EP2220684A1 - Empilement de lentilles encapsulées - Google Patents

Empilement de lentilles encapsulées

Info

Publication number
EP2220684A1
EP2220684A1 EP08855609A EP08855609A EP2220684A1 EP 2220684 A1 EP2220684 A1 EP 2220684A1 EP 08855609 A EP08855609 A EP 08855609A EP 08855609 A EP08855609 A EP 08855609A EP 2220684 A1 EP2220684 A1 EP 2220684A1
Authority
EP
European Patent Office
Prior art keywords
substrates
substrate
optical elements
cavities
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP08855609A
Other languages
German (de)
English (en)
Inventor
Markus Rossi
Hartmut Rudmann
Ville Kettunen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Sensors Singapore Pte Ltd
Original Assignee
Heptagon Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heptagon Oy filed Critical Heptagon Oy
Publication of EP2220684A1 publication Critical patent/EP2220684A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Definitions

  • the invention is in the field of manufacturing integrated optical devices with two or more optical elements, e.g. refractive and/or diffractive lenses, in a well defined spatial arrangement on wafer scale by means of a replication process.
  • integrated optical devices are, for example, camera devices, optics for camera devices, or collimating optics for flash lights, especially for camera mobile phones.
  • the invention relates to a wafer scale package comprising two or more substrates (wafers) that are stacked in an axial direction and have a plurality of replicated optical elements.
  • the invention further relates to an optical device, e.g. a camera or a collimating optics therefor, comprising two or more replicated optical elements and optionally also electro-optical components, to a method for production of such a wafer scale package, and to a method of manufacturing a plurality of optical elements.
  • Replication techniques include injection molding, roller hot embossing, flat-bed hot embossing, UV embossing.
  • the surface topology of a master structure is replicated into a thin film of a UV-curable replication material such as an UV curable epoxy resin on top of a substrate.
  • the replicated surface topology can be a refractive or a diffractive optically effective structure, or a combination of both.
  • a replication tool bearing a plurality of replication sections that are a negative copy of the optical structures to be manufactured is prepared, e.g. from a master. The tool is then used to UV-emboss the epoxy resin.
  • the master can be a lithographically fabricated structure in fused silica or silicon, a laser or e-beam written structure, a diamond turned structure or any other type of structure.
  • the master may also be a submaster produced in a multi stage generation process by replication from a (super) master.
  • a wafer or substrate in the meaning used in this text is a disc or a rectangular plate or a plate of any other shape of any dimensionally stable, often transparent material.
  • the diameter of a wafer disk is typically between 5 cm and 40 cm, for example between 10 cm and 31 cm. Often it is cylindrical with a diameter of either 2, 4, 6, 8 or 12 inches, one inch being about 2,54 cm.
  • the wafer thickness is for example between 0,2 mm and 10 mm, typically between 0,4 mm and 6 mm.
  • the wafer is at least partially transparent. Otherwise, the wafer can be nontransparent as well. It can also be a wafer bearing electro-optical components, e.g. a silicon or GaAs or other semiconductor based wafer; it may for example be a CMOS wafer or a wafer carrying CCD arrays or an array of Position Sensitive Detectors, a wafer carrying light sources such as LEDs or VECSELs, etc..
  • electro-optical components e.g. a silicon or GaAs or other semiconductor based wafer; it may for example be a CMOS wafer or a wafer carrying CCD arrays or an array of Position Sensitive Detectors, a wafer carrying light sources such as LEDs or VECSELs, etc.
  • the wafer-scale replication allows the fabrication of several hundreds of generally identical devices with a single step, e.g. a single or double-sided UV-embossing process.
  • the subsequent separating (dicing) step of the wafer then yields the individual optical devices.
  • Integrated optical devices include functional elements, at least one of which is an optical element, stacked together along the general direction of light propagation.
  • Such optical devices can be manufactured by stacking wafers that comprise functional, e.g. optical, elements in a well defined spatial arrangement on the wafer.
  • a wafer scale package comprises at least two wafers that are stacked along the axis corresponding to the direction of the smallest wafer dimension (axial direction) and attached to one another. At least one of the wafers bears replicated optical elements, and the other can comprise or can be intended to receive optical elements or other functional elements, such as electro-optical elements.
  • the wafer stack thus comprises a plurality of generally identical integrated optical devices arranged side by side. Precise positioning of the optical/functional elements on the different wafers, but also within the same wafer, is essential for the perfo ⁇ nance of the individual integrated devices. Subsequent dicing of the stack then yields the individual integrated optical devices.
  • spacer means, e.g. a plurality of separated spacers or an interconnected spacer matrix as disclosed in US 2003/0010431 or WO 2004/027880, the wafers can be spaced from one another, and optical elements can also be arranged between the wafers on a wafer surface facing another wafer.
  • Wafer scale packages as presently known generally comprise two or more substrates that have optical elements arranged on both of their main surfaces. Such substrates are also designated as double-sided wafers/substrates.
