EP2456625B1 - Verfahren zur herstellung einer vorrichtung mit einem anzeigeelement - Google Patents

Verfahren zur herstellung einer vorrichtung mit einem anzeigeelement Download PDF

Info

Publication number
EP2456625B1
EP2456625B1 EP10733009.4A EP10733009A EP2456625B1 EP 2456625 B1 EP2456625 B1 EP 2456625B1 EP 10733009 A EP10733009 A EP 10733009A EP 2456625 B1 EP2456625 B1 EP 2456625B1
Authority
EP
European Patent Office
Prior art keywords
layer
protective layer
substrate
graphical element
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP10733009.4A
Other languages
English (en)
French (fr)
Other versions
EP2456625A2 (de
Inventor
Chrystel Deguet
Alain-Marcel Rey
Thomas Signamarcheix
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA, Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of EP2456625A2 publication Critical patent/EP2456625A2/de
Application granted granted Critical
Publication of EP2456625B1 publication Critical patent/EP2456625B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44F—SPECIAL DESIGNS OR PICTURES
    • B44F1/00—Designs or pictures characterised by special or unusual light effects
    • B44F1/02—Designs or pictures characterised by special or unusual light effects produced by reflected light, e.g. matt surfaces, lustrous surfaces
    • B44F1/04—Designs or pictures characterised by special or unusual light effects produced by reflected light, e.g. matt surfaces, lustrous surfaces after passage through surface layers, e.g. pictures with mirrors on the back
    • A—HUMAN NECESSITIES
    • A44—HABERDASHERY; JEWELLERY
    • A44C—PERSONAL ADORNMENTS, e.g. JEWELLERY; COINS
    • A44C27/00—Making jewellery or other personal adornments

