EP2221390B1 - Method for producing a copper alloy sheet excellent in strength, bending workability and stress relaxation resistance - Google Patents

Method for producing a copper alloy sheet excellent in strength, bending workability and stress relaxation resistance Download PDF

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Publication number
EP2221390B1
EP2221390B1 EP08843774.4A EP08843774A EP2221390B1 EP 2221390 B1 EP2221390 B1 EP 2221390B1 EP 08843774 A EP08843774 A EP 08843774A EP 2221390 B1 EP2221390 B1 EP 2221390B1
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Prior art keywords
mass
becomes
proof stress
rolling
copper alloy
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German (de)
English (en)
French (fr)
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EP2221390A1 (en
EP2221390A4 (en
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Kiyoshige Hirose
Kuniteru Mihara
Hiroshi Kaneko
Tatsuhiko Eguchi
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Furukawa Electric Co Ltd
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Furukawa Electric Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Definitions

  • the present invention relates to a method for producing a copper alloy sheet.
  • a spring property becomes to be important in order to maintain a contact pressure at a contact member of a spring after performing a molding into a shape of a connector. And then therefore not only the tensile strength but also a proof stress that is a limit of an elastic deformation zone is required to be higher for a material which is to be made use.
  • a high strength beryllium copper (an alloy as pursuant to the JIS-C1720) has been made use. And then this alloy has the tensile strength of stronger than or equal to 815 MPa as pursuant to the 1/2HM Temper and of stronger than or equal to 910 MPa as pursuant to the HM Temper for a mill-hardened material for which it is not necessary to perform an aging heat treatment after performing a press molding process, and the same is superior in bending workability as well.
  • the metal of beryllium is harmful for a human body.
  • a material for substituting is desired in accordance with a consideration of a processing of production and thereof for an environment as well.
  • the alloy of Cu-Ni-Si system is an alloy of a precipitation type in which a precipitate is to be formed and then the same is to be hardened, that is comprised of Ni and Si, and then an ability to harden is higher as extremely.
  • an objective of the present invention is to provide a copper alloy material that has the strength as higher and that is superior in the bending workability and in the stress relaxation resistance, and to provide a method for producing such a copper alloy material.
  • the present inventors have studied regarding a copper alloy material which is to be suitable for a usage of an electrical apparatus and of an electronic equipment. And then it becomes able to complete the invention of the copper alloy material that has the strength as higher and that is superior in the bending workability and in the stress relaxation resistance, by performing a control of a composition of the copper alloy. Moreover, the present inventors found out as well that it becomes able to obtain a copper alloy material which has an anisotropy to be smaller in addition to the above description, by performing a control of a grain of matrix size and of a shape of a grain of matrix in a structure of the copper alloy, and by performing a control of a hardening amount at a period of a manufacturing process.
  • the invention refers to the method of claim, being a method of producing a copper alloy sheet, consisting of:
  • FIG. 1 is an explanatory drawing showing an evaluation method of a grain of matrix size and of a shape of a grain of matrix which is specified in accordance with the present invention.
  • the copper alloy material means a copper alloy which has a specified shape, such as a plate material, a bar material, a wire rod, or the like.
  • Ni 2 Si phase As mainly and then it becomes able to perform an improvement of the strength and of the electrical conductivity in a case where an aging treatment is performed for the Ni and the Si in a copper alloy. And then it is desirable for a content of the Ni to be from 2.8 mass% to 5.0 mass%, or it is further preferable for the same to be from 3.0 mass% to 4.8 mass%.
  • a ground to be specified in such a manner is because there becomes to be occurred the problems of which it is not able to obtain the strength as equivalent to or stronger than that of the high strength beryllium copper (the alloy as pursuant to the JIS-C1720) in a case where an added amount is less than 2.8 mass%, and in the meantime, in a case where the same is more than 5.0 mass% a formation of a chemical compound that is not to contribute to the improvement of the strength at a period of performing a casting or at a period of performing a hot working, and then not only that it is not able to obtain the strength which corresponds to the added amount, but also that a hot workability becomes to be worsened and then the same becomes to effect as negatively.
  • a content of the Si is from 0.4 mass% to 1.7 mass%, and then it is further preferable for the same to be from 0.6 mass% to 1.3 mass%.
