CN115023631A - 制造光学结构 - Google Patents
制造光学结构 Download PDFInfo
- Publication number
- CN115023631A CN115023631A CN202180011015.6A CN202180011015A CN115023631A CN 115023631 A CN115023631 A CN 115023631A CN 202180011015 A CN202180011015 A CN 202180011015A CN 115023631 A CN115023631 A CN 115023631A
- Authority
- CN
- China
- Prior art keywords
- substrate
- spacer
- optical
- optical element
- liquid photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 125
- 125000006850 spacer group Chemical group 0.000 claims abstract description 119
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 68
- 239000007788 liquid Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 47
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 18
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 10
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 10
- -1 Polydimethylsiloxane Polymers 0.000 claims description 4
- 239000006117 anti-reflective coating Substances 0.000 claims description 3
- 230000010076 replication Effects 0.000 description 12
- 239000011521 glass Substances 0.000 description 7
- 230000005693 optoelectronics Effects 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
- B29D11/00307—Producing lens wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00432—Auxiliary operations, e.g. machines for filling the moulds
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/005—Diaphragms
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B9/00—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or -
- G02B9/02—Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or - having one + component only
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Ophthalmology & Optometry (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB2009877.8 | 2020-06-29 | ||
GBGB2009877.8A GB202009877D0 (en) | 2020-06-29 | 2020-06-29 | Manufacturing an optical structure |
PCT/SG2021/050369 WO2022005396A1 (en) | 2020-06-29 | 2021-06-24 | Manufacturing an optical structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115023631A true CN115023631A (zh) | 2022-09-06 |
Family
ID=71949700
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202180011015.6A Pending CN115023631A (zh) | 2020-06-29 | 2021-06-24 | 制造光学结构 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230241848A1 (zh) |
CN (1) | CN115023631A (zh) |
DE (1) | DE112021003497T5 (zh) |
GB (1) | GB202009877D0 (zh) |
WO (1) | WO2022005396A1 (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110037887A1 (en) * | 2009-08-13 | 2011-02-17 | Samsung Electronics Co., Ltd. | Wafer-level lens module and image pickup device including the same |
CN102279506A (zh) * | 2010-05-27 | 2011-12-14 | 采钰科技股份有限公司 | 照相模块及其制造方法 |
CN105531829A (zh) * | 2013-09-10 | 2016-04-27 | 赫普塔冈微光有限公司 | 紧凑光电模块以及用于这样的模块的制造方法 |
CN115867868A (zh) * | 2020-08-27 | 2023-03-28 | ams传感器新加坡私人有限公司 | 制造光学元件 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7768628B2 (en) * | 2006-10-12 | 2010-08-03 | Hewlett-Packard Development Company, L.P. | Contact lithography apparatus and method |
NL1034857C2 (nl) * | 2007-12-21 | 2009-06-23 | Anteryon B V | Optisch systeem. |
US7728399B2 (en) * | 2008-07-22 | 2010-06-01 | National Semiconductor Corporation | Molded optical package with fiber coupling feature |
KR101651157B1 (ko) * | 2009-08-13 | 2016-08-25 | 후지필름 가부시키가이샤 | 웨이퍼 레벨 렌즈, 웨이퍼 레벨 렌즈의 제조 방법, 및 촬상 유닛 |
JP2011248159A (ja) * | 2010-05-28 | 2011-12-08 | Sony Corp | 撮像装置、撮像システム、撮像装置の制御方法およびプログラム |
-
2020
- 2020-06-29 GB GBGB2009877.8A patent/GB202009877D0/en not_active Ceased
-
2021
- 2021-06-24 WO PCT/SG2021/050369 patent/WO2022005396A1/en active Application Filing
- 2021-06-24 DE DE112021003497.9T patent/DE112021003497T5/de active Pending
- 2021-06-24 US US18/003,518 patent/US20230241848A1/en active Pending
- 2021-06-24 CN CN202180011015.6A patent/CN115023631A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110037887A1 (en) * | 2009-08-13 | 2011-02-17 | Samsung Electronics Co., Ltd. | Wafer-level lens module and image pickup device including the same |
CN102279506A (zh) * | 2010-05-27 | 2011-12-14 | 采钰科技股份有限公司 | 照相模块及其制造方法 |
CN105531829A (zh) * | 2013-09-10 | 2016-04-27 | 赫普塔冈微光有限公司 | 紧凑光电模块以及用于这样的模块的制造方法 |
CN115867868A (zh) * | 2020-08-27 | 2023-03-28 | ams传感器新加坡私人有限公司 | 制造光学元件 |
Also Published As
Publication number | Publication date |
---|---|
GB202009877D0 (en) | 2020-08-12 |
WO2022005396A1 (en) | 2022-01-06 |
US20230241848A1 (en) | 2023-08-03 |
DE112021003497T5 (de) | 2023-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20241015 Address after: Shinka ha Applicant after: Juguang Singapore Ltd. Country or region after: Singapore Address before: Singapore City Applicant before: AMS sensor Asia Pte. Ltd. Country or region before: Singapore |
|
TA01 | Transfer of patent application right | ||
CB02 | Change of applicant information |
Country or region after: Singapore Address after: Room # 06-02-03, 7000 Road 5, Singapore (569877) Applicant after: HEPTAGON Photon Co.,Ltd. Address before: Shinka ha Applicant before: Juguang Singapore Ltd. Country or region before: Singapore |
|
CB02 | Change of applicant information |