Definitions

  • the invention relates to a method for producing a device with a graphic element.
  • the invention makes it possible, in particular, to produce one or more devices that can be produced in a collective manner, and that includes graphic elements of microscopic and / or nanoscopic dimensions, representing for example data such as text and / or images and / or or drawings buried in one or more massive objects in the form of vignettes may include one or more transparent windows to see them.
  • the invention makes it possible, in particular, to mark an object, for example for decorative purposes and / or for purposes of identification or traceability, such as a jewel, a watch glass, a window of an equipment screen.
  • an object for example for decorative purposes and / or for purposes of identification or traceability, such as a jewel, a watch glass, a window of an equipment screen.
  • electronic a gemstone or semi-precious stone, or any object with high added value or high security requirements (vehicle safety parts or elements of the medical field such as prostheses).
  • An object of the present invention is to propose a method for producing a device with a graphic element making it possible to customize a surface, for example a flat surface, of an object by adding a buried and protected graphic element, and thus tamperproof. and which does not have the disadvantages of the prior art.
  • This method makes it possible to transfer a graphic element to an object, called a second substrate, without denaturing it, given the small thickness of the protective layer, for example between about 100 nm and 100 ⁇ m.
  • the graphic element can be produced, during step a), by etching at least the first face of the protective layer in a pattern of the graphic element.
  • the graphic element is formed by recesses made by etching in the first face of the protective layer.
  • the securing step b) may comprise a molecular bonding of the protective layer against the second substrate used in a vacuum environment.
  • Such molecular bonding makes it possible in particular to obtain a device having excellent thermal resistance.
  • the protective layer may be oxide-based, for example silicon oxide, or silicon nitride
  • the second substrate may comprise an oxide-based face, for example silicon oxide. , or silicon nitride, the protective layer and the second substrate being able to be stuck molecularly to each other, during step b), at the first face of the protective layer and said face of the second substrate.
  • the layer intended to form the graphic element may be based on a material at least partially opaque to visible light, and / or visible to infrared and / or ultraviolet light.
  • Step b) of joining may comprise a molecular bonding of the layer covering the protective layer and the graphic element against the second substrate.
  • Such molecular bonding makes it possible in particular to obtain a device having excellent thermal resistance.
  • the layer covering the protective layer and the graphic element may be based on a dielectric material.
  • the layer covering the protective layer and the graphic element may be based on oxide, for example silicon oxide, or silicon nitride
  • the second substrate may comprise an oxide-based face, for example the silicon oxide, or silicon nitride, the layer covering the protective layer and the graphic element, and the second substrate being able to be stuck together molecularly during step b), level of said face of the second substrate.
  • Step c) of uncoupling may comprise an application of a mechanical stress between the sacrificial layer and the protective layer, and / or, when the first substrate is based on an at least partially transparent material and the sacrificial layer based on at least one material capable of decomposing, a laser irradiation of the sacrificial layer through the first substrate, and / or, when the sacrificial layer is based on a fusible material, a heat treatment at a temperature greater than or equal to at the melting temperature of said fusible material, and / or an attack by a solution capable of decomposing the material of the sacrificial layer.
  • the protective layer and / or the second substrate may be based on at least one optically transparent material. Thus, it is possible to see the graphic element through the protective layer and / or through the second substrate.
  • neither the protective layer nor the second substrate is based on an optically transparent material.
  • the material of the protective layer and / or the material of the second substrate to be chosen so as to be able to read the graphic element, for example by infrared or ultraviolet, these materials being, for example, silicon. .
  • Steps a) to c) can be implemented collectively for the production of several devices with graphic elements.
  • Figures 1A to 1H represent the steps of a process of producing a device with a graphic element 100 according to a first embodiment.
  • a stack comprising a substrate 102 that may be based on a material that is transparent or not transparent to light is produced.
  • This substrate may for example be a wafer, or a wafer, of diameter for example equal to about 200 mm, for example based on semiconductor such as silicon, or glass.
  • a sacrificial layer 104 is disposed on the substrate 102 and is covered by a protective layer 106.
  • the material of the sacrificial layer 104 is chosen in order to be able subsequently to separate or separate the substrate 102 from the protective layer 106.
  • the sacrificial layer 104 is for example based on SiN x , for example If 3 N 4 .
  • the substrate 102 may be made from a transparent material such as glass in order to subsequently be able to separate the substrate 102 and the protective layer 106 by the implementation of a laser shrinkage. also called a "laser liftoff" in which the irradiation of the sacrificial layer 104 by a laser beam through the transparent substrate 102 causes a decomposition of this material, thus separating the sacrificial layer 104 from the protective layer 106.