  • a ground to be specified in such a manner is because that it is not able to obtain the improvement of the strength as sufficiently by making use of the aging treatment, and then that it is not able to obtain the strength which is equivalent to or more than that of the alloy which is pursuant to the JIS-C1720 in a case where an amount of Si is less than 0.4 mass%, and in the meantime, that in a case where the content of the Si is more than 1.7 mass% it becomes a cause of a decrease in the electrical conductivity in addition to an occurrence of the problems that is similar to the case where the amount of Ni is excessive.
  • Ni and Si form the Ni 2 Si phase as mainly. And then therefore there is an optimal ratio between Ni and Si in order to perform the improvement of the strength. And then a ratio (Ni / Si) between the Ni (mass%) and the Si (mass%) is determined to be 4.2 in a case where the Ni 2 Si phase is formed regarding the amount of the Si. Furthermore, it is desirable to perform a control of the (Ni / Si) to be from 3.0 to 6.0 with the above mentioned value to be a central value, and then it is further preferable to perform the control of the (Ni / Si) to be from 3.8 to 4.6.
  • S is contained with a very small amount in a copper alloy in general. And then in a case where the amount is more than or equal to 0.005 mass% the same becomes a cause of worsening the hot workability. And then therefore it is required to specify the content to be less than 0.005 mass%. Or, it is further preferable for the same to be less than 0.002 mass% in particular.
  • the amount it is desirable to perform an addition of Mg into the copper alloy. And then it is desirable for the amount to be from 0.01 mass% to 0.20 mass%. Further, due to Mg it becomes able to perform an improvement of a stress relaxation property as extremely, in the meantime however, the same effects as negatively to the bending workability. Furthermore, it is necessary for an amount of the Mg to be more than or equal to 0.01 mass% in order to perform the improvement of the stress relaxation property, and then the more the amount is, the better the improvement becomes to be. And in the meantime however, in a case where the amount is more than 0.20 mass% it becomes unable to satisfy a required property of the bending workability. And hence it is further preferable for the amount to be from 0.05 mass% to 0.15 mass%.
  • the amount is desirable to perform an addition of Sn into the copper alloy. And then it is desirable for the amount to be from 0.05 mass% to 1.5 mass%. Further, due to the Sn with relating to Mg together it becomes able to perform the further improvement of the stress relaxation property, however, the advantage is not so large with comparing to that according to the Mg. And then in a case where the Sn is less than 0.05 mass% it is not able to obtain the advantage as sufficiently. In the meantime however, in a case where the amount is more than 1. 5 mass% the electrical conductivity becomes to be decreased as excessively. And hence it is further preferable for the amount to be from 0.1 mass% to 0.7 mass%.
  • the amount of Zn into the copper alloy it is desirable to perform an addition of Zn into the copper alloy. And then it is desirable for the amount to be from 0.2 mass% to 1.5 mass%. Further, due to the Zn it becomes able to perform an improvement of the bending workability with a little amount of degrees. And then by specifying the amount of the Zn to be from 0.2 mass% to 1.5 mass% it becomes able to obtain the bending workability that corresponds the standard of which there is no problem for a practical use even in a case where it is to be performed an addition of Mg with 0.20 mass% at the maximum.
  • the Zn it becomes able to perform an improvement of such as a property of adherence or a property of migration or the like regarding such as a plating of Sn or a plating of solder or the like.
  • the amount of the Zn is less than 0.2 mass% it is not able to obtain the advantage as sufficiently, and in the meantime, in a case where the amount is more than 1.5 mass% the electrical conductivity becomes to be decreased. And hence it is further preferable for the amount to be from 0.3 mass% to 1.0 mass%.
  • any one nature or more than or equal to any two natures into the copper alloy that is selected from a group of Sc, Y, Ti, Zr, Hf, V, Mo and Ag with an amount from 0.005 mass% to 0.3 mass% in total.
  • any of Sc, Y, Ti, Zr, Hf, V and Mo forms a chemical compound with Si. And then it is able to obtain an advantage by which it becomes able to prevent a grain of matrix size from becoming coarse.
  • it is possible to perform the addition with the amount of the addition to be within the above mentioned range by which the property of such as the strength or of the electrical conductivity or the like will not be worsened.
  • the Ag due to the Ag it becomes able to perform the improvement of a heat resistance and of the strength. Still further, it becomes able to prevent the grain of matrix from becoming coarse, and it becomes able to perform the improvement of the bending workability at the same time. In the meantime however, in a case where the amount of the Ag is less than 0.005 mass% it is not able to obtain the advantage as sufficiently. And in the meantime, in a case of performing the addition of more than 0.3 mass% it becomes a cause of a high cost of production, though there is no effect as negatively to be given to the properties. And then therefore it is desirable for the content of the Ag to be within the above mentioned range from a point of view of those.