  • the optical elements are, for example, convex or concave structures, each forming a classical refractive (half- )lens.
  • each pair of such structures/half-lenses on both sides of the wafer can be treated as a single classical lens with two convex/concave surfaces, for example.
  • the aim is to keep the optical design as simple as possible by reducing the number of lenses and to keep manufacture as simple and well-priced as possible by reducing the number of substrates.
  • all designs actually employed in integrated devices use double-sided wafers, wherein empty surfaces are generally avoided.
  • FIG. 7 An example for an optical device 1 manufactured from such a package according to the prior art is shown in Fig. 7. It comprises two (double-sided) substrate portions 2,
  • Each pair 4' of optical elements 4 acts as single classical convex lens.
  • the substrate portions 2, 3 are stacked in axial direction Z and spaced by spacer means 5.
  • the finished stack is placed on top of a further substrate 6, e.g. a CMOS wafer.
  • further spacer means 7 are arranged in between the bottom substrate 3 and the further substrate 6.
  • the freely accessible optical elements on the end faces of the package are subject to damage or contamination by dust or an adhesive, especially during the dicing step and/or when further components like a camera or a flash light or other (optoelectronic components are attached to the wafer scale package or the individual optical device.
  • Protective hoods or cover plates or additional spacer means as described with respect to Fig. 7 may thus be needed. Such hoods or cover plates or spacers make the design of the module more complicated and costly. Especially hoods may also adversely affect the optical properties of the device.
  • Another problem is associated with the manufacture of double-sided wafers in a replication process: hi a double sided substrate with optical structures on both main surfaces, it is necessary that the optical structures on both sides are precisely aligned with respect to one another. Consequently, the substrate has to be precisely aligned two times with respect to the replication tool, in a first step for replication of the structures on one surface and in a second step for replication of the structures on the second surface. Alignment in the second step is especially difficult, because of the structures already present on the other surface.
  • the substrates need a certain thickness to ensure stability during replication. Especially when replicating on the second surface, the substrate cannot be supported over its entire area due to the structures on the first surface.
  • optical structures on a double sided substrate can be considered as a single
  • This lens (double sided) lens.
  • the optical parameters of this lens are influenced by the thickness of the substrate, and this thickness generally cannot be changed. Further, an aperture stop of common packages or devices, if any, normally coincides with the plane of one of the lenses. This is a restriction of the design possibilities and may also lead to unwanted collection of stray light into the device.
  • a wafer scale package having the features of claim 1, an optical device having the features of claim 11, a method for producing a wafer scale package with the features of claim 16, and a method of producing a plurality of optical devices from such a package according to claim 23.
  • Preferred embodiments are described in the dependent claims and the description and are shown in the figures.
  • the wafer scale package according to the invention comprises at least two outer substrates and optionally one or more intermediate substrates stacked in an axial direction (perpendicular to the main surfaces of the substrates).
  • a plurality of preferably closed cavities is arranged in between the substrates, hi case of two substrates, there is one layer or group of cavities, in case of n substrates, there are generally n-1 or less groups or layers of cavities.
  • Replicated optical elements e.g. classical convex/concave lenses or diffractive/refractive microstructures, attached to the inner surfaces of the substrates, are arranged within the cavities.
  • At least one pair of neighboring substrates of the package has optical elements on each of the surfaces which face one another, hi other words, each cavity located in between this pair of substrates comprises two optical elements. Preferably, these optical elements are axially aligned.
  • the minimum wafer stack consists of two single sided substrates, i.e. substrates with replicated optical elements only on one of their main surfaces.
  • the substrates are arranged such that the optical elements face one another, and the distance between them is defined by spacer means which may be a separate element or an integral part of one or both of the substrates.
  • the outer surfaces of the substrates, i.e. the end faces of the package/stack do not comprise any replicated optical elements.
  • This intermediate substrate is preferably, but not necessarily double sided, i.e. comprises optical elements on both of its surfaces.
  • the top substrate is typically a transparent wafer with optical elements on its inner surface.
  • the bottom substrate may be a transparent substrate with or without optical elements, or it may be a substrate carrying an array of electro-optical components, in particular imaging elements (cameras, CCD, Position Sensitive Detectors) or light sources (LEDs or VECSELs etc.); for this purpose, silicon or GaAs or other semiconductor based (e.g. CMOS) wafers can be used.
  • imaging elements cameras, CCD, Position Sensitive Detectors
  • silicon or GaAs or other semiconductor based (e.g. CMOS) wafers can be used.
  • the outer surfaces of the outer substrates and thus the end faces of the package and the optical device do not comprise any replicated optical elements.