  • the sacrificial layer 104 may be based on a fusible material, for example germanium, that is to say a material capable of melting from a certain temperature (for example 937 ° C in the case of germanium) and thus achieve the separation of the protective layer 106 relative to the substrate 102.
  • the substrate 102 may be based of a non-transparent material.
  • the sacrificial layer 104 may be based on porous silicon, which will make it possible to mechanically disassemble the sacrificial layer 104 with respect to the protective layer 106, for example by inserting a blade between the protective layer 106 and the sacrificial layer 104.
  • the sacrificial layer 104 for example based on Ge or Si 3 N 4
  • the sacrificial layer 104 can be eliminated by etching (with, for example, a solution based on H 2 O 2 in the case of a Ge-based sacrificial layer or an H 3 PO 4 -based solution in the case of a sacrificial layer based on Si 3 N 4 ), thus achieving the separation of the protective layer 106 and the substrate 102.
  • the substrate 102 may be based on a non-transparent material.
  • the protective layer 106 is for example deposited on the sacrificial layer 104 and is based, for example, on oxide (such as SiO 2 ) and / or alumina and / or diamond (such as diamond-like carbon DLC and / or nitride (such as Si 3 N 4 ) and / or resin and / or at least one dielectric.
  • the thickness of the protective layer 106 is for example between about 100 nm and 100 ⁇ m in order to protect mechanically the graphic element which will be subsequently produced at the level of the protective layer 106. In order to be able to observe this graphic element through the protective layer 106, it is possible to produce this protective layer 106 based on an optically transparent material .
  • the degree of transparency of the layer 106 may be variable.
  • the thickness and the material of the layer 106 can be chosen so that the graphic element, which will be realized later, can be visible through the transparent layer 106.
  • a layer 108, in which the graphic element is intended to be made, is disposed on an upper face 107 of the protective layer 106 which is opposite the face of the protective layer 106 in contact with the sacrificial layer 104.
  • This layer 108 may be based on any material, and in particular, when the protective layer 106 and / or the object on which the graphic element will be joined are transparent, a material having a contrast vis-à-vis the materials to be subsequently arranged on the layer 108 (in particular the elements referenced 110 and 116 on the figure 1H ) since the graphic element can be observed through the protective layer 106 and / or the transparent object. It is also possible that the material of the layer 108 is at least partially opaque at certain wavelengths.
  • the layer 108 may be metal-based.
  • the layer 108 can also be made from a material having a contrast in the wavelength range of infrared light (wavelengths between about 780 nm and 1 mm) or ultraviolet (wavelengths between about 380 nm and 10 nm).
  • the thickness of the layer 108 is, for example, between about 10 nm and 1 ⁇ m, and preferably between about 50 nm and 200 nm.
  • the layer 108 is then etched so that the remaining portions 109, or gaps or gaps formed between the etched portions of the layer 108, form the desired graphic element ( Figure 1B ).
  • This graphic element represents for example data.
  • the remaining portions 109 or spaces formed between the remaining portions have for example dimensions whose lower limit corresponds to the technological limits of the engraving techniques used.
  • the etching technique used may be chosen depending on the nature of the material of the layer 108.
  • a mask layer for example based on a mineral material, on the layer 108, to etch the mask layer according to the pattern of the graphic element, then to etch the layer 108 to through the mask made on layer 108. The mask is then deleted.
  • the graphic element by first depositing on the face 107 of the protective layer 106 a mask layer, for example based on resin.
  • This resin layer is then etched to form a mask whose pattern corresponds to the inverse pattern of the graphic element.
  • the material intended to form the graphic element for example metal or any other suitable material and for example similar to the material of the layer 108 described above, is then deposited on the face 107 of the protective layer 106 through the mask, forming thus the graphic element.
  • the resin mask is removed so as to keep on the face 107 of the protective layer 106 only the material forming the graphic element.
  • the portions of material forming the graphic element are therefore similar to the portions 109 of the layer 108 forming the graphic element represented on the Figure 1B .
  • a layer 110 As shown on the figure 1C , then depositing and planarizing, for example mechanochemical, a layer 110, or a stack of layers, based on at least one material compatible with molecular bonding which will be described later.
  • This layer 110 completely covers the remaining portions 109 of the layer 108 forming the graphic element, as well as the portions of the face 107 of the transparent layer 106 which are not covered by the remaining portions 109 of the layer 108.
  • the layer 110 is for example based on a dielectric material, and may in particular be based on oxide, for example SiO 2 .
  • the planarization makes it possible to render an upper face 112 of the layer 110 compatible, in particular as regards the roughness and topology of the surface, for the subsequent implementation of a molecular bonding of the layer 110, at the level of the face upper 112, with the object intended to receive the graphic element.
  • the layer 110 may be made so that the thickness of this layer lying above the remaining portions 109 of the layer 108 is between about 10 nm and 10 ⁇ m, and preferably between about 10 nm and 1 ⁇ m.