  • the Cr becomes to be precipitated as finely into the copper and then the same becomes to contribute to the improvement of the strength.
  • the same becomes to form a chemical compound with the Si or with the Ni and the Si together, and then it becomes able to obtain an advantage to prevent the grain of matrix size from becoming coarse, that is similar to the above mentioned group of Sc, Y, Ti, Zr, Hf, V and Mo.
  • the amount is less than 0.05 mass% it is not able to obtain the advantage as sufficiently.
  • the amount is more than 1.0 mass% the bending workability becomes to be deteriorated.
  • the amount is to be specified within a range from 0.005 mass% to 2.0 mass% in total with corresponding to a required property.
  • a grain of matrix size and a shape of a grain of matrix in order to realize the properties of the copper alloy material which has the above mentioned composition. And then in accordance with the present invention it is desirable for the above mentioned grain of matrix size to be larger than 0.001 mm, but to be smaller than or equal to 0.025 mm. Or, it is further preferable for the same to be larger than 0.001 mm, but to be smaller than or equal to 0.015 mm.
  • the grain of matrix size is smaller as excessively it becomes easier for a recrystallized structure to be a mixed grain (a structure in which grains of matrix exist together that have a different size from each other), and hence the bending workability and also the stress relaxation property become to be worsened.
  • the grain of matrix size is larger as excessively the bending workability becomes to be effected as negatively.
  • the grain of matrix size is larger the matter becomes a cause of increasing a difference of the strength between a vertical direction of rolling and a parallel direction thereof.
  • the above mentioned grain of matrix size is determined to be a value which is measured with being pursuant to the JIS-H0501 (the method of cutting).
  • the shape of the grain of matrix in accordance with the present invention indicates a ratio (a / b) between a major axis (a) of the grain of matrix on a cross section which is parallel to a direction for a final plastic working and a major axis (b) of the grain of matrix on the cross section which is at right angles to the direction for the final plastic working.
  • the ratio (a / b) it is desirable for the ratio (a / b) to be higher than or equal to 0.8 but lower than or equal to 1.5. Or, it is further preferable for the same to be from 1.0 to 1.3.
  • the above mentioned ratio (a / b) is higher as excessively the stress relaxation property becomes to be worsened.
  • the above mentioned ratio (a / b) is lower as excessively the stress relaxation property becomes to be worsened either. And hence it is desirable for the same to be higher than or equal to 0.8.
  • a maximum value of a difference between a proof stress in a rolling direction (which is equivalent as normally to the above mentioned direction for the final plastic working) and a proof stress in a direction of which has an angle of 90 degrees against the rolling direction to be lower than or equal to 100 MPa.
  • the ground is because there becomes to be occurred a problem of such as that in a case where the value is higher than 100 MPa it becomes difficult to perform a designing of a connector or to perform a setting of a metallic mold at a time of performing the bend working, or a contact pressure strength of the connector is not to satisfy the property due to a difference from a designed value, or the like.
  • the maximum value of the difference between the above mentioned each of the values is lower than or equal to 50 MPa.
  • the maximum value of the difference between the above mentioned each of the values is not limited to 50 MPa.
  • a schematic manufacturing process as desired for the copper alloy material in accordance with the present invention comprises the following steps of:
  • a method for producing the same is desired, that satisfy the following formulas from (1) to (3), in a case where a variation of a proof stress after the low temperature annealing is defined to be ⁇ total (MPa) that is varied from a proof stress immediately before the rolling (1) that is after obtaining the recrystallized structure by performing the solution heat treatment, where a variation of a proof stress before and after the rolling (1) is defined to be ⁇ C1 (MPa), and where a variation of a proof stress before and after the rolling (2) is defined to be ⁇ C2 (MPa), for the material that is to be produced by the above mentioned steps of the casting the hot rolling - the dough rolling ⁇ the solution heat treatment ⁇ the rolling (1) ⁇ the aging treatment ⁇ the rolling (2) ⁇ the low temperature annealing: 0.1 ⁇ ⁇ C ⁇ 1 / ⁇ total ⁇ 0.35 0 ⁇ ⁇ C ⁇ 2 / ⁇ total ⁇ 0.35 0.1 ⁇ ⁇ C ⁇ 1
  • the ground that it is desirable to perform the control of the variation of the proof stress at each of the processes is because the variation of the proof stress, and more specifically the variation of the proof stress at the cold rolling has a correlation with an amount of strain which is introduced into the material.