  • no replicated optical elements are exposed to the exterior.
  • All optical elements are arranged in between the outer surfaces of the outer substrates, as seen in the axial direction.
  • the end faces of the wafer stack are generally unstructured and planar. They may, however, contain apertures and/or alignment marks that leave the generally planar surface unchanged. They may also contain a coating such as an IR cutoff filter or an anti reflection coating. Such elements may be applied at a later stage after replication and stacking is completed.
  • the invention uses a completely different approach than in state-of-the-art designs as discussed in the introduction:
  • the lens of conventional designs - a double sided lens formed by optical structures on both surfaces of a transparent substrate (double sided substrate) - is split in two "halves" by having two substrates with optical structures on only one surface and a planar other surface.
  • the optical elements are shaped and arranged in such a way that the same optical performance as with the double sided lens is achieved. As there are no limitations with respect to the shape, thickness and distance of the optical elements, an even better performance can be achieved.
  • This splitting generally concerns the outermost lens as seen in the axial direction. Intermediate substrates, if present, may be double-sided.
  • the invention makes possible that in integrated optical devices especially no lens is present on the outermost surface, i.e. the surface that is most remote from the active (e.g. CMOS) device.
  • the outer substrates are single-sided or do not comprise any optical elements at all, e.g. in case of a CMOS wafer as bottom substrate of the stack.
  • the invention dispenses with an especially shaped refractive (or possibly difrractive) surface on the outermost layer that according to the state of the art was considered essential for achieving the best performance.
  • the inventive wafer scale package ensures a well defined spatial arrangement of the replicated optical elements and, optionally, by means of integrating a semiconductor substrate into the package further electro-optical components, as well as the simultaneous production of a plurality of identical optical devices with very small dimensions and at low cost. All optical elements are well protected during manufacture and handling, especially during the step of dicing the package into individual optical devices.
  • the cavities are closed such that all optical elements are fully encapsulated by the substrate and/or the spacer means also in lateral direction.
  • This can be achieved by using spacer means or recesses having an appropriate shape, e.g. through-holes in an otherwise continuous substrate.
  • the cavities are formed by connecting two neighboring substrates via spacer means, e.g. a plurality of separated spacers or an interconnected spacer matrix as disclosed in US 2003/0010431 or WO 2004/027880, and/or by using one or more preshaped substrates with a plurality of recesses.
  • spacer means e.g. a plurality of separated spacers or an interconnected spacer matrix as disclosed in US 2003/0010431 or WO 2004/027880, and/or by using one or more preshaped substrates with a plurality of recesses.
  • the claimed optical device may be manufactured by dicing the wafer scale package described above. It is thus suited for mass production. It comprises at least two outer substrate portions stacked in an axial direction with at least one preferably closed cavity in between the substrate portions. The cavity is formed e.g. by using spacer means or a preshaped substrate, as described above.
  • the device further comprises two optical elements, arranged in the at least one cavity.
  • the optical device comprises two essentially planar end faces that are constituted by outer surfaces of the outer substrate portions. All optical elements are thus well protected.
  • the optical device is made of a wafer scale package with three or more substrates and thus comprises at least one intermediate substrate portion arranged in between the outer substrate portions, and two or more preferably axially aligned cavities spaced from one another by the intermediate substrate portion(s).
  • the intermediate substrate portion(s) is/are preferably double sided, i.e. comprise(s) optical elements on both surfaces, while the outer substrate portions are single sided.
  • the bottom substrate may be a substrate with electro-optical components, like an imaging device or light sources, on its inner surface. These components are also arranged within a preferably closed cavity and thus well protected.
  • the optical device may be a camera with integrated optics which can be mass produced at low cost, e.g. for the use in mobile phones.
  • the method for producing a wafer scale package comprises the following steps: Providing at least two substrates; providing said at least two substrates with a plurality of optical elements by means of a replication technique; stacking the at least two substrates in an axial direction; and connecting the at least two substrates in such a way that cavities enclosing the optical elements are formed, wherein end faces of the package are essentially planar and are constituted by outer surfaces of outer substrates of the package.
  • the method for producing an optical element comprises the steps of the method for producing a wafer scale package and further the step of dicing the package along planes running in axial direction in order to separate the package into individual optical elements.
  • dicing takes place along planes running through the spacer means such that the cavities in the individual devices remain closed and the optical elements arranged therein fully encapsulated.