  • a protective layer 114 for example based on Si 3 N 4 , resin, or carbon ( figure 1D ).
  • This protective layer 114 makes it possible to protect the layers 102, 104, 106, 109 and 110 of a dry or wet etching carried out at least through this protective layer 114 for delimiting portions of these layers that will be part of the device 100.
  • This etching can also be performed through the other layers 110 and / or 106 and / or 104. In the example of figure 1D this etching is carried out through the layers 114, 110 and 106.
  • This etching step therefore allows delimiting "on the surface” the device 100 of the other devices made in parallel on the same wafer.
  • the protective layer 114 is then removed.
  • Preparation steps for the molecular bonding of the face 112 can then be implemented collectively or individually for the chip. or all the chips from the initial stack of the layers 102, 104, 106, 108 and 110.
  • These preparation steps may be chemical cleaning steps of the surface 112 by solutions of the CARO, SC1 type, etc. and / or steps of mechanical preparation, for example brushing, and / or UV treatment steps, with ozone, or of type plasma for activating the molecules of the layer 110 at the surface 112.
  • Molecular bonding of the chip 115 is then carried out with a second substrate 116 (substrate on which it is possible to have an oxide layer beforehand), at the face 112 of the dielectric layer 110 (FIG. figure 1G ).
  • This second substrate 116 corresponds to the object intended to include the graphic element, that is to say the object to identify and / or decorate (jewel, watch glass, precious stone, electronic device screen,. ..).
  • the device 100 is then completed by separating the substrate 102 and the sacrificial layer 104 from the protective layer 106 by implementing one of the separation techniques described above according to the nature of the material of the sacrificial layer 104 (withdrawal by laser when the substrate 102 is transparent and the material of the sacrificial layer 104 is able to decompose or to carry out a degassing, heat treatment when the sacrificial layer 104 is based on a fusible material, application of a mechanical stress for mechanically separating the sacrificial layer 104 from the protective layer 106, or etching to remove the sacrificial layer 104) as shown in FIG. figure 1H .
  • FIGS. 2A to 2D represent the steps of a method of producing a graphics element device 200 according to a second embodiment.
  • a stack comprising the substrate 102, the sacrificial layer 104 placed on the substrate 102 and covered by the protective layer 106 (FIG. Figure 2A ).
  • the materials and / or the thicknesses of these layers are for example substantially similar to the materials and / or the thicknesses previously described in connection with the first embodiment.
  • the material of the protective layer 106 is preferably a transparent material, for example SiO 2 .
  • the stack of layers made in this second embodiment does not include the layer 108 in which the graphic element was etched.
  • the graphic element is etched directly in the protective layer 106, at its upper face 107 which is opposite to the face in contact with the sacrificial layer 104 (see Figure 2B ).
  • Holes 202 are therefore made for example by photolithography and etching, or by etching through a mask made temporarily on the protective layer 106, in the upper face 107 of the protective layer 106, these hollows 202 forming the graphic element.
  • a protective layer in order to protect the layers 106, 104 and 102 of a dry or wet etching carried out at least through the protective layer for delimit portions of these layers that will be part of the device 200. This etching can also be performed through the other layers 106 and 104.
  • This etching can be performed through the stack at a thickness of between about 10 nm and 500 nm, and preferably between about 10 nm and 100 nm.
  • This stage of etching of the protective layer thus makes it possible to define the device 200 of the other devices made in parallel on the same wafer. Indeed, in a similar manner to the first embodiment, although the production of a single device with a graphic element is represented on the Figures 2A to 2D , several other devices with graphic elements, not shown, are also made from the stack of layers described above, by the collective implementation of the steps described in connection with the Figures 2A and 2B .
  • a material such as a metal or polysilicon
  • the deposition of such a material makes it possible, in particular, when the protective layer 106 and / or the second substrate 116 are based on an optically transparent material, to improve the contrast for the observation of the graphic element which is then formed by the hollows and by the material deposited in the hollows.
  • Molecular bonding of the protective layer 106 is then carried out with the second substrate 116, that is to say the object to be identified and / or decorated, at the upper face 107 of the protective layer 106 comprising the graphic element ( Figure 2C ).
  • the face of the second substrate 116 intended to be secured to the protective layer 106 may be previously covered with an oxide layer 204, for example of the same nature as the oxide of the protective layer 106, making the molecular bonding compatible between the second substrate 116 and the transparent layer 106.
  • this molecular bonding is preferably performed in a chamber under empty.
  • the device 200 is then completed by separating the substrate 102 and the sacrificial layer 104 from the protective layer 106 by implementing one of the separation techniques described above according to the nature of the material of the sacrificial layer 104 (withdrawal by laser when the substrate 102 is transparent, heat treatment when the sacrificial layer 104 is based on a fusible material, applying a mechanical stress to mechanically separate the sacrificial layer 104 from the protective layer 106, or etching to remove the sacrificial layer 104) as shown in FIG. 2D figure .