  • the proof stress of a material the bending workability, the stress relaxation resistance, and the like depend on the amount of strain which is introduced into the material.
  • the amount of strain is larger the bending workability and the stress relaxation resistance become to be deteriorated.
  • the amount of strain which is to be introduced into a material depends on a state of solution and precipitation of a mother phase of copper. And then therefore there is not performed a unified interpretation regarding an evaluation by making use of such as a conventional rate of rolling or the like in a case where a composition and a state of precipitation are different.
  • the present inventors perform a standardization of the variation of the proof stress at the period of performing the cold rolling by making use of a total variation of the proof stress after performing the low temperature annealing varied from that immediately after performing the solution heat treatment. And then by performing a control of this standardized value to be within a range of the specification, it is found out that it becomes able to produce a copper alloy material that has the strength as higher, and that is superior in the bending workability and in the stress relaxation resistance with comparing to the conventional materials.
  • the casting is designed to be performed by making use of such as a general DC method or the like. Still further, it is desirable for the hot rolling to perform the rolling at a temperature from 700°C to 1000 °C immediately after performing a homogenization treatment of an ingot at a temperature from 850°C to 1000 °C with an amount of time from 0.5 hour to six hours, and then thereafter it is desirable to perform a water cooling in order to prevent from a precipitation at a period of performing the cooling. Still further, after performing the hot rolling and then after performing a facing of an oxide film layer the dough rolling is designed to be performed.
  • the rolling is designed to be performed regarding this dough rolling in order to obtain a plate thickness by which it becomes able to obtain a predetermined processing rate at the rolling (1) and at the rolling (2). Furthermore, it becomes able to obtain a sample material which has a plate shape by making use of the above mentioned hot rolling and the dough rolling.
  • the solution heat treatment it is desirable for the solution heat treatment to be performed at a substantial temperature of a material from 800°C to 1000°C, to be maintained thereafter with an amount of time approximately from three seconds to sixty seconds, and to be cooled down thereafter with a cooling rate of faster than or equal to 15°C per second in order to prevent from the precipitation. (Or, it is further preferable for the same to be faster than or equal to 30°C per second. And in the meantime, there is no limitation in particular regarding an upper limit, however, it is desirable for the same to be slower than or equal to 150°C per second.) In the meantime however, in a case where the temperature of the solution heat treatment is lower as excessively it is not able to obtain a sound recrystallized structure.
  • the rolling (1) is designed to be performed in order to perform an improvement of the tensile strength and of the proof stress at the period of performing the aging treatment. And then a dislocation is to be introduced into the mother phase of the copper alloy at the period of performing the rolling (1). Moreover, a part of those dislocations becomes to function as a site for generating a heterogeneous core of the Ni 2 Si at the period of performing the aging treatment which is the next process. And then the same becomes an assistant for the Ni 2 Si to be formed as densely and as finely. Further, the higher the increased amount of the proof stress ( ⁇ C1) is enhanced due to performing the rolling (1), the further the strength of the aging becomes to be improved as well. And then therefore it is desirable for the same to be introduced.
  • each of the proof stress and the electrical conductivity is not to be sufficient.
  • the aging temperature is higher as excessively an Ni 2 Si becomes to be formed as coarsely. And hence it is not able to obtain the proof stress as sufficiently.
  • the rolling (2) is designed to be performed in order to obtain an improvement of the proof stress. And then in a case where the proof stress after performing the aging is sufficient it may be not necessary to introduce the rolling (2). In the meantime however, in a case where the increased amount of the proof stress ( ⁇ C2) due to performing the rolling (2) is higher as excessively the bending workability becomes to be deteriorated. And hence the same becomes to be a cause of a deterioration of the stress relaxation resistance. And then therefore ( ⁇ C2 / ⁇ total) is designed to be specified as more than or equal to zero but less than or equal to 0.35.
  • a total amount of the amounts of strain that are to be introduced into the material is higher as excessively the bending workability becomes to be deteriorated, and the stress relaxation resistance becomes to be deteriorated as well. And then therefore a standardized value of a total amount of strain (( ⁇ C1 + ⁇ C2) / ⁇ total) is designed to be specified as more than or equal to 0.1 but less than or equal to 0.45.
  • the low temperature annealing is designed to be performed in order to recover an extensibility, the bending workability and a threshold limit value of a spring with maintaining the strength as a certain amount of degrees.