  • the aperture stop is always in same plane with one of the lenses.
  • the encapsulated wafer stack according to the invention has two "free" end faces and thus allows the aperture to be also in a different plane, e.g. in either of the flat end surfaces. This leads to more design flexibility.
  • the encapsulated stack is less sensitive to stray-light since there is no lens before the aperture to ,,collect" also unwanted light into it, leading to an improved performance.
  • the refraction in the fiat (top) surface can be to some extent utilized, while in case of normal design the refraction at the cover glass is completely fixed by the need to match the chief ray angles at the sensor.
  • the order of surfaces is beneficial with the encapsulated case. This would be similar effect than e.g. the difference seen in focusing performance of a plano-convex singlet depending on the lens orientation.
  • Stack manufacturing & module assembly As discussed above, the manufacture of double sided substrates is complicated because the substrate has to be precisely aligned with respect to the replication tool. The invention allows to reduce the number of aligned double sided replications, and thus simplifies fabrication of the device.
  • the lenses are preferably fully encapsulated, no foreign materials or chemicals can get to the lenses.
  • the wafer package and the optical device are thus less sensitive to assembly conditions. Also, standard cleaning processes can be used in case the top or bottom end faces are dirty.
  • the end faces of the package are flat, which allows easier handling during dicing and bonding.
  • the packages and devices are also easier to handle, especially with fully automated systems.
  • the encapsulation of the lenses offers added reliability in form of protection against environmental conditions. This means that the range of suitable replication materials and coatings etc. is larger.
  • the encapsulation offers added mechanical protection of the replicated optical elements.
  • the package may thus be even suited for insert molding.
  • CMOS cameras including CMOS cameras for mobile phones.
  • one of the flat and unstructured end faces could be directly used as the cover window of the camera, of a module within the camera, or even of the phone cover instead of a separate cover window. This leads to both simplified assembly and lower material cost.
  • Fig. 1 shows schematically a wafer scale package with two substrates spaced by spacer means
  • Fig. 2 shows schematically an optical device manufactured by dicing a package as shown in Fig. 1 ;
  • Fig. 3 shows schematically a wafer scale package with two substrates, one of them pre-shaped
  • Fig. 4 shows schematically a wafer scale package with three substrates spaced by spacer means
  • Fig. 5 shows schematically an optical device manufactured by dicing a package as shown in Fig. 4, attached to a further wafer, e.g. CMOS wafer;
  • Fig. 6 shows an optical device similar to that of Fig. 5 with a CMOS wafer as bottom substrate;
  • Fig. 7 shows schematically an optical device according to the prior art.
  • FIG. 1 shows purely schematically an embodiment of a wafer scale package according to the invention 10 with two planar outer substrates 20, 30, which are preferably standard wafers, and a plurality of cavities 40 in between the substrates 20, 30.
  • the outer substrates 20, 30 are stacked in a direction z normal to their main surfaces 22, 24, 32, 34, which is also designated as axial direction.
  • the substrates 20, 30 are axially spaced by spacer means 50.
  • the axial walls 42, 44, i.e. in Fig. 1 the bottom and top walls, of the cavities 40 are constituted by portions of the inner surfaces 24, 34 of the two outer substrates 20, 30.
  • the lateral walls 46, 48 of the cavities 40 are constituted by the corresponding lateral walls 54 of the spacer means 50.
  • the spacer means 50 are constituted by a flat substrate with a plurality of through-holes (spacer matrix), for example, or by individual spacers.
  • Optical elements 62, 64 are attached to the inner surfaces 24, 34 of the substrates 20, 30 at places corresponding to the locations of the cavities 40, and more particular, at places corresponding to the bottom and top walls 42, 44 of the cavities 40.
  • the outer surfaces 22, 32 of the top and bottom substrate 20, 30 do not comprise optical elements. Consequently, each cavity 40 houses two optical elements 62, 64 such that they are encapsulated as seen in the axial direction.
  • the spacer means are shaped such that the optical elements 62, 64 are also encapsulated as seen in the lateral direction, such that all optical elements 62, 64 present are fully encapsulated and protected.
  • the optical elements 62 attached to the top substrate 20 are aligned with respect to the optical elements 64 from the bottom substrate 30 in the same cavity 40; other embodiments include also off-axis arrangements.
  • the package 10 shown in Fig. 1 may be manufactured by providing two standard substrates 20, 30. On each of the substrates 20, 30, optical elements 62, 64 are manufactured by means of a replication technique. In particular, portions of replication material are applied to the substrate on locations corresponding to the locations of the optical elements 62, 64 to be manufactured, and the optical elements are then formed by bringing a replication tool into close proximity with the substrate. As an alternative, the replication material may be applied directly onto the replication tool.
  • the replication tool has structural features corresponding to the outer shape of the optical element. Hardening the replication material with the structure of the replication tool imprinted then yields the optical elements.