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Claims (14)

  1. Verfahren zur Herstellung einer Vorrichtung (100, 200) mit einem grafischen Element (109, 202), umfassend wenigstens die folgenden Schritte:
    a) Herstellen von wenigstens einem Stapel, welcher wenigstens eine Opferschicht (104), die zwischen wenigstens einem ersten Substrat (102) und wenigstens einer Schutzschicht (106) angeordnet ist, und wenigstens ein grafisches Element (109, 202) umfasst, welches auf der Höhe einer ersten Fläche (107) der Schutzschicht (106) gegenüber von einer zweiten Fläche der Schutzschicht (106) ausgeführt ist, so dass die zweite Fläche auf der Opferschicht (104) angeordnet ist,
    b) Verbinden des Stapels mit wenigstens einem zweiten Substrat (116), so dass das grafische Element (109, 202) zwischen dem ersten Substrat (102) und dem zweiten Substrat (116) angeordnet ist,
    c) Lösen der Opferschicht (104) von der Schutzschicht (106).
  2. Verfahren nach Anspruch 1, wobei das grafische Element (202) beim Schritt a) hergestellt wird, indem wenigstens die erste Fläche (107) der Schutzschicht (106) gemäß einem Motiv des grafischen Elements (202) geätzt wird.
  3. Verfahren nach Anspruch 2, wobei der Schritt b) des Verbindens ein molekulares Kleben der Schutzschicht (106) an das zweite Substrat (116) umfasst, welches in einer Vakuum-Umgebung durchgeführt wird.
  4. Verfahren nach Anspruch 3, wobei die Schutzschicht (106) auf Siliziumoxid oder auf Siliziumnitrid basiert, wobei das zweite Substrat (116) eine Fläche (204) auf Basis von Siliziumoxid oder Siliziumnitrid umfasst, wobei die Schutzschicht (106) und das zweite Substrat (116) beim Schritt b) molekular aneinander geklebt werden, auf Höhe von der ersten Fläche (107) der Schutzschicht (106) und der Fläche (204) von dem zweiten Substrat (116).
  5. Verfahren nach Anspruch 1, wobei der Schritt a) des Herstellens von dem Stapel die Durchführung der folgenden Schritte umfasst:
    - Herstellen von einem Stapel, welcher die Opferschicht (104), die zwischen dem ersten Substrat (102) und der Schutzschicht (106) angeordnet ist, und eine Schicht (108) umfasst, die dazu bestimmt ist, das grafische Element (109) zu bilden, und die auf der ersten Fläche (107) der Schutzschicht (106) angeordnet ist,
    - Ätzen der Schicht (108) die dazu bestimmt ist, das grafische Element (109) zu bilden, entsprechend einem Motiv des grafischen Elements, wobei die übrig gebliebenen Abschnitte der geätzten Schicht (108) das grafische Element (109) bilden,
    - Aufbringen einer Schicht (110), welche die Schutzschicht (106) und das grafische Element (109) abdeckt,
    - Planarisieren der Schicht (110), welche die Schutzschicht (106) und das grafische Element (109) abdeckt.
  6. Verfahren nach Anspruch 5, wobei die Schicht (108), die dazu bestimmt ist, das grafische Element (109) zu bilden, auf einem Material basiert, welches wenigstens teilweise für das sichtbare Licht opak ist oder/und für Infrarot-Licht oder/und ultraviolettes Licht sichtbar ist.
  7. Verfahren nach Anspruch 1, wobei der Schritt a) der Herstellung von dem Stapel die Durchführung der folgenden Schritte umfasst:
    - Herstellen eines Stapels, welcher die Opferschicht (104), die zwischen dem ersten Substrat (102) und der Schutzschicht (106) angeordnet ist, und eine Maskierungsschicht umfasst, die auf der ersten Fläche (107) der Schutzschicht (106) angeordnet ist,
    - Ätzen der Maskierungsschicht gemäß einem Motiv, welches invers zu dem Motiv von dem grafischen Element ist,
