2010-11-08 2012-12-07 Commissariat Energie Atomique Procédé de réalisation d'une pièce contenant un motif enfoui dont les dimensions sont au plus micrométriques, et pièce ainsi obtenue
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AU2009207638A1 (en) 2009-07-30
EP2237697A2 (de) 2010-10-13
AU2009207638B2 (en) 2012-11-29
IL207073A0 (en) 2010-12-30
JP2011509782A (ja) 2011-03-31
FR2926747A1 (fr) 2009-07-31
IL207073A (en) 2013-05-30
WO2009092799A3 (fr) 2009-11-19
US8274151B2 (en) 2012-09-25
CN101951802A (zh) 2011-01-19
FR2926747B1 (fr) 2011-01-14
CN101951802B (zh) 2014-04-30
WO2009092799A2 (fr) 2009-07-30
US20110018132A1 (en) 2011-01-27
JP5302337B2 (ja) 2013-10-02

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