  • the package 10 shown in Fig. 1 is an alternative solution to a single double sided wafer with optical elements on both main surfaces. Alignment problems during the replication of the optical elements on one and the same wafer are avoided, as single sided wafers are used.
  • the encapsulated stack according to the invention comprises more wafers than the known double sided solution. However, it is not necessarily thicker, as the wafers can be supported by a planar support during replication and can thus generally be made thinner than double sided wafers that need to have a certain stability for replication on both sides.
  • Individual optical devices 100 are manufactured by dicing the wafer scale package 10 along axial planes P.
  • An example for an optical device 100 manufactured from a package as shown in Fig. 1 is illustrated in Fig. 2. It comprises outer substrate portions 20', 30' corresponding to the outer substrates 20, 30 of the package 10.
  • the optical elements 62, 64 remain fully encapsulated by the top and bottom substrate portions 20', 30' and the spacer means 50 also in the individual optical device 100.
  • the individual optical device 100 may optionally be attached to a further substrate 80, e.g. a CMOS wafer carrying electronic components like an optical sensor, or a cover glass in case of a packaged sensor. Since the bottom end face 32' of the bottom substrate portion 30' is planar, attachment of the further substrate 80 is particularly easy, and there is also no danger of exposing the optical elements 62, 64 to any substances that might damage them when attaching the further substrate 80.
  • the further substrate may also be attached to the wafer package 10 prior to the dicing step, e.g. as disclosed in WO 2005/083789 which is incorporated herein by reference. This further simplifies manufacture.
  • An aperture 70 may be attached to or manufactured on the top end face 22' of the optical device 100 or already on the top end face 22 of the package 10. As shown in Fig. 2, the aperture 70 lies in a different plane than both optical elements 62, 64. This allows for more freedom of design.
  • the wafer scale package 110 comprises two outer substrates 120, 130.
  • the top substrate 120 is a standard substrate with planar surfaces 122, 124.
  • the bottom substrate 130 is pre shaped and comprises a planar outer surface 132 and an inner surface 134 that is structured by a plurality of recesses 150 (or having the spacer means as an integral part of the bottom substrate 130).
  • the recesses 150 are shaped such that a plurality of cavities 140 is formed when connecting the top substrate 120 directly to the bottom substrate 130.
  • a plurality of optical elements 162 is attached to the inner surface 124 of the top substrate 120 at locations corresponding to those of the cavities 140 and the recesses 150, respectively. Furthermore, optical elements 164 are arranged at the bottoms of the recesses 150 of the pre shaped substrate 130 in axial alignment with the optical elements 162 on the top substrate 120. Like in Fig. 1, all optical element 162, 164 are fully encapsulated, and the end faces are planar and without optical elements.
  • Fig. 4 shows a further embodiment 210 of the invention with two outer substrates 220, 230, and one intermediate substrate 290, stacked in axial direction Z.
  • Two layers of cavities 240, 240' are arranged between the top substrate 220 and the intermediate substrate 290, and the intermediate substrate 290 and the bottom substrate 230, respectively.
  • the cavities 240, 240' are formed by means of two sets of spacer means 250, 250' arranged between the respective substrates.
  • the top and bottom substrates 220, 230 are single sided and comprise optical elements 262, 264 only on their inner surfaces 224, 234, while the outer surfaces 222, 232 and thus the end faces of the stack 210 are planar and without optical elements.
  • the intermediate substrate 290 is double sided and comprises optical elements 266, 268 on both of its main surfaces 292, 294.
  • the cavities 240, 240' of the two layers are axially aligned with respect to one another. Within the cavities, the optical elements are also axially aligned; off-axis arrangements (not shown) are possible. Again, all optical elements are fully encapsulated.
  • the individual optical devices 2100 are produced by dicing along the planes P.
  • Fig. 5 shows an integrated optical device 2100 manufactured by dicing from a stack 210 as shown in Fig. 4.
  • the top and bottom outer substrate portions 220', 230' and intermediate substrate portion 290 ' are stacked in axial direction Z and spaced by spacers 252, 252', i.e. portions of the spacer means 250, 250' from Fig. 4, such that two cavities 240, 240' are formed.
  • the cavities 240, 240' house the optical elements 262, 266, 264, 268 described in connection with Fig. 4.
  • the optical elements 262, 266, 264, 268 may be convex or concave lenses, or may comprise micro-optical structures that represent a predetermined optical function.
  • the end faces 222', 232' do not comprise replicated optical structures, however, they may receive some sort of finishing treatment, e.g. polishing, attachment of apertures, attachment of a further substrate 280, like a CMOS wafer or a cover class.
  • the further substrate 280 can be attached prior to or after dicing.
  • Fig. 6 shows an optical device similar to that of Fig. 5.
  • the bottom outer substrate portion 230' is constituted by a portion of a CMOS or other semiconductor wafer.
  • This portion 230' preferably bears electro-optical components, like an imaging element.
  • the bottom substrate 230 here e.g. the CMOS wafer, is attached to the stack prior to dicing.
  • the optical element 268 in the lower cavity 264 as well as any electro-optical components on the bottom substrate portion 230' are thus well protected by the lateral walls of the cavity (the spacer means) and the adjoining substrate portions 230', 290'.