    - Aufbringen von einem Material auf die erste Fläche (107) der Schutzschicht (106) durch die geätzte Maskierungsschicht hindurch, wodurch das grafische Element gebildet wird,
    - Entfernen der geätzten Maskierungsschicht,
    - Aufbringen einer Schicht (110), welche die Schutzschicht (106) und das grafische Element bedeckt,
    - Planarisieren der Schicht (110), welche die Schutzschicht (106) und das grafische Element bedeckt.
  8. Verfahren nach einem der Ansprüche 5 bis 7, wobei der Schritt b) des Verbindens ein molekulares Kleben der Schicht (110), welche die Schutzschicht (106) und das grafische Element (109) bedeckt, auf das zweite Substrat (116) umfasst.
  9. Verfahren nach einem der Ansprüche 5 bis 8, wobei die Schicht (110), welche die Schutzschicht (106) und das grafische Element (109) bedeckt, auf einem dielektrischen Material basiert.
  10. Verfahren nach Anspruch 8, wobei die Schicht (110), welche die Schutzschicht (106) und das grafische Element (109) bedeckt, auf Siliziumoxid oder Siliziumnitrid basiert, wobei das zweite Substrat (116) eine Fläche (204) auf Basis von Siliziumoxid oder von Siliziumnitrid umfasst, wobei die Schicht (110), welche die Schutzschicht (106) und das grafische Element (109) bedeckt, und das zweite Substrat (116) beim Schritt b) molekular aneinander geklebt werden, auf Höhe der Fläche (204) von dem zweiten Substrat (116).
  11. Verfahren nach einem der vorhergehenden Ansprüche, wobei der Schritt c) des Lösens eine Anwendung einer mechanischen Belastung zwischen der Opferschicht (104) und der Schutzschicht (106) umfasst, oder/und, falls das erste Substrat (102) auf einem Material basiert, das wenigstens teilweise transparent ist, und die Opferschicht (104) auf wenigstens einem Material basiert, das dazu geeignet ist, sich zu zersetzen, eine Laser-Bestrahlung der Opferschicht (104) durch das erste Substrat (102) hindurch umfasst, oder/und, falls die Opferschicht (104) auf einem schmelzbaren Material basiert, eine thermische Behandlung mit einer Temperatur umfasst, die größer oder gleich der Schmelztemperatur von dem schmelzbarem Material ist, oder/und einen chemischen Angriff mit einer Lösung umfasst, die dazu geeignet ist, das Material der Opferschicht (104) zu zersetzen.
  12. Verfahren nach einem der vorhergehenden Ansprüche, wobei die Schutzschicht (106) oder/und das zweite Substrat (116) auf wenigstens einem optisch transparenten Material basieren.
  13. Verfahren nach einem der vorhergehenden Ansprüche, wobei die Schritte a) bis c) in kollektiver Weise durchgeführt werden, um mehrere Vorrichtungen (100, 200) mit grafischen Elementen herzustellen.
  14. Verfahren nach Anspruch 13, weiterhin umfassend die folgenden Schritte, zwischen dem Schritt a) des Herstellens des Stapels und dem Schritt b) des Verbindens:
    - Aufbringen einer Schutzschicht (114) auf einer Fläche (112) des Stapels gegenüber von dem ersten Substrat (102),
    - Ätzen wenigstens der Schutzschicht (114), wodurch die Vorrichtungen (100, 200) mit grafischen Elementen abgegrenzt werden,
    - Ausschneiden/Zuschneiden der übrigen nicht geätzten Schichten (110, 108, 106, 104, 102) des Stapels auf der Höhe der geätzten Bereiche wenigstens in der Schutzschicht (114),
    - Entfernen der Schutzschicht (114).
EP10733009.4A 2009-07-22 2010-07-20 Verfahren zur herstellung einer vorrichtung mit einem anzeigeelement Not-in-force EP2456625B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0955124A FR2948318B1 (fr) 2009-07-22 2009-07-22 Procede de realisation d'un dispositif a element graphique
PCT/EP2010/060456 WO2011009847A2 (fr) 2009-07-22 2010-07-20 Procede de realisation d'un dispositif a element graphique