  • the substantial temperature is higher as excessively a recrystallization becomes to be occurred. And hence the same becomes to be a cause of the decrease in the proof stress. And then therefore it is desirable to perform the annealing at the substantial temperature from 300°C to 600°C with an amount of time from five seconds to sixty seconds as a shorter period of time.
  • the copper alloy material of the Cu-Ni-Si system produced in accordance with the present invention becomes to be a copper alloy material, that has the strength as higher, and that is superior in the bending workability and in the stress relaxation resistance at the same time. And hence the same becomes to be suitable for such as a lead frame, a connector, a terminal material, a relay, a switch, or the like for a usage of an electrical apparatus and of an electronic equipment.
  • each of the copper alloy materials which is made use for the corresponding Examples and for the Comparative examples in accordance with the present invention is formed of a copper alloy (No. 1 to 30) which has a chemical composition (the balance is Cu) that is shown in the following Table 1, respectively. Moreover, each of those copper alloys is dissolved by making use of a high frequency melting furnace, and then the same is casted into an ingot thereafter to have a dimension of a thickness of 30 mm and a width of 120 mm and a length of 150 mm by making use of the DC method.
  • each of those ingots are heated up to approximately 950°C, and then the same is maintained at this temperature with an amount of time for one hour approximately, and then the hot rolling is performed thereafter for the same to have the thickness to be 12 mm, and then thereafter the cooling is performed for the same as promptly.
  • the oxide film layer is removed by cutting both faces with 1.5 mm for each. And then thereafter the same is processed to have a thickness to be from 0.16 mm to 0.50 mm by performing the cold rolling (dough rolling). And then at this time, regarding the Comparative example No. 27 because the amount of the Sn is more than the corresponding specified amount, a copper crack is occurred at the period of performing the cold rolling, and then the following processes are stopped. And then thereafter the solution heat treatment is performed for the same at a temperature from 800°C to 950°C with an amount of time for approximately thirty seconds. And then immediately thereafter the cooling is performed for the same with the cooling rate of faster than or equal to 15°C per second.
  • the rolling (1) is performed for each of the samples with various value of rolling rates (a draft: percent) that are individually lower than or equal to fifty percent. And then thereafter the aging treatment is performed in an ambient atmosphere of an inert gas at a temperature of approximately 500°C with an amount of time for approximately two hours. And then thereafter the rolling (2) which is a final plastic working is performed for the same with various value of rolling rates (the draft: percent), and hence each of the final plate thicknesses is adjusted to be 0.15 mm. And then each of the copper alloy plates are obtained which corresponds to each of the numbers, for which the low temperature annealing treatment is performed at a temperature from 400°C to 600°C with an amount of time for approximately thirty seconds after performing the rolling (2), wherein regarding each of the No.
  • various value of rolling rates a draft: percent
  • cross sections regarding the above mentioned grain of matrix size are individually defined here to be a cross section (A) which is parallel to the direction for the final cold rolling that is shown in FIG. 1 (the direction for the final plastic working), and to be a cross section (B) which is at right angles to the direction for the final cold rolling.
  • a diameter of a grain of matrix (1) is measured in the two directions of the direction as parallel to the direction for the final cold rolling and of the direction at right angles thereto.
  • a measured value as larger is defined here to be a major axis (a), and in the meantime, the other value as smaller is defined here to be a minor axis.
  • a diameter of a grain of matrix (2) is measured in the two directions of the direction as parallel to a normal direction for a rolled surface and of a direction is at right angles to the normal line for the rolled surface. And then a measured value as larger is defined here to be a major axis (b), and in the meantime the other value as smaller is defined here to be another minor axis.
  • a photograph of a structure of the above mentioned copper alloy plate is taken by making use of a scanning electron microscope with a magnification of 1000 times. And then a line segment is drawn with a length of 200 mm on the photograph. Still further, the number of the grain of matrix s (n) is counted, that are cut by the above mentioned line segment. And hence the same is evaluated by making use of the formula of (200 [mm] / (n) times 1000). Still further, in a case where the number of the grain of matrix s that are cut by the above mentioned line segment is less than twenty a photograph is taken with a magnification of 500 times.
  • the shape of the grain of matrix is shown with making use of a value (a / b) of which the major axis (a) of the above mentioned cross section (A) is divided by the major axis (b) of the above mentioned cross section (B).
  • the electrical conductivity is evaluated with being pursuant to the JIS-H0505.