Abstract

L'invention concerne un boîtier à l'échelle d'une tranche comportant au moins deux substrats (20', 30') (tranches) qui sont empilés dans une direction axiale et une pluralité d'éléments optiques répliqués (62, 64). L'invention concerne en outre un dispositif optique (100) comportant un ou plusieurs éléments optiques, et un procédé de fabrication d'un tel boîtier à l'échelle d'une tranche. Le boîtier à l'échelle d'une tranche et le dispositif comportent une ou plusieurs cavités qui reçoivent les éléments optiques, alors que les faces d'extrémité du boîtier ou du dispositif sont planes et n'ont pas d'éléments optiques répliqués sur elles. L'invention permet de réduire le nombre de substrats double face et présente des avantages au niveau de la conception et de la fabrication du dispositif optique.
EP08855609A 2007-11-27 2008-11-18 Empilement de lentilles encapsulées Ceased EP2220684A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US99045107P 2007-11-27 2007-11-27
PCT/CH2008/000487 WO2009067832A1 (fr) 2007-11-27 2008-11-18 Empilement de lentilles encapsulées

Publications (1)

Publication Number Publication Date
EP2220684A1 true EP2220684A1 (fr) 2010-08-25

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP08855609A Ceased EP2220684A1 (fr) 2007-11-27 2008-11-18 Empilement de lentilles encapsulées

Country Status (7)

Country Link
US (1) US20110031510A1 (fr)
EP (1) EP2220684A1 (fr)
JP (1) JP5580207B2 (fr)
KR (1) KR101575915B1 (fr)
CN (1) CN101990711B (fr)
TW (1) TWI502693B (fr)
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CN101990711A (zh) 2011-03-23
TW200929456A (en) 2009-07-01
KR101575915B1 (ko) 2015-12-08
JP5580207B2 (ja) 2014-08-27
JP2011507219A (ja) 2011-03-03
CN101990711B (zh) 2017-05-17
US20110031510A1 (en) 2011-02-10
TWI502693B (zh) 2015-10-01
WO2009067832A1 (fr) 2009-06-04
KR20100087755A (ko) 2010-08-05

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