Publications (2)

Publication Number Publication Date
EP2456625A2 EP2456625A2 (de) 2012-05-30
EP2456625B1 true EP2456625B1 (de) 2013-11-06

Family

ID=42035280

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10733009.4A Not-in-force EP2456625B1 (de) 2009-07-22 2010-07-20 Verfahren zur herstellung einer vorrichtung mit einem anzeigeelement

Country Status (4)

Country Link
US (1) US20120111829A1 (de)
EP (1) EP2456625B1 (de)
FR (1) FR2948318B1 (de)
WO (1) WO2011009847A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2926748B1 (fr) * 2008-01-25 2010-04-02 Commissariat Energie Atomique Objet muni d'un element graphique reporte sur un support et procede de realisation d'un tel objet.
FR3007892B1 (fr) 2013-06-27 2015-07-31 Commissariat Energie Atomique Procede de transfert d'une couche mince avec apport d'energie thermique a une zone fragilisee via une couche inductive

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4490440A (en) * 1983-08-16 1984-12-25 Reber William L High technology jewelry and fabrication of same
JP3319661B2 (ja) * 1993-10-12 2002-09-03 日本写真印刷株式会社 転写箔および多色の光透過抜きパターンを有するプラスチック成形品の製造方法
US5972233A (en) * 1996-01-31 1999-10-26 Refractal Design, Inc. Method of manufacturing a decorative article
ATE263499T1 (de) * 1998-04-23 2004-04-15 Winter Cvd Technik Gmbh Schmucksteine
FR2787061B1 (fr) * 1998-12-14 2001-01-26 Becton Dickinson France Procede et installation de marquage superficiel d'un substrat
JP3495696B2 (ja) * 2000-11-08 2004-02-09 株式会社アトライズヨドガワ キートップ及びその製造方法
US20030034328A1 (en) * 2001-08-20 2003-02-20 Pang-Tsung Lu Method of making 3d patterns on a mold
FR2851496B1 (fr) * 2003-02-20 2005-05-27 Savoyet Jean Louis P J Moyens et dispositifs de protection d'un graphisme lithographique reporte sur un objet pouvant contenir un dispositif electronique de reperage.
FR2856192B1 (fr) * 2003-06-11 2005-07-29 Soitec Silicon On Insulator Procede de realisation de structure heterogene et structure obtenue par un tel procede
ATE439335T1 (de) * 2003-12-16 2009-08-15 Asulab Sa Verfahren zur herstellung eines transparenten elements mit unsichtbaren elektroden
US7691281B2 (en) * 2005-04-28 2010-04-06 Harmony Fastening Systems, Inc. Method of producing a reflective design
FR2888402B1 (fr) * 2005-07-06 2007-12-21 Commissariat Energie Atomique Procede d'assemblage de substrats par depot d'une couche mince de collage d'oxyde ou de nitrure et structure ainsi assemblee
FR2893018B1 (fr) * 2005-11-09 2008-03-14 Commissariat Energie Atomique Procede de formation de supports presentant des motifs, tels que des masques de lithographie.
FR2906078B1 (fr) * 2006-09-19 2009-02-13 Commissariat Energie Atomique Procede de fabrication d'une structure micro-technologique mixte et une structure ainsi obtenue

