EP2195607A1 - Procede de test optique - Google Patents

Procede de test optique

Info

Publication number
EP2195607A1
EP2195607A1 EP07833121A EP07833121A EP2195607A1 EP 2195607 A1 EP2195607 A1 EP 2195607A1 EP 07833121 A EP07833121 A EP 07833121A EP 07833121 A EP07833121 A EP 07833121A EP 2195607 A1 EP2195607 A1 EP 2195607A1
Authority
EP
European Patent Office
Prior art keywords
image
target object
test method
regular reflection
optical test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07833121A
Other languages
German (de)
English (en)
Inventor
Ssang-Geun Im
Sang-Yun Lee
Mingu Kang
Seok-Joon Jang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intekplus Co Ltd
Original Assignee
Intekplus Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intekplus Co Ltd filed Critical Intekplus Co Ltd
Publication of EP2195607A1 publication Critical patent/EP2195607A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G01B11/2513Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object with several lines being projected in more than one direction, e.g. grids, patterns

Definitions

  • the present invention relates to an optical test method, and more particularly to an optical test method for acquiring not only an image having a low regular reflection rate on a regular reflection surface, but also a peripheral image on which a peripheral lattice plane in the vicinity of a regular reflection surface is clearly seen, employing the acquired images, and improving the accuracy of a target image to be measured, so that it can solve the problem of deteriorating the image accuracy on the regular reflection surface including several steps.
  • a variety of items of the electronic components should be measured, for example, the size, shape, surface-roughness precision.
  • an optical method for measuring a three-dimensional shape which configures a reference pattern for an optical signal generated from the light source, applies the optical signal to a target object to be measured, compares the optical signal modified by the shape of the target object with the reference pattern, and measures the shape of the target object to be measured, so that the three-dimensional shape of the target object is measured.
  • the above-mentioned optical method for measuring the three-dimensional shape requires a high speed, a high precision, and non-contact measurement.
  • a representative example of the above-mentioned optical method for measuring the three-dimensional shape is an optical method for measuring a three-dimensional shape using a moire pattern.
  • the moire pattern is indicative of an interference pattern formed when at least two periodic patterns overlap with each other.
  • the moire scheme is classified into a shadow moire scheme and a projection moire scheme according to methods for forming the moire pattern.
  • the projection moire scheme applies an optical signal or light beam to a target object to be measured, so that it applies a lattice pattern on the target object.
  • the projection moire scheme allows a lattice image modified by the shape of the target object to overlap with a reference lattice having the same pitch as that of the lattice providing the lattice image, so that it can acquire the moire pattern .
  • the above-mentioned optical method for measuring the three-dimensional shape has a disadvantage in that ib has difficulty in accurately acquiring the image of a regular reflection surface by the regular reflection of a three-dimensional surface.
  • the BGA package in the case of testing the BGA package, the BGA package generates serious reflection on the central rounding surface of the ball, so that the above-mentioned optical measuring method has difficulty in accurately acquiring the image on the central rounding surface.
  • the present invention has been made in view of the above problems, and it is an object of the invention to provide an optical test method for acquiring a first image in which an illumination saturation area on a 3D surface having a high regular reflection rate is decreased, acquiring a second image in which a lattice image becomes prominent on a peripheral area of the 3D surface, mixing the first image and the second image, and comparing the mixed resultant image with a reference image to determine the presence or absence of a defect in a target object on which the 3D shape is formed, thereby acquiring an accurate image.
  • an optical test method which projects a lattice pattern on a target object on which a 3D image is formed, compares an optical signal modified by a shape of the target object with a reference pattern, and determines the presence or absence of a defect in the target object according to the comparison result, the method comprising: acquiring a first image by adjusting an illumination value to reduce a regular reflection rate of a 3D surface of the target object so that a saturation area is reduced by the reduced regular reflection rate; acquiring a second image by adjusting an illumination value to clearly form a lattice pattern on a peripheral area of the 3D surface of the target object; mixing the first image and the second image; and determining the presence or absence of a defect in the target object by analyzing the mixed image of the first and second images.
  • FIG. 1 is a flow chart illustrating an optical test method according to the present invention
  • FIG. 2 is a schematic diagram illustrating an optical test apparatus for use in the optical test method according to the present invention
  • FIG. 3 shows exemplary photo-images, each of which has a low saturation degree on a 3D surface according to the optical test method
  • FIG. 4 shows exemplary photo-images, each of which has a low saturation degree on a peripheral area of a 3D surface according to the optical test method
  • FIG. 5 shows a mixed image of an image acquired by the optical test method according to the present invention.