  • the electrical conductivity 25% IACS (international annealed copper standard) of an electrical conductivity of a high strength beryllium copper (an alloy as pursuant to the JIS-C1720) is set to be a standard.
  • a value which is higher than or equal to 30% IACS is defined here to be EXCELLENT, and in the meantime, a value which is higher than 25% IACS but lower than 30% IACS is defined here to be GOOD, and in the meantime, a value which is lower than or equal to 25% IACS is defined here to be NO GOOD.
  • a treatment device for bending to 90 degrees is made use by which a bended radius at an inner side becomes to be 0.15 mm. And then a (W) bending test of 90 degrees is performed by which a ratio between the bended radius and the plate thickness (R / t) becomes to be 1.0. And hence a judgment is performed, in which for a sample in which no crack becomes to be occurred at all at a bended part is defined here to be GOOD, and for a sample in which any crack becomes to be occurred is defined here to be NO GOOD.
  • the cantilever block method which is the standard specification in accordance with Electronic Material Association of Japan (EMAS-3003). And then a load stress is set up for a maximum stress on a surface to become eighty percent of the proof stress. Moreover, a sample is maintained in a constant temperature bath at approximately 150°C with an amount of time for 1000 hours approximately. And then a stress relaxation rate (S. R. R. (%)) is evaluated.
  • a sample of which the stress relaxation rate is lower than or equal to 10 percent is defined here to be EXCELLENT, and in the meantime, a sample of which the same is higher than 10 percent but lower than 15 percent is defined here to be GOOD, and in the meantime, a sample of which the same is higher than or equal to 15 percent is defined here to be NO GOOD.
  • each of the copper alloys has the strength to be higher, has the bending workability to be good, and the same is superior in the stress relaxation resistance, respectively. Moreover, the anisotropy of the same is smaller, respectively.
  • the copper alloy material produced by the method of the present invention becomes to be desirable for a material of such as a terminal, a connector, a switch, or the like.
  • the method for producing the copper alloy sheet in accordance with the present invention becomes to be desirable as the method for producing the above mentioned copper alloy material.

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EP08843774.4A 2007-11-01 2008-10-31 Method for producing a copper alloy sheet excellent in strength, bending workability and stress relaxation resistance Not-in-force EP2221390B1 (en)

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JP2007285605 2007-11-01
PCT/JP2008/069977 WO2009057788A1 (ja) 2007-11-01 2008-10-31 強度、曲げ加工性、耐応力緩和特性に優れる銅合金材およびその製造方法

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EP2221390A1 EP2221390A1 (en) 2010-08-25
EP2221390A4 EP2221390A4 (en) 2012-06-27
EP2221390B1 true EP2221390B1 (en) 2014-06-18

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US (1) US20100269963A1 (ja)
EP (1) EP2221390B1 (ja)
JP (1) JP4851596B2 (ja)
CN (1) CN101842506B (ja)
WO (1) WO2009057788A1 (ja)

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JP5522692B2 (ja) * 2011-02-16 2014-06-18 株式会社日本製鋼所 高強度銅合金鍛造材
JP6265582B2 (ja) * 2011-12-22 2018-01-24 古河電気工業株式会社 銅合金材およびその製造方法
JP6210563B2 (ja) * 2015-04-10 2017-10-11 古河電気工業株式会社 ばね用銅合金線材、該ばね用銅合金線材の製造方法、並びにばね、該ばねの製造方法
CN107636179B (zh) * 2015-09-09 2020-06-16 三菱综合材料株式会社 电子电气设备用铜合金、电子电气设备用铜合金塑性加工材、电子电气设备用组件、端子及汇流条
WO2017043551A1 (ja) 2015-09-09 2017-03-16 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金塑性加工材、電子・電気機器用部品、端子、及び、バスバー
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CN105349805A (zh) * 2015-11-03 2016-02-24 虞惠财 一种晶体细致铜合金生产方法
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JP6780187B2 (ja) 2018-03-30 2020-11-04 三菱マテリアル株式会社 電子・電気機器用銅合金、電子・電気機器用銅合金板条材、電子・電気機器用部品、端子、及び、バスバー
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WO2009057788A1 (ja) 2009-05-07
JP4851596B2 (ja) 2012-01-11
CN101842506B (zh) 2012-08-22
US20100269963A1 (en) 2010-10-28
EP2221390A4 (en) 2012-06-27
CN101842506A (zh) 2010-09-22
JPWO2009057788A1 (ja) 2011-03-10

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