Also Published As

Publication number Publication date
FR2948318A1 (fr) 2011-01-28
EP2456625A2 (de) 2012-05-30
US20120111829A1 (en) 2012-05-10
WO2011009847A2 (fr) 2011-01-27
WO2011009847A3 (fr) 2011-04-14
FR2948318B1 (fr) 2011-08-19

Similar Documents

Publication Publication Date Title
EP2237698B1 (de) Mit einem graphischen element auf einem träger versehenes objekt und verfahren zur herstellung des objekts
EP2237697B1 (de) Mit einem graphischen element auf einem träger versehenes objekt und verfahren zur herstellung des objekts
EP1634685A2 (de) Dünner elektronischer Chip auf Glas für elektronisches Bauelement und Herstellungsverfahren
FR2842650A1 (fr) Procede de fabrication de substrats notamment pour l'optique, l'electronique ou l'opto-electronique
FR2957190A1 (fr) Procede de realisation d'une structure multicouche avec detourage par effets thermomecaniques.
EP1825510B1 (de) Verfahren zum kollektiven produzieren einer elementüberlagerungs-mikrostruktur
FR2935535A1 (fr) Procedede de detourage mixte.
FR2935536A1 (fr) Procede de detourage progressif
FR2860842A1 (fr) Procede de preparation et d'assemblage de substrats
FR2925223A1 (fr) Procede d'assemblage avec marques enterrees
EP2348527A1 (de) Verfahren zum glühen einer struktur
EP1756864B9 (de) Verfahren zur herstellung von chips
EP2456625B1 (de) Verfahren zur herstellung einer vorrichtung mit einem anzeigeelement
FR2842651A1 (fr) Procede de lissage du contour d'une couche utile de materiau reportee sur un substrat support
EP2273548B1 (de) Verfahren zur Herstellung eines temporären Trägerwafers, der Sichtfenster enthält
FR2842647A1 (fr) Procede de transfert de couche
EP1572578A2 (de) Verfahren zur herstellung mikromechanischer bauteile unter verwendung einer polymerschicht und nach diesem verfahren hergestellte bauteile
FR2959596A1 (fr) Amincissement detourant
EP3159916B1 (de) Verfahren zur verdünnung von proben
EP3823013B1 (de) Verfahren zur demontage eines stapels von mindestens drei substraten
FR2866982A1 (fr) Procede de fabrication de composants electroniques
EP3412625A1 (de) Herstellungsverfahren eines mikromechanischen bauteils
FR2842649A1 (fr) Procede d'augmentation de l'aire d'une couche utile de materiau reportee sur un support
CH713854B1 (fr) Procédé de fabrication d'une pièce micromécanique.
WO2019186035A1 (fr) Procédé de fabrication d'un substrat donneur pour la réalisation d'une structure intégrée en trois dimensions et procédé de fabrication d'une telle structure intégrée

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20120118

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

DAX Request for extension of the european patent (deleted)
GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20130531

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 639182

Country of ref document: AT

Kind code of ref document: T

Effective date: 20131215

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: FRENCH

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602010011526

Country of ref document: DE

Effective date: 20140102

REG Reference to a national code

Ref country code: NL

Ref legal event code: VDEP

Effective date: 20131106

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 639182

Country of ref document: AT

Kind code of ref document: T

Effective date: 20131106

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140206

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140306

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140306

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602010011526

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

26N No opposition filed

Effective date: 20140807

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602010011526

Country of ref document: DE

Effective date: 20140807

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602010011526

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: LU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140720

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20140720

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20150331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140731

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140731

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20150203

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 602010011526

Country of ref document: DE

Effective date: 20150203

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140720

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140720

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140207

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140731

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20100720

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131106