  • FIG. 1 is a flow chart illustrating an optical test method according to the present invention.
  • the optical test method according to the present invention projects a lattice pattern on a target object on which a 3D image is formed, compares an optical signal modified by the shape of the target object with a reference pattern, and determines the presence or absence of a defect in the target object according to the comparison result.
  • the above-mentioned optical test method acquires a first image by adjusting an illumination value to reduce a regular reflection rate of a 3D surface of the target object at step SlOO, acquires a second image by adjusting an illumination value to clearly form the lattice pattern on a peripheral area of the 3D surface of the target object at step S200, mixes the first image and the second image at step S300, and determines the presence or absence of a defect in the target object by analyzing the mixed image of the first and second images at step S400.
  • the adjustment of the illumination values for acquiring the first and second images may be implemented by adjusting the light quantity using a single lamp or illumination, or may be implemented by reducing the size of a saturation area using a specific BPF (Band Pass Filter) .
  • the adjustment of the illumination value using the above-mentioned specific BPF may be implemented by a color filter or a polarizing filter.
  • the first image may be acquired with a light quantity less than that of the second image.
  • FIG. 2 is a schematic diagram illustrating an optical test apparatus for use in the optical test method according to the present invention.
  • the optical test system includes an illumination unit 1, a target object 2 to be tested, an image-capturing unit 3, and an analyzing unit 4.
  • the illumination unit 1 acts as a unit for illuminating an optical signal on the target object 2 to be tested.
  • the illumination unit 1 includes a light source 11, a band pass filter (BPF) 12, a lattice unit 13, a projection optical system 14 for focusing the light generated from the light source 11, and a reflection mirror 15, etc.
  • BPF band pass filter
  • the BPF may be a color filter or a polarizing filter.
  • the target object 2 may be a semiconductor package equipped with balls.
  • the semiconductor package is not shown in the drawings, it is delivered and arranged on a test table.
  • the image-capturing unit 3 is used as an image pickup element for capturing an image reflected from the surface of the target object 2.
  • the image-capturing unit 3 includes a CCD camera 32 and an image optical system 31 for focusing the light on the CCD camera, and transmits the image captured by the CCD camera 32 to the analyzing unit 4.
  • the analyzing unit 4 analyzes the received signal, compares the analyzed image with a reference image, and determines the presence or absence of a defect in a corresponding target object according to the comparison result.
  • the analyzing unit 4 may be implemented with a computer.
  • the test method for use in the above-mentioned optical test apparatus will hereinafter be described in detail. For the convenience of description, a semiconductor package equipped with balls is exemplarily used as the target object to be tested.
  • FIGS. 3A ⁇ 3C show exemplary photo-images, each of which has a low saturation degree on the 3D surface according to the optical test method.
  • the test method adjusts an illumination value to remove a regular reflection point from the 3D surface (i.e., the part on which many regular reflections occur) of the target object 2 delivered to the test table.
  • the test method acquires the image captured by the CCD camera 32 as shown in FIGS. 3B ⁇ 3C, so that a phase map and a visibility map are depicted.
  • the illumination value may be adjusted by adjusting either the light quantity generated from the light source 11 or the filter 12.
  • FIGS. 4A ⁇ 4C show exemplary photo-images, each of which has a low saturation degree on a peripheral area of the 3D surface according to the optical test method.
  • the test method adjusts the illumination value to clearly show the lattice image on a peripheral area of the 3D surface.
  • the test method acquires the image captured by the CCD camera 32, and acquires the phase map and the visibility map as shown in FIGS. 4B ⁇ 4C.
  • the test method searches for a 3D image having good visibility using the analyzing unit 4, and selects a first image.
  • the test method searches for an image of a peripheral area of the 3D image having good visibility, selects a second image, and calculates a phase map of each image.
  • the test method mixes the phase maps of the individual images as shown in FIG. 5, analyzes the mixed image, and determines the presence or absence of a defect in a corresponding target object to be tested.
  • FIG. 5 shows a mixed image of an image acquired by the optical test method according to the present invention.
  • the optical test method according to the present invention adjusts the illumination value using a light quantity or a filter to remove a regular reflection point caused by a glittering part of the 3D surface, so that it acquires the 3D-surface image having a smaller illumination saturation area.
  • the optical test method adjusts the illumination value using the light quantity or the filter to clearly show the lattice image on a peripheral area of the 3D surface, acquires the image of the peripheral area, selects a specific image having good visibility from among several images, mixes the 3D-surface image and the selected image, and compares the reference image with the mixed image to determine the presence or absence of a defect in the target object.
  • the above-mentioned optical test method prevents the test accuracy from being deteriorated by the regular reflection on the 3D surface, so that the test reliability increases.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

L'invention concerne un procédé de test optique consistant : à acquérir non seulement une image présentant un faible taux de réflexion régulière sur une surface de réflexion régulière, mais également une image périphérique sur laquelle un plan de réseau périphérique à proximité d'une surface de réflexion régulière est clairement visible ; à utiliser les images acquises ; et à améliorer la précision d'une image cible à mesurer. Le procédé de test optique selon l'invention consiste également à projeter un motif de réseau sur un objet cible sur lequel est formée une image tridimensionnelle, à comparer un signal optique modifié par la forme de l'objet cible avec un motif de référence, et à déterminer la présence ou l'absence d'un défaut dans l'objet cible en fonction du résultat de la comparaison.
EP07833121A 2007-10-02 2007-10-02 Procede de test optique Withdrawn EP2195607A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/KR2007/004807 WO2009044944A1 (fr) 2007-10-02 2007-10-02 Procede de test optique

Publications (1)

Publication Number Publication Date
EP2195607A1 true EP2195607A1 (fr) 2010-06-16

Family

ID=40526348

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07833121A Withdrawn EP2195607A1 (fr) 2007-10-02 2007-10-02 Procede de test optique

Country Status (4)

Country Link
EP (1) EP2195607A1 (fr)
JP (1) JP2010540955A (fr)
CN (1) CN101815925B (fr)
WO (1) WO2009044944A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102739952B (zh) 2011-03-29 2015-06-03 财团法人工业技术研究院 多视角取像方法及其应用系统
EP2959262A4 (fr) * 2013-02-21 2016-09-28 Nova Measuring Instr Ltd Procédé et système de mesure de phase optique

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JPH01172904A (ja) * 1987-12-28 1989-07-07 Nippon Petrochem Co Ltd 光学フィルターおよびその製造方法
JPH07119709B2 (ja) * 1988-01-13 1995-12-20 トヨタ自動車株式会社 表面欠陥検査装置
JP3040607B2 (ja) * 1992-08-04 2000-05-15 三菱重工業株式会社 光切断方法における異常光除去方法
JPH06102197A (ja) * 1992-09-21 1994-04-15 Kawasaki Steel Corp 表面欠陥検出方法
JPH07120238A (ja) * 1993-10-22 1995-05-12 Mazda Motor Corp 三次元測定器による測定方法
JP3218889B2 (ja) * 1994-09-30 2001-10-15 スズキ株式会社 立体物の形状検査装置
JPH11201743A (ja) * 1998-01-16 1999-07-30 Hitachi Ltd 異物欠陥検査方法およびその装置
JP2000230814A (ja) * 1999-02-09 2000-08-22 Mitsubishi Heavy Ind Ltd レーザ光を利用した形状測定方法
US6205354B1 (en) * 1999-06-18 2001-03-20 University Of Utah Method and apparatus for noninvasive measurement of carotenoids and related chemical substances in biological tissue
JP2002148029A (ja) * 2000-11-08 2002-05-22 Ricoh Co Ltd 円筒状被検物の表面凹凸検査装置及び方法
KR20040006443A (ko) * 2002-07-12 2004-01-24 주식회사 휴노테크놀로지 광학식 지문 입력 장치 및 그 장치에서의 잔상 판별 방법
KR20050000861A (ko) * 2003-06-25 2005-01-06 삼성테크윈 주식회사 부품 검사 장치 및 이를 이용한 부품 검사 방법
JP4041042B2 (ja) * 2003-09-17 2008-01-30 大日本スクリーン製造株式会社 欠陥確認装置および欠陥確認方法
JP3938785B2 (ja) * 2006-04-17 2007-06-27 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置

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Title
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Also Published As

Publication number Publication date
CN101815925B (zh) 2011-08-24
JP2010540955A (ja) 2010-12-24
WO2009044944A1 (fr) 2009-04-09
CN101815925A (zh) 2010-08-25

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